CN204464318U - A kind of bar shaped one side emitting led light source and light-emitting device thereof - Google Patents
A kind of bar shaped one side emitting led light source and light-emitting device thereof Download PDFInfo
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- CN204464318U CN204464318U CN201520019624.8U CN201520019624U CN204464318U CN 204464318 U CN204464318 U CN 204464318U CN 201520019624 U CN201520019624 U CN 201520019624U CN 204464318 U CN204464318 U CN 204464318U
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- metal substrate
- light source
- bar shaped
- conductive electrode
- led light
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- 239000000758 substrate Substances 0.000 claims abstract description 38
- 229910052751 metal Inorganic materials 0.000 claims abstract description 35
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- 230000004888 barrier function Effects 0.000 claims abstract description 13
- 239000004020 conductor Substances 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 13
- 239000010410 layer Substances 0.000 claims description 11
- 239000004411 aluminium Substances 0.000 claims description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 239000002344 surface layer Substances 0.000 claims description 3
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- 239000011521 glass Substances 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
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- 229910000831 Steel Inorganic materials 0.000 description 1
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- 238000009713 electroplating Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
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Abstract
A kind of bar shaped one side emitting led light source and light-emitting device thereof, described light source comprises metal substrate, conductive electrode, insulating barrier, specular layer, LED chip, plain conductor and arc fluorescent glue, it is, insulating barrier is provided with at the two ends of metal substrate, specular layer is provided with in the middle of metal substrate, described conductive electrode is attached on insulating barrier, some LEDs chips are provided with on specular layer, be together in series by plain conductor between LED chip, and be finally connected with the conductive electrode at metal substrate two ends, be provided with in arc fluorescent glue is wrapped on plain conductor and LED chip, described light-emitting device adopts foregoing bar shaped one side emitting led light source, solve the heat radiation of LED filament and power problem of being made up of metal substrate, make its not only radiating effect greatly improve, and structure is easy to realize, thus solve the deficiency of prior art.
Description
Technical field
The utility model belongs to lighting technical field, be specifically related to a kind of bar shaped one side emitting led light source and light-emitting device relevant.
Background technology
LED(Light Emitting Diode); be a kind of semiconductor element of luminescence, because its controllability is good, structure is simple; compact; color is pure, abundant, shock-resistant, vibration resistance; the features such as the response time is fast; being recognized is 21 century one of high-tech product most with prospects, while initiation illumination revolution, also for promoting energy-saving and emission-reduction, environmental protection makes major contribution.
COB is that Chip On Boarding(chip on board directly fills) english abbreviation, a kind of by adhesive or solder, LED chip is directly pasted PCB(Printed Circuit Board) on plate, then the encapsulation technology of electrical interconnection between chip and pcb board is realized by wire bonding.COB technology is mainly used in the LED of high-power multi-core chip arrays, with SMT(Surface Mounted Technology surface mounting technology) compare, not only substantially increase package power density, and reduce packaging thermal resistance.
People in order to the effect of the profile and luminescence of imitating incandescent lamp, and then have invented LED silk lamp, and at present, LED filament substrate mainly contains transparent ceramic, glass, perspex, metal substrate etc.
Wherein, transparency carrier (as pottery, glass) light transmission is good, can realize all-round angle easily luminous, but expensive due to it, and make complexity, thermal conductivity is low, is often restricted in using.Metal substrate is in the market cheap, thermal conductivity is high, but due to the reason of structural design, light source junction temperature is caused to rise, light decay increases, filament heat dissipation technology cannot effectively be solved always, although people expect filling inertia heat radiation gas around filament, DeGrain and too increase production cost.And then the power of light source cannot be done greatly.
Summary of the invention
The purpose of this utility model is the shortcoming overcoming above-mentioned prior art, provides a kind of bar shaped one side emitting led light source and light-emitting device thereof, is intended to solve the LED filament be made up of metal substrate and dispels the heat and power problem.Make its not only radiating effect greatly improve, and structure is easy to realize, thus solves the deficiency of prior art.
