CN203297977U

CN203297977U - System-level integration lighting module

Info

Publication number: CN203297977U
Application number: CN2013201719145U
Authority: CN
Inventors: 罗崇波; 张文雁
Original assignee: Individual
Current assignee: Individual
Priority date: 2013-04-08
Filing date: 2013-04-08
Publication date: 2013-11-20
Anticipated expiration: 2023-04-08

Abstract

The utility model discloses a system-level integration lighting module. The system-level integration lighting module comprises a cooling circuit board, an LED bare ship, a driving chip and an AC/DC converting module; the cooling circuit board comprises a cooling substrate and a metal line layer arranged on the front surface of the cooling substrate in an attached mode, the LED bare chip, the driving chip and the AC/DC converting module are attached to and electrically connected to the front surface of the cooling substrate through the metal line layer, and the LED bare chip is in electrical connection with the metal line layer through a metal conductive line. According to the system-level integration lighting module, a driving power supply and a light source are integrated on the cooling substrate, the cooling substrate serves as a main cooling route, and therefore the cooling structure is more simple, the cooling performance is improved, a driving electrical route is greatly shortened, the number of parasitic circuits and interference are reduced, reliability of the lighting module is enhanced, and the service life of the lighting module is prolonged. The system-level integration lighting module greatly reduces the number of electronic parts and components and the number of production technologies, greatly improves the production yield and consistency, and therefore lowers manufacturing costs, improves product quality, and meets the requirements for environmental protection and energy saving better.

Description

System-level integrated lighting module

Technical field

The utility model relates to the LED lighting technical field, is specifically related to a kind of system-level integrated lighting module.

Background technology

Driving power and the light source of illumination have a wide range of applications at lighting fields such as comprising LED commercial lighting, domestic lighting, back lighting.Only there is LED lamp pearl or the naked wafer of fixing by scolder in the front of lighting source, the back side contacts with radiator by heat-conducting glue or other Heat Conduction Materials, and it needs independently driving power and light source formation electrical connection, and form one, exchanges electrically driven (operated) illuminating product.

In conventional art, the operating voltage of illumination driving power source and light source is the output voltage of alternating current driving power, under working condition, its voltage is higher so, so require the surface of illumination driving power source and light source that good insulation resistance is arranged, and the back side of light source and radiator closely conflict, to strengthen the heat radiation of light source to environment.Have between safety regulation light source and radiator certain dielectric strength will be arranged, due to light source and radiator close contact, so require the dielectric voltage withstand performance of light source to get well.Existing illumination driving power source and light source comprise radiating circuit plate, emitting led wafer, optical material, Drive and Control Circuit, electronic devices and components, pcb board, connecting line etc., its production technology relative complex, technologic control is had relatively high expectations, and be difficult to meet the requirement of homogeneity of product.Due to driving power and the required raw material of light source numerous, it must cause higher manufacturing expense and reduce reliability, thus reduction of service life and do not meet the requirement of environmental protection.

In the illumination driving power source and light source of this technical scheme, the electrical connection circuit between driving power and light source is longer, so can produce a lot of parasitic circuits and interference characteristic.And driving power and light source all radiating condition is required very high, so the condition of heat radiation will determine the service life of power supply and light source.During application, must have good radiator structure in time is dispersed in air with the heat that guarantees power supply and light source, but in actual applications, the radiator structure of power supply often is subject to product structure and cost and can't finds good solution, therefore the life-span of illuminating product is often depended on the life-span of power supply, and the life-span of power supply is the solutions that depend on radiator structure more.Otherwise, if the Cooling Solution of illumination driving power source does not meet, light decay speed that can accelerated light source.

The utility model content

The utility model provides a kind of system-level integrated lighting module, the assembly of whole lighting module can be integrated on a substrate, to address the above problem.

