CN202957241U - Light source structure - Google Patents
Light source structure Download PDFInfo
- Publication number
- CN202957241U CN202957241U CN201220569136.0U CN201220569136U CN202957241U CN 202957241 U CN202957241 U CN 202957241U CN 201220569136 U CN201220569136 U CN 201220569136U CN 202957241 U CN202957241 U CN 202957241U
- Authority
- CN
- China
- Prior art keywords
- light
- heat
- source structure
- conducting substrate
- control element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 78
- 239000004020 conductor Substances 0.000 claims description 34
- 239000003292 glue Substances 0.000 claims description 22
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 230000007704 transition Effects 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 3
- 238000009826 distribution Methods 0.000 abstract description 13
- 238000013461 design Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 4
- 238000012546 transfer Methods 0.000 abstract description 2
- 239000003566 sealing material Substances 0.000 abstract 2
- 238000004026 adhesive bonding Methods 0.000 abstract 1
- 230000010354 integration Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 9
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229910001074 Lay pewter Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010957 pewter Substances 0.000 description 1
- 229910000498 pewter Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Led Device Packages (AREA)
Abstract
The utility model provides a light source structure, including heat conduction base plate, emitting diode component, control element, inside wire, first external lead, second external lead and seal the material of gluing. The heat conducting substrate comprises a first surface and a second surface, wherein the first surface is provided with a transfer pad. The light emitting diode device and the control device capable of receiving the input of the full voltage range are disposed on the first surface. The internal lead is connected with the control element and the light-emitting diode element. The first and second pairs of external wires connect the pad to the LED element or the control element, respectively. The sealing material containing light distribution design is arranged on the first surface and used for integrating the light-emitting diode element, the control element with the capability of receiving full-voltage range input, the lead and the switching pad into a whole, so that the whole system integration is achieved, and the sealing material also has good compatibility and adaptability to various application occasions.
Description
Technical field
The utility model relates to a kind of light-source structure, relates in particular to a kind of light-source structure of light-emitting diode.
Background technology
In recent years, light-emitting diode (Light Emitting Diode, be called for short LED) is little by its volume, power saving and durable advantage, becomes gradually the main flow of illumination market.In addition, the operating voltage of light-emitting diode low (only 1.5-3V), can active illuminating and there is certain brightness, brightness voltage available or electric current are regulated, possess shock-resistant, anti-vibration, the characteristics in life-span long (100,000 hours) simultaneously, so be widely used in various terminal equipments, from car headlamp, traffic lights, indicator by character, billboard and large screen display, to fields such as architectural lighting and LCD backlights, all can see the application of light-emitting diode light source structure.
In daily life, usining light-emitting diode as the light-source structure of light source, is for example a light emitting diode bulb, often with a plurality of light-emitting diodes, be arranged on a substrate, and an external control element and one drive circuit.Yet, in this type of known light-source structure, light-emitting diode and control element, drive circuit etc. all divide and be arranged, assembling is high with cost of manufacture, and the structure that is unfavorable for light-source structure is simplified with microminiaturization and developed.
On the other hand, the temperature of light source module after long-time running is higher, needs the additional configuration radiator, to avoid overheated problem.Yet arranging equally of this radiator simplified with microminiaturization etc. and caused burden assembling, cost of manufacture, the structure of light source module.
The utility model content
In view of this, the utility model provides a kind of light-source structure, integrate light-emitting diode with control element in same encapsulation module, contribute to improve the element integrated level, save and assemble and cost of manufacture, and the structure that is conducive to light-source structure is simplified with microminiaturization and is developed.
The utility model provides a kind of light-source structure, does not need additional radiator just can have good radiating effect.