For reaching above-mentioned purpose, the utility model adopts following technical scheme:
A kind of bar shaped one side emitting led light source, comprises metal substrate, conductive electrode, insulating barrier, specular layer, LED chip, plain conductor and arc fluorescent glue; It is, insulating barrier is provided with at the two ends of metal substrate, specular layer is provided with in the middle of metal substrate, described conductive electrode is attached on insulating barrier, some LEDs chips are provided with on specular layer, be together in series by plain conductor between LED chip, and be finally connected with the conductive electrode at metal substrate two ends, be provided with in arc fluorescent glue is wrapped on plain conductor and LED chip.
Further, wherein, described metal substrate is rectangular structure, is copper material or aluminium or iron material.
Further, the surface layer of metal substrate electroplates one deck specular aluminium reflector.
Further, the width of metal substrate is 2-5mm.
A kind of light-emitting device, described light-emitting device adopts foregoing bar shaped one side emitting led light source.
Adopt technique scheme, solve the heat radiation of LED silk and power problem of being made up of metal substrate.Make its not only radiating effect greatly improve, and structure is easy to realize, thus solves the deficiency of prior art.
Accompanying drawing explanation
Fig. 1 is the utility model structural representation;
Fig. 2 is the utility model cross-sectional view.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail.
Consult Fig. 1-Figure 2 shows that embodiment of the present utility model.
A kind of bar shaped one side emitting led light source, comprises metal substrate 1, conductive electrode 2, insulating barrier 3, specular layer 4, LED chip 5, plain conductor 6 and arc fluorescent glue 7; It is, insulating barrier 3 is provided with at the two ends of metal substrate 1, specular layer 4 is provided with in the middle of metal substrate 1, described conductive electrode 2 is attached on insulating barrier 3, some LEDs chips 5 are provided with on specular layer 4, be together in series by plain conductor 6 between LED chip 5, and be finally connected with the conductive electrode 2 at metal substrate 1 two ends, be provided with in arc fluorescent glue 7 is wrapped on plain conductor 6 and LED chip 5.
In actual applications, in order to reduce material cost, described metal substrate can be copper material or the metal material such as aluminium or iron of cuboid knot, and prioritizing selection sexual valence is than high aluminium.In order to improve the reflectivity of metal substrate, the surface layer of metal substrate is electroplated one deck specular aluminium reflector.In order to improve thermal endurance and the adhesive property of insulating barrier, the material used between metal substrate and conductive electrode is BT material or FR4 material.The die bond glue used in order to the brightness LED chip improving light source can make elargol or insulating cement, preferentially selects transparent insulation glue, can reduce the absorption of die bond glue to chip brightness.In order to improve the conductivity of light source, the plain conductor that LED light source is used, can make gold thread, silver-colored line, copper cash, aluminum steel, iron wire or alloy wire etc.Preferentially select gold thread or alloy wire.In order to improve the light efficiency of light source, LED fluorescent glue used is high index of refraction organic silica gel.In order to increase the light-out effect of light source, the width control system of metal aluminum substrate can need to change according to actual design in 2-5mm. length.In order to improve the thermal diffusivity of light source, described aluminium base THICKNESS CONTROL is between 2-5mm.
Another object of the present utility model is to provide a kind of light-emitting device, and described light-emitting device adopts above-mentioned bar shaped one side emitting led light source.
The utility model, when making, is divided into substrate manufacture, die bond bonding wire, some glue or mould molding.
Substrate manufacture is as follows: metal substrate, through extruding or dicing, is made into the thickness that design is wanted.By sheet metal base plate by chemical plating method, in its electroplating surface one deck high reflectance minute surface aluminium reflector.By impurity such as the mirror-surface aluminum base board distilled water clean surface greasy dirts electroplated.According to drawing requirement brushing insulating layer material, pressing conductive electrode on insulating layer material.The material good by pressing, uses the method for electroless plating, conductive electrode is electroplated the turmeric of 3-10um.Finally cut into netted strip structure support according to layout design.
Die bond bonding wire: by the support made by automatic die bond board by LED chip die bond on the specular aluminium reflector of bullion substrate, baking, the cleaning of electricity slurry, bonding wire.
