DE102017103294A1 - OPTOELECTRONIC LIGHTING DEVICE AND METHOD FOR OPERATING AN OPTOELECTRONIC LIGHTING DEVICE - Google Patents

Abstract

The invention relates to an optoelectronic light-emitting device and a method for operating an optoelectronic light-emitting device. The invention proposes that an optimized number of interconnected LED chips are supplied by an electrical supply voltage, for example an on-board voltage of a motor vehicle, wherein a driving device for the one another defined interconnected LED chips is designed, depending on the voltage level of the supply voltage, the LED chips interconnect with each other such that a voltage difference between the electrical supply voltage and a voltage drop across the LED chips interconnected defined is minimized. As a result, advantageously, a power loss of the drive device is minimized.

Description

The present invention relates to an optoelectronic lighting device. The present invention further relates to a method for operating an optoelectronic lighting device.

Known are modular optoelectronic light-emitting devices for motor vehicles, in which a suitable driver chip is installed with an LED together on a FR-4 printed circuit board. The driver chip is supplied with an on-board electrical system voltage that can fluctuate between approx. 7 V and approx. 16 V. The LEDs are controlled by means of a linear regulator, in which excess electrical voltage is converted into heat. This heat can lead to a thermal limitation of brightnesses, which is achieved with such module solutions. In addition, this thermal problem prevents further miniaturization of the modules. Due to the usually fluctuating electrical system voltage locally locally fluctuating temperatures are generated, which can adversely affect a color shift of the LED chips.

Remedy can be done by reducing the waste heat in the driver block, which then allows further miniaturization. However, in many applications (such as coupling into an optical fiber), the relatively large spacing between the LED chips in currently available packages adversely results in relatively long runs until homogeneous color mixing can be achieved.

The object underlying the invention is to be seen to provide an optoelectronic lighting device with improved efficiency.

This object is achieved with the objects of the independent claims. Advantageous developments of the invention are the subject of dependent claims.

• - zwei Kontakte zum Anschließen an eine elektrische Versorgungsspannung;
• - wenigstens eine Gruppe von miteinander definiert verschaltbaren LED-Chips, die über ein Leitungsnetz an die elektrische Versorgungsspannung schaltbar ist;
• - wobei wenigstens eine Gruppe von miteinander definiert verschaltbaren LED-Chips über eine definierte Anzahl von elektrischen Stromquellen an die Versorgungsspannung schaltbar ist; und
• - eine Ansteuerungseinrichtung für die wenigstens eine Gruppe von miteinander definiert verschaltbaren LED-Chips, die ausgelegt ist, abhängig vom Spannungspegel der Versorgungsspannung die LED-Chips miteinander derart zu verschalten, dass eine Spannungsdifferenz zwischen der elektrischen Versorgungsspannung und einem Spannungsabfall an der wenigstens einen Gruppe der definiert miteinander verschaltbaren LED-Chips minimiert ist.

According to a first aspect, the invention provides an optoelectronic lighting device, comprising:

• - Two contacts for connection to an electrical supply voltage;
• - At least one group of mutually interconnected LED chips, which is switchable via a line network to the electrical supply voltage;
• - Wherein at least one group of mutually defined interconnected LED chips over a defined number of electrical power sources to the supply voltage is switchable; and
• a drive device for the at least one group of LED chips which can be interconnected with one another and which is designed to interconnect the LED chips with one another in such a way that a voltage difference between the electrical supply voltage and a voltage drop at the at least one group of the defined interconnected LED chips is minimized.

In this way, an electrical system voltage of a motor vehicle, which fluctuates greatly for the system, can be optimally utilized for the optoelectronic light-emitting device, wherein an electrical power loss of the drive device of the optoelectronic light-emitting device is advantageously minimized.

As a result, advantageously a relatively free configurability of interconnected LED chips can be realized, whereby an improved electrical / optical efficiency is realized for the optoelectronic light-emitting device.

