CN103148381A - LED lamp encapsulating structure - Google Patents

LED lamp encapsulating structure Download PDF

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Publication number
CN103148381A
CN103148381A CN2013100473176A CN201310047317A CN103148381A CN 103148381 A CN103148381 A CN 103148381A CN 2013100473176 A CN2013100473176 A CN 2013100473176A CN 201310047317 A CN201310047317 A CN 201310047317A CN 103148381 A CN103148381 A CN 103148381A
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China
Prior art keywords
connected
led
light source
lamp
led lamp
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CN2013100473176A
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Chinese (zh)
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左洪波
朱晓飚
唐寅轩
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左洪波
朱晓飚
唐寅轩
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Priority to CN2013100473176A priority Critical patent/CN103148381A/en
Publication of CN103148381A publication Critical patent/CN103148381A/en

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Abstract

The invention provides an LED lamp encapsulating structure. The LED lamp encapsulating structure consists of a lamp shade and a lamp holder, as well as LED light source groups, a stem, a support, a drive power supply and connecting conductors, which are arranged inside, wherein each LED light source group comprises a sapphire substrate, chip modules connected through metal wires on the sapphire substrate and fluorescent powder wrapped outside. According to the invention, metal wires are manufactured on the sapphire polished sections to connected chips so as to form the chip modules, and the fluorescent powder is wrapped outside the chip modules by 360 degrees to obtain an LED light source; a plurality of LED light sources are mutually connected and then assembled with the drive power supply and other lamp accessories to form a final LED lamp structure; as the sapphire substrates with excellent light transmittance are adopted, an active layer can almost nondestructively emit light in all directions to greatly improve the light extraction efficiency; as a heat sink structure is not needed, the weight of a lamp is remarkably reduced; and the transparent resin lamp shade adopts substantially the same structure as a conventional incandescent lamp, and the light emitting angle can reach more than 300 degrees.

Description

一种LED灯封装结构 An LED lamp package

(—)技术领域 (-) FIELD

[0001] 本发明涉及半导体照明领域,具体提供一种LED灯封装结构。 [0001] The present invention relates to semiconductor lighting, specifically to provide an LED lamp package.

(二)背景技术 (B) Background Art

[0002] 人类照明经历了白炽灯、荧光灯、节能灯等不同的阶段,在提高光效等方面取得了很大的进步。 [0002] Human illumination experienced different stages of incandescent, fluorescent, energy saving lamps, made great strides in improving the light efficiency and the like. 然而,出于降成本、节能、环保方面的考虑,还有进一步提升的空间。 However, for cost reduction, energy saving, environmental considerations, there is further room for improvement. 而LED利用固态半导体芯片作为发光材料,具有发光效率高、体积小、耗电量低、使用寿命长、环保等优点,其内在特征决定了它是最理想的传统光源替代品,其理论转换效率比传统光源出光效率高5〜20倍。 Using solid state semiconductor chips and LED as a light emitting material having high light emission efficiency, small size, low power consumption, long life, environmental protection, etc., the inherent characteristics of the decision it is the ideal alternative to conventional light sources, the theoretical conversion efficiency 5~20 times than conventional light sources the light efficiency. LED灯是否能够在普通照明领域得以普及取决于LED芯片技术的提高和封装技术的改进,只有在与传统照明产品具有相同甚至更低生产成本的前提下,能够获得更高的光效,才有可能广泛应用。 Whether the LED lamp can be improved depending on the improvement and popularize LED chip packaging technology art in the field of general lighting, and only in the traditional lighting products have the same or even lower production costs premise, higher luminous efficiency can be obtained, only It may be widely used.

