CN201708153U - Laminated encapsulation structure of LED module - Google Patents
Laminated encapsulation structure of LED module Download PDFInfo
- Publication number
- CN201708153U CN201708153U CN201020178276.6U CN201020178276U CN201708153U CN 201708153 U CN201708153 U CN 201708153U CN 201020178276 U CN201020178276 U CN 201020178276U CN 201708153 U CN201708153 U CN 201708153U
- Authority
- CN
- China
- Prior art keywords
- supply control
- power supply
- control chip
- chip
- power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/4901—Structure
- H01L2224/4903—Connectors having different sizes, e.g. different diameters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to a laminated encapsulation structure of an LED module, which comprises a base plate, wherein a printed circuit board is fixedly connected on the base plate, the central area of the printed circuit board is concavely provided with a locating slot, and the locating slot is internally provided with a power-supply control chip which is fixedly connected with the base plate; the power-supply control chip is provided with LED chips which are uniformly distributed and fixed on the power-supply control chip by insulating glue; two sides of the LED chips are respectively provided with chip connecting ends which are fixed on and electrically connected with the power-supply control chip; the chip connecting ends are connected with the power supply end of the LED chips by connecting leads; and the printed circuit board is also provided with a power supply connecting end which is electrically connected with the power-supply control chip. The laminated encapsulation structure is convenient in operation and has good radiating effect, high luminance and low cost.
Description
Technical field
The utility model relates to a kind of LED encapsulating structure, and the laminated encapsulating structure of especially a kind of led module belongs to the technical field that LED throws light on.
Background technology
At present, in the LED lighting technical field, directly led chip is powered on, led chip sends light, can be used for various lighting environments.When described led chip uses, mostly be and interconnect the brighter light source of generation between single or multiple led chips; When single or multiple led chips are worked, needing by one group of transformer the direct current of 90-250V to be dropped to voltage is 3.5V, electric current is the working power of the power supply of 0.1A as led chip, and a plurality of led chip needs bigger voltage and electric current when interconnecting, and satisfies the needs that connect between led chip.
Summary of the invention
The purpose of this utility model is to overcome the deficiencies in the prior art, provides a kind of led module laminated encapsulating structure, and it is easy to operate, good heat dissipation effect, and illumination brightness reaches with low cost greatly.
According to the technical scheme that the utility model provides, the laminated encapsulating structure of described led module comprises substrate; Described substrate is provided with fixedly connected printed circuit board (PCB); The center of described printed circuit board (PCB) is concaved with location notch, is provided with power supply control chip in the described location notch, and described power supply control chip is fixedlyed connected with substrate; Described power supply control chip is provided with equally distributed led chip, and described led chip utilizes insulating cement to be fixed on the power supply control chip; The both sides of led chip are equipped with the chip link, and described chip link is fixed on the power supply control chip, and electrically connect with power supply control chip; Described chip link is connected with the power end of led chip by connecting lead; Also be provided with power connector end on the printed circuit board (PCB), described power connector end and power supply control chip electrically connect.
Described power supply control chip is bonded on the substrate by conducting resinl, and described conducting resinl and power supply control chip all are positioned at location notch.The material of described substrate comprises aluminium or copper.Described power connector end is provided with power line, and an end of described power line is fixed on the power connector end, and the other end is connected with the power supply of 90～250V.Described power supply control chip is provided with 40～100 LEDs chips, and described led chip is evenly distributed on the power supply control chip.
Link in the middle of all being provided with on described printed circuit board (PCB) and the power supply control chip electrically connects by connecting lead between described middle link; Link electrically connects by printed circuit board (PCB) and power connector end in the middle of described.The material of described power connector end and chip link includes gold, silver, copper or aluminium.The material of link comprises gold, silver, copper or aluminium in the middle of described.
Advantage of the present utility model: substrate adopts aluminium sheet or copper coin to make, and the heat that can effectively send led chip dispels the heat.On the described substrate power supply control chip is set, equally distributed led chip is set on the power supply control chip, when having avoided single led chip, need carry out step-down power supply, easy to connect.40～100 LEDs chips are set on the described power supply control chip, can guarantee luminous intensity as led light source.Described power supply control chip is placed on the substrate by conducting resinl, can carry out efficiently radiates heat, good heat dissipation effect to power supply control chip and led chip.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Embodiment
The utility model is described in further detail below in conjunction with concrete drawings and Examples.
