CN203288645U - Circular MCOB packaging structure - Google Patents
Circular MCOB packaging structure Download PDFInfo
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- CN203288645U CN203288645U CN2013203149767U CN201320314976U CN203288645U CN 203288645 U CN203288645 U CN 203288645U CN 2013203149767 U CN2013203149767 U CN 2013203149767U CN 201320314976 U CN201320314976 U CN 201320314976U CN 203288645 U CN203288645 U CN 203288645U
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- mcob
- encapsulating structure
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Abstract
The utility model discloses a circular MCOB packaging structure comprising a circular aluminium substrate with a sinking hole and a wafer fixed on the aluminium substrate by wafer fixing adhesive. Two surface electrodes are mounted on two sides of the aluminium substrate. The wafer is connected with the surface electrodes by a golden wire. Packaging colloid for sealing the wafer and the golden wire is disposed on the wafer and around the wafer. A plurality of packaging structures of the aluminium plates are combined, are packaged on the overall substrate and are connected by leads to be convenient to connect a power supply in a unified manner. The MCOB packaging structure provided by the utility model has the advantages of simple structure, low cost, high light efficiency, low thermal resistance, high heat conduction, low light attenuation, uniform light emission and color-spot-free property. The circular MCOB packaging structure can fill market blank of the demands at home and abroad.
Description
Technical field
The utility model relates to LED illumination and encapsulation technology, relate in particular to a kind of high light efficiency, low thermal resistance, high heat conduction, low light attenuation, bright dipping evenly, without color spot, low-cost circular MCOB packaged LED structure.
Background technology
LED (light-emitting diode) application is very extensive, as semiconductor light sources, compare the traditional lighting light source, have energy-conservation, life-span is long, environmental protection, use the advantages such as voltage is low, white light SMD (the surface attaching type that current techniques provides, Surface Mounted Devices) integration packaging technology, that light-emitting diode is arranged on aluminium base and makes the LED bulb lamp, thereby make the contact heat resistance of device architecture thermal resistance and device and aluminium base larger, thereby cause the PN junction temperature higher, heat is not easy to derive in time, poor radiation, for a long time so can cause the reduction in LED lamp life-span, can only be applied to the less demanding lighting field of properties of product, this is external when carrying out paster, needed Reflow Soldering, its high temperature can cause very major injury to wafer, thereby make whole integrated morphology defect rate high, easily damage.
LED chip only concentrates on chip internal, allow luminous energy more run out, need very many angles, the mouth of bright dipping is The more the better in other words, efficiency just can promote, contrast present most MCOB encapsulation, all on the encapsulation basis of aluminium base, on aluminium base, a plurality of integrated chips being encapsulated together exactly, is Copper Foil below the substrate of aluminium base, and Copper Foil can only well be switched on, can not do good optical treatment, thereby make the luminous efficiency of this encapsulating structure poor, light loss is larger, and illumination effect is bad.
The utility model content
The purpose of this utility model is the deficiency for original technology, provide a kind of high light efficiency, low thermal resistance, high heat conduction, low light attenuation, bright dipping evenly, without color spot, low-cost circular MCOB encapsulating structure.
To achieve these goals, the technical scheme that the utility model provides is: a kind of circular MCOB encapsulating structure, comprise circular aluminium base and by crystal-bonding adhesive, be fixed on wafer on aluminium base, the both sides of described aluminium base are provided with two surface electrodes, described wafer is connected to described surface electrode by gold thread, also is provided with the packing colloid of the described wafer of sealing and gold thread around described wafer and wafer.
Preferably, the encapsulating structure assembled package of described a plurality of aluminium bases, to monolith substrate, uses wire to be connected to each other between the encapsulating structure of described a plurality of aluminium bases, convenient unified access power supply.
Preferably, the outside of described wafer also is provided with transparent arc packaging body, and described arc packaging body is fixed on described aluminium base.
Preferably, also be provided with counterbore for heat conduction and heat radiation on described aluminium base.
Preferably, the size diameter of described monolith substrate is 48mm.
compared with prior art, MCOB encapsulating structure described in the utility model, simple in structure, LED chip directly is put in a plurality of optics cups and encapsulates, realized optical treatment preferably, bright dipping is even, avoided to greatest extent glare problem, by directly being installed to LED chip on aluminium base, the LED that compares is arranged on aluminium base and makes the LED bulb lamp, can remove the contact heat resistance of device architecture thermal resistance and device and aluminium base from, be conducive to reduce the PN junction temperature, heat is derived in time, extended the life-span of light fixture, the MCOB encapsulation does not need Reflow Soldering in addition, do not need to buy the equipment such as chip mounter and welding yet, owing to having saved the device operation, not only reduced the threshold of application enterprise, cost can significantly descend simultaneously.
Therefore, on the whole, MCOB encapsulating structure described in the utility model, have advantages of simple in structure, cost is low, high light efficiency, low thermal resistance, high heat conduction, low light attenuation, bright dipping evenly, without color spot, can fill up the market vacancy of this type of demand both at home and abroad.
Description of drawings
Below utilize accompanying drawing to be further detailed the utility model, but the embodiment in accompanying drawing does not form any restriction of the present utility model.
Fig. 1 is the Facad structure schematic diagram of MCOB encapsulating structure described in the utility model.