The utility model provides a kind of light-source structure, comprises a heat-conducting substrate, a plurality of light-emitting diode, a control element, many inner leads, at least one first pair of outer conductor, at least one second pair of outer conductor and seal glues.Heat-conducting substrate comprises a first surface and with respect to a second surface of first surface, and heat-conducting substrate has one first switching pad and one second switching pad, and the first switching pad and the second switching pad are positioned on first surface.In addition, heat-conducting substrate also has one first external contact and one second external contact, and wherein the first external contact is electrically connected to the first switching pad, and the second contact is electrically connected to the second switching pad.A plurality of light-emitting diodes are configured on first surface.Having the control element that receives the full voltage range input capability is configured on first surface.Many inner lead is connected between control element and light-emitting diode.At least one first pair of outer conductor is connected to or control element in light-emitting diode by the first switching pad.At least one second pair of outer conductor is connected to or control element in light-emitting diode by the second switching pad.The seal glue that comprises the luminous intensity distribution design is configured on first surface, in order to cover light-emitting diode, control element, inner lead, the first switching pad, the second switching pad, at least one first pair of outer conductor and at least one second pair of outer conductor.
In an embodiment of the present utility model, above-mentioned control element is suitable for receiving the direct voltage of 12 to 48 volts, or the alternating voltage of 90 to 260 volts.
In an embodiment of the present utility model, above-mentioned the first external contact and the second external contact are positioned on the first surface of heat-conducting substrate, and are positioned at outside seal glue.
In an embodiment of the present utility model, the first above-mentioned external contact is positioned on the second surface of heat-conducting substrate, and heat-conducting substrate also has one first conduction duct and run through heat-conducting substrate, and is connected electrically between the first switching pad and the first external contact.
In an embodiment of the present utility model, the second above-mentioned external contact is positioned on the second surface of heat-conducting substrate, and heat-conducting substrate also has one second conduction duct and run through heat-conducting substrate, and is connected electrically between the second switching pad and the second external contact.
In an embodiment of the present utility model, above-mentioned heat-conducting substrate is metal substrate, ceramic substrate or silicon substrate.
In an embodiment of the present utility model, above-mentioned light-source structure also comprises an adhesion coating, is configured between control element and first surface and between light-emitting diode and first surface.
In an embodiment of the present utility model, above-mentioned adhesion coating comprises brazing metal.
In an embodiment of the present utility model, above-mentioned light-emitting diode comprises a plurality of light-emitting diode chip for backlight unit of mutual series connection.
In an embodiment of the present utility model, above-mentioned light-source structure also comprises a smooth transition layer, is configured between seal glue and light-emitting diode chip for backlight unit.
In an embodiment of the present utility model, above-mentioned light-source structure, also comprise a plurality of smooth transformed particles, is positioned at seal glue.
In an embodiment of the present utility model, the outer surface of above-mentioned seal glue is one or more curved surfaces.
Based on above-mentioned, light-source structure of the present utility model is arranged on light-emittingdiode diode element and control element with full voltage range input capability on same heat-conducting substrate, by heat-conducting substrate, to light-emittingdiode diode element and control element, to provide good radiating effect.In addition, in light-emittingdiode diode element and control element outside, cover the seal glue (being for example the combination of single curved surface or a plurality of curved surfaces) with luminous intensity distribution design, the light distribution effect that also can reach, but make the light-source structure monomer directly apply.Light-source structure of the present utility model, reach electric connection by inner lead between its light-emittingdiode diode element and control element, and be encapsulated in same module, contributes to improve the element integrated level.Light-source structure of the present utility model not more external other control elements can operate, reach the purpose of the integrated simplified system of total system, in addition, when the light-source structure of application utility model when coordinating the light fixture of other light projectors or luminous intensity distribution design, because the seal glue of body has had light distribution effect, follow-up luminous intensity distribution is comparatively easy, also can reach the function of simplification system.Therefore all there is good compatibility and adaptability for various application scenarios.
For above-mentioned feature and advantage of the present utility model can be become apparent, special embodiment below, and shown in coordinating, accompanying drawing is described in detail below.
The accompanying drawing explanation
The stereogram of the light-source structure that Figure 1A is an embodiment of the present utility model;
Figure 1B is the profile of Figure 1A along A-A ' line segment;
The stereogram of the light-source structure that Fig. 2 is another embodiment of the utility model;
The stereogram of the light-source structure that Fig. 3 is the another embodiment of the utility model;
The stereogram of the light-source structure that Fig. 4 A is the utility model one embodiment;
Fig. 4 B is the profile of Fig. 4 A along I-I ' line segment;
The stereogram of the light-source structure that Fig. 5 A is another embodiment of the utility model;
Fig. 5 B is the profile of Fig. 5 A along II-II ' line segment;
The enlarged drawing of the dashed region that Fig. 6 is Fig. 5 B;
Fig. 7 illustrates the internal structure schematic diagram of a kind of light-emitting diode of the present utility model.