As shown in Figure 1: the utility model comprises chip link 1, connects lead 2, insulating cement 3, led chip 4, power supply control chip 5, conducting resinl 6, printed circuit board (PCB) 7, substrate 8, power line 9, location notch 10, middle link 11 and power connector end 12.
As shown in Figure 1, described substrate 8 is provided with fixedly connected printed circuit board (PCB) 7, and two surfaces of described printed circuit board (PCB) 7 all have conductivity.The material of substrate 8 comprises aluminium or copper, has good thermal conductivity, and the heat that produces when can be to led chip 4 luminous carries out efficiently radiates heat.The center of described printed circuit board (PCB) 7 is concaved with location notch 10, described location notch 10 from printed circuit board (PCB) 7 corresponding to extending to the surface of substrate 8 with substrate 8 contacted another surfaces.Be provided with power supply control chip 5 in the location notch 10, described power supply control chip 5 is bonded on the substrate 8 by conducting resinl 6, and conducting resinl 6 can be further dispels the heat to the heat of led chip 4; Described printed circuit board (PCB) 7 is looped around the outer ring of power supply control chip 5 and conducting resinl 6.Power supply control chip 5 is provided with equally distributed led chip 4, and the both sides of described led chip 4 are equipped with chip link 1; Described chip link 1 is fixed on the power supply control chip 5, and electrically connects with power supply control chip 5.Described chip link 1 is connected with the power end of led chip 4 by connecting lead 2, makes power supply control chip 5 provide working power for led chip 4.Power supply control chip 5 is exported constant voltage or electric current according to the operating state requirement of led chip 4, guarantees that led chip 4 can steady operation.
Link 11 in the middle of being equipped with on described power supply control chip 5 and the printed circuit board (PCB) 7; Middle link 11 on middle link 11 on the described printed circuit board (PCB) 7 and the power supply control chip 5 electrically connects by being connected lead 2.Middle link 11 on the described power supply control chip 5 is close to printed circuit board (PCB)s 7, and is connected with the power end of power supply control chip 5; Middle link 11 contiguous power supply control chips 5 on the printed circuit board (PCB) 7.The material of described chip link 1, middle link 11 and power connector end 12 comprises gold, silver, copper or aluminium.
Also be provided with power connector end 12 on the described printed circuit board (PCB) 7, described power connector end 12 electrically connects with printed circuit board (PCB) 7.Power line 9 is set on the power connector end 12, and an end of described power line 9 is fixed on the power connector end 12, the power supply of another termination 90～250V voltage.Printed circuit board (PCB) 7 all has conductivity corresponding to the surface of placing power connector end 12, and power line 9 electrically connects with middle link 11 by power connector end 12, printed circuit board (PCB) 7; And the power supply that needs for providing of power supply control chip 5.When power line 9 was connected with the power supply of 90～110V voltage, 48 LEDs chips 4 evenly distributed on the power supply control chip 5; When power line 9 was connected with the power supply of 110～250V voltage, 96 LEDs chips 4 evenly distributed on the power supply control chip 5.
As shown in Figure 1, during use, power supply control chip 5 is installed on the substrate 8 by conducting resinl 6, efficiently radiates heat was carried out in the evolution of heat when described conducting resinl 6 was can be to led chip 4 luminous.40～100 LEDs chips 4 are set on the surface of described power supply control chip 5, and described led chip 4 is of a size of 1*1mm; Led chip 4 is evenly distributed on the surface of power supply control chip 5, and the installation accuracy control of led chip 4 is at 50 microns; Led chip 4 is installed in the surface of power supply control chip 5 by insulating cement 3; Insulating cement 3 can avoid led chip 4 and 5 of power supply control chips to pass through electric current.4 of led chips are connection in series-parallel coexistence mode on the described power supply control chip 5, need utilize transformer to carry out the operation that just can power on after the step-down when having avoided providing power supply for power supply control chip 5 and led chip 4, and are easy to operate; Simultaneously on led chip 4, cover silica gel, and on silica gel, be coated with fluorescent material, satisfy led chip 4 different luminous needs.
One end of described power line 9 is connected with external power source, because printed circuit board (PCB) 7 has conductivity corresponding to the surface that power connector end 12 is set, external power source can and connect lead 2 by printed circuit board (PCB) 7, middle link 11 and power for power supply control chip 5 and led chip 4.Power supply control chip 5 provides led chip 4 steady operations required voltage or electric current according to the job requirement of led chip 4.Led chip 4 is evenly distributed on the power supply control chip 5,4 of led chips all by chip link 1 with to be connected lead 2 interconnected, reduced the luminous cost of LED, improved the luminosity of led chip 4.