Fig. 2 is the side structure schematic diagram of MCOB encapsulating structure described in the utility model.
Fig. 3 is the structural representation that a plurality of MCOB encapsulating structures are integrated into monolith substrate.
Embodiment
, in order better to understand the technical solution of the utility model, below in conjunction with accompanying drawing, describe the embodiment that the utility model provides in detail.
as depicted in figs. 1 and 2, the utility model provides a kind of circular MCOB encapsulating structure, comprise band be useful on heat conduction and heat radiation counterbore circular aluminum substrate 105 and be fixed on wafer 101 on aluminium base 105 by crystal-bonding adhesive 103, described wafer is a LED luminous element, luminous function is provided, the both sides of described aluminium base 105 are provided with two surface electrodes 106, described wafer 101 is connected to described surface electrode 106 by gold thread 102, thereby chip surface electrode and support are coupled together, also be provided with the packing colloid 104 of the described wafer 101 of sealing and gold thread 102 around described wafer 101 and wafer 101, thereby protection wafer 101, gold thread 102 is without prejudice.
The outside of described wafer 101 also is provided with transparent arc packaging body 107; described arc packaging body 107 is fixed on described aluminium base 105; described arc packaging body 107 can be protected whole encapsulating structure; and the luminous scattering of LED is even; under specific demand; can also will coat the fluorescent material of various colors on arc packaging body 107, thereby make LED light have various colors.
Encapsulating structure 10 assembled package of described a plurality of aluminium bases, to monolith substrate 20, use wire 30 to be connected to each other between the encapsulating structure 10 of described a plurality of aluminium bases, convenient unified access power supply, and the size diameter of described monolith substrate is 48mm.
compared with prior art, MCOB encapsulating structure described in the utility model, simple in structure, LED chip directly is put in a plurality of optics cups and encapsulates, realized optical treatment preferably, bright dipping is even, avoided to greatest extent glare problem, by directly being installed to LED chip on aluminium base, the LED that compares is arranged on aluminium base and makes the LED bulb lamp, can remove the contact heat resistance of device architecture thermal resistance and device and aluminium base from, be conducive to reduce the PN junction temperature, heat is derived in time, extended the life-span of light fixture, the MCOB encapsulation does not need Reflow Soldering in addition, do not need to buy the equipment such as chip mounter and welding yet, owing to having saved the device operation, not only reduced the threshold of application enterprise, cost can significantly descend simultaneously.
Therefore, on the whole, MCOB encapsulating structure described in the utility model, have advantages of simple in structure, cost is low, high light efficiency, low thermal resistance, high heat conduction, low light attenuation, bright dipping evenly, without color spot, can fill up the market vacancy of this type of demand both at home and abroad.
Above content is only preferred embodiment of the present utility model, for those of ordinary skill in the art, according to thought of the present utility model, all will change in specific embodiments and applications, this description should not be construed as restriction of the present utility model.
Claims (5)
1. circular MCOB encapsulating structure, it is characterized in that: comprise circular aluminium base and by solid crystal-bonding adhesive, be fixed on wafer on aluminium base, the both sides of described aluminium base are provided with two surface electrodes, described wafer is connected to described surface electrode by gold thread, also is provided with the packing colloid of the described wafer of sealing and gold thread around described wafer and wafer.
2. circular MCOB encapsulating structure as claimed in claim 1 is characterized in that: the encapsulating structure assembled package of described a plurality of aluminium bases, to monolith substrate, uses wire to be connected to each other between the encapsulating structure of described a plurality of aluminium bases, convenient unified access power supply.
3. circular MCOB encapsulating structure as claimed in claim 1, it is characterized in that: the outside of described wafer also is provided with transparent arc packaging body, and described arc packaging body is fixed on described aluminium base.
4. circular MCOB encapsulating structure as claimed in claim 1, is characterized in that: also be provided with the counterbore for heat conduction and heat radiation on described aluminium base.
5. as claim 1 or circular MCOB encapsulating structure claimed in claim 2, it is characterized in that: the size diameter of described monolith substrate is 48mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203149767U CN203288645U (en) | 2013-05-29 | 2013-05-29 | Circular MCOB packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013203149767U CN203288645U (en) | 2013-05-29 | 2013-05-29 | Circular MCOB packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203288645U true CN203288645U (en) | 2013-11-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013203149767U Expired - Fee Related CN203288645U (en) | 2013-05-29 | 2013-05-29 | Circular MCOB packaging structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN203288645U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106025039A (en) * | 2016-06-28 | 2016-10-12 | 储世昌 | LED package structure |
-
2013
- 2013-05-29 CN CN2013203149767U patent/CN203288645U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106025039A (en) * | 2016-06-28 | 2016-10-12 | 储世昌 | LED package structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN KINGLIGHT CO., LTD. Free format text: FORMER NAME: JINGTAI OPTOELECTRONICS CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 518000, Guangdong, Baoan District, Fuyong Shenzhen Street (west side of Fu Garden Road) run Heng Industrial plant 4, plant third, fourth, fifth floor Patentee after: SHENZHEN JINGTAI CO., LTD. Address before: 518000 Guangdong city of Shenzhen province Baoan District Xixiang Baoan Avenue Fisheries Industrial Park Building 4 floor B measurements Patentee before: Shenzhen Jingtai Optoelectronics Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131113 Termination date: 20160529 |