• - Erfassen eines Spannungspegels einer elektrischen Versorgungsspannung; und
• - Betreiben von wenigstens einer Gruppe von miteinander definiert verschaltbaren LED-Chips derart, dass die LED-Chips derart an die elektrische Versorgungsspannung angeschaltet werden, dass abhängig vom Spannungspegel der elektrischen Versorgungsspannung eine Spannungsdifferenz zwischen der elektrischen Versorgungsspannung und einem Spannungsabfall an der miteinander definiert verschalteten Gruppe von LED-Chips minimiert ist.

According to a second aspect, the invention provides a method for operating an optoelectronic lighting device, comprising the steps:

• - detecting a voltage level of an electrical supply voltage; and
• - Operating at least one group of interconnected interconnected LED chips such that the LED chips are connected to the electrical supply voltage such that depending on the voltage level of the electrical supply voltage, a voltage difference between the electrical supply voltage and a voltage drop across the group interconnected with each other minimized by LED chips.

The invention advantageously realizes that a maximized number of interconnected LED chips is supplied by an electrical on-board voltage of a motor vehicle or that a power loss of the optoelectronic lighting device is minimized. Due to the fact that the electrical voltage of motor vehicles fluctuates greatly in practice, this means that in each case different numbers of interconnected LED chips are supplied by the electrical system voltage. As a result, an optimized operating characteristic for the LED chips is thereby achieved, whereby a thermal power dissipation of a driving driver module is minimized. This is achieved by minimizing a voltage delta between the supply voltage and the cumulative forward voltages of the group of LED chips, whereby the entire optoelectronic lighting device is operated in an energy-optimized manner.

According to one embodiment of the optoelectronic light-emitting device, it is provided that a number of the LED chips which can be interconnected in a defined manner are dependent on currents which are driven by the electric current sources through the LED chips. In this way, the number of interconnected LED chips can be advantageously controlled by the electrical currents of the power sources.

According to one embodiment of the optoelectronic lighting device, it is provided that the LED chips can be switched by means of switch elements provided by the drive device, wherein the LED chips can be connected in parallel and / or in series between the contacts of the supply voltage. In this way, numerous circuit topologies can be realized, which minimize a power loss of the optoelectronic light-emitting device.

According to one embodiment of the optoelectronic lighting device, it is provided that the electrical current sources can be controlled by means of the control device. In this way, an electric current can be controlled by the group of LED chips, as a result of which, for example, advantageous. a color location of the optoelectronic lighting device is adjustable.

According to one embodiment of the optoelectronic alignment, it is provided that the control device is designed as an electronic driver module. As a result, various, easily implementable variants for driving the LED chips can be provided. For example, in this way an infrastructure of the driver module can be used for the interconnection of the LED chips, whereby a space requirement for the optoelectronic lighting direction is minimized.

A further embodiment of the optoelectronic light-emitting device is characterized in that LED chips of at least one group are arranged in at least two subgroups, each subgroup comprising a defined number of serially connectable LED chips, the interconnection of the LED chips of each subgroup by means of the switch elements is synchronously feasible. In this way, due to definable numbers of the interconnected LED chips, different color characteristics of the optoelectronic lighting device can be provided.

According to one embodiment of the optoelectronic light-emitting device, it is provided that a first group of the LED chips, which can be interconnected in a defined manner, comprise red LED chips, a second group of green LED chips, and a third group of blue LED chips. In this way, specific color characteristics or color locations can be realized by means of the optoelectronic light-emitting device.

According to a further advantageous embodiment of the optoelectronic light-emitting device is provided that the LED chips are arranged on a surface of the drive means. As a result, a design of the optoelectronic lighting device can be advantageously realized compact.

A further advantageous embodiment of the optoelectronic light-emitting device is characterized in that a distance from the LED chip center to the LED chip center is smaller than a double chip length of an LED chip. In this way, the LED chips are arranged as close to each other as possible, as a result, an improvement of a local light mixture is realized. This advantageously supports a uniform color impression of the optoelectronic lighting device.

