TWM443935U - Light source structure - Google Patents

Light source structure Download PDF

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Publication number
TWM443935U
TWM443935U TW101211019U TW101211019U TWM443935U TW M443935 U TWM443935 U TW M443935U TW 101211019 U TW101211019 U TW 101211019U TW 101211019 U TW101211019 U TW 101211019U TW M443935 U TWM443935 U TW M443935U
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TW
Taiwan
Prior art keywords
light
light source
source structure
emitting diode
substrate
Prior art date
Application number
TW101211019U
Other languages
Chinese (zh)
Inventor
Kuo-Tso Chen
Original Assignee
Optromax Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Optromax Electronics Co Ltd filed Critical Optromax Electronics Co Ltd
Priority to TW101211019U priority Critical patent/TWM443935U/en
Priority to CN201220569136.0U priority patent/CN202957241U/en
Publication of TWM443935U publication Critical patent/TWM443935U/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating

Landscapes

  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

A light source structure including a heat conductive substrate, multiple LED devices, a control device, multiple inner conductive wires, a first external conductive wire, a second external conductive wire and an encapsulant is provided. The heat conductive substrate is provided with landing pads on a first surface thereof. The LED devices are disposed on the first surface together with the control device being adapted to wide input voltage range. The inner conductive wires are connected among the LED devices and the control device. The first landing pad and the second landing pad are connected to the LED devices or the control device via their corresponding external conductive wires. The encapsulant with light distribution design is disposed on the first surface, thereby the LED devices, the control device, the conductive wires and the landing pads are integrated as a whole, to achieve better compatibility and adjustability in various application fields.

Description

M443935 五、新型說明： 【新型所屬之技術領域】 本創作是有關於-種光源結構，且特別是有關於一種 發光二極體的光源結構。 【先前技術】 近年來’發光二極體（Light Emitting Diode，LED)藉 由其體積小、省電且耐用的優點，已逐漸成為照明市場的 主、/；il。此外，發光一極體的工作電壓低（僅1 5-3V")、能 主動發光且具有一疋壳度，壳度可用電壓或電流調節，同 時具備耐衝擊、抗振動、壽命長（1〇萬小時）之特點，所 以在各種終端設備中被廣泛使用，從汽車前照燈、交通信 號燈、文子顯示器 '看板及大螢幕視頻顯示器，到建築照 明和液晶顯示ϋ背料領域，都可見到發光二極體光源結 構的應用。 在日常生活十，以發光二極體作為光源的光源結構， 例如是-發光二極體燈泡，常以多個發光二極體設置於一 基板上，並外接-控制元件以及—驅動電路。然而，此類 已知的光源結财，贱二極體魅制元件、驅動電路等 二二巧V组裴與製作成本高，且不利於光源結構的結 構精簡與微型化發展。 需額U二ί源模組經過長時間運作後的溫度較高， 而額外配置放熱$ ’以避免過熱的 的設置同樣對光源模纽的^^ 此欣…裔 型化等造成負擔。 裝、製作成本、結構精簡與微 4 【發明内容】 鑑此，本創作提供 與控制元件於同—個封構，係整合發光二極體 度，節省組裝與製作成本^組内’有助於提高元件積集 與微型化發层。 並有利於光源結構的結構精簡 本創作提供一種光溽姓 良好的散熱效果。 、、，D構’不需外加散熱器便可具有 本創作提供一種光源站· 光二極體元件、-控制^構^括—導熱基板、多個發 對外導線、至少一第二對二f:条内部導線、至少-第- 對於第-表面的-第二表面，且導 =具:::一轉接塾以及-第二轉接墊，第-轉接塾 ^第—表面上。此外，導熱基板更具有 一弟一 f卜接點以及—第二對外接點，其中第-對外接點 電連接第―轉紐，而第二接點電連接第二職墊。多個 發光-極體讀配置於第—表面上。具有接收全電壓範圍 輸入能力的㈣元件配置於第—表面上。錄内部導線分 別連接於控制元件與發光二極體元件之間。至少一第一對 外導線將第一轉接墊連接至發光二極體元件中的一個或者 控制元件。至少一第二對外導線將第二轉接墊連接至發光 一極體元件中的一個或者控制元件。包含配光設計之封膠 材配置於第一表面上，用以覆蓋發光二極體元件、控制元 件、内部導線、第一轉接墊、第二轉接墊、至少一第一對 外導線以及至少一第二對外導線。 M443935 在本創作之一實施例中，上述之控制元件適於接收12 至48伏特的直流電壓，或是90至260伏特的交流電壓。 在本創作之一實施例中，上述之第一對外接點以及第 二對外接點位於導熱基板的第一表面上，且位於封膠材之 外。 在本創作之一實施例中，上述之第一對外接點位於導 熱基板的第二表面上，且導熱基板更具有一第一導電孔道 貫穿導熱基板’並且電連接於第一轉接墊與第一對外接點 之間。 在本創作之一實施例中，上述之第二對外接點位於導 熱基板的第一表面上，且導熱基板更具有一第二導電孔道 貫穿導熱基板’並且電連接於第二轉接墊與第二對外接點 之間。 在本創作之一實施例中，上述之導熱基板為金屬恭 板、陶瓷基板或矽基板。 —在本創作之一實施例中，上述之光源結構更包括一黏 著層，配置於控制元件與第—表面之間以及發光二極體元 件與第一表面之間。 在本創作之一實施例中，上述之黏著層包括金屬銲 料。 在本創作之一實施例中，上述之發光二極體元件包栝 相互串聯的多個發光二極體晶片。 在本創作之-實_巾，上述之光·構更包括一光 轉變層，配置於封膠材與發光二極體晶片之間。. M443935 在本創作之一實施例中’上述之光源結構，更包括多 個光轉變顆粒，位於封膠材内。 在本創作之一實施例中’上述之封膠材的外表面為一 個或多個曲面。 基於上述，本創作之光源結構將發光二極體元件以及 具有全電壓範圍輸入能力之控制元件設置在同一導熱基板 上，以藉由導熱基板來對發光二極體元件以及控制元件提 • 供良好的散熱效果。此外，在發光二極體元件以及控制元 件外部，覆蓋具有配光設計之封膠材(例如是單一曲面或多 個，面的結合體）’更可達到好的配光效果，使得光源結構 可單體直接應用。本創作之光源結構，其發光二極體元件 以及控制元件之間藉由内部導線達到電性連接，並且封裝 於同一模組内，有助於提高元件積集度。本創作之光源結 構不須再外接其他控制元件即可運作，達到全系統一體化 的精簡系統的目的，此外，當應用本創作之光源結構在配 合其他投光或配光设计之燈具時，因本體的封膠材已具有 鲁配光效果，後續的配光較為容易，更可達到簡化系統之功 能。因此對於各種應用場合皆具有良好的相容性與適應性。 為讓本創作之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式作詳細說明如下。 【實施方式】 圖1A為本創作之一實施例之光源結構的立體圖。圖 1B為圖1A沿著A-A’線段的剖面圖。請參考圖1A及圖 7 1B。本創作之實施例之光源結構1〇〇包括一導熱基板 110、多個發光二極體元件120、一控制元件13〇、多條内 部導線140、至少—第一對外導線150、至少一第二對外導 線155以及一封膠材16〇。導熱基板11〇包括一第一表面 112以及相對於第一表面112的一第二表面114，且導熱基 板11〇具有一第一轉接墊113以及一第二轉接墊115，第 一轉接墊113以及第二轉接墊115皆位於第一表面112上。 導熱基板110具有一第一對外接點116以及一第二對 外接點118，以供導熱基板no連接至外部電路，其中第 一對外接點116電連接第一轉接墊113，而第二對外接點 118電連接第二轉接墊115。第一對外接點116與第一轉接 塾113由一連接線路ii9a導通，第二對外接點118與第二 轉接墊115亦藉由一連接線路ii9b導通。此連接線路 119a、119b可為導熱基板11〇的表層線路，或是當導熱基 板110為多層線路板時，可為導熱基板11()内層的内連線。 