Description of reference numerals:
100: light-source structure;
110: heat-conducting substrate;
112: first surface;
113: the first switching pads;
114: second surface;
115: the second switching pads;
116: the first external contacts;
118: the second external contacts;
119a: connection line;
119b: connection line;
120: light-emitting diode;
130: control element;
140: inner lead;
150: the first pairs of outer conductors;
155: the second pairs of outer conductors;
160: seal glue;
162: the light transition layer;
170: adhesion coating;
200: light-source structure;
220a: light-emitting diode;
250: the first pairs of outer conductors;
255: the second pairs of outer conductors;
300: light-source structure;
320a: light-emitting diode;
350: the first pairs of outer conductors;
355: the second pairs of outer conductors;
400: light-source structure;
410: heat-conducting substrate;
412: first surface;
414: second surface;
416: the first external contacts;
416a: the first conduction duct;
418: the second external contacts;
418a: the second conduction duct;
500: light-source structure;
510: heat-conducting substrate;
512: first surface;
514: second surface;
516: the first external contacts;
516a: the first conduction duct;
516b: insulating barrier;
516c: conductive material;
516d: perforation;
517: the three switching pads;
518: the second external contacts;
518a: the second conduction duct;
519: the four switching pads;
519a: connection line;
519b: connection line;
700: light-emitting diode;
710: light-emitting diode chip for backlight unit.
Embodiment
The stereogram of the light-source structure that Figure 1A is an embodiment of the present utility model.Figure 1B is the profile of Figure 1A along A-A ' line segment.Please refer to Figure 1A and Figure 1B.The light-source structure 100 of embodiment of the present utility model comprises a heat-conducting substrate 110, a plurality of light-emitting diode 120, a control element 130, many inner leads 140, at least one first pair of outer conductor 150, at least one second pair of outer conductor 155 and seal glues 160.Heat-conducting substrate 110 comprises a first surface 112 and with respect to a second surface 114 of first surface 112, and heat-conducting substrate 110 has one first switching pad 113 and 1 second switching pad 115, the first switching pad the 113 and second switching pads 115 and all is positioned on first surface 112.
Heat-conducting substrate 110 has one first external contact 116 and one second external contact 118, be connected to external circuit for heat-conducting substrate 110, wherein the first external contact 116 is electrically connected to the first switching pad 113, and the second external contact 118 is electrically connected to the second switching pad 115.The first external contact 116 and the first switching pad 113 are by a connection line 119a conducting, and the second external contact 118 and the second switching pad 115 are also by a connection line 119b conducting.This connection line 119a, 119b can be the top layer circuit of heat-conducting substrate 110, or, when heat-conducting substrate 110 is multilayer circuit board, can be the intraconnections of heat-conducting substrate 110 internal layers.The first switching pad 113 is connected to control element 130 by first pair of outer conductor 150.Second pair of outer conductor 155 can be connected to control element 130 by the second switching pad 115.
Light-emitting diode 120 and there is the control element 130 that receives the full voltage range input capability and be arranged on the first surface 112 of heat-conducting substrate 110, and by many inner leads 140, interconnect respectively.Because heat-conducting substrate 110 has good thermal conductivity, the heat that therefore control element 130 of light-emitting diode 120 and tool reception full voltage range input capability can be produced after long-time running conducts to light-source structure 100 outsides, to maintain the normal operation of light-source structure 100.Described control element 130 has the full voltage range of reception input capability, is for example to receive a direct current voltage of 12 to 48 volts, or an alternating voltage of 90 to 260 volts.The available heat-conducting substrate 110 of the present embodiment is such as being the substrate that metal substrate (as copper base or aluminium base), ceramic substrate or silicon substrate etc. have the high thermal conductivity coefficient material.
