WO2012040956A1 - Packaging structure of led lighting source module - Google Patents
Packaging structure of led lighting source module Download PDFInfo
- Publication number
- WO2012040956A1 WO2012040956A1 PCT/CN2010/078620 CN2010078620W WO2012040956A1 WO 2012040956 A1 WO2012040956 A1 WO 2012040956A1 CN 2010078620 W CN2010078620 W CN 2010078620W WO 2012040956 A1 WO2012040956 A1 WO 2012040956A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- source module
- base
- led
- light source
- reflector
- Prior art date
Links
- 238000004806 packaging method and process Methods 0.000 title abstract description 5
- 239000003292 glue Substances 0.000 claims abstract description 13
- 229920001296 polysiloxane Polymers 0.000 claims description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 7
- 239000003365 glass fiber Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000741 silica gel Substances 0.000 abstract description 4
- 229910002027 silica gel Inorganic materials 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 101100441413 Caenorhabditis elegans cup-15 gene Proteins 0.000 description 3
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 230000001795 light effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Definitions
- the present invention relates to a lighting device, and more particularly to an LED light source module. Background technique
- the traditional LED light source module package structure generally includes a metal base with a reflective cup, and a reflective cup at the base. There are a plurality of LED chips in the center of the bottom. The LED chips are uniformly adhered to the center of the bottom of the reflector by soldering or insulating glue. The LED chips are connected in series or in parallel through the wires, and connected to the reflector disposed on the metal base.
- the external circuit board is coated with a glue and a phosphor mixed layer on the upper surface of the LED chip to completely cover the inside of the mixed layer.
- the glue and phosphor mixed layer are mostly soft silica gel, but the light efficiency loss is large, and if hard silica gel is used, the light effect can be improved, but at the same time
- the cost of LED modules will increase significantly, which is not conducive to large-scale production in the industry. Summary of the invention
- the technical problem to be solved by the present invention is to provide an LED light source module package structure which can save production cost while maintaining good light efficiency.
- An LED light source module package structure includes a base having a reflector cup, and at least one LED chip is disposed in the center of the bottom of the reflector of the base, and the LED chip is adhered to the bottom of the reflector through an insulating glue.
- a surface of the LED chip is coated with a hard silicone layer, and a layer of glue and phosphor is mixed on the outside of the hard silicone layer.
- the chips are connected by wires to lead the positive and negative electrodes.
- An insulating sheet is disposed on the base, and the LED chips are connected to the insulating sheet after being connected in series or in parallel.
- the upper surface of the base is provided with an electroplated reflective layer.
- the base and the reflector are both circular.
- the insulating sheet is a glass fiber sheet, and a printed circuit is provided on the insulating sheet.
- the invention has the following advantages: the surface of the LED chip is coated with a hard silicone layer, and a double-layer structure of a mixed layer of glue and phosphor is coated on the outside of the hard silicone layer, which can greatly save the production cost. And its light efficiency loss is very small, which is conducive to large-scale industrial production.
- FIG. 1 is a view showing the entire configuration of a first embodiment of the present invention.
- Fig. 2 is a cross-sectional view taken along line A-A of Fig. 1; 1 to 2, the LED light source module package structure of the present invention includes a base 11, an LED chip 12, an insulating glue 13, a glue and phosphor mixed layer 14, a reflective cup 15, The circuit board 16, the hard silicone layer 17, and the wire 18.
- the base 11 of the base 11 is provided with a reflector cup 15.
- the base 11 and the reflector cup 15 in this embodiment are both circular.
- the base 11 is integrally formed of copper, and has an electroplated reflective layer on the upper surface thereof.
- the reflective layer is a silver-plated layer
- the bottom of the reflector 15 is provided with a plurality of LED chips 12, and the LED chips 12 are adhered to the bottom of the reflector 15 by an insulating glue.
- the surface of the LED chip 12 is coated with a hard silicone.
- the layer 17 is further coated with a glue and phosphor mixed layer 14 on the outside of the hard silicone layer 17.