The utility model substrate 8 adopts aluminium sheet or copper coin to make, and the heat that can effectively send led chip 4 dispels the heat.On the described substrate 8 power supply control chip 5 is set, equally distributed led chip 4 is set on the power supply control chip 5, when having avoided single led chip 4, need carry out step-down power supply, easy to connect.40～100 LEDs chips are set on the described power supply control chip 5, can guarantee luminous intensity as led light source.Described power supply control chip 5 is placed on the substrate 8 by conducting resinl 6, can carry out efficiently radiates heat, good heat dissipation effect to power supply control chip 5 and led chip 4.
Claims (8)
1. the laminated encapsulating structure of led module comprises substrate (8); It is characterized in that: described substrate (8) is provided with fixedly connected printed circuit board (PCB) (7); The center of described printed circuit board (PCB) (7) is concaved with location notch (10), is provided with power supply control chip (5) in the described location notch (10), and described power supply control chip (5) is fixedlyed connected with substrate (8); Described power supply control chip (5) is provided with equally distributed led chip (4), and described led chip (4) utilizes insulating cement (3) to be fixed on the power supply control chip (5); The both sides of led chip (4) are equipped with chip link (1), and described chip link (1) is fixed on the power supply control chip (5), and electrically connect with power supply control chip (5); Described chip link (1) is connected with the power end of led chip (4) by connecting lead (2); Also be provided with power connector end (12) on the printed circuit board (PCB) (7), described power connector end (12) electrically connects with power supply control chip (5).
2. the laminated encapsulating structure of led module according to claim 1 is characterized in that: described power supply control chip (5) is bonded on the substrate (8) by conducting resinl (6), and described conducting resinl (6) all is positioned at location notch (10) with power supply control chip (5).
3. the laminated encapsulating structure of led module according to claim 1 is characterized in that: the material of described substrate (8) comprises aluminium or copper.
4. the laminated encapsulating structure of led module according to claim 1 is characterized in that: described power connector end (12) is provided with power line (9), and an end of described power line (9) is fixed on the power connector end (12), and the other end is connected with the power supply of 90～250V.
5. the laminated encapsulating structure of led module according to claim 1 is characterized in that: described power supply control chip (5) is provided with 40～100 LEDs chips (4), and described led chip (4) is evenly distributed on the power supply control chip (5).
6. the laminated encapsulating structure of led module according to claim 1 is characterized in that: link (11) in the middle of all being provided with on described printed circuit board (PCB) (7) and the power supply control chip (5), pass through to connect lead (2) electric connection between described middle link (11); Link (11) electrically connects by printed circuit board (PCB) (7) and power connector end (12) in the middle of described.
7. the laminated encapsulating structure of led module according to claim 1 is characterized in that: described power connector end (12) includes gold, silver, copper or aluminium with the material of chip link (1).
8. the laminated encapsulating structure of led module according to claim 6 is characterized in that: the material of link (11) comprises gold, silver, copper or aluminium in the middle of described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020178276.6U CN201708153U (en) | 2010-04-23 | 2010-04-23 | Laminated encapsulation structure of LED module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201020178276.6U CN201708153U (en) | 2010-04-23 | 2010-04-23 | Laminated encapsulation structure of LED module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201708153U true CN201708153U (en) | 2011-01-12 |
Family
ID=43445307
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201020178276.6U Expired - Fee Related CN201708153U (en) | 2010-04-23 | 2010-04-23 | Laminated encapsulation structure of LED module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201708153U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017103294A1 (en) | 2017-02-17 | 2018-08-23 | Osram Opto Semiconductors Gmbh | OPTOELECTRONIC LIGHTING DEVICE AND METHOD FOR OPERATING AN OPTOELECTRONIC LIGHTING DEVICE |
| CN109244058A (en) * | 2018-09-19 | 2019-01-18 | 深圳铨力半导体有限公司 | Semiconductor package and preparation method thereof |
-
2010
- 2010-04-23 CN CN201020178276.6U patent/CN201708153U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017103294A1 (en) | 2017-02-17 | 2018-08-23 | Osram Opto Semiconductors Gmbh | OPTOELECTRONIC LIGHTING DEVICE AND METHOD FOR OPERATING AN OPTOELECTRONIC LIGHTING DEVICE |
| CN109244058A (en) * | 2018-09-19 | 2019-01-18 | 深圳铨力半导体有限公司 | Semiconductor package and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110112 Termination date: 20150423 |
|
| EXPY | Termination of patent right or utility model |