CN202349946U

CN202349946U - Linearly-distributed light-emitting diode (LED) large substrate

Info

Publication number: CN202349946U
Application number: CN2011204445858U
Authority: CN
Inventors: 蒋秀华; 邓立
Original assignee: JIANGSU ECO NEW ENERGY TECHNOLOGY Co Ltd
Current assignee: JIANGSU ECO NEW ENERGY TECHNOLOGY Co Ltd
Priority date: 2011-11-10
Filing date: 2011-11-10
Publication date: 2012-07-25
Anticipated expiration: 2021-11-10

Abstract

The utility model discloses a linearly-distributed light-emitting diode (LED) large substrate, which relates to the field of substrates for LED illumination. The large substrate adopts a high-thermal conductive metal plate as a bottom plate of the substrate, inorganic materials are directly used to be made into an insulating coating on the bottom plate, a plurality of circuit leads are distributed in the insulating coating, a plurality of LED chips are connected in series and installed on the circuit leads, and one ends of the circuit leads are connected with a constant current component for providing constant current for the LED chips. The large substrate adopts a mode of directly arranging the insulating coating and circuit leads on the bottom plate, so that small substrates, high-thermal conductive adhesive and other raw materials are saved, further, the production cost is reduced, the manufacturing and mounting time can also be saved, and the working efficiency is improved.

Description

Straight cloth formula LED large substrates

Technical field

The utility model relates to the LED illumination and uses substrate field, specifically a kind of straight cloth formula LED large substrates.

Background technology

Led light source has high life, low in power consumption and has received the cognition of the whole society.In recent years; The LED lighting apparatus has obtained extensive use in various occasions; And the light source substrate of large-scale LED lighting apparatus mostly adopts the combined type substrate; Promptly through utilization high-heat-conductivity glue stick and screw, a plurality of little LED substrates are fixed on the surface of aluminum heat sink, the chip that connects respectively on a plurality of little LED substrates through external power cord again makes it luminous.The material that the large substrates one of this combined type is to use is more, and the 2nd, the fabrication and installation process is complicated, and time-consuming taking a lot of work strengthened installation cost.

Summary of the invention

Goal of the invention: the technical problem that the utility model will solve is, reduces the number of the little substrate on the combined type substrate, simplifies manufacture process, insulating barrier and some circuit loops is deployed directly on the high-thermal conductive metal base plate together, to reduce the fabrication and installation cost.

Technical scheme: with the base plate of high-thermal conductive metal plate as the LED large substrates; On base plate, directly make insulating coating with inorganic material; Many the return wires that in insulating barrier, are arranged side by side are installed a plurality of led chips and constant current components and parts on return wire, to led chip constant electric current is provided.

Beneficial effect: the utlity model has following three advantages:

1, the base plate processed of high-thermal conductive metal plate, area of dissipation is big, and can combine the exterior design of light fixture to dispel the heat jointly, therefore has better radiating effect.

2, on a base plate, directly be arranged side by side many circuit loops are installed, can practice thrift the fabrication and installation time, improve work efficiency.

3, directly on base plate, arrange circuit loop and installation led chip, saved raw material such as little substrate and high-heat-conductivity glue stick, reduced production cost.

Description of drawings

Fig. 1 is the utility model front view.

Fig. 2 is the utility model upward view.

1. base plates, 2. insulating barriers, 3. return wire 4.LED chips, 5. Chip-Rs, 6. power supply connectors, 7. constant current components and parts, 8. installing holes among the figure.

The specific embodiment

Like Fig. 1, shown in 2, the insulating barrier 2 that application one deck is made up of insulating resin, inorganic silicon dioxide and aluminium oxide on a surface of high-thermal conductive metal base plate 1 is arranged side by side in insulating barrier 2 many Copper Foil return wires 3 is installed; Led chip 4 series connection welding are installed on the return wire 3; End at return wire 3 connects Chip-R 5 and constant current components and parts 7, and through power supply connector 6 constant electric current is supplied with led chip 4 through return wire 3.

Claims

1. straight cloth formula LED large substrates is characterized in that: application one layer insulating (2) is gone up on the surface at high-thermal conductive metal base plate (1), in insulating barrier (2), is arranged side by side many Copper Foil return wires (3) are installed; Led chip (4) series connection welding is installed on the return wire (3); End at return wire (3) connects Chip-R (5) and constant current components and parts (7), and through power supply connector (6) constant current is supplied with led chip (4) through return wire (3).