In addition, as shown in Figure 1B, between light-emitting diode 120 and heat-conducting substrate 110 and between control element 130 and heat-conducting substrate 110, adhesion coating 170 can be set respectively, so that light-emitting diode 120 and control element 130 are fixed on heat-conducting substrate 110.Adhesion coating 170 is for example brazing metal, comprise tin, leypewter or tin pewter etc., and being followed to technology (Surface Mount Technology is called for short SMT) with surface, light-emitting diode 120 and control element 130 be engaged to heat-conducting substrate 110.Use brazing metal can make between light-emitting diode 120 and heat-conducting substrate 110 and between control element 130 and heat-conducting substrate 110 to have good thermal conductance thermal effect as adhesion coating 170.
Certainly, the utility model does not limit the material of adhesion coating and the juncture of light-emitting diode 120 and control element 130.At this, can apply any applicable prior art light-emitting diode 120 and control element 130 are engaged to heat-conducting substrate 110.
In addition, seal glue 160 is configured on the first surface 112 of heat-conducting substrate 110, in order to cover light-emitting diode 120, control element 130, inner lead 140, first switching pad the 113, second switching 115, first pairs of outer conductors 150 of pad and second pair of outer conductor 155.Seal glue 160 described herein can or go out the demand of light effect according to rising angle, is designed to have the external form of light distribution effect, one or more curved surface, is consisted of.By the setting of seal glue 160, can avoid extraneous aqueous vapor, air to invade light-source structure 100 inside, and can avoid the element of light-source structure 100 inside damaged by external impacts.
On the other hand, for for example, demand in response to using upper (white light output), also a smooth transition layer 162 can be set between seal glue 160 and light-emitting diode 120, convert the light output of required wavelength in order to the light output of specific wavelength that light-emitting diode 120 is sent to.For example, in the present embodiment, light transition layer 162 is for example a fluorescent layer, and light-emitting diode 120 is for example blue light diode.The blue light that light-emitting diode 120 sends can be converted to gold-tinted by light transition layer 162, and again with remaining blue light mixed light after, become white light output.In addition, in the unshowned embodiment of the utility model, also can be chosen in seal glue inside a plurality of smooth transformed particles (for example phosphor powder) are set, to replace aforementioned smooth transition layer 162.
When light-source structure 100 passes through the first external contact 116 and the second external contact 118 external power supply, drive current can pass through first external contact the 116, second external contact 118, connection line 119a, connection line 119b, 115, first pairs of outer conductors of the first switching pad 113,1 second switching pad 150, second pair of outer conductor 155 and inner lead 140, enter corresponding control element 130 or light-emitting diode 120, by control element 130, to drive light-emitting diode 120 luminous.
Yet the utility model does not limit the annexation between related elements, wire and connection pad (contact).Although in the aforementioned embodiment, first pair of outer conductor 150 connects the first switching pad 113 and control element 130, and second pair of outer conductor 155 connects the second switching pad 115 and control element 130, but the utility model also can be selected will transfer to pad by wire to be connected on light-emitting diode, directly light-emitting diode controlled or to be powered.Below for several embodiment, possible connected mode is described again.
The stereogram of the light-source structure that Fig. 2 is another embodiment of the utility model.In the light-source structure 200 of the present embodiment, first pair of outer conductor 250 is connected to light-emitting diode 220a by the first switching pad 113, and second pair of outer conductor 255 is connected to control element 130 by the second switching pad 115.So, power supply or the signal by the first external contact 116 inputs can enter light-emitting diode 220a, or be delivered to control element 130 by light-emitting diode 220a again by connection line 119a, 113, first pairs of outer conductors 250 of the first switching pad.
The stereogram of the light-source structure that Fig. 3 is the another embodiment of the utility model.In the light-source structure 300 of the present embodiment, first pair of outer conductor 350 and second pair of outer conductor 355 are connected to different light-emitting diode 320a by the first switching pad 113 and the second switching pad 115 respectively.So, power supply or the signal by the first external contact 116 inputs can enter light-emitting diode 320a, or be delivered to control element 130 by light-emitting diode 320a again by connection line 119a, 113, first pairs of outer conductors 350 of the first switching pad.