An advantageous embodiment of the optoelectronic light-emitting device is characterized in that a differently colored LED chip is arranged orthogonally adjacent to each LED chip. Also in this way a good color mixing of the optoelectronic lighting device is supported due to eye inertia.

According to a further advantageous embodiment of the optoelectronic light-emitting device is provided that the drive means is arranged on a printed circuit board, being provided on the circuit board mutually insulated contact surfaces for an electrical supply and for data lines. This results in advantageous space-saving configurations that are controlled in a comfortable way with the supply voltage and data lines. As a result, compact "intelligent" light sources can be realized. In this case, external data can be transmitted in a simple manner to the optoelectronic lighting device, for example, modulated data signals can be transmitted via supply lines for the supply voltage.

According to a further advantageous embodiment of the optoelectronic lighting device is provided that the arrangement of LED chips, drive means and circuit board is enclosed by a molding compound. As a result, good protection and a compact fit of the LED chips are supported by a cost-effective production method.

According to an advantageous embodiment of the optoelectronic light-emitting device is provided that by means of plated-through contacts on electrodes of the LED chips are electrically contacted. In this way, a line or wiring structure of the optoelectronic light-emitting device can be designed optimized.

A further advantageous embodiment of the optoelectronic lighting device is characterized in that an operating characteristic of the LED chips can be changed in a defined manner by means of a software program of the control device. In this way, an amount and / or timing of the electric current through the LED chips can be controlled, whereby a color characteristic of the optoelectronic lighting device can be efficiently controlled (e.g., color gradients, brightness gradients, etc.). For example, it can be realized by switching from one color to another within a certain period of time. Technical functionalities and advantages of the proposed optoelectronic light-emitting device result analogously from corresponding technical functionalities and advantages of the method for operating an optoelectronic light-emitting device. This means, in particular, that technical functionalities and advantages of the device features result from corresponding technical functionalities and advantages of process features, and vice versa.

• 1 ein prinzipielles Schaltbild einer Ausführungsform der vorgeschlagenen optoelektronischen Leuchtvorrichtung,
• 2 das Schaltbild von 1 mit beispielhaft geschlossenen Schalterelementen,
• 3 ein Spannungsverlaufsdiagramm mit Spannungszuständen an den LED-Chips der optoelektronischen Leuchtvorrichtung,
• 4 eine Schnittansicht durch eine Ausführungsform der vorgeschlagenen optoelektronischen Leuchtvorrichtung,
• 5 eine Schnittansicht durch eine weitere Ausführungsform der vorgeschlagenen optoelektronischen Leuchtvorrichtung,
• 6 eine Draufsicht auf eine Ausführungsform der vorgeschlagenen optoelektronischen Leuchtvorrichtung,
• 7 eine Rückansicht auf eine Ausführungsform der vorgeschlagenen optoelektronischen Leuchtvorrichtung,
• 8 und 9 zwei Anordnungen von LED-Chips der vorgeschlagenen optoelektronischen Leuchtvorrichtung, und
• 10 ein Ablaufdiagramm eines Verfahrens zum Betreiben einer optoelektronischen Leuchtvorrichtung.

The described characteristics, features and advantages of this invention, as well as the manner in which they are achieved, will become clearer and more clearly understood in connection with the following description of the exemplary embodiments, which are explained in more detail in connection with figures, wherein the figures are not necessarily executed true to scale are. In the figures shows:

• 1 a schematic diagram of an embodiment of the proposed optoelectronic lighting device,
• 2 the circuit diagram of 1 with exemplary closed switch elements,
• 3 a voltage waveform diagram with voltage states at the LED chips of the optoelectronic lighting device,
• 4 a sectional view through an embodiment of the proposed optoelectronic lighting device,
• 5 a sectional view through a further embodiment of the proposed optoelectronic lighting device,
• 6 a plan view of an embodiment of the proposed optoelectronic lighting device,
• 7 a rear view of an embodiment of the proposed optoelectronic lighting device,
• 8th and 9 two arrangements of LED chips of the proposed optoelectronic light-emitting device, and
• 10 a flowchart of a method for operating an optoelectronic lighting device.