The utility model provides a kind of system-level integrated lighting module, comprising: the radiating circuit plate, and the naked wafer of LED, for the driving chip of the naked wafer of driving LED, be used to the AC/DC modular converter of the naked wafer of LED and driving chip power supply; Wherein, the radiating circuit plate comprises heat-radiating substrate and is sticked at the metallic circuit layer in heat-radiating substrate front, and the naked wafer of described LED is mounted on the metallic circuit layer of described heat-radiating substrate, and forms electrical connection by plain conductor and described metallic circuit layer; It is positive also by the electrical connection of metallic circuit layer that described driving chip and AC/DC modular converter are mounted on heat-radiating substrate.

Preferably, also comprise the separation layer that a high voltage insulating materials is made, described separation layer covers and drives on chip, AC/DC modular converter and following metallic circuit layer thereof.

Preferably, on the naked wafer of described LED, be coated with one deck for increasing optical material layer luminous and protection.

Preferably, described optical material layer adopts the fluorescence silica gel thing to make.

Preferably, the quantity of the naked wafer of LED is a plurality of, and AC/DC modular converter and driving chip are positioned at the middle position of heat-radiating substrate, and the naked wafer of a plurality of LED evenly is arranged in the surrounding of heat-radiating substrate.

Preferably, on the metallic circuit layer, be connected be used to exchanging the input terminal of input, described input terminal runs through heat-radiating substrate and extends to the heat-radiating substrate back side.

Preferably, the heat-radiating substrate back side is pasted with a radiator, and radiator is provided with the connecting hole for accommodating input terminal.

Preferably, described AC/DC modular converter is the rectifier bridge unit.

Preferably, described heat-radiating substrate is square or circular.

Preferably, described heat-radiating substrate is ceramic substrate or metal substrate.

Technique scheme can be found out, because the utility model embodiment adopts integrated driving power (driving chip and AC-DC conversion module), light source (the naked wafer of LED) on heat-radiating substrate, using heat-radiating substrate as main heat radiation approach, make radiator structure more oversimplify, improved heat dispersion.This lighting module has also shortened the driving electrical path greatly, has reduced parasitic circuit and interference, so increased reliability and the life-span of lighting module.Simultaneously, this lighting module has greatly reduced electronic devices and components and production technology, thus greatly improved yield and the uniformity of producing, thus reduced manufacturing expense, and the quality that has improved product, also more meet the requirement of environmental protection and energy saving.

The accompanying drawing explanation

In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, below will the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.

Fig. 1 is the side sectional structure schematic diagram of system-level integrated lighting module in the utility model embodiment;

Fig. 2 is in the utility model embodiment during rounded the arranging of the naked wafer of LED, the plan structure schematic diagram of metallic circuit layer.

The specific embodiment

Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making all other embodiment that obtain under the creative work prerequisite, all belong to the scope of the utility model protection.

Embodiment:

The utility model embodiment provides a kind of system-level integrated lighting module, as shown in Figure 1, comprising: radiating circuit plate 1, the naked wafer 2 of LED, for the driving chip 3 of the naked wafer of driving LED, be used to the naked wafer 2 of LED and drive the AC/DC modular converter (not shown) that chip 3 is powered; Wherein, radiating circuit plate 1 comprises heat-radiating substrate 11 and is sticked at the metallic circuit layer 12 in heat-radiating substrate 11 fronts, it is positive also by 12 electrical connection of metallic circuit layer that the naked wafer 2 of described LED, driving chip 3 and AC/DC modular converter are mounted on heat-radiating substrate 11, because light source adopts naked wafer, therefore, the naked wafer 2 of described LED needs to form electrical connection by plain conductor 21 and described metallic circuit layer 12; The naked wafer 2 of LED, driving chip 3 and AC/DC modular converter are realized mutual electrical connection by metallic circuit layer 12.In the utility model embodiment, heat-radiating substrate 11 is ceramic substrate, to increase heat dispersion, certainly, in a single day heat-radiating substrate can also be realized good heat dispersion by metal substrate in other embodiment, certainly selects metal substrate, need to be at front surface coated one deck insulating cement of metal substrate, to realize the insulating properties of metal substrate, metal substrate is to select aluminium base and copper base to be advisable, and the aluminium base quality is light, and copper base can have better radiating effect.