The utility model also can change the position of external contact on heat-conducting substrate.In fact, along with the difference of heat-conducting substrate type and the demands such as juncture of light-source structure, externally contact may be positioned at upper surface or the lower surface of heat-conducting substrate.The stereogram of the light-source structure that Fig. 4 A is the utility model one embodiment.Fig. 4 B is the profile of Fig. 4 A along I-I ' line segment.The main difference of the embodiment of the shown embodiment of Fig. 4 A and Fig. 1 is: the first external contact 416 and the second external contact 418 are separately positioned on the second surface 414 of heat-conducting substrate 410.So, be conducive to light-source structure 400 and follow the technology direct-assembling to the outside circuit elements such as circuit board by surface.In addition, as shown in Figure 4 B, in order to reach the electric connection of corresponding first switching pad the 113 and second switching pad 115 on the first external contact 416 and the second external contact 418 and first surface 412, the present embodiment is chosen in the first vertical conduction duct 416a of heat-conducting substrate 410 making and the second conduction duct 418a.The first conduction duct 416a and the second conduction duct 418a run through heat-conducting substrate 410, in order to connect respectively the corresponding first external contact 416 and first switching pad the 113 and second external contact 418 and the second switching pad 115.In the present embodiment, the first external contact 416 and the second external contact 418 correspondences be positioned at the first switching pad 113 and the second switching pad 115 under, and directly by the first conduction duct 416a and the second conduction duct 418a mutual conduction.
The stereogram of the light-source structure that Fig. 5 A is another embodiment of the utility model.Fig. 5 B is the profile of Fig. 5 A along II-II ' line segment.The embodiment of Fig. 5 A and Fig. 4 A Main Differences are, the light-source structure 500 of the present embodiment, its first external contact 516 and the second external contact 518 are arranged on the second surface 514 of heat-conducting substrate 510, and the first external contact 516 and the projected position of the second external contact 518 on first surface 512 all with the first switching pad 113 and the second switching pad 115 zero laps.
The electric connection of in order to reach the first external contact 516 and the second external contact 518 and corresponding the first switching, padding the 113 and second switching pad 115, the present embodiment is chosen on the first surface 512 of heat-conducting substrate 510 and is provided with one the 3rd switching pad 517 and 1 the 4th switching pad 519, and with the first external contact 516 and the second external contact 518, the projected position on first surface 512 has overlappingly the 3rd switching pad the 517 and the 4th switching pad 519 respectively, therefore can make vertical one first at heat-conducting substrate 510, conducts electricity duct 516a and one second and conducts electricity duct 518a.The first conduction duct 516a and the second conduction duct 518a run through heat-conducting substrate 510, connect respectively the corresponding first external contact 516 and the 3rd switching pad the 517 and second external contact 518 and the 4th switching pad 519.In addition, between the first switching pad the 113 and the 3rd switching pad 517, and the second switching pad 115 and the 4th is transferred between padding 519 and also can be connected by connection line 519a, 519b.This connection line 519a, 519b can be the top layer circuit of heat-conducting substrate 510, or the intraconnections of heat-conducting substrate 510 internal layers.
On the other hand, may there be along with the Change of types of heat-conducting substrate different structures in the conduction duct of aforementioned proposition.The enlarged drawing of the dashed region that for example, Fig. 6 is Fig. 5 B.At this, the material of heat-conducting substrate 510 is for example a metal substrate (being for example aluminium base or copper base) or silicon substrate.Because metal substrate or silicon substrate have conductivity, therefore in the processing procedure of the first conduction duct 516a, must be at perforation 516d inwall coating insulating barrier 516b, to avoid the first conduction duct 516a and heat-conducting substrate 510 conductings, then insert conductive material 516c to form the first conduction duct 516a in perforation 516d.
Although previous embodiment has been introduced the switching pad that connects the heat-conducting substrate levels with conductive through hole and the external mode of contact, in fact the utility model also can be applied any possible mode and reaches being electrically connected to of switching pad and external contact.For example, in unshowned embodiment, can come by the line layer on heat-conducting substrate inside or top layer conducting external connector and switching pad.