Hereinafter, the same reference numerals are used for the same or functionally identical features. For the purpose of better clarity, it may be provided that not all figures for all elements are always drawn in all figures.

The formulations "respectively", "or" in particular also include the formulation "and / or".

1 shows a circuit diagram of an exemplary first embodiment of a proposed optoelectronic lighting device 100 , The optoelectronic lighting device 100 is connected via contacts 1, 2 to an electrical supply voltage U _B connected. The optoelectronic lighting device 100 has a first group 10 from first LED chips 11 a first color (here red), a second group 20 of second LED chips 21 a second color (here green) and a third group 30 of third LED chips 31 a third color (here blue). However, it goes without saying that other and / or additional, not shown groups with LED chips of other colors (eg orange, yellow, etc.) can be used.

As in 1 shown are the LED chips 11 . 21 . 31 of the individual groups 10 . 20 and 30 by means of switch elements 60 serially and / or parallel interconnected, wherein in the arrangement of 1 all switch devices 60 are open. As a result, thereby the electrical supply voltage U _B (Eg, an electrical battery or vehicle voltage of a motor vehicle) according to the respective electrical Flussspannungen U _f the LED chips 11 . 21 . 31 a defined number of LED chips 11 . 21 . 31 drive, with a residual electrical residual voltage to controllable power sources 50 (eg constant current sources) drops. This results in the respective forward voltages on the LED chips 11 . 21 , 31 depending on the means of current sources 50 driven electric currents, so as a result the number of interconnected LED chips 11 . 21 . 31 from the currents of the power sources 50 depends.

führen.In motor vehicles, a minimum electrical supply voltage of approx. 6.5 V and a maximum electrical supply voltage of approx. 16 V are assumed. At 6.5 V, it is possible to operate 2.8 red LED chips at a specific electrical forward voltage. Rounded off this results in n = 2 red LED chips per row. At 16 V, 7.0 red LED chips can be operated. This results in a reasonable strand number x = 3, since three strands, each with two red LED chips in a series connection to a total voltage $$6\times 2.3\text{V}=13.8\text{V}$$

to lead.

For green and blue LED chips of the second and third group 20, 30, the above considerations apply analogously to the respective specific forward voltages. As more green LED chips are usually needed to achieve a desired white point, green LED chips are required 21 the second group 20 two subgroups ("clusters") 22, 23 are provided, wherein each subgroup in each case two second LED chips 21 of the subgroups 22 . 23 connected in series with each other. In this way, a number of the green second LED chips 21 may be twice as many as a number of the blue third LED chips 31 ,

An advantage of this approach is that the number of LED chips 11 . 21 . 31 can be varied according to the application and thus, for example, more blue LED chips can be installed as red or green LED chips. Thus, in total more blue light (radiometric watts) can be emitted, so that after the weighting with the low eye sensitivity in the blue spectral range, a comparable optical intensity can be achieved in comparison to the other colors.

The following table shows different parameters for red, green and blue LED chips: LED color red green blue total U _f @ 3 0mA 2.3V 3.3V 3.2V Number of LED chips @ U _B = 6.5V 2.8 2.0 2.0 Number of LED chips @ U _B = 16V 7.0 4.8 5.0 Number of LED chips per row 2 2 2 Number of parallel strands 3 2 2 Number of subgroups 1 2 1 Total number of LED chips 6 8th 4 18 U _f ... electrical flux or forward voltage

Different parameters are indicated for red LED chips (2nd column), green LED chips (3rd column) and blue LED chips (4th column). It can be seen for the above types of LED chips specific values of the electrical forward voltage U _f depending on the electric current 30mA. Also recognizable are numbers of theoretically serially connectable LED chips in the electrical battery voltages U _B 6.5V and 16V.

