CN203398158U - LED packaging structure - Google Patents
LED packaging structure Download PDFInfo
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- CN203398158U CN203398158U CN201320354863.XU CN201320354863U CN203398158U CN 203398158 U CN203398158 U CN 203398158U CN 201320354863 U CN201320354863 U CN 201320354863U CN 203398158 U CN203398158 U CN 203398158U
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- fluorescent material
- material glue
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- groove
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Abstract
The utility model relates to an LED packaging structure. The LED packaging structure comprises an LED chip, a cup bowl and an external layer sealing glue. The LED packaging structure is characterized in that the central portion of the cup bowl is provided with a semicircular groove; the LED chip is installed inside the groove; a phosphor glue line comprises an upper layer and a lower layer with different granularities; the groove is fully coated by the lower phosphor glue line; the upper phosphor glue line is disposed on the lower phosphor glue line; the external layer sealing glue is disposed outside the phosphor glue line; the anode and the cathode of the LED chip are connected with leads; the upper phosphor glue line comprises an internal layer and an external layer; the LED chip is a blue-light chip; and the inner surface of the groove is coated by a reflection layer. Preferably, the lower phosphor glue line has a granularity of 25 to 22 micrometers, and the upper phosphor glue line has an internal layer granularity of 23 to 20 micrometers and an external layer granularity of 20 to 15 micrometers. Preferably, the thickness of the lower phosphor glue line is three times that of the upper phosphor glue line.
Description
Technical field
The utility model relates to LED lighting field, particularly a kind of LED encapsulating structure.
Background technology
LED(Light Emitting Diode; Light-emitting diode) be a kind of solid-state semiconductor device that can be visible ray by electric energy conversion, have life-span length, low power consumption and other advantages, along with the development of LED technology, the performance of LED light source is also become better and better.In existing LED encapsulating structure, the LED of main flow is encapsulated as blue-ray LED chip and adds yellow fluorescent powder to form white light, can there is hot spot and light efficiency because of the impact of yellow fluorescent powder granularity size in the white light LEDs that this mode encapsulates, if granularity light efficiency less than normal is on the low side, cannot reach existing lighting requirement; If granularity hot spot bigger than normal is very poor, easily go out champac circle phenomenon, the two situation all badly influences range of application and the practical effect of LED.
Summary of the invention
The purpose of this utility model is for the deficiencies in the prior art, and a kind of high light efficiency and uniform LED encapsulating structure of light guide realized is provided.
For achieving the above object, the technical solution of the utility model is: LED encapsulating structure, comprise LED chip, cup, outer sealing, fluorescent material glue-line, there is a semicircular groove at cup middle part, LED chip is arranged in the middle of groove, fluorescent material glue-line comprises different two-layer up and down of granularity, and lower floor's fluorescent material glue-line fills groove.Upper strata fluorescent material glue-line is positioned on lower floor's fluorescent material glue-line, and it is outside that described outer sealing is positioned at fluorescent material glue-line, and the both positive and negative polarity of LED chip connects wire, and described upper strata fluorescent material glue-line includes inside and outside two-layer.LED chip is blue chip, and groove inner surface scribbles reflector.
As optimization, the granularity of lower floor's fluorescent material glue-line is 25-22 micron, and upper strata fluorescent material glue-line inner layer granule degree is 23-20 micron, and outer granularity is 20-15 micron.
As optimization, described lower floor phosphor gel layer thickness is three times of upper strata phosphor gel layer thickness.
The utility model LED encapsulating structure adopts variable grain degree levels to distribute and semicircular groove design, the reason that excites different-effect according to blue light to variable grain degree fluorescent material, and the reflection of groove, realized and can reach high light efficiency and the uniform white light LEDs of light guide.
Accompanying drawing explanation
Fig. 1 is the utility model LED encapsulating structure structural representation.
Embodiment
The utility model is described in further detail for embodiment plan given below; but can not be interpreted as it is the restriction to the utility model protection range; those skilled in the art to nonessential improvement and adjustment more of the present utility model, still belong to protection range of the present utility model according to the utility model content.
As shown in Figure 1, LED encapsulating structure, comprises LED chip 1, cup 2, outer sealing 3, there is a semicircular groove 7 at cup 2 middle parts, LED chip 1 is arranged in the middle of groove 7, and fluorescent material glue-line comprises different two-layer up and down of granularity, and lower floor's fluorescent material glue-line 4 fills groove.Upper strata fluorescent material glue-line is positioned on lower floor's fluorescent material glue-line 4, and it is outside that outer sealing 3 is positioned at fluorescent material glue-line, and the both positive and negative polarity of LED chip 1 connects wire 6.Upper strata fluorescent material glue-line includes internal layer phosphor gel 5, outer phosphor gel 8.The granularity of lower floor's fluorescent material glue-line 4 is 25-22 micron, and internal layer phosphor gel 5 granularities of upper strata fluorescent material glue-line are 23-20 micron, and outer phosphor gel 8 granularities are 20-15 micron.
The utility model LED encapsulating structure adopts variable grain degree levels to distribute and semicircular groove design, the reason that excites different-effect according to blue light to variable grain degree fluorescent material, and the reflection of groove, realized and can reach high light efficiency and the uniform white light LEDs of light guide.
The utility model, LED chip is blue chip.Groove inner surface scribbles reflector.Lower floor's phosphor gel layer thickness is three times of upper strata phosphor gel layer thickness.
Claims (5)
1. a LED encapsulating structure, comprise LED chip, cup, outer sealing, fluorescent material glue-line, it is characterized in that there is a semicircular groove at cup middle part, LED chip is arranged in the middle of groove, fluorescent material glue-line comprises different two-layer up and down of granularity, lower floor's fluorescent material glue-line fills groove, upper strata fluorescent material glue-line is positioned on lower floor's fluorescent material glue-line, it is outside that described outer sealing is positioned at fluorescent material glue-line, the both positive and negative polarity of LED chip connects wire, and described upper strata fluorescent material glue-line includes inside and outside two-layer.
2. according to the LED encapsulating structure described in claim 1, it is characterized in that the granularity of described lower floor fluorescent material glue-line is 25-22 micron, upper strata fluorescent material glue-line inner layer granule degree is 23-20 micron, and outer granularity is 20-15 micron.
3. according to the LED encapsulating structure described in claim 1, it is characterized in that described lower floor phosphor gel layer thickness is three times of upper strata phosphor gel layer thickness.
4. according to the LED encapsulating structure described in claim 1, it is characterized in that described LED chip is blue chip.
5. according to the LED encapsulating structure described in claim 1, it is characterized in that described groove inner surface scribbles reflector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320354863.XU CN203398158U (en) | 2013-06-20 | 2013-06-20 | LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320354863.XU CN203398158U (en) | 2013-06-20 | 2013-06-20 | LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203398158U true CN203398158U (en) | 2014-01-15 |
Family
ID=49909666
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320354863.XU Expired - Fee Related CN203398158U (en) | 2013-06-20 | 2013-06-20 | LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203398158U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103779479A (en) * | 2013-06-20 | 2014-05-07 | 苏州恒荣节能科技安装工程有限公司 | LED package structure |
-
2013
- 2013-06-20 CN CN201320354863.XU patent/CN203398158U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103779479A (en) * | 2013-06-20 | 2014-05-07 | 苏州恒荣节能科技安装工程有限公司 | LED package structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140115 Termination date: 20140620 |
|
| EXPY | Termination of patent right or utility model |