Point glue or mould molding: the material that bonding wire is good dehumidifies, and the low high-viscosity glue of thixotropy can be used to use automatic board to carry out tie rod point glue, also can be shaping by mould bar.Baking.
Finally the material that baking terminates is carried out electric parameter detecting.
The utility model solves the heat radiation of LED filament and power problem of being made up of metal substrate.Make its not only radiating effect greatly improve, and structure is easy to realize, thus solves the deficiency of prior art.
Another object of the utility model embodiment is to provide a kind of light-emitting device, and described light-emitting device adopts above-mentioned LED silk.
Above-mentioned explanation illustrate and describes preferred embodiment of the present utility model, as previously mentioned, be to be understood that the utility model is not limited to the form disclosed by this paper, should not regard the eliminating to other embodiments as, and can be used for other combinations various, amendment and environment, and can in utility model contemplated scope described herein, changed by the technology of above-mentioned instruction or association area or knowledge.And the change that those skilled in the art carry out and change do not depart from spirit and scope of the present utility model, then all should in the protection range of the utility model claims.
Claims (5)
1. a bar shaped one side emitting led light source, is characterized in that: comprise metal substrate, conductive electrode, insulating barrier, specular layer, LED chip, plain conductor and arc fluorescent glue; It is, insulating barrier is provided with at the two ends of metal substrate, specular layer is provided with in the middle of metal substrate, described conductive electrode is attached on insulating barrier, some LEDs chips are provided with on specular layer, be together in series by plain conductor between LED chip, and be finally connected with the conductive electrode at metal substrate two ends, be provided with in arc fluorescent glue is wrapped on plain conductor and LED chip.
2. a kind of bar shaped one side emitting led light source as claimed in claim 1, it is characterized in that: wherein, described metal substrate is rectangular structure, is copper material or aluminium or iron material.
3. a kind of bar shaped one side emitting led light source as claimed in claim 1, is characterized in that: the surface layer of metal substrate is electroplated one deck specular aluminium reflector.
4. a kind of bar shaped one side emitting led light source as claimed in claim 1, is characterized in that: the width of metal substrate is 2-5mm.
5. a light-emitting device, is characterized in that: described light-emitting device adopts the bar shaped one side emitting led light source as described in claim 1-4 any one.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201520019624.8U CN204464318U (en) | 2015-01-13 | 2015-01-13 | A kind of bar shaped one side emitting led light source and light-emitting device thereof |
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CN201520019624.8U CN204464318U (en) | 2015-01-13 | 2015-01-13 | A kind of bar shaped one side emitting led light source and light-emitting device thereof |
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CN204464318U true CN204464318U (en) | 2015-07-08 |
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CN201520019624.8U Expired - Fee Related CN204464318U (en) | 2015-01-13 | 2015-01-13 | A kind of bar shaped one side emitting led light source and light-emitting device thereof |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015120085A1 (en) * | 2015-11-19 | 2017-05-24 | Osram Opto Semiconductors Gmbh | LED filaments, process for producing LED filaments and retrofit lamp with LED filament |
CN107305885A (en) * | 2016-04-20 | 2017-10-31 | 香港理工大学 | LED filament, LED lamp and manufacturing method thereof |
CN107644886A (en) * | 2016-07-21 | 2018-01-30 | 三星显示有限公司 | Light-emitting device and its manufacture method |
-
2015
- 2015-01-13 CN CN201520019624.8U patent/CN204464318U/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015120085A1 (en) * | 2015-11-19 | 2017-05-24 | Osram Opto Semiconductors Gmbh | LED filaments, process for producing LED filaments and retrofit lamp with LED filament |
CN107305885A (en) * | 2016-04-20 | 2017-10-31 | 香港理工大学 | LED filament, LED lamp and manufacturing method thereof |
CN107644886A (en) * | 2016-07-21 | 2018-01-30 | 三星显示有限公司 | Light-emitting device and its manufacture method |
CN107644886B (en) * | 2016-07-21 | 2023-06-13 | 三星显示有限公司 | Light emitting device and manufacturing method thereof |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150708 Termination date: 20200113 |