Also recognizable are numbers of actually serially connectable LED chips per row, numbers of interconnectable parallel strings of the LED chips, numbers of subgroups and a total number of interconnectable LED chips. Visible for the three different LED chips and a total chip edge length equivalent at 130μm chip grid.

The optoelectronic lighting device 100 further comprises a drive device 40 (Eg, an electronic driver module), in which a computer device (preferably a microcontroller, microprocessor, etc.) and electronic switch elements 60 are integrated. By means of the drive device 40 can be a switching mode of the switch elements 60 controlled and the power sources 50 be controlled.

In this way, the electrical supply or battery voltage U _B each optimally used to power the LED chips 11, 21, 31. Furthermore, with the computer device of the driving component, an electrical current flow of the current sources 50 through the LED chips 11 . 21 . 31 be controlled so that due to different, changing electrical currents specific color lamps for the LED chips 11 , 21, 31 are feasible.

2 shows the arrangement of 1 with specifically interconnected LED chips 11 . 21 . 31 , Realized is in the first group 10 a series circuit of four first LED chips 11 , which together with two serially connected first LED chips 11 to the supply voltage U _B are turned on. In the second group 20 you recognize a first subgroup 22 with four serially interconnected second LED chips 21 connected to the supply voltage U _B is turned on and also a second subgroup 23 due to open switch elements 60 from the supply voltage U _B is disconnected. The third group 30 includes four series connected third LED chips 31 connected to the supply voltage U _B are switched.

It can therefore be seen that it is with the control device 40 possible is the LED chips 11 . 21 . 31 of the groups 10 . 20 and 30 either serially and / or in parallel to the electrical supply voltage U _B to turn.

The power sources 50 are about the computer device of the drive device 40 Programmable controllable. The electrical currents of the strands of a color are typically, but not necessarily the same size. To a brightness and / or color adjustment of the LED chips 11 . 21 . 31 For example, a pulse-width modulated control of the current sources 50 be performed.

As a result, this results in a number n (n at least one) LED chips 11 . 21 . 31 a color in a strand. The number n within a strand can be the same or different. The strands can be electrically connected to each other in parallel and / or in series, wherein the interconnection via electronic switch elements 60 he follows. One or more strands can not be energized. The electrical supply voltage U _B thus determines whether a string is energized and whether it is connected in series or in parallel with other strings.

That way, for all LED chips 11 . 21 . 31 realized the principle "no common anode and no common cathode", so that the electrical supply voltage U _B best possible, ie with a minimized voltage difference between the supply voltage U _B and the total flux tensions U _f for operating the interconnected LED chips 11 , 21, 31 is used. The electrical supply voltage U _B is exploited in this way the best possible, so that the electrical power loss of the drive 40 is minimized.

With the described dynamic switching of the LED chips in series and / or parallel circuit, the thermal power loss can be reduced in the form that, for example, a redshift due to the local heating of the component significantly reduced and easier control and red compensation of the LED chips are possible ,

3 shows a voltage waveform diagram underlying the above concept. In the diagram is the electrical supply voltage U _B plotted on the x-axis. On the y-axis are the summary flux and forward voltages U _f the LED chips 11 . 21 . 31 applied. The electrical forward voltage, which drops across the red, green and blue LED chips, is plotted with the respective voltage curves U _r , U _g , U _b . For the red LED chips is up to 10 V supply voltage U _B a parallel circuit PS before, between 10V and 14 V is a series connection of four red LED chips 11 Before and after 14 V, a series connection with six serially connected red LED chips 11 ,

For blue / green LED chips 13/14 V is connected in parallel with the blue / green LED chips 21 . 31 before and then at higher supply voltage U _B a series circuit RS. The voltage difference ΔU _T between the supply voltage U _B and the LED chip summaries drops as "loss voltage" at the driver 40 or at the power sources 50 and is converted into thermal energy loss.