第一轉接墊113藉由第一對外導線150連接至控制元件M443935 V. New description: [New technical field] This creation is about a kind of light source structure, and especially relates to a light source structure of a light-emitting diode. [Prior Art] In recent years, the Light Emitting Diode (LED) has gradually become the mainstay of the lighting market due to its small size, power saving and durability. In addition, the working voltage of the light-emitting body is low (only 1 5-3V"), can be actively illuminated and has a clamshell degree, and the shell degree can be adjusted by voltage or current, and has impact resistance, vibration resistance and long life (100,000). Hour), so it is widely used in various terminal equipment, from car headlights, traffic lights, text monitors 'kanbans and large screen video displays, to architectural lighting and liquid crystal display backing materials, you can see the light two The application of polar body light source structure. In daily life, a light source structure using a light-emitting diode as a light source, for example, a light-emitting diode bulb, is usually provided with a plurality of light-emitting diodes on a substrate, and an external-control element and a drive circuit. However, such known sources of light source, 贱 diode body components, drive circuits, etc., are costly to manufacture and are not conducive to the simplification and miniaturization of the structure of the light source structure. The U 2 source module has a higher temperature after a long period of operation, and the extra configuration of the exotherm $ ́ to avoid overheating also imposes a burden on the source of the light source. Installation, production cost, structure simplification and micro 4 [Invention content] In view of this, the creation provides the same component as the control component, which integrates the light-emitting diode, saving assembly and production costs. Improve component accumulation and miniaturization. And it is conducive to the structure of the light source structure. This creation provides a good heat dissipation effect. The D structure can be provided without a heat sink. The present invention provides a light source station, a light diode element, a control structure, a heat conduction substrate, a plurality of external conductors, and at least a second pair of two f: The inner wire, at least - the first surface of the first surface, and the second surface of the first surface, and the conductor::: a transfer 塾 and a second transfer pad, the first transfer surface. In addition, the heat-conducting substrate further has a first-in-one contact and a second external contact, wherein the first-outer contact is electrically connected to the first-turn, and the second contact is electrically connected to the second-level pad. A plurality of illuminating-polar body readings are disposed on the first surface. The (4) component having the input capability of receiving the full voltage range is disposed on the first surface. The internal conductors are connected between the control element and the LED component. At least one first pair of outer leads connects the first riser pad to one of the light emitting diode elements or the control element. At least one second outer conductor connects the second transition pad to one of the light emitting body elements or the control element. The sealing material including the light distribution design is disposed on the first surface to cover the LED component, the control component, the internal lead, the first transfer pad, the second transfer pad, the at least one first external lead, and at least A second outer conductor. M443935 In one embodiment of the present invention, the control element described above is adapted to receive a DC voltage of 12 to 48 volts, or an AC voltage of 90 to 260 volts. In an embodiment of the present invention, the first external contact and the second external contact are located on the first surface of the thermally conductive substrate and are located outside the sealant. In an embodiment of the present invention, the first external contact is located on the second surface of the thermally conductive substrate, and the thermally conductive substrate further has a first conductive via extending through the thermally conductive substrate 'and electrically connected to the first transfer pad and the first Between an external contact. In an embodiment of the present invention, the second external contact is located on the first surface of the thermally conductive substrate, and the thermally conductive substrate further has a second conductive via extending through the thermally conductive substrate 'and electrically connected to the second transfer pad and the first Two between the external contacts. In an embodiment of the present invention, the heat conductive substrate is a metal plate, a ceramic substrate or a tantalum substrate. In one embodiment of the present invention, the light source structure further includes an adhesive layer disposed between the control element and the first surface and between the light emitting diode element and the first surface. In one embodiment of the present invention, the adhesive layer described above comprises a metal solder. In one embodiment of the present invention, the above-described light emitting diode element includes a plurality of light emitting diode chips connected in series with each other. In the present invention, the light structure further includes a light conversion layer disposed between the sealant and the light emitting diode