In order to realize driving the isolation of the circuit parts such as chip and AC/DC modular converter, prevent simultaneously the human electric shock, in the utility model embodiment, also comprise the separation layer 13 that a high voltage insulating materials is made, described separation layer 13 covers and drives on chip 3, AC/DC modular converter and following metallic circuit layer 12 thereof, namely drives metallic circuit layer under chip 3 and the metallic circuit layer under the AC/DC modular converter and all covers below separation layer.In the process of manufacturing, the separation layer that high voltage insulating materials is made can be coated in by the mode of casting and drive on chip 3 and AC/DC modular converter, simultaneously the naked wafer 2 except LED, other components and metallic circuit layer can be coated under separation layer, separation layer can play certain anti-interference and waterproof action, the hidden danger that also can avoid personnel's contact circuit module to be electrically shocked.

as lighting module, the quantity of the naked wafer 2 of LED can be at least one, the quantity of the naked wafer 2 of LED is a plurality of in the utility model embodiment, to realize the illuminating effect of high brightness, in order further to realize better illuminating effect, on the naked wafer of each LED, be coated with one deck for increasing optical material layer 4 luminous and protection, in the utility model embodiment, the described optical material layer of optical material layer 4 adopts the mixture that comprises silica gel and fluorescent material composition to make, this mixture is called the fluorescence silica gel thing, this mixture those skilled in the art can obtain by prior art, repeat no more herein.Be understandable that, due to the small volume of the naked wafer of LED, therefore, the contacted tie point in the naked wafer of the gold thread on the metallic circuit layer and LED the two poles of the earth also covers in optical material layer.For the Hermetic coating of optical material layer to the naked wafer of LED, around optical material layer, be coated with one deck box dam glue (not shown), described box dam glue, for the tool materials that those skilled in the art commonly use, repeats no more herein.

In order to realize that rational deployment is to form good radiating effect, in the utility model embodiment, AC/DC modular converter and driving chip 3 are positioned at the middle position of heat-radiating substrate 11, and the naked wafer 2 of a plurality of LED evenly is arranged in the surrounding of heat-radiating substrate 11.The naked wafer 2 of LED can be arranged into a circle or one square, even can also be arranged into hexagon or triangle, in the figure that the naked wafer of LED surrounds, has a central area, this central area gets final product accommodating AC/DC modular converter and drives chip, because the naked wafer 2 of each LED all needs to connect driving chip 3, therefore this arrangement mode centered by the driving chip, can effectively reduce to be electrically connected path, reduces parasitic circuit and relevant interference.

for the ease of connecting, in the utility model embodiment, on the metallic circuit layer, be connected with the input terminal 5 be used to exchanging input, described input terminal 5 runs through heat-radiating substrate 11 and extends to the heat-radiating substrate back side, alternating current is input to the AC/DC modular converter through input terminal 5 by the gold thread on metallic circuit layer 12 (can referring to the gold thread layout in Fig. 2), AC/DC modular converter output direct current is for the normal operation that drives chip 3 and the naked wafer 2 of LED, in the utility model embodiment because input terminal 5 extends to the back side of heat-radiating substrate 11, therefore formed a kind of pluggable splicing ear, improved the simplification of assembling, improved the reliability that connects.The AC/DC modular converter adopts the rectifier bridge unit, and this rectifier bridge unit can be full-bridge circuit or half-bridge circuit, at the output of full-bridge circuit or half-bridge circuit, can also be connected with the constant current tube (not shown), to guarantee the stable supplying of dc source.Be understandable that, due to the AC/DC modular converter, be positioned at the middle position of heat-radiating substrate, therefore, in the utility model embodiment, input terminal 5 also is positioned at the middle position of heat-radiating substrate, so can reduce the electrical path of input terminal to the AC/DC modular converter, save wire rod, reduce parasitic circuit, be conducive to the Highgrade integration of circuit structure.