It can thus be seen that, depending on the existing electrical supply voltage U _B a different number of serially and / or parallel connected LED chips 11 . 21 . 31 from that of the electrical supply voltage U _B are driven. In this way, the on-board electrical system voltage of a motor vehicle is utilized in the best possible manner and a power loss at the driver module is minimized, which results in efficient operation of the entire optoelectronic lighting device 100 supported.

4 shows a cross-sectional view through an embodiment of the optoelectronic light-emitting device 100 with surface emitting LED chips 11 . 21 . 31 in particular due to their efficiency and luminance. In principle, however, the use of volume emitters as LED chips is possible (not shown). It is also possible to use LED chips with two electrical contacts on one surface ("horizontal LED chip"). In 4 are vertical first LED chips 11 recognizable, the electric and thermal on the driving device 40 are mounted. As a result, the unit of electronic component and LED chips is very compact and can advantageously be installed in places (eg in the vehicle) with little space. In addition, this is the driving device 40 in the form of the silicon electronic module, a good heat conductor, which dissipates and dissipates accumulating heat well in the component.

The lower chip contacts of the LED chips must not be electrically connected to each other. This can be achieved by using a contacting element 70 in the form of ACF (anisotropic conductive film), CDAF on chip (conductive English attach film) or can be achieved by a soldering contact. The top contacts of the first LED chips 11 become electrically through PI contacts 71 (Planar interconnect contact) and vias 72 (PI vias) (Planar interconnects vias) with the control device 40 connected. By means of wire bridges 74 become electrical contacts from an upper side of the driving device 40 to vias 81 the circuit board 80 produced. The whole arrangement of LED chips 11 . 21 . 31 , Control device 40 and circuit board 80 is of a cured molding material 75 enclosed.

The thus formed LED chip array can optionally be protected with a thin, transparent potting compound (not shown). Since there is no reflector, the LED chips can radiate substantially uniformly in all spatial directions, thereby advantageously reducing color shift under a color-over-angle.

As electrical contacts is a backside metallization 82 on the circuit board 80 conceivable or pads on the component top, which are produced by the PI process. The wiring according to the wiring diagram according to 1 and 2 can be implemented only to a very limited extent by the PI metallization, which is why they mainly in rewiring levels (not shown) within the control device 40 is realized.

5 shows a cross-sectional view of another embodiment of the optoelectronic lighting device 100 , In this case, a plurality of ICs are arranged in the optoelectronic light-emitting device 100. One recognizes a drive device designed as a driver module here 40 and another IC chip 90 , For example, the driver chip represents a microcontroller and the second IC chip 90 a data bus driver IC, which is available as a standard device and only special tasks, such as LED driver and switch functions for the switch elements 60 takes over. It is also conceivable that switch Components 60 in the driving device 40 to integrate. In the illustrated chip-on-board approach, such a system-in-a-package (SiP) is possible. It is also recognizable that at the bottom of a series of vias 81 in the circuit board 80 are formed, over the for the opto-electronic lighting device 100 an effective heat sink is integrated.

6 shows a plan view of a further embodiment of the optoelectronic lighting device 100 , It can be seen here that the PI contacts 71 between the LED chips 11 . 21 and 31 are laid. As a result, small distances from LED chip center to LED chip center can be realized. Preferably, a distance between LED chip center to LED chip center is smaller than twice the chip edge length of the larger LED chip, wherein in the case of 6 all LED chips 11 . 21 . 31 are the same size.