wafer. M443935 In one embodiment of the present invention, the light source structure described above further includes a plurality of light-converting particles located within the sealant. In one embodiment of the present invention, the outer surface of the above-mentioned sealant is one or more curved surfaces. Based on the above, the light source structure of the present invention has a light emitting diode element and a control element having a full voltage range input capability disposed on the same heat conducting substrate to provide good illumination of the LED component and the control component by the heat conducting substrate. Cooling effect. In addition, outside the light-emitting diode element and the control element, covering the sealing material with a light distribution design (for example, a single curved surface or a plurality of combined surfaces) can achieve a better light distribution effect, so that the light source structure can be Monomers are applied directly. In the light source structure of the present invention, the light-emitting diode elements and the control elements are electrically connected by internal wires, and are packaged in the same module, which helps to improve the component accumulation. The light source structure of the present invention can be operated without external control elements, and achieves the goal of a system-integrated and streamlined system. In addition, when the light source structure of the present application is used in conjunction with other light-emitting or light-distributing lamps, The sealing material of the body has the effect of light distribution, and the subsequent light distribution is easier, and the function of the system is simplified. Therefore, it has good compatibility and adaptability for various applications. To make the above-described features and advantages of the present invention more comprehensible, the following detailed description of the embodiments and the accompanying drawings are set forth below. [Embodiment] FIG. 1A is a perspective view showing a structure of a light source according to an embodiment of the present invention. Figure 1B is a cross-sectional view of Figure 1A taken along line A-A'. Please refer to FIG. 1A and FIG. 7B. The light source structure 1 of the embodiment of the present invention includes a heat conductive substrate 110, a plurality of light emitting diode elements 120, a control element 13A, a plurality of inner wires 140, at least a first outer lead 150, at least a second The outer lead 155 and a piece of glue 16 〇. The heat conductive substrate 11 includes a first surface 112 and a second surface 114 opposite to the first surface 112, and the heat conductive substrate 11 has a first transfer pad 113 and a second transfer pad 115, the first transfer The pad 113 and the second transfer pad 115 are both located on the first surface 112. The heat conductive substrate 110 has a first external contact 116 and a second external contact 118 for connecting the thermally conductive substrate no to an external circuit, wherein the first external contact 116 is electrically connected to the first transfer pad 113, and the second pair The external contact 118 is electrically connected to the second transfer pad 115. The first external contact 116 and the first transfer port 113 are electrically connected by a connection line ii9a, and the second external contact 118 and the second transfer pad 115 are also electrically connected by a connection line ii9b. The connecting lines 119a, 119b may be surface lines of the heat-conducting substrate 11 or may be internal wirings of the inner layer of the heat-conductive substrate 11 when the heat-conductive substrate 110 is a multilayer wiring board. The first transfer pad 113 is connected to the control element by the first outer lead 150

130。第二對外導線155可將第二轉接墊U5連接至控制元 件 130。 I 發光二極體元件120及具有接收全電壓範圍輸入能力 的控制元件130設置在導熱基板11〇的第一表面112上， 且分別藉由多條内部導線140相互連接。由於導熱基板11〇 具有良好的導熱性，因此可將發光二極體元件12〇及具接 收全電壓範圍輸入能力之控制元件13〇在長時門軍你 生的熱傳導至光源結構刚外部，以維持 M443935 正常運作。所述之控制元件13〇具有接收全電壓範圍輸入 能力，例如是可接收12至48伏特的一直流電壓，或者是 90至260伏特的一交流電壓。本實施例可選用的導熱基板 11 〇例如是金屬基板(如銅基板或鋁基板)、陶瓷基板或矽基 板等具有高導熱係數材質的基板。 此外，如圖1B所示，發光二極體元件12〇與導熱基 板110之間以及控制元件13〇與導熱基板u〇之間可分別 φ 設置黏著層口〇’以將發光二極體元件120與導熱基板110 固定於導熱基板110上。黏著層170例如是金屬銲料，包 括錫、錫錯合金或者是錫録合金等，而將發光二極體元件 120及控制元件13〇以表面接著技術（Surface M〇um Technology，SMT)接合至導熱基板110。使用金屬銲料作 為黏著層170可使發光二極體元件120與導熱基板ι1〇之 間以及控制元件130與導熱基板110之間具有良好的熱導 熱效果。 當然，本創作並不限制黏著層的材質以及發光二極體 • 元件120與控制元件130的接合方式❶在此，可應用任何 適用的現有技術來將發光二極體元件120與控制元件13〇 接合至導熱基板110。 此外，封膠材160配置於導熱基板11〇的第一表面112 上’用以覆蓋發光二極體元件120、控制元件13〇、内部導 線140、第一轉接墊113、第二轉接墊115、第一對外導線 150以及第二對外導線155。在此所述之封膠材16〇可依出 光角度或出光效果的需求，設計成具有配光效果的外型， 9 M443935 例如是由一個或多個曲面所構成。藉由封膠材16〇的設 置，可以避免外界水氣、空氣侵入光源結構1〇〇内部，並 可避免光源結構100内部的元件遭受外力衝擊損傷。 另一方面，爲了因應使用上(例如白光輸出）的需求， 吾人更可在封膠材160與發光二極體元件12〇之間設置一 光轉變層162,用以將發光二極體元件12〇發出的特定波 長的光輸出轉換成所需波長的光輸出。舉例而言，在本實 施例中，光轉變層162例如是一螢光層，而發光二極體元 件120例如是藍光二極體。發光二極體元件12〇所發出的 監光可被光轉·^層162轉換成黃光，並且再與其餘的藍光 混光後，成為白光輸出。此外，在本創作未繪示的實施例 中’吾人也可選擇在封膠材内部設置多個光轉變顆粒(例如 榮光粉）’以取代前述光轉變層162。 