- the base 11 also has a small groove for accommodating the circuit board 16, and after the circuit board 16 is installed in the small groove,
- the plurality of LED chips 12 are connected to the circuit board 16 by wires 18 connected in series or in parallel to form positive and negative electrodes.
- the base is not limited to a circular shape, and may be formed in a square or elongated shape to achieve the aforementioned object.
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Abstract
A packaging structure of a light emitting diode (LED) light source module belongs to the field of the lighting device manufacturing. The packaging structure includes a base (11) with a reflector cup (15), at least one LED chip (12) is positioned on the bottom center of the reflector cup (15), and the chip (12) is bonded to the bottom of the reflector cup (15) by an insulation paste (13). The packaging structure is characterized in that a hard silica gel layer (17) is coated around the surface of the LED chip (12), a mixed layer (14) formed by a glue mixed with fluorescent powders is coated on the hard silica gel layer (17), and a positive and a negative poles are fetched out after the chips (12) are connected to each other by wirings (18).
Description
LED光源模块封装结构 技术领域 LED light source module packaging structure
本发明涉及一种照明设备， 尤其涉及一种 LED光源模块。 背景技术 The present invention relates to a lighting device, and more particularly to an LED light source module. Background technique
LED是一种低电压光源， 由于其省电、 寿命长， 现已被广泛应用于 各种低压照明装置，传统的 LED光源模块封装结构一般包括一具有反光 杯的金属底座， 在底座的反光杯底部中央设有若干 LED芯片， 该 LED 芯片通过焊接方式或者绝缘胶均匀地粘在反光杯的底部中央， LED芯片 之间通过导线相串联或者并联后引出， 连接至设置在金属底座上的反光 杯外部的线路板,再将 LED芯片的上表面涂敷一胶水与荧光粉混合层后 使 LED芯片被完全覆盖在混合层内部。 上述传统的 LED光源模块封装 结构中， 为了节约成本， 因此所述胶水与荧光粉混合层采用的大都是软 硅胶， 但其光效损失较大， 若采用硬硅胶则可以提高光效， 但同时 LED 模块的成本会大幅增加， 不利于工业上的大规模生产。 发明内容 LED is a low-voltage light source. Due to its power saving and long life, it is widely used in various low-voltage lighting devices. The traditional LED light source module package structure generally includes a metal base with a reflective cup, and a reflective cup at the base. There are a plurality of LED chips in the center of the bottom. The LED chips are uniformly adhered to the center of the bottom of the reflector by soldering or insulating glue. The LED chips are connected in series or in parallel through the wires, and connected to the reflector disposed on the metal base. The external circuit board is coated with a glue and a phosphor mixed layer on the upper surface of the LED chip to completely cover the inside of the mixed layer. In the above conventional LED light source module package structure, in order to save cost, the glue and phosphor mixed layer are mostly soft silica gel, but the light efficiency loss is large, and if hard silica gel is used, the light effect can be improved, but at the same time The cost of LED modules will increase significantly, which is not conducive to large-scale production in the industry. Summary of the invention
本发明要解决的技术问题， 在于提供一种既能够节省生产成本， 又 可以保持较好的光效的 LED光源模块封装结构。 The technical problem to be solved by the present invention is to provide an LED light source module package structure which can save production cost while maintaining good light efficiency.
本发明是这样实现的： 一种 LED光源模块封装结构， 包括一具有反 光杯的底座， 底座的反光杯底部中央设有至少一个 LED芯片， 该 LED 芯片通过绝缘胶粘在反光杯的底部，所述 LED芯片的表面周围涂敷有一 硬硅胶层， 在该硬硅胶层的外部还涂敷有一胶水与荧光粉混合层， 所述 芯片之间通过导线连接后引出正负极。 The present invention is implemented as follows: An LED light source module package structure includes a base having a reflector cup, and at least one LED chip is disposed in the center of the bottom of the reflector of the base, and the LED chip is adhered to the bottom of the reflector through an insulating glue. A surface of the LED chip is coated with a hard silicone layer, and a layer of glue and phosphor is mixed on the outside of the hard silicone layer. The chips are connected by wires to lead the positive and negative electrodes.