Shown in 6 Dimensions, the size ratios of the individual dimensions of the individual elements of the optoelectronic light-emitting device 100 at a 130 μm pitch of the LED chips 11 . 21 . 31 to indicate. As a result, many small, discrete LED chips having a chip edge length of preferably <200μm are electrically isolated from each other on an IC, with PI contacts each chip top contact being individually wired to the IC. In this way, a light mixture of eg red, green and blue can be realized locally with a size scale that is significantly reduced compared to conventional dimensions. Through-connections are not located in the LED chip assembly field, but only outside the LED chip assembly field. Alternatively or additionally, contact elements can also be used as via elements, for example made of aluminum, copper, silicon (not shown).

7 shows a schematic view of a bottom of an optoelectronic lighting device 100 , As in 7 a total of four exemplary pads 82a..d for supplying the electrical supply voltage U _B , of ground potential (pads 82a , 82b) and data signals (pads 82c , 82d). Said connection surfaces 82 are preferably designed as metallization surfaces, wherein a connection for a data bus is provided for the transmission of data signals, via which serial data can be transmitted to the activation device 40.

In this way, a user has the option of own configuration programs for the computer device of the control device 40 to create and in this way a performance of the optoelectronic lighting device 100 to train as desired. In this way, for example, a brightness and / or color specification, for example in the form of flashing, brightness and / or color lamps, etc. for the LED chips can be realized.

In order to obtain as homogeneous a color impression as possible, the LED chips 11 . 21 . 31 the optoelectronic light-emitting device 100 arranged so mixed that in each case differently colored LED chips are arranged in vertical and horizontal, ie in each case orthogonal alignment to each LED chip direction. This is in the 8th and 9 with two exemplary configurations with green (G), red (R) and blue (B) LED chips. A total of eighteen LED chips can be approximately square in a 4 × 4 + 2 arrangement according to 8th or oblong in a 3 × 6 arrangement according to 9 Arrange. As a result, the most homogeneous possible color impression of the optoelectronic lighting device is even with a short viewing distance 100 supported.

10 shows a basic flow diagram of an embodiment of a proposed method for operating an optoelectronic lighting device 100 ,

In a step 200, a detection of a voltage level of an electric supply voltage U _B carried out.

In a step 210, an operation of at least one group is performed 10 . 20 . 30 of mutually interconnectable LED chips 11 . 21 . 31 performed such that the LED chips 11, 21, 31 in such a way to the electrical supply voltage U _B be turned on, that depends on the voltage level of the electrical supply voltage U _B a voltage difference between the electrical supply voltage U _B and a voltage drop across the group of LED chips interconnected with each other 11 . 21 . 31 is minimized.

The assignment can be made, for example, via a table which, given a supply voltage U _B the circuit states show, done (so-called look-up table).

In summary, the present invention proposes an optoelectronic lighting device which has an optimized operating behavior with minimized electrical and thermal power loss.

Although the invention has been further illustrated and described in detail by the preferred embodiment, the invention is not limited by the disclosed examples, and other variations can be derived therefrom by those skilled in the art without departing from the scope of the invention.

LIST OF REFERENCE NUMBERS

10

1st group

11

LED chips

20

2nd group

21

LED chips

22

subgroup

23

subgroup

30

3rd group

31

LED chips

40

driving means

50

power source

60

switching element

70

contacting

71

PI Contact

72

PI Durchkontaktieruntg

73

IC metallization

74

wire contact

75

molding compound

80

circuit board

81

via

82a, b

Connection surface supply

82c, d

Connection area supply / data

90

IC module

100

Opto-electronic lighting device

200 ... 210

steps

U _B

supply voltage

U _f

forward voltage

Claims (15)