當光源結構1〇〇藉由第一對外接點116及第二對外接 點118外接電源時，驅動電流可經由第一 第二對外接點m、連接線路119a、連接:=二 轉接塾113、一第二轉接墊115、第一對外導線15〇、第二 對外導線I55以及内部導線⑽，進入相應的控制元件請 或發光二極體元件12G，以藉由控制元件13()驅動發光二 極體元件120發光。 然而，本創作不限制相關元件、導線與接墊(接點)之 間的連接關。㈣在前述實關巾，第—對外導線15〇 連接第—轉接墊⑴及㈣元件130,而第二對外導線155 連接第二轉接塾115及控制元件13()，但本創作也可以選 M443935 擇藉由導線將轉接墊連接到發光二極體元件上，以直接對 發光二極體元件進行控制或供電。以下再舉數個實施例來 說明可能的連接方式。 圖2為本創作另一實施例的立體圖。在本實施例之光 源結構200中，第一對外導線250將第一轉接墊113連接 至發光二極體元件220a，第二對外導線255將第二轉接整 115連接至控制元件13〇。如此，由第一對外接點〖π輸入 φ 的電源或訊號可經由連接線路119a、第一轉接墊H3、第 一對外導線250進入發光二極體元件220a，或者再經由發 光二極體元件220a傳遞到控制元件130。 圖3為本創作又一實施例的立體圖。在本實施例之光 源結構300中，第一對外導線35〇及第二對外導線355分 別將第一轉接墊113及第二轉接墊115連接至不同的發= 二極體元件320a。如此，由第一對外接點116輪入的電源 或訊號可經由連接線路119a、第一轉接墊113、第一對外 導線350進入發光二極體元件32〇a，或者再經由發光二極 鲁體元件32〇a傳遞到控制元件13〇。 ^創作亦可改變對外接點在導熱基板上的位置。實際 上，隨著導熱基板類型的不同以及光源結構的接合方式^ 需求，對外接點可能位於導熱基板的上表面或下表面。圖 4 A為本創作一實關之光源结構的立體圖。圖4b為圖^ 沿著I-Ι線段的剖面圖。圖4A所繪示之實施例與圖丄之 施例的主要差別在於：第―對外接點416以及第二對 點418分別設置在導熱基板41〇的第二表面414上。如此， 11 JV1443935 有利於光源結構400藉由表面接著技術直接組裝至外部的 電路板等電路元件。另外’如圖4B所示，為了達成第一 對外接點416以及第二對外接點418與第一表面412上相 應之第一轉接墊113以及第二轉接墊115的電性連接，本 實施例選擇在導熱基板410製作垂直的第一導電孔道41如 以及第二導電孔道418a。第一導電孔道416a以及第二導 電孔道418a貫穿導熱基板410，用以分別連接相應的第一 對外接點416與第一轉接墊113以及第二對外接點418與 第二轉接塾115。在本實施例中，第一對外接點416以及籲 第二對外接點418對應位於第一轉接墊113以及第二轉接 墊115的正下方，而直接藉由第一導電孔道41如以及 導電孔道418a相互導通。 圖5A為本創作另一實施例之光源結構的立體圖。圖 5B為圖5A沿著Π-Π’線段的剖面圖。圖5A之實施例與圖 4A主要差異在於’本實施例之光源結構5〇〇，其第一對外 接點516以及第二對外接點518設置於導熱基板51〇的第 二表面514上，且第一對外接點516以及第二對外接點518 φ 在第一表面512上的投影位置皆與第一轉接墊113以及第 二轉接墊115無重疊。 為了達成第一對外接點516以及第二對外接點518與 相應之第一轉接墊113以及第二轉接墊115的電性連接， 本實施例選擇在導熱基板51〇的第一表面512上設置了一 第二轉接墊517以及一第四轉接墊519,且第三轉接墊517 以及第四轉接墊519分別與第一對外接點516以及第二對 12 M443935 外接點518在第一表面512上的投影位置有重疊，故可在 導熱基板510製作垂直的一弟一導電孔道516a以及一第二 導電孔道518a。第一導電孔道516a以及第二導電孔道μ% 貝穿導熱基板510，为別連接相應的第一對外接點516斑 第三轉接墊517以及第二對外接點518與第四轉接墊 519。此外，第一轉接墊113與第三轉接墊517之間，以及 第二轉接墊115與第四轉接塾519之間更可藉由連接線路 519a、519b連接。此連接線路519a、51%可A墓埶其缸 M0的表層線路，或是導熱基板510内㈣内H、、、基板 另-方面’前述提出的導電孔道可能隨著導熱基板的 類型變化而有不同的結構。舉例而言，如圖6所示的圖诏 之虛線區域的放大圖。在此，導熱基板51〇的材質例如是 -金屬基板（例如是祕板或銅基板）或者切基板。由 於金屬基板或石夕基板具有導電性，故在導電孔道516a的製 私中’須在貫孔516d内壁披覆絕緣層㈣， 孔道516a與導埶某柘道、s ^ I兄夺宅 、畜㈣w 導通，再於貫孔516d内填入導 通材枓516c以形成導電孔道51知。 上下例介紹了以導電通孔來連接導熱基板 =任::r:;來達成轉接塾與對外接二電 =了 的線路層來轉導熱基板内部或表層 圖7繪禾本貪丨作 其中發光二極體元件遍光3二極體元件的内部結構， 例如是由多個發光二極體晶片 13 M443935 710串聯而成。所述串聯的發光二極體晶片71〇例如是一 咼壓發光二極體(HV LED)，可具有較佳的發光效率及耐用 度13當然，在本創作其他未繪示實施例中，發光二極體元 件也可只為單個發光二極體晶片。此外，發光二極體元件 700可為白光發光二極體元件或是單色光(如藍光)發光二 極體元件。 练上所述，本創作之光源結構將發光二極體元件以及 具有全電壓範圍輸入能力之控制元件設置在同一導熱基板 上，以藉由導熱基板來對發光二極體元件以及控制^件提 供良好的散熱效果。此外，在發光二極體元件以及控制元 件外部，覆蓋具有配光設計之封膠材(例如是曲面或多個曲 面的結合體），更可達到好的配光效果，使得光源結構可單 體直接應用。本創作之光源結構，其發光二極體元件以及 控制元件之間藉由内部導線達到電性連接，並且封裝於同 一模組内，有祕提高元件積餘。本創作之絲^構不 須再外接其他㈣元餅可運作，_全系統—體化的精 簡系統的目的。此外，當應用本創作之光源結構在配合其 他投光或配光設計之燈具時，因本體的封膠材已具有配^ 效果，後續的配光較為容易，更可達到簡化系統^功倉t。 因此對於各種應用場合皆具有良好的相容性盥適應j生^。 雖然本創作已以實施例揭露如上，然其並非^以阳— 本發明’任何所屬技術領域中具有通常知識者，在= 本發明之精神和範圍内’當可作些許之更動與們 創作之保護範圍當視後附之申請專利範圍所界二:為二本 M443935 【圖式簡單說明】 圖1A為本創作之一實施例之光源結構的立體圖。 圖1B為圖1A沿著A-A’線段的剖面圖。 圖2為本創作另·一實施例之光源結構的立體圖。 圖3為本創作又一實施例之光源結構的立體圖。 圖4A為本創作一實施例之光源結構的立體圖。 圖4B為圖4A沿著Ι-Γ線段的剖面圖。 圖5A為本創作另一實施例之光源結構的立體圖。 圖5B為圖5A沿著Π-Π’線段的剖面圖。 圖6為圖5B之虛線區域的放大圖。 圖7繪示本創作之一種發光二極體元件的内部結構。 【主要元件符號說明】 100 :光源結構 110 :導熱基板 112 :第一表面 113 :第一轉接墊 114 :第二表面 115 :第二轉接墊 116 :第一對外接點 118 :第二對外接點 119a :連接線路 119b :連接線路 120 :發光二極體元件 15 M443935 130 :控制元件 140 :内部導線 150 :第一對外導線 155 :第二對外導線 160 :封膠材 162 :光轉變層 170 :黏著層 200 :光源結構 220a :發光二極體元件 250 :第一對外導線 255 :第二對外導線 300 :光源結構 320a :發光二極體元件 350 :第一對外導線 355 :第二對外導線 400 :光源結構 410 :導熱基板 412 :第一表面 414 :第二表面 416 :第一對外接點 416a :第一導電孔道 418 :第二對外接點 418a :第二導電孔道 500 :光源結構 16 M443935 510 .導熱基板 512 :第一表面 514 :第二表面 516 :第一對外接點 516a :第一導電孔道 516b :絕緣層 516c :導通材料 516d :貫孔 517 :第三轉接墊 518 :第二對外接點 518a :第二導電孔道 519 :第四轉接墊 519a :連接線路 519b :連接線路 700 :發光二極體元件 710 :發光二極體晶片 17130. The second outer lead 155 can connect the second transfer pad U5 to the control element 130. The light-emitting diode element 120 and the control element 130 having the input capability of receiving the full voltage range are disposed on the first surface 112 of the heat-conducting substrate 11A, and are respectively connected to each other by a plurality of internal wires 140. Since the heat-conducting substrate 11 has good thermal conductivity, the light-emitting diode element 12 and the control element 13 having the input capability of receiving the full voltage range can be transferred to the outside of the light source structure for a long time. Maintain the normal operation of M443935. The control element 13A has an input capability to receive a full voltage range, such as a DC voltage that can receive 12 to 48 volts, or an AC voltage of 90 to 260 volts. The heat conductive substrate 11 which can be used in the present embodiment is, for example, a substrate having a high thermal conductivity material such as a metal substrate (e.g., a copper substrate or an aluminum substrate), a ceramic substrate, or a ruthenium substrate. In addition, as shown in FIG. 1B, an adhesive layer port 〇 ′ may be respectively disposed between the light emitting diode element 12 〇 and the heat conductive substrate 110 and between the control element 13 〇 and the heat conductive substrate 〇 ′ to separate the light emitting diode element 120 . The heat conductive substrate 110 is fixed to the heat conductive substrate 110. The adhesive layer 