CN103148381A

CN103148381A - LED lamp encapsulating structure

Info

Publication number: CN103148381A
Application number: CN2013100473176A
Authority: CN
Inventors: 左洪波; 朱晓飚; 唐寅轩
Original assignee: Individual
Current assignee: Individual
Priority date: 2013-01-24
Filing date: 2013-01-24
Publication date: 2013-06-12

Abstract

The invention provides an LED lamp encapsulating structure. The LED lamp encapsulating structure consists of a lamp shade and a lamp holder, as well as LED light source groups, a stem, a support, a drive power supply and connecting conductors, which are arranged inside, wherein each LED light source group comprises a sapphire substrate, chip modules connected through metal wires on the sapphire substrate and fluorescent powder wrapped outside. According to the invention, metal wires are manufactured on the sapphire polished sections to connected chips so as to form the chip modules, and the fluorescent powder is wrapped outside the chip modules by 360 degrees to obtain an LED light source; a plurality of LED light sources are mutually connected and then assembled with the drive power supply and other lamp accessories to form a final LED lamp structure; as the sapphire substrates with excellent light transmittance are adopted, an active layer can almost nondestructively emit light in all directions to greatly improve the light extraction efficiency; as a heat sink structure is not needed, the weight of a lamp is remarkably reduced; and the transparent resin lamp shade adopts substantially the same structure as a conventional incandescent lamp, and the light emitting angle can reach more than 300 degrees.

Description

A kind of LED lamp encapsulation structure

(1) technical field

The present invention relates to field of semiconductor illumination, a kind of LED lamp encapsulation structure specifically is provided.

(2) background technology

The mankind are thrown light on the different stages such as having experienced incandescent lamp, fluorescent lamp, electricity-saving lamp, have made significant headway at aspects such as improving light efficiency.Yet, for the consideration of falling cost, energy-saving and environmental protection aspect, also have the space that further promotes.And LED utilizes the solid-state semiconductor chip as luminescent material, have the advantages such as luminous efficiency is high, volume is little, power consumption is low, long service life, environmental protection, its internal characteristics has determined that it is optimal conventional light source substitute, and its theoretical transformation efficient is higher 5～20 times than conventional light source light extraction efficiency.Whether the LED lamp can be popularized in the general lighting field raising of depending on the LED chip technology and the improvement of encapsulation technology, only have under the prerequisite of identical even more low production cost with the traditional lighting product, can obtain higher light efficiency, just might extensive use.

People are obtaining very big breakthrough aspect the making of LED lamp, and the highest light efficiency surpasses 130Lm/W, also has portioned product to put goods on the market.But also being far from reaching the level that substitutes conventional light source aspect cost of manufacture and product stability, there are a lot of problem demanding prompt solutions in the LED lamp at present.For example, different according to application, the LED lamp generally adopts pinned, SMD or COB pattern according to module now.Compare with conventional light source, LED lamp lighting angle is less, is 180～270 degree; The assembling chip substrate has PCB, MCPCB, ceramic substrate etc. usually, and these substrates are all light tight, makes the back side of chip can't bright dipping, affects amount of light.For solving the chip cooling problem, often adopt aluminium to do heat sink, this can make the weight of whole lamp larger, reaches more than 5 times of incandescent lamp.

(3) summary of the invention

The invention provides a kind ofly take sapphire as support, can significantly improve light extraction efficiency, large lighting angle is without the LED light fixture encapsulating structure of the lightweight of heat sink structure.

the object of the present invention is achieved like this: it is by lampshade, lamp socket and be placed in inner LED light source group, stem stem, support, driving power and connection wire form, the LED light source group comprises sapphire substrate, by the chip module of the connection of the metallic circuit on sapphire substrate and the fluorescent material of outside coating, sapphire substrate is for adopting sapphire surface processing polished wafer to make the substrate of chip module, be connected the metallic circuit that a side sapphire substrate surface is coated with the connection chip module electrode that conductive metal film is made into the chip module, the LED light source group is connected with driving power after wire connects with connecting, connect between the LED light source group and fix by stem stem and support.

The present invention also has some technical characterictics like this:

1, described sapphire polished wafer length 10-100mm, width 0.1-10mm, thickness 0.2-2mm.

2, the outer 360 degree coating fluorescent powders of described chip module, two ends reserve as with the link position of other module or power supply.

3, described connection wire is copper conductor, the mode with serial or parallel connection between the chip module is coupled together, then be connected with the output of drive circuit.

4, described lampshade comprises transparent lamp shade and insulating resin lampshade, and transparent lamp shade, insulating resin lampshade are connected with lamp socket respectively.

5, described stem stem and support material are printing opacity, high temperature insulation resin.