In order further to increase the heat dispersion of lighting module, the heat-radiating substrate back side is pasted with a radiator (not shown) in the utility model embodiment, and radiator is provided with the connecting hole for accommodating input terminal.Radiator can adopt existing radiator to get final product, and heat spreader structures is not done and is repeated herein, certainly between heat-radiating substrate and radiator, can adopt heat conductivity preferably silica gel connect.

For the ease of the assembling of arranging between a plurality of lighting modules, in the utility model embodiment, heat-radiating substrate is square, and therefore, radiating circuit plate also respective design is square, and heat-radiating substrate also can adopt circle in other embodiments certainly.

For the metallic circuit layer, can by PCB making sheet technology, realize according to concrete circuit structure being illustrated in figure 2 the layout of gold thread on the metallic circuit layer, during rounded the arranging of the naked wafer of LED, the plan structure figure of metallic circuit layer.For PCB making sheet technology those skilled in the art, can know by existing knowledge, repeat no more herein.

The above system-level integrated lighting module that the utility model embodiment is provided is described in detail, applied specific case herein principle of the present utility model and embodiment are set forth, the explanation of above embodiment is just be used to helping to understand core concept of the present utility model; Simultaneously, for one of ordinary skill in the art, according to thought of the present utility model, all will change in specific embodiments and applications, in sum, this description should not be construed as restriction of the present utility model.

Claims

1. system-level integrated lighting module, is characterized in that, comprising: the radiating circuit plate, and the naked wafer of LED, for the driving chip of the naked wafer of driving LED, be used to the AC/DC modular converter of the naked wafer of LED and driving chip power supply; Wherein, the radiating circuit plate comprises heat-radiating substrate and is sticked at the metallic circuit layer in heat-radiating substrate front, and described emitting led naked wafer is mounted on the metallic circuit layer of described heat-radiating substrate, and forms electrical connection by plain conductor and described metallic circuit layer; It is positive also by the electrical connection of metallic circuit layer that described driving chip and AC/DC modular converter are mounted on heat-radiating substrate.

2. the system as claimed in claim 1 level integrated lighting module is characterized in that: also comprise the separation layer that a high voltage insulating materials is made, described separation layer covers and drives on chip, AC/DC modular converter and following metallic circuit layer thereof.

3. system-level integrated lighting module as claimed in claim 1 or 2, is characterized in that, on the naked wafer of described LED, is coated with one deck for increasing optical material layer luminous and protection.

4. system-level integrated lighting module as claimed in claim 3, is characterized in that, described optical material layer adopts the fluorescence silica gel thing to make.

5. system-level integrated lighting module as claimed in claim 3, is characterized in that, the quantity of the naked wafer of LED is a plurality of, and AC/DC modular converter and driving chip are positioned at the middle position of heat-radiating substrate, and the naked wafer of a plurality of LED evenly is arranged in the surrounding of heat-radiating substrate.

6. system-level integrated lighting module as claimed in claim 1 or 2, is characterized in that, on the metallic circuit layer, is connected be used to exchanging the input terminal of input, and described input terminal runs through heat-radiating substrate and extends to the heat-radiating substrate back side.

7. system-level integrated lighting module as claimed in claim 6, is characterized in that, the heat-radiating substrate back side is pasted with a radiator, and radiator is provided with the connecting hole for accommodating input terminal.

8. system-level integrated lighting module as claimed in claim 1 or 2, is characterized in that, described AC/DC modular converter is the rectifier bridge unit.

9. system-level integrated lighting module as claimed in claim 1 or 2, is characterized in that, described heat-radiating substrate is square or circular.

10. system-level integrated lighting module as claimed in claim 1 or 2, is characterized in that, described heat-radiating substrate is ceramic substrate or metal substrate.