170 is, for example, a metal solder, including tin, tin alloy or tin alloy, and the light emitting diode element 120 and the control element 13 are bonded to the heat conduction by Surface M〇um Technology (SMT). Substrate 110. The use of metal solder as the adhesive layer 170 provides a good thermal conductivity between the light-emitting diode element 120 and the thermally conductive substrate ι1 and between the control element 130 and the thermally conductive substrate 110. Of course, this creation does not limit the material of the adhesive layer and the manner in which the light-emitting diodes • component 120 are coupled to the control component 130. Here, any suitable prior art can be applied to illuminate the LED component 120 and the control component 13 Bonded to the thermally conductive substrate 110. In addition, the sealant 160 is disposed on the first surface 112 of the heat conductive substrate 11' to cover the LED component 120, the control component 13A, the internal lead 140, the first transfer pad 113, and the second transfer pad. 115. The first outer lead 150 and the second outer lead 155. The sealant 16 在 described herein can be designed to have a light distribution effect according to the requirements of the light angle or the light-emitting effect, and the 9 M443935 is composed of, for example, one or more curved surfaces. By the arrangement of the sealing material 16〇, it is possible to prevent the outside water vapor and air from intruding into the interior of the light source structure 1 and to prevent the components inside the light source structure 100 from being damaged by external force impact. On the other hand, in order to meet the demand for use (for example, white light output), a light-transition layer 162 may be disposed between the sealant 160 and the light-emitting diode element 12A for the light-emitting diode element 12 to be disposed. The light output of a particular wavelength emitted by the chirp is converted to a light output of the desired wavelength. For example, in the present embodiment, the light-transition layer 162 is, for example, a phosphor layer, and the light-emitting diode element 120 is, for example, a blue LED. The light emitted by the light-emitting diode element 12A can be converted into yellow light by the light-transfer layer 162, and then mixed with the remaining blue light to become a white light output. Further, in the embodiment not shown in the present creation, 'we may also choose to provide a plurality of light-converting particles (e.g., glare powder)' inside the sealant to replace the aforementioned light-transition layer 162. When the light source structure 1 is externally connected to the first external contact 116 and the second external contact 118, the driving current can be connected via the first and second external contacts m, the connection line 119a, and the connection: a second transfer pad 115, a first outer lead 15 〇, a second outer lead I55, and an inner lead (10) enter the corresponding control element or the light emitting diode element 12G to drive the light by the control element 13 () The diode element 120 emits light. However, this creation does not limit the connection between the relevant components, wires and pads (contacts). (4) In the above-mentioned solid cover towel, the first outer lead 15 is connected to the first transfer pad (1) and the (four) element 130, and the second outer lead 155 is connected to the second transfer port 115 and the control element 13 (), but the creation may also M443935 is selected to connect the transfer pad to the LED component by a wire to directly control or power the LED component. Several embodiments are described below to illustrate possible connections. Figure 2 is a perspective view of another embodiment of the present invention. In the light source structure 200 of the present embodiment, the first outer lead 250 connects the first transfer pad 113 to the light emitting diode element 220a, and the second outer lead 255 connects the second transfer complete 115 to the control element 13A. Thus, the power source or signal from the first external contact π input φ can enter the light emitting diode element 220a via the connection line 119a, the first transfer pad H3, the first external lead 250, or via the light emitting diode element. 