Fig. 7 illustrates the internal structure schematic diagram of a kind of light-emitting diode of the present utility model, and wherein light-emitting diode 700 is for example to be in series by a plurality of light-emitting diode chip for backlight unit 710.The light-emitting diode chip for backlight unit 710 of described series connection is for example a high-voltage LED (HV LED), can have preferably luminous efficiency and durability.Certainly, in other not shown embodiment of the utility model, light-emitting diode can be only also single light-emitting diode chip for backlight unit.In addition, light-emitting diode 700 can be White light-emitting diode element or monochromatic light (as blue light) light-emitting diode.
In sum, light-source structure of the present utility model is arranged on light-emitting diode and control element with full voltage range input capability on same heat-conducting substrate, by heat-conducting substrate, to light-emitting diode and control element, to provide good radiating effect.In addition, in light-emitting diode and control element outside, cover the seal glue (being for example the combination of curved surface or a plurality of curved surfaces) with luminous intensity distribution design, the light distribution effect also reached, but make the light-source structure monomer directly apply.Light-source structure of the present utility model, reach electric connection by inner lead between its light-emitting diode and control element, and be encapsulated in same module, contributes to improve the element integrated level.Light-source structure of the present utility model not more external other control elements can operate, reach the purpose of the integrated simplified system of total system.In addition, when application light-source structure of the present utility model, when coordinating the light fixture of other light projectors or luminous intensity distribution design, because the seal glue of body has had light distribution effect, follow-up luminous intensity distribution is comparatively easy, also can reach the function of simplification system.Therefore all there is good compatibility and adaptability for various application scenarios.
Finally it should be noted that: above each embodiment, only in order to the technical solution of the utility model to be described, is not intended to limit; Although with reference to aforementioned each embodiment, the utility model is had been described in detail, those of ordinary skill in the art is to be understood that: its technical scheme that still can put down in writing aforementioned each embodiment is modified, or some or all of technical characterictic wherein is equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution break away from the scope of each embodiment technical scheme of the utility model.
Claims (10)
1. a light-source structure, is characterized in that, comprising:
One heat-conducting substrate, comprise a first surface and with respect to a second surface of this first surface, this heat-conducting substrate has one first switching pad, one second switching pad, this the first switching pad and this second switching pad are positioned on this first surface, this heat-conducting substrate also has one first external contact and one second external contact, wherein this first external contact is electrically connected to this first switching pad, and this second external contact is electrically connected to this second switching pad;
A plurality of light-emitting diodes, be configured on this first surface;
One control element, be configured on this first surface, and have the full voltage range of reception input capability;
Many inner leads, be connected between this control element and those light-emitting diodes;
At least one first pair of outer conductor, be connected to or this control element in those light-emitting diodes by this first switching pad;
At least one second pair of outer conductor, be connected to or this control element in those light-emitting diodes by this second switching pad; And
One seal glue, be configured on this first surface, in order to cover those light-emitting diodes, this control element, those inner leads, this first switching pad, this second switching pad, this at least one first pair of outer conductor and this at least one second pair of outer conductor.
2. light-source structure according to claim 1, is characterized in that, this control element is suitable for receiving a direct current voltage of 12 to 48 volts, or an alternating voltage of 90 to 260 volts.
3. light-source structure according to claim 1, is characterized in that, this first external contact and this second external contact are positioned on this first surface of this heat-conducting substrate, and are positioned at outside this seal glue.
4. light-source structure according to claim 1, it is characterized in that, this first external contact is positioned on this second surface of this heat-conducting substrate, and this heat-conducting substrate also has one first conduction duct and run through this heat-conducting substrate, and is connected electrically between this first switching pad and this first external contact.
5. light-source structure according to claim 3, it is characterized in that, this second external contact is positioned on this second surface of this heat-conducting substrate, and this heat-conducting substrate also has one second conduction duct and run through this heat-conducting substrate, and is connected electrically between this second switching pad and this second external contact.
6. light-source structure according to claim 1, is characterized in that, also comprises an adhesion coating, is configured between this control element and this first surface and between those light-emitting diodes and this first surface.
7. light-source structure according to claim 1, is characterized in that, each light-emitting diode comprises a plurality of light-emitting diode chip for backlight unit of mutual series connection.