所述底座上设有绝缘片，所述 LED芯片经串联或并联连接后引出至 绝缘片。 An insulating sheet is disposed on the base, and the LED chips are connected to the insulating sheet after being connected in series or in parallel.
所述底座的上表面设有一电镀的反光层。
所述底座和反光杯均为圓形。 The upper surface of the base is provided with an electroplated reflective layer. The base and the reflector are both circular.
所述绝缘片为玻璃纤维片， 绝缘片上设有印刷电路。 The insulating sheet is a glass fiber sheet, and a printed circuit is provided on the insulating sheet.
本发明具有如下优点：采用上述将 LED芯片的表面周围涂敷有一硬 硅胶层， 在该硬硅胶层的外部还涂敷有一胶水与荧光粉混合层的双胶层 结构， 可以大大节省了生产成本， 并且其光效损失极少， 有利于大批量 的工业化生产。 附图说明 The invention has the following advantages: the surface of the LED chip is coated with a hard silicone layer, and a double-layer structure of a mixed layer of glue and phosphor is coated on the outside of the hard silicone layer, which can greatly save the production cost. And its light efficiency loss is very small, which is conducive to large-scale industrial production. DRAWINGS
下面参照附图结合实施例对本发明作进一步的说明。 The present invention will be further described below in conjunction with the embodiments with reference to the accompanying drawings.
图 1是本发明的实施例一的整体结构示意图。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the entire configuration of a first embodiment of the present invention.
图 2是图 1的 A-A剖视图。 具体实施方式 请参阅图 1至图 2所示，是本发明的所述的 LED光源模块封装结构， 包括底座 11、 LED芯片 12、 绝缘胶 13、 胶水与荧光粉混合层 14、 反光 杯 15、 线路板 16、 硬硅胶层 17、 导线 18。 Fig. 2 is a cross-sectional view taken along line A-A of Fig. 1; 1 to 2, the LED light source module package structure of the present invention includes a base 11, an LED chip 12, an insulating glue 13, a glue and phosphor mixed layer 14, a reflective cup 15, The circuit board 16, the hard silicone layer 17, and the wire 18.
所述底座 11的中央设有一反光杯 15, 本实施例中的底座 11和反光 杯 15均为圓形， 所述底座 11为铜制一体成型， 其上表面有一电镀的反 光层，在本实施例中该反光层为镀银层，反光杯 15的底部设有若干 LED 芯片 12,这些 LED芯片 12通过绝缘胶粘在反光杯 15的底部，所述 LED 芯片 12的表面周围涂敷有一硬硅胶层 17,在该硬硅胶层 17的外部还涂 敷有一胶水与荧光粉混合层 14,底座 11上还预留有容纳线路板 16的小 槽，将线路板 16安装在该小槽内后，所述若干 LED芯片 12之间用导线 18经串联或并联后引出连接至线路板 16, 形成正负极。 The base 11 of the base 11 is provided with a reflector cup 15. The base 11 and the reflector cup 15 in this embodiment are both circular. The base 11 is integrally formed of copper, and has an electroplated reflective layer on the upper surface thereof. In the example, the reflective layer is a silver-plated layer, and the bottom of the reflector 15 is provided with a plurality of LED chips 12, and the LED chips 12 are adhered to the bottom of the reflector 15 by an insulating glue. The surface of the LED chip 12 is coated with a hard silicone. The layer 17 is further coated with a glue and phosphor mixed layer 14 on the outside of the hard silicone layer 17. The base 11 also has a small groove for accommodating the circuit board 16, and after the circuit board 16 is installed in the small groove, The plurality of LED chips 12 are connected to the circuit board 16 by wires 18 connected in series or in parallel to form positive and negative electrodes.
上述实施例中， 所述底座也不局限于圓形， 可以做成方形或者长条 形等形状， 仍然可以达到前述的发明目的。
In the above embodiment, the base is not limited to a circular shape, and may be formed in a square or elongated shape to achieve the aforementioned object.