220a is passed to control element 130. Figure 3 is a perspective view of still another embodiment of the present invention. In the light source structure 300 of the present embodiment, the first outer lead 35 〇 and the second outer lead 355 respectively connect the first transfer pad 113 and the second transfer pad 115 to different hair=dipole elements 320a. In this way, the power source or signal that is rotated by the first external contact 116 can enter the LED component 32〇a via the connection line 119a, the first transfer pad 113, the first external lead 350, or the light-emitting diode The body element 32A is passed to the control element 13A. ^ Creation can also change the position of the external contacts on the thermal substrate. In practice, the external contacts may be located on the upper or lower surface of the thermally conductive substrate, depending on the type of thermally conductive substrate and the manner in which the light source structure is bonded. Fig. 4A is a perspective view of a light source structure of a real creation. Figure 4b is a cross-sectional view of the line along the I-Ι line. The main difference between the embodiment shown in FIG. 4A and the embodiment of FIG. 4 is that the first outer contact 416 and the second opposite point 418 are respectively disposed on the second surface 414 of the thermally conductive substrate 41A. Thus, 11 JV1443935 facilitates direct assembly of the light source structure 400 to external circuit boards and the like by surface-attachment techniques. In addition, as shown in FIG. 4B, in order to achieve electrical connection between the first external contact 416 and the second external contact 418 and the corresponding first and second transfer pads 113 and 115 on the first surface 412, The embodiment selects a vertical first conductive via 41 such as a second conductive via 418a on the thermally conductive substrate 410. The first conductive vias 416a and the second conductive vias 418a extend through the thermally conductive substrate 410 for respectively connecting the corresponding first external contacts 416 and the first transfer pads 113 and the second external contacts 418 and the second transfer pads 115. In this embodiment, the first external contact 416 and the second external contact 418 are located directly below the first transfer pad 113 and the second transfer pad 115, and directly through the first conductive via 41 and The conductive vias 418a are electrically connected to each other. FIG. 5A is a perspective view of a light source structure of another embodiment of the present invention. Figure 5B is a cross-sectional view of Figure 5A taken along line Π-Π'. The main difference between the embodiment of FIG. 5A and FIG. 4A is that the light source structure 5 of the present embodiment has a first outer contact 516 and a second outer contact 518 disposed on the second surface 514 of the thermally conductive substrate 51〇, and The projection positions of the first external contact 516 and the second external contact 518 φ on the first surface 512 are not overlapped with the first transfer pad 113 and the second transfer pad 115. In order to achieve electrical connection between the first external contact 516 and the second external contact 518 and the corresponding first and second transfer pads 113 and 115, the present embodiment selects the first surface 512 of the thermally conductive substrate 51A. A second transfer pad 517 and a fourth transfer pad 519 are disposed, and the third transfer pad 517 and the fourth transfer pad 519 are respectively connected to the first external contact 516 and the second pair 12 M443935 external contact point 518. The projection positions on the first surface 512 overlap, so that a vertical conductive hole 516a and a second conductive via 518a can be formed on the thermally conductive substrate 510. The first conductive via 516a and the second conductive via μ% pass through the thermal conductive substrate 510, and the third external transfer pad 517 and the second external contact 518 and the fourth transfer pad 519 are connected to the corresponding first external contact 516. . In addition, between the first transfer pad 113 and the third transfer pad 517, and between the second transfer pad 115 and the fourth transfer port 519, the connection line 519a, 519b can be connected. The connection line 519a, 51% can be a tomb 埶 the surface line of the cylinder M0, or the inside of the heat-conducting substrate 510 (4), H,, and the other side of the substrate. The aforementioned conductive hole may have a change with the type of the heat-conducting substrate. Different structures. For example, an enlarged view of the dotted line area of the figure 如图 shown in FIG. Here, the material of the heat conductive substrate 51 is, for example, a metal substrate (for example, a secret plate or a copper substrate) or a cut substrate. Since the metal substrate or the stone substrate is electrically conductive, the inner wall of the conductive hole 516a must be covered with an insulating layer (4) on the inner wall of the through hole 516d, and the hole 516a and the guiding channel, the s ^ I brothers seize the house, the animal (4) w is turned on, and then the conductive material 枓 516c is filled in the through hole 516d to form the conductive via 51. The upper and lower examples introduce the use of conductive vias to connect the thermally conductive substrate = any::r:; to achieve the transfer layer and the external connection = the circuit layer to transfer the inside or the surface of the thermally conductive substrate. Figure 7 The internal structure of the light-emitting diode element multiplexer 3 diode element is, for example, a series of a plurality of light-emitting diode chips 13 M443935 710 connected in series. The series LEDs 71 are, for example, a slewing diode (HV LED), which can have better luminous efficiency and durability. Of course, in other embodiments of the present invention, the illuminating The diode element can also be a single light emitting diode wafer. In addition, the light emitting diode element 700 can be a white light emitting diode element or a monochromatic light (e.g., blue light) light emitting diode element. As described above, the light source structure of the present invention provides a light-emitting diode component and a control component having a full-voltage range input capability on the same heat-conducting substrate to provide the light-emitting diode component and the control component by the heat-conductive substrate. Good heat dissipation. In addition, the light-emitting diode element and the control element are covered with a sealing material (for example, a curved surface or a combination of a plurality of curved surfaces) having a light distribution design, thereby achieving a good light distribution effect, so that the light source structure can be single. Direct application. In the light source structure of the present invention, the light-emitting diode elements and the control elements are electrically connected by internal wires, and are packaged in the same module, which has the secret to improve component spares. The silk structure of this creation does not need to be externally connected to other (four) yuan cakes to operate, _ whole system - the purpose of streamlining the system. In addition, when the light source structure of the present application is used in combination with other light-emitting or light-distributing lamps, the sealing material of the body has a matching effect, and the subsequent light distribution is relatively easy, and the simplified system can be achieved. . Therefore, it has good compatibility for various applications and adapts to J. Although the present invention has been disclosed above by way of example, it is not intended to be a singularity of the present invention, and it is intended to be a part of the teachings of the present invention. The scope of protection is defined by the scope of the patent application attached to the following: two copies of M443935 [Simplified illustration of the drawings] Fig. 1A is a perspective view of the light source structure of one embodiment of the present invention. Figure 1B is a cross-sectional view of Figure 1A taken along line A-A'. Fig. 2 is a perspective view showing the structure of a light source according to another embodiment of the present invention. 3 is a perspective view of a light source structure of still another embodiment of the present invention. 4A is a perspective view of a light source structure of an embodiment of the present invention. Figure 4B is a cross-sectional view of Figure 4A along the Ι-Γ line segment. FIG. 5A is a perspective view of a light source structure of another embodiment of the present invention. Figure 5B is a cross-sectional view of Figure 5A taken along line Π-Π'. Fig. 6 is an enlarged view of a broken line area of Fig. 5B. FIG. 7 illustrates the internal structure of a light-emitting diode element of the present invention. [Main component symbol description] 100: Light source structure 110: Thermally conductive substrate 112: First surface 113: First transfer pad 114: Second surface 115: Second transfer pad 116: First external contact 118: Second pair External contact 119a: connection line 119b: connection line 120: light-emitting diode element 15 M443935 130: control element 140: inner conductor 150: first outer conductor 155: second outer conductor 160: sealant 162: light-converting layer 170 Adhesive layer 200: light source structure 220a: light emitting diode element 250: first outer conductor 255: second outer conductor 300: light source structure 320a: light emitting diode element 350: first outer conductor 355: second outer conductor 400 Light source structure 410: thermally conductive substrate 412: first surface 414: second surface 416: first outer contact 416a: first conductive via 418: second external contact 418a: second conductive via 500: light source structure 16 M443935 510 Thermal conductive substrate 512: first surface 514: second surface 516: first external contact 516a: first conductive via 516b: insulating layer 516c: conductive material 516d: through hole 517: third transfer pad 518: second pair External point 518a: second guide Channel 519: a fourth switching pads 519a: connection line 519b: connection line 700: Light emitting diode element 710: a light emitting diode chip 17

Claims (1)