8. light-source structure according to claim 1, is characterized in that, also comprises a smooth transition layer, is configured between this seal glue and those light-emitting diode chip for backlight unit.
9. light-source structure according to claim 1, is characterized in that, also comprises a plurality of smooth transformed particles, is positioned at this seal glue.
10. light-source structure according to claim 1, is characterized in that, the outer surface of this seal glue is one or more curved surface.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101211019U TWM443935U (en) | 2012-06-07 | 2012-06-07 | Light source structure |
| TW101211019 | 2012-06-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202957241U true CN202957241U (en) | 2013-05-29 |
Family
ID=48089699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201220569136.0U Expired - Fee Related CN202957241U (en) | 2012-06-07 | 2012-10-31 | Light source structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN202957241U (en) |
| TW (1) | TWM443935U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104377195A (en) * | 2013-08-16 | 2015-02-25 | 弘凯光电(深圳)有限公司 | LED light-emitting device |
| CN105575956A (en) * | 2015-12-31 | 2016-05-11 | 中国科学院半导体研究所 | Light emitting diode (LED) chip integration package module and package method |
| DE102017103294A1 (en) | 2017-02-17 | 2018-08-23 | Osram Opto Semiconductors Gmbh | OPTOELECTRONIC LIGHTING DEVICE AND METHOD FOR OPERATING AN OPTOELECTRONIC LIGHTING DEVICE |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105895756B (en) * | 2016-05-16 | 2018-09-18 | 华南师范大学 | Multi-electrode visible light communication light emission device and preparation method thereof |
-
2012
- 2012-06-07 TW TW101211019U patent/TWM443935U/en not_active IP Right Cessation
- 2012-10-31 CN CN201220569136.0U patent/CN202957241U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104377195A (en) * | 2013-08-16 | 2015-02-25 | 弘凯光电(深圳)有限公司 | LED light-emitting device |
| CN105575956A (en) * | 2015-12-31 | 2016-05-11 | 中国科学院半导体研究所 | Light emitting diode (LED) chip integration package module and package method |
| CN105575956B (en) * | 2015-12-31 | 2017-11-17 | 中国科学院半导体研究所 | LED chip integrating packaging module and method for packing |
| DE102017103294A1 (en) | 2017-02-17 | 2018-08-23 | Osram Opto Semiconductors Gmbh | OPTOELECTRONIC LIGHTING DEVICE AND METHOD FOR OPERATING AN OPTOELECTRONIC LIGHTING DEVICE |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM443935U (en) | 2012-12-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103180661B (en) | Lamp and lighting device | |
| US7777237B2 (en) | Semiconductor light-emitting device and method of fabricating the same | |
| JP2015035598A (en) | Light-emitting device, light source for illumination using the same, and illumination device | |
| US20120300430A1 (en) | Light-emitting module and lighting apparatus | |
| CN202957241U (en) | Light source structure | |
| TWM437919U (en) | Light emission device | |
| US9297500B2 (en) | Light emitting module, lighting device, and lighting apparatus | |
| CN203836632U (en) | Straight pipe lamp and illuminating device | |
| CN104114941A (en) | Luminous module printed circuit board | |
| US20080303050A1 (en) | Light emitting module | |
| US9200766B2 (en) | Lighting fixture | |
| US20170122545A1 (en) | Light module and lamp thereof | |
| TWM486007U (en) | Light-emitting components and light-emitting device | |
| CN104896324B (en) | Illumination light source and lighting device | |
| CN203223777U (en) | Illuminating device | |
| TW201204975A (en) | LED tube and drive circuit | |
| CN101504938A (en) | LED encapsulation structure and LED encapsulation method | |
| JP6827195B2 (en) | Luminous module and lighting equipment | |
| CN204611395U (en) | Lamp device and lighting device | |
| TW201445222A (en) | Light source device adapted to a direct-type backlight module and display device | |
| US8633639B2 (en) | Multichip package structure and light bulb of using the same | |
| CN202691653U (en) | LED (light emitting diode) module | |
| CN103423617A (en) | Light emitting diode module | |
| CN201708153U (en) | Laminated encapsulation structure of LED module | |
| CN221526347U (en) | LED filament light source module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130529 Termination date: 20161031 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |