CN201093369Y - LED light source packaging to curved surface - Google Patents
LED light source packaging to curved surface Download PDFInfo
- Publication number
- CN201093369Y CN201093369Y CNU2007200325901U CN200720032590U CN201093369Y CN 201093369 Y CN201093369 Y CN 201093369Y CN U2007200325901 U CNU2007200325901 U CN U2007200325901U CN 200720032590 U CN200720032590 U CN 200720032590U CN 201093369 Y CN201093369 Y CN 201093369Y
- Authority
- CN
- China
- Prior art keywords
- curved surface
- light source
- led light
- led
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model mainly relates to a LED light source. A LED light source encapsulated in a curved surface includes the anode and the cathode 1 of a printed circuit 8, LED light-emitting chips 5 and the electrical connection of the printed circuit 8. The utility model is characterized in that the LED light source also includes a curved substrate 2, a plurality of bowl cups are arranged on the curved substrate 2, and the LED light-emitting chips 5 are arranged in the bowl cups. The utility model has the advantages that the outer surface of the curved substrate assumes an arc back shape, the light rays emitting by the LED light-emitting chips distributed on the outer surface of the curved substrate radiates to all directions which the arc back faces, so that the irradiation area is increased. The LED light-emitting chips has the advantages that the density is high, the interval is small, the edges of the adjacent beams overlap each other, the brightness in the light covered range is even, and the volume of the LED curved light source is relatively smaller. The requirement of the market is that exploiting light covers larger range, the light-emitting surface can be encapsulated into different shaped according to the feature of the illumination site, a lamp merely made of one light source can meet the LED light source which is encapsulated in a curved surface and is applied to the specific illumination site.
Description
Technical field:
The utility model relates generally to a kind of led light source.
Background technology:
Led light source becomes the light source of new generation that most possibly substitutes conventional light source at present in the world with its lower power demand, drive characteristic, response speed, higher shock resistance, long service life, environmental protection and the luminous efficiency that constantly improves fast etc. faster preferably.Along with the swift and violent breakthrough of compound semiconductor technology and improving constantly of encapsulation technology, LED begins to form and progressively enlarge in the application of lighting field, and it has been trend of the times that the semiconductor LED solid state light emitter substitutes the traditional lighting light source.At present, led light source all is spot lights (light emitting diode) of single luminescence chip encapsulation and a plurality of luminescence chips is encapsulated in a planar package light source (as the LED lattice module etc.) on the planar substrates, only a branch of direct light or a luminous flat of producing, the light coverage is little, volume is big, makes public place illumination such as street lamps and indoor illumination light fitting with these light sources and is restricted.
The utility model content:
The purpose of this utility model is to avoid the deficiencies in the prior art part and a kind of led light source that is packaged in curved surface is provided, public place such as existing led light source light coverage rate is little to solve, assembling street lamp and the indoor illumination light fitting difficulty is big, volume big, the problem of brightness irregularities, this led light source that is packaged in curved surface can provide direct projection light for all directions of needs illumination, and volume is little, luminous efficiency is high, all directions brightness is even.A light fixture only needs a led light source that is packaged in curved surface, assembles easy.
The purpose of this utility model can be by realizing by the following technical solutions: a kind of led light source that is packaged in curved surface, the both positive and negative polarity (1) that includes printed circuit (8) is electrically connected with LED luminescence chip (5), printed circuit (8), its main feature is also to include curved surface matrix (2), on curved surface matrix (2), be provided with several bowls cup (21), be provided with LED luminescence chip (5) in the bowl cup (21).LED luminescence chip (5) LED luminescence chip (5) can be with adhesive bond in bowl cup (21) bowl cup (21).
The described curved surface matrix (2) that is packaged in the led light source of curved surface is hunchbacked shape for the surface, is sphere, tiling, the face of cylinder.The surperficial sphere of described curved surface matrix (2) is whole sphere, or is hemisphere face, or be 1/4th, the eighth ball face, or spherical calotte.
The described bowl cup (21) that is packaged in the led light source of curved surface is hemispherical.Described hemispheric bowl cup, its surface light reflectivity is good, sink to curved surface matrix (2) outer surface but do not penetrate the pit of curved surface matrix (2).
The material that the led light source that is packaged in curved surface also includes curved surface matrix (2) is the metal material of good heat conductivity, can change the metal material of local shape under certain pressure, and described metal material comprises aluminium but is not limited to aluminium.Outer surface at curved surface matrix (2) has heat-conducting insulated film (22).Described outer surface is that face at LED luminescence chip place.Described heat-conducting insulated film (22) is the burning insulating barrier on curved surface matrix (2) outer surface or is coated on high-thermal-conductivity epoxy resin on curved surface matrix (2) outer surface.
The described led light source that is packaged in curved surface also includes at the last compress of the outer surface heat-conducting insulated film (22) of curved surface matrix (2) printed circuit (8), printed circuit (8) is peripheral with transparent epoxy resin (3) encapsulation, and the both positive and negative polarity (1) of printed circuit (8) is drawn along curved surface matrix (2).Described compress printed circuit is copper facing or cover Copper Foil, corrode into behind the printed circuit at the printed circuit electroplate on oxidation insulating film, and the both positive and negative polarity of printed circuit is drawn along the curved surface matrix, connects external power source during use.
Described LED luminescence chip (5) is connected in the printed circuit (8) in the mode of serial or parallel connection.
During power turn-on, because each the LED luminescence chip that is distributed on the curved surface outer surface of matrix all sends a branch of direct projection light, each normal direction of area relative of LED luminescence chip all has direct projection light to send so the curved surface outer surface of matrix has distributed, and satisfies led light source can both provide direct projection light for all directions of specific illumination place needs illumination demand; Because LED luminescence chip density is big, the gap is little mutually, beam edge is overlapped, so brightness is even in the light coverage of led light source.Curved surface matrix (2) and heat-conducting insulated film (22) all have good heat-conducting, the heat that LED luminescence chip (5) and printed circuit (8) produce is delivered on the curved surface matrix by heat-conducting insulated film (22) evenly to be dispersed, so led light source (5) can improve luminous efficiency, increase the service life.
The described led light source that is packaged in curved surface also includes on the surface of LED luminescence chip (5) and is coated with fluorophor (7).The led light source that is packaged in curved surface can send white light, also can send the light of other colors such as blue streak, ruddiness, green glow.When needing white light source, the LED luminescence chip that led light source uses is selected the blue streak chip for use, at blue streak chip surface coating YAG fluorophor.When the light color that the light that light source sent that needs LED luminescence chip encapsulation and LED luminescence chip self are sent is identical, need not to be coated with fluorophor on LED luminescence chip surface.
The beneficial effects of the utility model are, the curved surface outer surface of matrix is hunchbacked shape, and therefore all directions that the light directive back of a bow that the LED luminescence chip on it of distributing sends is faced have increased irradiated area.
LED luminescence chip density is big, adjacent segment is little, the imbricate of adjacent beams, so brightness volume even, the LED curved surface light source is less relatively in the light coverage.
The curved surface outer surface of matrix is provided with hemispherical bowl cup, and bowl cup surface has good light reflective properties, and the LED luminescence chip is fixed in the bowl cup, so the light that the LED luminescence chip produces is gone out with the direct projection of light beam form.
The heat-conducting insulated film of curved surface outer surface of matrix is an insulator, thus the printed circuit of compress on it not can with the conducting of curved surface matrix.
Heat-conducting insulated film, curved surface matrix, transparent epoxy resin, binding agent etc. all have good heat-conducting, the heat that light in LED luminescence chip, printed circuit, the transparent epoxy resin, gold thread etc. are produced is derived by the afterbody of curved surface matrix directly or indirectly by the heat-conducting insulated film transmission and be evenly distributed on the curved surface matrix; The inner surface of curved surface matrix contacts with air with the outer surface of transparent epoxy resin, disperses heat by air; Therefore, a large amount of heats can not saved bit by bit in led light source inside, thereby have improved luminous efficiency, prolonged life-span of LED luminescence chip.
The both positive and negative polarity of printed circuit is drawn at heat-conducting insulated film upper edge curved surface matrix, reaches from the outside to the purpose of led light source power supply.
The printed circuit electroplate, solderability is good, and reflective is good.
Exploitation light coverage is big, according to illumination place characteristics with light-emitting area be packaged into different shapes, the led light source that is packaged in curved surface that only just can satisfy the use of specific illumination place with the light fixture of a light source manufacturing is the demand in market.
Description of drawings:
Fig. 1 (a) is that the utility model embodiment 1 is packaged in sphere curved surface led light source structural representation.
Fig. 1 (b) is the A portion enlarged drawing of Fig. 1 (a).
Fig. 2 is that the utility model embodiment 2 is packaged in cylindrical curved surface led light source structural representation.
Fig. 3 is that the utility model embodiment 3 is packaged in a watt shape curved surface LED light-source structure schematic diagram.
The specific embodiment:
Embodiment 1: see Fig. 1 (a), Fig. 1 (b), a kind of led light source that is packaged in sphere curved surface, the both positive and negative polarity 1 that includes printed circuit 8 is electrically connected with LED luminescence chip 5, printed circuit 8, on curved surface matrix 2, be provided with several bowls cup 21, be provided with LED luminescence chip 5 in the bowl cup 21.Bowl cup 21 is a hemispherical.Curved surface matrix 2 is sphere for the surface.The curved surface matrix 2 outer surfaces identical bowl cup 21 of several sizes that distributes, described size is identical to refer to that the degree of depth of bowl cup 21 is identical with radius.Copper facing on heat-conducting insulated film 22, the silver-plated back of burn into form printed circuit 8 in bowl cup 21 gaps, bowl cup 21 surfaces are through copper facing, silver-plated formation reflector, the high heat conduction binding agent of LED luminescence chip 5 usefulness is fixed on bowl cup 21 bottoms and is connected in the printed circuit 8 in the mode of series connection/parallel connection, LED luminescence chip 5 pins weld with gold thread during series connection, LED luminescence chip 5 pins are welded on the printed circuit 8 when in parallel, this led light source that is packaged in curved surface can provide direct projection light for all directions of needs illumination, and volume is little, luminous efficiency is high, all directions brightness is even.A light fixture only needs a led light source that is packaged in curved surface, assembles easy.The material of curved surface matrix 2 is the aluminium of good heat conductivity.LED luminescence chip 5 is a blue streak LED luminescence chip.Be coated with YAG fluorophor 7 on LED luminescence chip 5 surfaces, the printed circuit 8 peripheral transparent epoxy resins 3 of using encapsulate, and form the complete led light source that is packaged in sphere curved surface, form the curved surface encapsulated LED light source of white light, sphere.When power supply passes through 1 conducting of printed circuit both positive and negative polarity, because each the LED luminescence chip 5 that is distributed on sphere curved surface matrix 2 outer surfaces all sends a branch of direct projection white light by YAG fluorophor 7, each normal direction of area relative of LED luminescence chip 5 all has the direct projection white light to send so curved surface matrix 2 outer surfaces have distributed, and the encapsulated LED light source can both provide direct projection light for all directions around the spheroid; Because LED luminescence chip 5 density are big, the gap is little mutually, beam edge is overlapped, so the volume of led light source is less, the interior brightness of light coverage is even.Curved surface matrix 2, heat-conducting insulated film 22, transparent epoxy resin 3, high heat conduction binding agent 6 all have good heat-conducting, the heat that LED luminescence chip 5 and printed circuit 8 produces is delivered to by heat-conducting insulated film 22 evenly to be dispersed on the curved surface matrix 2 and derives from curved surface matrix 2 afterbodys, inner surface by transparent epoxy resin 3 outer surfaces and curved surface matrix 2 diffuses in the air simultaneously, reaches raising led light source luminous efficiency, prolongs the led light source purpose in service life.
Embodiment 2: be packaged in the cylindrical curved surface led light source, see Fig. 2, it is cylindrical that curved surface matrix 2 is cavity, and led light source can both provide direct projection light for the cylinder circumference all directions.Except that light coverage, the application place of curved surface matrix 2 shapes and light source were different, the structure of this routine light source, principle, performance were identical with Fig. 1 light source.
Embodiment 3: be packaged in a watt shape curved surface LED light source, see Fig. 3, curved surface matrix 2 is a watt shape, and led light source can both provide direct projection light for watt corresponding all directions of the shape back of a bow.Except that light coverage, the application place of curved surface matrix 2 shapes and light source were different, the structure of this routine light source, principle, performance were identical with Fig. 1 light source.
Claims (8)
1. led light source that is packaged in curved surface, the both positive and negative polarity (1) that includes printed circuit (8) is electrically connected with LED luminescence chip (5), printed circuit (8), it is characterized in that also including curved surface matrix (2), on curved surface matrix (2), be provided with several bowls cup (21), be provided with LED luminescence chip (5) in the bowl cup (21).
2. the led light source that is packaged in curved surface as claimed in claim 1 is characterized in that described curved surface matrix (2) is hunchbacked shape for the surface, is sphere, tiling, the face of cylinder.
3. the led light source that is packaged in curved surface as claimed in claim 2 is characterized in that the surperficial sphere of described curved surface matrix (2) is whole sphere, or is hemisphere face, or be 1/4th, the eighth ball face, or spherical calotte.
4. the led light source that is packaged in curved surface as claimed in claim 1 or 2 is characterized in that described bowl cup (21) is hemispherical.
5. the led light source that is packaged in curved surface as claimed in claim 4 is characterized in that the outer surface that also includes at curved surface matrix (2) is provided with heat-conducting insulated film (22).
6. the led light source that is packaged in curved surface as claimed in claim 5, it is characterized in that also including at the last compress of the outer surface heat-conducting insulated film (22) of curved surface matrix (2) printed circuit (8) is arranged, printed circuit (8) is peripheral with transparent epoxy resin (3) encapsulation, and the both positive and negative polarity (1) of printed circuit (8) is drawn along curved surface matrix (2).
7. the led light source that is packaged in curved surface as claimed in claim 6 is characterized in that described LED luminescence chip (5) is connected in the printed circuit (8) in the mode of serial or parallel connection.
8. the led light source that is packaged in curved surface as claimed in claim 7 is characterized in that also including on the surface of LED luminescence chip (5) and is coated with fluorophor (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200325901U CN201093369Y (en) | 2007-07-25 | 2007-07-25 | LED light source packaging to curved surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200325901U CN201093369Y (en) | 2007-07-25 | 2007-07-25 | LED light source packaging to curved surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201093369Y true CN201093369Y (en) | 2008-07-30 |
Family
ID=39901338
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200325901U Expired - Fee Related CN201093369Y (en) | 2007-07-25 | 2007-07-25 | LED light source packaging to curved surface |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201093369Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102299244A (en) * | 2011-09-20 | 2011-12-28 | 河南光之源太阳能科技有限公司 | High-power light emitting diode (LED) seamless special-shaped light source |
| CN102748601A (en) * | 2011-04-19 | 2012-10-24 | 薛伯钱 | Bulb of light-emitting diode (LED) energy-saving lamp |
| CN103542301A (en) * | 2013-10-29 | 2014-01-29 | 广西桂林宇川光电科技有限公司 | LED (light-emitting diode) lamp |
| CN104300078A (en) * | 2013-07-18 | 2015-01-21 | 王志根 | A omnidirectional luminous filament and preparation method thereof |
-
2007
- 2007-07-25 CN CNU2007200325901U patent/CN201093369Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102748601A (en) * | 2011-04-19 | 2012-10-24 | 薛伯钱 | Bulb of light-emitting diode (LED) energy-saving lamp |
| CN102299244A (en) * | 2011-09-20 | 2011-12-28 | 河南光之源太阳能科技有限公司 | High-power light emitting diode (LED) seamless special-shaped light source |
| CN104300078A (en) * | 2013-07-18 | 2015-01-21 | 王志根 | A omnidirectional luminous filament and preparation method thereof |
| CN103542301A (en) * | 2013-10-29 | 2014-01-29 | 广西桂林宇川光电科技有限公司 | LED (light-emitting diode) lamp |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201363572Y (en) | LED light source module | |
| WO2006108339A1 (en) | Led white light source based on metal wiring board | |
| CN101839410B (en) | Space omnidirectional light-emitting diode (LED) | |
| CN201359209Y (en) | Flat-plate type lens integrated LED light source | |
| CN201795315U (en) | Spatial omnidirectional luminous LED | |
| CN201093369Y (en) | LED light source packaging to curved surface | |
| CN201772368U (en) | LED tunnel lamp | |
| CN107305922A (en) | A kind of stereo luminous light source of charged integrated 360-degree and preparation method thereof | |
| CN201373367Y (en) | High-power LED light source module adopting semiconductor for cooling | |
| CN201601146U (en) | Light-emitting diode (LED) | |
| CN201428943Y (en) | Led lamp | |
| CN103236489A (en) | LED (light emitting diode) packaging structure | |
| CN201443693U (en) | LED light source module | |
| CN203131498U (en) | Light emitting diode (LED) lamp source based on chip on board (COB) substrate | |
| CN201050705Y (en) | High light LED illuminator | |
| CN206003823U (en) | Improve the high-power LED light source module of heat dispersion | |
| CN203103348U (en) | COB base plate structure-equipped LED lamp source | |
| CN201425272Y (en) | LED packaging structure | |
| CN2826706Y (en) | Single granule and colony packaged power LED directional light source | |
| CN203336275U (en) | LED lamp structure | |
| CN203384679U (en) | LED (light-emitting diode) bulb lamp capable of emitting light in all directions | |
| CN201731346U (en) | Annular LED light source | |
| CN214535741U (en) | A new type of LED fill light bead | |
| CN201206742Y (en) | LED lighting module | |
| CN203398152U (en) | Led |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C53 | Correction of patent for invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Du Jiancheng Inventor before: Du Jiancheng |
|
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Gansu Taifeng Electronic Technology Co., Ltd. Assignor: Du Jiancheng Contract record no.: 2011990001059 Denomination of utility model: LED light source packaging to curved surface Granted publication date: 20080730 License type: Common License Record date: 20111125 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080730 Termination date: 20160725 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |