CN203398152U - Led - Google Patents
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- Publication number
- CN203398152U CN203398152U CN201320353604.5U CN201320353604U CN203398152U CN 203398152 U CN203398152 U CN 203398152U CN 201320353604 U CN201320353604 U CN 201320353604U CN 203398152 U CN203398152 U CN 203398152U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- led
- dissipation substrate
- heat dispersion
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses an LED. The LED comprises an LED chip, a heat dissipation substrate, an external layer sealing glue line and a phosphor glue line. The heat dissipation substrate is arc-shaped; the central portion of the heat dissipation substrate is provided with a chip pedestal; the LED chip is installed on the chip pedestal; the phosphor glue line coats the LED chip; the external layer sealing glue line is disposed outside the phosphor glue line; the anode and the cathode of the LED chip are connected with leads; the lower portion of the heat dissipation substrate is connected with a plurality of heat dissipation fins; and the bottoms of the heat dissipation fins are provided with a plurality of heat dissipation channels. The head dissipation substrate is preferably a copper plate. The inner side of the heat dissipation substrate is coated with a reflection layer. According to the utility model, the LED is provided with the arc-shaped heat dissipation substrate, the heat dissipation substrate is connected with the plurality of heat dissipation fins, the bottoms of the heat dissipation fins are provided with the plurality of heat dissipation channels, and the inner side of the heat dissipation substrate is coated with the reflection layer so that the heat dissipation of the LED is facilitated, and the design of the arc-shaped heat dissipation substrate helps to improve the luminescence effects of the LED.
Description
Technical field
The utility model relates to LED lighting field, particularly a kind of LED encapsulating structure.
Background technology
LED(Light Emitting Diode; Light-emitting diode) be a kind of solid-state semiconductor device that can be visible ray by electric energy conversion, there is life-span length, low power consumption and other advantages, along with the development of LED technology, the performance of LED light source is also become better and better, in general, whether the work of LED lamp is stable, quality quality, most important with lamp body heat radiation itself, the heat radiation of high-brightness LED lamp in the market, usually adopt natural heat dissipation, effect is unsatisfactory.In addition, in existing LED encapsulating structure, the LED of main flow is encapsulated as blue-ray LED chip and adds yellow fluorescent powder to form white light, the white light LEDs that this mode encapsulates exists and occurs hot spot and the low problem of light efficiency, and the two situation all badly influences range of application and the practical effect of LED.
Summary of the invention
The purpose of this utility model is for the deficiencies in the prior art, a kind of good heat dispersion that has is provided, and the LED of illumination effect, for achieving the above object, the technical solution of the utility model is: a kind of LED, comprise LED chip, heat dispersion substrate, outer adhesive layer, fluorescent material glue-line, described heat dispersion substrate is circular arc, heat dispersion substrate middle part is provided with chip base, LED chip is arranged on chip base, fluorescent material glue-line is coated on LED chip, it is outside that outer adhesive layer is positioned at fluorescent material glue-line, the both positive and negative polarity of LED chip connects wire, heat dispersion substrate bottom is connected with a plurality of fin, described fin bottom is provided with a plurality of heat dissipation channels.
As optimization, heat dispersion substrate is copper coin.Heat dispersion substrate inner side scribbles reflector.
The utility model LED has the heat dispersion substrate of arc, and heat dispersion substrate is connected with a plurality of fin.Fin bottom is provided with a plurality of heat dissipation channels.Heat dispersion substrate inner side scribbles reflector.Contribute to the heat radiation of LED, the heat dispersion substrate of arc design simultaneously contributes to improve LED illumination effect.
Accompanying drawing explanation
Fig. 1 is a kind of LED structural representation of the utility model.
Embodiment
The utility model is described in further detail for embodiment plan given below; but can not be interpreted as it is the restriction to the utility model protection range; those skilled in the art to nonessential improvement and adjustment more of the present utility model, still belong to protection range of the present utility model according to the utility model content.
As shown in Figure 1, LED, comprise LED chip 1, heat dispersion substrate 2, outer adhesive layer 3, fluorescent material glue-line 4, heat dispersion substrate 2 is circular arc, heat dispersion substrate 2 middle parts are provided with chip base 5, and LED chip 1 is arranged on chip base 5, and fluorescent material glue-line 4 is coated on LED chip 1, outer adhesive layer 3 is positioned at fluorescent material glue-line 4 outsides, and the both positive and negative polarity of LED chip 1 connects wire 6., heat dispersion substrate 2 bottoms are connected with a plurality of fin 7, and described fin 7 bottoms are provided with a plurality of heat dissipation channels 8.
Heat dispersion substrate 2 is copper coin.Heat dispersion substrate 2 inner sides scribble reflector.
Claims (3)
1. a LED, comprise LED chip, heat dispersion substrate, outer adhesive layer, fluorescent material glue-line, it is characterized in that described heat dispersion substrate is circular arc, heat dispersion substrate middle part is provided with chip base, and LED chip is arranged on chip base, and fluorescent material glue-line is coated on LED chip, it is outside that outer adhesive layer is positioned at fluorescent material glue-line, the both positive and negative polarity of LED chip connects wire, and heat dispersion substrate bottom is connected with a plurality of fin, and described fin bottom is provided with a plurality of heat dissipation channels.
2. according to the LED described in claim 1, it is characterized in that described heat dispersion substrate is copper coin.
3. according to the LED described in claim 1, it is characterized in that described heat dispersion substrate inner side scribbles reflector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320353604.5U CN203398152U (en) | 2013-06-20 | 2013-06-20 | Led |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320353604.5U CN203398152U (en) | 2013-06-20 | 2013-06-20 | Led |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203398152U true CN203398152U (en) | 2014-01-15 |
Family
ID=49909660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320353604.5U Expired - Fee Related CN203398152U (en) | 2013-06-20 | 2013-06-20 | Led |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203398152U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103779477A (en) * | 2013-06-20 | 2014-05-07 | 苏州恒荣节能科技安装工程有限公司 | LED (light-emitting diode) |
-
2013
- 2013-06-20 CN CN201320353604.5U patent/CN203398152U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103779477A (en) * | 2013-06-20 | 2014-05-07 | 苏州恒荣节能科技安装工程有限公司 | LED (light-emitting diode) |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140115 Termination date: 20140620 |
|
| EXPY | Termination of patent right or utility model |