An optoelectronic lighting device (100), comprising: - two contacts (1, 2; 82a, 82b; 82c, 82d) for connection to an electrical supply voltage (U _B ); - At least one group (10, 20, 30) of mutually defined interconnected LED chips (11, 21, 31), which is connected via a line network to the electrical supply voltage (U _B ) switchable; - Wherein at least one group of mutually defined interconnected LED chips (11, 21, 31) via a defined number of electrical power sources (50) to the supply voltage (U _B ) is switchable; - A driving means (40) for the at least one group (10, 20, 30) of mutually defined interconnected LED chips (11, 21, 31), which is designed, depending on the voltage level of the supply voltage (U _B ), the LED chips (11, 21, 31) interconnect with each other such that a voltage difference between the electrical supply voltage (U _B ) and a voltage drop across the at least one group (10, 20, 30) of the LED chips (11, 21, 31) which can be interconnected in a defined manner is minimized. Optoelectronic lighting device (100) according to Claim 1 characterized in that a number of the LED chips (11, 21, 31), which can be interconnected in a defined manner, are dependent on currents which are driven by the electrical current sources (50) through the LED chips (11, 21, 31). Optoelectronic lighting device (100) according to Claim 1 or 2 , characterized in that the LED chips (11, 21, 31) by means of the drive means (40) provided switch elements (60) are switchable, wherein the LED chips (11, 21, 31) in parallel and / or in series between the Contacts (1, 2) of the supply voltage (UB) are switchable. Optoelectronic lighting device (100) according to one of Claims 1 to 3 , characterized in that the electrical current sources (50) by means of the drive means (40) are controllable. Optoelectronic lighting device (100) according to one of Claims 2 to 4 , characterized in that the drive means (40) is designed as an electronic driver module. Optoelectronic light-emitting device (100) according to one of the preceding claims, characterized in that LED chips (11, 21, 31) of at least one group (10, 20, 30) are arranged in at least two sub-groups (22, 23), each sub-group (22, 23) comprises a defined number of serially connectable LED chips (21), wherein the interconnection of the LED chips of each subgroup (22, 23) by means of the switch elements (60) is synchronously feasible. Optoelectronic light-emitting device (100) according to one of the preceding claims, characterized in that a first group (10) of the mutually defined interconnected LED chips (11, 21, 31) red LED chips (11), a second group (20) green LED chips (21) and a third group (30) comprises blue LED chips (31). Optoelectronic light-emitting device (100) according to one of the preceding claims, characterized in that the LED chips (11, 21, 31) are arranged on a surface of the drive device (40). Optoelectronic lighting device (100) according to Claim 8 , characterized in that a distance from the LED chip center to the LED chip center is smaller than a double chip length of an LED chip (11, 21, 31). Optoelectronic lighting device (100) according to Claim 8 or 9 , characterized in that orthogonal to each LED chip (11, 21, 31) adjacent to a different color LED chip (11, 21, 31) is arranged. Optoelectronic light-emitting device (100) according to any one of the preceding claims, characterized in that the drive device (40) is arranged on a printed circuit board (80), wherein on the printed circuit board (80) from each other isolated contact surfaces (82) provided for an electrical supply and data lines are. Optoelectronic lighting device (100) according to Claim 11 , characterized in that the arrangement of LED chips (11, 21, 31), drive means (40) and printed circuit board (80) by a molding compound (75) is enclosed. Optoelectronic lighting device (100) according to Claim 11 or 12 , characterized in that by means of plated-through holes (72) contacts on electrodes of the LED chips (11, 21, 31) are electrically contacted. Optoelectronic light-emitting device (100) according to any one of the preceding claims, characterized in that by means of a software program of the drive means (40) an operating characteristic of the LED chips (11, 21, 31) is defined changeable. A method of operating an opto-electronic lighting device (100), comprising the steps of: - detecting a voltage level of an electrical supply voltage (UB); and - Operating at least one group (10, 20, 30) of LED chips (11, 21, 31) which can be interconnected in a defined manner such that the LED chips (11, 21, 31) are connected to the electrical supply voltage (UB) in such a way in that, depending on the voltage level of the electrical supply voltage (UB), a voltage difference between the electrical supply voltage (UB) and a voltage drop across the group of LED chips (11, 21, 31) connected to one another in a defined manner is minimized.

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