The LED light source group of LED multi-chip package of the present invention adopts sapphire surface processing polished wafer to make the substrate of chip module, be connected a side sapphire surface with the chip module and plate conductive metal film, adopt subsequently relevant art conductive metal film to be made into the circuit that connects chip module electrode, and by obtaining in advance lamp power, the chip dies component is contained on several substrates.With the outer 360 degree coating fluorescent powders of the chip module of making, two ends reserve conduct and other module or power supply link position.With copper conductor, the mode with serial or parallel connection between the chip module is coupled together, then be connected with the output of drive circuit, at last printing opacity, insulating resin lampshade are connected with lamp socket.Connect between the LED chip module and fix by stem stem and support, rock preventing.

The invention has the beneficial effects as follows: 1) adopt sapphire surface processing polished wafer as the chip dies group substrate, the light that active layer sends can see through substrate, makes the chip module can nearly 360 spend bright dippings; 2) insulating properties of the excellence that has of sapphire single-crystal, good thermal conductivity, and need not to use insulator separation between conductive layer, heat can be directly transferred on sapphire substrate, and thermal resistance is reduced; 3) the LED light source group is comprised of several many core assemblies sheet modules, adds the transparent lamp shade greater than 300 degree, makes more than the lighting angle of bulb can reach 300 degree; 4) adopt printing opacity, the good resin of thermal conductivity to do transparent lamp shade, compare with traditional glass ball bubble, manufacture craft is simple, and cost is low, and impact resistance is strong, is difficult for broken; 5) sapphire wafer can be processed into very high surface quality, touches well with the chip dies winding, is conducive to the transmission of heat; 6) do not adopt heat sink structure in fitting structure, light fitting quality is light.

(4) description of drawings

Fig. 1 is LED lamp encapsulation structure schematic diagram of the present invention.

(5) specific embodiment

The present invention is described in detail below in conjunction with the drawings and specific embodiments.

In conjunction with Fig. 1, the present embodiment is by lampshade 1, lamp socket 2 (underlying scolding tin gets an electric shock 3) and be placed in inner several LED light source groups 6, and stem stem 4, support 5, driving power and connection wire 7 form.As LED light source, LED light source group 6 adopts the sapphire polished wafer to do the sapphire substrate of chip module by 4 core assembly sheet modules, sapphire polished wafer length 30mm, and width 0.8mm, thickness 0.8mm, surface roughness is Ra10nm; With sapphire polished wafer single side surface plated aluminum metal film, and be etched into connection line, aluminum conductor width 80 μ m, line thicknesses 60 μ m.The chip module of some is connected with sapphire substrate surfaces of aluminum wire.Connecting wire 7 is copper conductor.Take series model between four LED light source groups, be connected the P electrode tip of LED light source group b with the N electrode tip in the P electrode tip of first LED light source group a and stem stem 4, connect successively subsequently LED light source group c and LED light source group d, the copper conductor that is connected with power cathode in the N utmost point of LED light source group d and stem stem is connected.LED light source group b lower end copper conductor is walked around insulating support and is connected with LED light source group c lower end, plays fixation.Between LED light source group a and LED light source group b, the copper conductor that is connected between LED light source group c and LED light source group d is separately fixed on support.Support and stem stem all adopt heat-resisting, insulating resin.

Claims

1. LED light fixture encapsulating structure, it is by lampshade, lamp socket and be placed in inner LED light source group, stem stem, support, driving power and connection wire form, it is characterized in that the LED light source group comprises sapphire substrate, by the chip module of the connection of the metallic circuit on sapphire substrate and the fluorescent material of outside coating, sapphire substrate is for adopting sapphire surface processing polished wafer to make the substrate of chip module, be connected the metallic circuit that a side sapphire substrate surface is coated with the connection chip module electrode that conductive metal film is made into the chip module, the LED light source group is connected with driving power after wire connects with connecting, connect between the LED light source group and fix by stem stem and support.

2. a kind of LED light fixture encapsulating structure according to claim 1, is characterized in that described sapphire polished wafer length 10-100mm, width 0.1-10mm, thickness 0.2-2mm.

3. a kind of LED light fixture encapsulating structure according to claim 2 is characterized in that the outer 360 degree coating fluorescent powders of described chip module, two ends reserve as with the link position of other module or power supply.

4. a kind of LED light fixture encapsulating structure according to claim 3, is characterized in that described connection wire is copper conductor, the mode with serial or parallel connection between the chip module coupled together, then be connected with the output of drive circuit.

5. a kind of LED light fixture encapsulating structure according to claim 4, is characterized in that described lampshade comprises transparent lamp shade and insulating resin lampshade, and transparent lamp shade, insulating resin lampshade are connected with lamp socket respectively.

6. a kind of LED light fixture encapsulating structure according to claim 5, is characterized in that described stem stem and support material are printing opacity, high temperature insulation resin.