[0003] 人们在LED灯制作方面已经取得了很大突破,最高光效超过130Lm/W,也有部分产品投入市场。 [0003] people in terms of making LED lights have made great breakthroughs, the maximum luminous efficiency of more than 130Lm / W, there are some products into the market. 但目前LED灯在制作成本及产品稳定性方面还远远没有达到替代传统光源的水平,存在很多亟待解决的问题。 But the LED lights in production costs and product stability still far from reaching the level alternative to traditional light sources, there are many problems to be solved. 例如,根据应用领域不同,现今LED灯根据模组一般采用引脚式、贴片式、或COB模式。 For example, according to different applications, according to the LED lamp module is now commonly used pin-type, SMD, or COB mode. 与传统光源相比,LED灯发光角度较小,为180〜270度;组装芯片基板通常有PCB、MCPCB、陶瓷基板等,这些基板均不透光,使芯片的背面无法出光,影响出光量。 Compared with traditional light sources, LED light emission angle is small, the degree of 180~270; usually assembled chip board PCB, MCPCB, a ceramic substrate or the like, which are not light-transmissive substrate, the back surface of the chip can not be light, influence the amount of light. 为解决芯片散热问题,常采用铝做热沉,这会使整个灯的重量较大,达白炽灯的5倍以上。 To solve the chip cooling problems, aluminum is often used to make heat sink, which causes heavy weight of the whole lamp, incandescent of more than 5 times.

(三)发明内容 (Iii) Disclosure of the Invention

[0004] 本发明提供一种以蓝宝石为支架,能够显著提高出光效率的,大发光角度,无热沉结构的轻质的LED灯具封装结构。 [0004] The present invention provides a stent as sapphire, can significantly improve the light extraction efficiency, a large emission angle, no heat sink structure lightweight LED lighting package.

[0005] 本发明的目的是这样实现的:它是由灯罩、灯座及置于内部的LED光源组、芯柱、支架、驱动电源及连接导线组成,LED光源组包括蓝宝石基板、通过蓝宝石基板上的金属线路连接的芯片模组及外面包覆的荧光粉,蓝宝石基板为采用蓝宝石表面加工抛光晶片做芯片模组的基板,与芯片模组连接一侧蓝宝石基板表面镀有金属导电薄膜制作成的连接芯片模组电极的金属线路,LED光源组用连接导线连接后与驱动电源相连,LED光源组间连接通过芯柱和支架固定。 [0005] The object of the present invention is implemented as follows: it is a globe, and the socket is placed inside the LED light source group, the stem, the stent, and connecting the wires that comprise driving power, the LED light source group includes a sapphire substrate, a sapphire substrate by metal lines on the chip module and connected to the outside of the phosphor-coated sapphire substrate is a surface of a sapphire substrate chip do polished wafer processing module, connected to the side surface of the sapphire substrate coated with a metal chip module made into a conductive thin film connecting a metal line electrode chip module, the LED light source group is connected with power wire connected to the drive connection, is connected between the LED light source group and the bracket is fixed by the stem.

[0006] 本发明还有这样一些技术特征: [0006] Thus the present invention also has technical features:

[0007] 1、所述的蓝宝石抛光晶片长度IO-1OOmm,宽度0.1-1Omm,厚度0.2_2mm。 [0007] 1, the length of the sapphire wafer polishing IO-1OOmm, width 0.1-1Omm, thickness 0.2_2mm.

[0008] 2、所述的芯片模组外360度包覆荧光粉,两端留出作为与其它模组或电源的连接位置。 [0008] 2, the outer covering of the phosphor chip module 360, leaving both ends of a module or other power connection points.

[0009] 3、所述的连接导线为铜导线,将芯片模组间用串联或并联的方式连接起来,再与驱动电路的输出端相连。 [0009] 3, said connecting wire is a copper wire, the connections between the chip module in series or in parallel together and then connected to the output of the driver circuit.

[0010] 4、所述的灯罩包括透光灯罩和绝缘树脂灯罩,透光灯罩、绝缘树脂灯罩分别与灯座相连。 [0010] 4, the lampshade comprising a light transmissive envelope and an insulating resin cover, light transmissive envelope, an insulating resin cover respectively connected with the socket. [0011] 5、所述的芯柱及支架材质为透光、耐热绝缘树脂。 [0011] 5, and the stem holder made of light transmissive, heat-resistant insulating resin.

[0012] 本发明LED多芯片封装的LED光源组采用蓝宝石表面加工抛光晶片做芯片模组的基板,与芯片模组连接一侧蓝宝石表面镀上金属导电薄膜,随后采用相应技术将金属导电薄膜制作成连接芯片模组电极的线路,并按预得到灯具功率将芯片模组分装在几个基板上。 [0012] LED package of the present invention, a multi-chip LED light source group polished sapphire wafer surface processing done substrate chip module, connected to the side surface of the sapphire chip module plated metal conductive film, and then using the corresponding conductive metal film production techniques chip module is connected to the electrode line, the pre-press to give the lamp power chip module are distributed on several substrates. 将制作好的芯片模组外360度包覆荧光粉,两端留出作为与其它模组或电源连接位置。 The outer chip module 360 ​​make a good phosphor coating, leaving both ends of a connection to other modules or power position. 用铜导线将芯片模组间用串联或并联的方式连接起来,再与驱动电路的输出端相连,最后将透光、绝缘树脂灯罩与灯座相连。 Copper wire connections between the chip module in series or in parallel with them, and then connected to the output drive circuit, and finally connected to a light-transmitting, insulating resin cover with socket. LED芯片模组间连接通过芯柱和支架固定,以防止晃动。 LED chip module is connected between the stem and secured by brackets to prevent rattling.

[0013] 本发明的有益效果是:1)采用蓝宝石表面加工抛光晶片作为芯片模组基板,有源层发出的光线可以透过基板,使芯片模组可以近360度出光;2)蓝宝石单晶具有的优异的绝缘性,良好的导热性,与导电层间无需用绝缘层隔离,热量可直接传导到蓝宝石基板上,使热阻降低;3)LED光源组由数条多组芯片模组组成,加上大于300度的透光灯罩,使灯泡的发光角度可达300度以上;4)采用透光、导热性良好的树脂做透光灯罩,与传统玻璃球泡相比,制作工艺简单,成本低,且抗冲击性强,不易破碎;5)蓝宝石晶片可以加工成非常高的表面质量,与芯片模组接触良好,有利于热量的传输;6)灯具结构中不采用热沉结构,灯具质量轻。 [0013] Advantageous effects of the present invention are: 1) The polished wafer surface processing sapphire light emitted as a chip module substrate, the active layer may be transmitted through the substrate, the chip module can be light near 360 degrees; 2) sapphire single crystal It has excellent insulating properties, good thermal conductivity, between the conductive layer and the insulating layer without isolation, directly to the heat-conducting sapphire substrate to reduce thermal resistance; 3) LED light source group by a number of chip module consisting of a plurality of sets , with greater than 300 degrees, light transmissive envelope of the light emitting bulb angle up to 300 degrees; 4) is transparent to light, good thermal conductivity, light transmissive envelope made of resin, as compared with conventional glass bulb, the production process is simple, low cost, and impact resistance, not broken; 5) sapphire wafer can be processed into a very high surface quality, good contact with the chip module, facilitate the transmission of heat; 6) are not used in the lamp structure heat sink structure, lighting light in mass.

(四)附图说明 (Iv) Brief Description of Drawings

[0014] 图1为本发明LED灯封装结构示意图。 [0014] FIG 1 LED lamp package of the present invention, a schematic view.

(五)具体实施方式 (E) Detailed Description

[0015] 下面结合附图和具体实施方式对本发明进行详细说明。 [0015] The present invention will be described in detail in conjunction with accompanying drawings and specific embodiments.

[0016] 结合图1,本实施例由灯罩1、灯座2 (下置焊锡触电3)及置于内部的数根LED光源组6,芯柱4、支架5、驱动电源及连接导线7组成。 [0016] in conjunction with FIG. 1, a lampshade Example 1 of the present embodiment, the number of the LED light source group socket 2 (3 underlying solder shock) and placed inside 6 of the stem 4, the bracket 5, and the driving power supply line 7 is connected Composition . 由4组芯片模组作为LED光源,LED光源组6采用蓝宝石抛光晶片做芯片模组的蓝宝石基板,蓝宝石抛光晶片长度30_,宽度 An LED light source, LED light source group 6 sapphire wafer is polished by the chip module 4 groups do chip module sapphire substrate, a sapphire wafer polishing 30_ length, width

0.8mm,厚度0.8mm,表面粗糙度为RalOnm ;将蓝宝石抛光晶片单侧表面镀上铝金属膜,并刻蚀成连接线路,铝导线宽度80 μ m,线路厚度60 μ m。 0.8mm, thickness 0.8mm, the surface roughness RalOnm; sapphire wafer polished on one side was coated with aluminum metal film, and etched into a connecting line, the width of the aluminum wire 80 μ m, line thickness 60 μ m. 将一定数量的芯片模组与蓝宝石基板表面铝导线相连。 A certain number of the chip module and the sapphire substrate surface of the aluminum wire are connected. 连接导线7为铜导线。 Connection wires 7 are made of copper. 四个LED光源组间采取串联模式,第一个LED光源组a的P电极端与芯柱4中与N电极端连接LED光源组b的P电极端,随后依次连接LED光源组c和LED光源组d,LED光源组d的N极与芯柱中与电源负极相连的铜导线相连。 LED light source groups take between four line mode, the first LED light source electrode terminal P of a group and the stem 4 N terminal is electrically connected to the electrode terminal P of the LED light source group b, then c sequentially connected LED group and LED light source group d, copper wire connected to the N pole and connected to the stem of the LED light source group with negative power d. LED光源组b下端铜导线绕过绝缘支架与LED光源组c下端相连,起固定作用。 LED light source group b copper wire to bypass lower insulating holder with the LED light source is connected to the lower end of c, serve as an anchor. LED光源组a与LED光源组b间,LED光源组c与LED光源组d间相连的铜导线分别固定在支架上。 LED light source group among a group of the LED light source b, copper wire connected to the LED light source group among the LED light source group d c are fixed to the holder. 支架及芯柱均采用耐热、绝缘树脂。 Support and the stem are made of heat-resistant insulating resin.

Claims (6)

1.一种LED灯具封装结构,它是由灯罩、灯座及置于内部的LED光源组、芯柱、支架、驱动电源及连接导线组成,其特征在于LED光源组包括蓝宝石基板、通过蓝宝石基板上的金属线路连接的芯片模组及外面包覆的荧光粉,蓝宝石基板为采用蓝宝石表面加工抛光晶片做芯片模组的基板,与芯片模组连接一侧蓝宝石基板表面镀有金属导电薄膜制作成的连接芯片模组电极的金属线路,LED光源组用连接导线连接后与驱动电源相连,LED光源组间连接通过芯柱和支架固定。 1. An LED lamp package, which is a lamp, lamp holder and the LED light source group disposed inside the stem, bracket, power supply and connecting wires, and is characterized in that the LED light source group includes a sapphire substrate, a sapphire substrate by metal lines on the chip module and connected to the outside of the phosphor-coated sapphire substrate is a surface of a sapphire substrate chip do polished wafer processing module, connected to the side surface of the sapphire substrate coated with a metal chip module made into a conductive thin film connecting a metal line electrode chip module, the LED light source group is connected with power wire connected to the drive connection, is connected between the LED light source group and the bracket is fixed by the stem.
2.根据权利要求1所述的一种LED灯具封装结构,其特征在于所述的蓝宝石抛光晶片长度10~100mm' 宽度0.1-1Omm,厚度0.2_2mm。 A LED lamp package according to claim 1, wherein said polishing sapphire wafer 10 ~ length 'width 100mm 0.1-1Omm, thickness 0.2_2mm.
3.根据权利要求2所述的一种LED灯具封装结构,其特征在于所述的芯片模组外360度包覆荧光粉,两端留出作为与其它模组或电源的连接位置。 An LED lamp package according to claim 2, wherein said outer coating phosphor chip module 360, leaving both ends of a module or other power connection points.
4.根据权利要求3所述的一种LED灯具封装结构,其特征在于所述的连接导线为铜导线,将芯片模组间用串联或并联的方式连接起来,再与驱动电路的输出端相连。 An LED lamp package according to claim 3, wherein said connecting wire is a copper wire, connecting between the chip module in series or in parallel, and then connected to the output terminal of the drive circuit .
5.根据权利要求4所述的一种LED灯具封装结构,其特征在于所述的灯罩包括透光灯罩和绝缘树脂灯罩,透光灯罩、绝缘树脂灯罩分别与灯座相连。 A LED lamp package as claimed in claim 4, characterized in that said globe comprises a light transmissive envelope and an insulating resin cover, light transmissive envelope, the insulating resin cover is connected to the socket, respectively.
6.根据权利要求5所述的一种LED灯具封装结构,其特征在于所述的芯柱及支架材质为透光、耐热绝缘树脂。 A LED lamp package as claimed in claim 5, wherein said holder stem and made of light transmissive, heat-resistant insulating resin.
CN2013100473176A 2013-01-24 2013-01-24 LED lamp encapsulating structure CN103148381A (en)

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CN103499037A (en) * 2013-10-15 2014-01-08 江苏华英光宝科技股份有限公司 Power source hidden LED bulb
CN103994349A (en) * 2014-05-04 2014-08-20 杭州杭科光电股份有限公司 LED bulb lamp with high lighting efficiency
CN104373842A (en) * 2014-11-04 2015-02-25 蔡干强 LED plastic structure bulb
CN104377194A (en) * 2014-11-17 2015-02-25 深圳市裕富照明有限公司 LED lamp filament, LED bulb and lamp
WO2015144030A1 (en) * 2014-03-24 2015-10-01 东莞市雷明灯照明科技有限公司 Led lamp wick and manufacturing method for led filament monomer thereof
CN105444109A (en) * 2015-12-02 2016-03-30 芜湖锐芯电子科技有限公司 Intelligent LED lamp with non-polar dimming function
CN105451417A (en) * 2015-12-02 2016-03-30 芜湖锐芯电子科技有限公司 Sectional dimming LED lamp
CN106159062A (en) * 2016-08-08 2016-11-23 深圳市泓亚智慧科技股份有限公司 LED filament light source, LED filament bulb lamp and production method thereof

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CN202281062U (en) * 2011-08-29 2012-06-20 浙江锐迪生光电有限公司 LED chip 4-Pi light-emitting LED bulb with high color rendering index
CN102800789A (en) * 2011-05-27 2012-11-28 东芝照明技术株式会社 Light-emitting module and lighting apparatus

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CN1679177A (en) * 2002-08-29 2005-10-05 氮化物半导体株式会社 Light-emitting device having light-emitting elements
CN102800789A (en) * 2011-05-27 2012-11-28 东芝照明技术株式会社 Light-emitting module and lighting apparatus
CN202281062U (en) * 2011-08-29 2012-06-20 浙江锐迪生光电有限公司 LED chip 4-Pi light-emitting LED bulb with high color rendering index

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103499037A (en) * 2013-10-15 2014-01-08 江苏华英光宝科技股份有限公司 Power source hidden LED bulb
CN103499037B (en) * 2013-10-15 2016-06-29 江苏华英光宝科技股份有限公司 Concealed power led lamp
WO2015144030A1 (en) * 2014-03-24 2015-10-01 东莞市雷明灯照明科技有限公司 Led lamp wick and manufacturing method for led filament monomer thereof
CN103994349A (en) * 2014-05-04 2014-08-20 杭州杭科光电股份有限公司 LED bulb lamp with high lighting efficiency
CN104373842A (en) * 2014-11-04 2015-02-25 蔡干强 LED plastic structure bulb
CN104377194A (en) * 2014-11-17 2015-02-25 深圳市裕富照明有限公司 LED lamp filament, LED bulb and lamp
CN105444109A (en) * 2015-12-02 2016-03-30 芜湖锐芯电子科技有限公司 Intelligent LED lamp with non-polar dimming function
CN105451417A (en) * 2015-12-02 2016-03-30 芜湖锐芯电子科技有限公司 Sectional dimming LED lamp
CN106159062A (en) * 2016-08-08 2016-11-23 深圳市泓亚智慧科技股份有限公司 LED filament light source, LED filament bulb lamp and production method thereof

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