六、申請專利範園： I 一種光源結構，包括： "導Γί板:一第一表面以及相對於該第-表面 f塾，該第-轉接塾以及該第二轉接塾位於該第 ’遠導熱絲更具有-第—對外接點以及 ，，其中該第-對外接點電連接該第—第^十卜接 對外接點電連接該第二轉接墊； 而/弟一 多個發光二極體元件，配置於該第一表面上； -控制元件，配置於該第—表 壓範圍輸入能力； U㈣王電 肺多Γ料線，相連接於該㈣元件與該些發光二 極體7G件之間； 至v f射卜導線，將該第—轉接塾連接至該些發 光二極體元件中的-個或者該控制元件； 至少n料線，將該第二轉接墊連接至該些發 "-極體兀件中的—個或者該控制元件；以及 -技舳封膠材’配置於該第—表面上，用以覆蓋該些發光 厂# 70件、該控制元件、該些内部導線、該第一轉接墊、 if Γ轉缝、紅少—第—對外導線以及該至少一第二 對外導線。 t如申請專利範㈣丨項所述之光源結構，其中該控 2二上於接，12至48伏特的-直流電壓，或是90至 260伏特的一交流電壓。 M443935 —3.如申請專利範圍第1項所述之光源結構，其中該第 -對外接‘㈣及該第二對外接點位於料減板的該第— 表面上，且位於該封膠材之外。 一 4.如申請專利範圍第1項所述之光源結構，其中該第 一對外接點位於該導熱基板的該第二表面上，且該導熱基 板更具有-第—導電孔道貫穿該導熱基板，並且電連接ς 該第一轉接墊與該第一對外接點之間。 、 一 5.如申請專利範圍第3項所述之光源結構，其中該第 二對外接點位於該導熱基板的該第二表面上，且該導^基 板更具有一第二導電孔道貫穿該導熱基板，並且電連接ς 5亥第二轉接墊與該第二對外接點之間。 6·如申請專利範圍第1項所述之光源結構，其中該導 熱基板為金屬基板、陶瓷基板或矽基板。 # 7.如申請專利範圍第1項所述之光源結構，更包括一 黏著層，配置於該控制元件與該第一表面之間以及該些發 光二極體元件與該第一表面之間。 —" —8.如申請專利範圍第ό項所述之光源結構，其中該黏 著層包括金屬銲料。 9. 如申請專利範圍第1項所述之光源結構，其中每— 發光—極體元件包括相互串聯的多個發光二極體晶片。 10. 如申請專利範圍第1項所述之光源結構，更包括 光轉、父層’配置於該封膠材與該些發光二極體晶片之間。 U.如申请專利範圍第1項所述之光源結構，更包括 多個光轉變顆粒，位於該封膠材内。 19 M443935 12.如申請專利範圍第1項所述之光源結構，其中該 封膠材的外表面為一或多個曲面。 20Sixth, apply for a patent garden: I A light source structure, including: "Guide Γ plate: a first surface and relative to the first surface f塾, the first transfer 塾 and the second transfer 塾 are located at the first The far-distance heat-conducting wire further has a first-outer contact point, and wherein the first-outer contact is electrically connected to the first-thirth-thirth-connecting external contact to electrically connect the second transfer pad; a light emitting diode element disposed on the first surface; a control element disposed in the first gauge pressure input capability; a U (four) king electric lung multi-twist line connected to the (four) component and the light emitting diodes Between the 7G pieces; to the vf, the wire is connected to the one of the light emitting diode elements or the control element; at least n the material line, the second transfer pad is connected And the control element and the control element are disposed on the first surface to cover the light-emitting factory #70, the control element The inner wires, the first transfer pad, the if Γ turn seam, the red-less-external wire The at least one second wire outside. The light source structure as described in the patent application (4), wherein the control is connected to a DC voltage of 12 to 48 volts or an alternating voltage of 90 to 260 volts. The light source structure of claim 1, wherein the first external connection (4) and the second external contact are located on the first surface of the material reduction plate, and is located in the sealing material. outer. The light source structure of claim 1, wherein the first external contact is located on the second surface of the thermally conductive substrate, and the thermally conductive substrate further has a first conductive via extending through the thermally conductive substrate. And electrically connecting between the first transfer pad and the first external contact. The light source structure of claim 3, wherein the second external contact is located on the second surface of the thermally conductive substrate, and the conductive substrate further has a second conductive via extending through the thermal conduction a substrate, and an electrical connection between the second relay pad and the second external contact. 6. The light source structure of claim 1, wherein the heat conductive substrate is a metal substrate, a ceramic substrate or a germanium substrate. The light source structure of claim 1, further comprising an adhesive layer disposed between the control element and the first surface and between the light-emitting diode elements and the first surface. The light source structure of claim 2, wherein the adhesive layer comprises a metal solder. 9. The light source structure of claim 1, wherein each of the light-emitting body elements comprises a plurality of light-emitting diode chips connected in series with each other. 10. The light source structure of claim 1, further comprising a light-transferring, parent layer disposed between the sealant and the light-emitting diode wafers. U. The light source structure of claim 1, further comprising a plurality of light-converting particles located in the sealant. The light source structure of claim 1, wherein the outer surface of the sealant is one or more curved surfaces. 20
TW101211019U 2012-06-07 2012-06-07 Light source structure TWM443935U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
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CN105895756A (en) * 2016-05-16 2016-08-24 华南师范大学 Multi-electrode visible light communication light-emitting device and manufacturing method thereof

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CN104377195A (en) * 2013-08-16 2015-02-25 弘凯光电(深圳)有限公司 LED light-emitting device
CN105575956B (en) * 2015-12-31 2017-11-17 中国科学院半导体研究所 LED chip integrating packaging module and method for packing
DE102017103294A1 (en) 2017-02-17 2018-08-23 Osram Opto Semiconductors Gmbh OPTOELECTRONIC LIGHTING DEVICE AND METHOD FOR OPERATING AN OPTOELECTRONIC LIGHTING DEVICE

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105895756A (en) * 2016-05-16 2016-08-24 华南师范大学 Multi-electrode visible light communication light-emitting device and manufacturing method thereof
CN105895756B (en) * 2016-05-16 2018-09-18 华南师范大学 Multi-electrode visible light communication light emission device and preparation method thereof

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