Claims
1、 一种 LED光源模块封装结构， 包括一具有反光杯的底座， 底座 的反光杯底部中央设有至少一个 LED芯片， 该 LED芯片通过绝缘胶粘 在反光杯的底部，其特征在于： 所述 LED芯片的表面周围涂敷有一硬硅 胶层， 在该硬硅胶层的外部还涂敷有一胶水与荧光粉混合层， 所述芯片 之间通过导线连接后引出正负极。 An LED light source module package structure, comprising a base having a reflector cup, wherein at least one LED chip is disposed in the center of the bottom of the reflector of the base, and the LED chip is adhered to the bottom of the reflector through an insulating glue, wherein: A hard silicone layer is coated around the surface of the LED chip, and a layer of glue and phosphor is mixed on the outside of the hard silicone layer. The chips are connected by wires to lead the positive and negative electrodes.
2、 根据权利要求 1所述的 LED光源模块封装结构， 其特征在于： 所述底座上设有绝缘片，所述 LED芯片经串联或并联连接后引出至绝缘 片。 2. The LED light source module package structure according to claim 1, wherein: the base is provided with an insulating sheet, and the LED chips are connected to the insulating sheet after being connected in series or in parallel.
3、 根据权利要求 1所述的 LED光源模块封装结构， 其特征在于： 所述底座的上表面设有一电镀的反光层。 3. The LED light source module package structure according to claim 1, wherein: an upper surface of the base is provided with an electroplated reflective layer.
4、 根据权利要求 1所述的 LED光源模块封装结构， 其特征在于： 所述底座和反光杯均为圓形。 4. The LED light source module package structure according to claim 1, wherein: the base and the reflector are both circular.
5、 根据权利要求 2所述的 LED光源模块封装结构， 其特征在于： 所述绝缘片为玻璃纤维片， 绝缘片上设有印刷电路。 The LED light source module package structure according to claim 2, wherein the insulating sheet is a glass fiber sheet, and the insulating sheet is provided with a printed circuit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102995730A CN102005445A (en) | 2010-09-30 | 2010-09-30 | Encapsulation structure of light emitting diode (LED) light source module |
| CN201010299573.0 | 2010-09-30 |
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| Publication Number | Publication Date |
|---|---|
| WO2012040956A1 true WO2012040956A1 (en) | 2012-04-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/CN2010/078620 WO2012040956A1 (en) | 2010-09-30 | 2010-11-11 | Packaging structure of led lighting source module |
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| CN (1) | CN102005445A (en) |
| WO (1) | WO2012040956A1 (en) |
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|---|---|---|---|---|
| CN102299247A (en) * | 2011-05-20 | 2011-12-28 | 浙江英特来光电科技有限公司 | Outdoor LED module group |
| CN102290410B (en) * | 2011-08-16 | 2016-09-07 | 陈炜旻 | LED area light source and manufacture method thereof |
| CN102306695A (en) * | 2011-09-09 | 2012-01-04 | 福建省万邦光电科技有限公司 | Ceramic-layer-plated base for LED (light emitting diode) light source single-cup module |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006237609A (en) * | 2005-02-22 | 2006-09-07 | Agilent Technol Inc | Semiconductor light emitting device and method for manufacturing same |
| CN101399304A (en) * | 2007-09-27 | 2009-04-01 | 海立尔股份有限公司 | Manufacturing method for LED with multi-layered optical lens and construction thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7655486B2 (en) * | 2006-05-17 | 2010-02-02 | 3M Innovative Properties Company | Method of making light emitting device with multilayer silicon-containing encapsulant |
| CN201820757U (en) * | 2010-09-30 | 2011-05-04 | 福建省万邦光电科技有限公司 | LED (light-emitting diode) light source module packaging structure |
-
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- 2010-09-30 CN CN2010102995730A patent/CN102005445A/en active Pending
- 2010-11-11 WO PCT/CN2010/078620 patent/WO2012040956A1/en active Application Filing
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006237609A (en) * | 2005-02-22 | 2006-09-07 | Agilent Technol Inc | Semiconductor light emitting device and method for manufacturing same |
| CN101399304A (en) * | 2007-09-27 | 2009-04-01 | 海立尔股份有限公司 | Manufacturing method for LED with multi-layered optical lens and construction thereof |
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