CN203165934U - MLCOB packaging structure - Google Patents
MLCOB packaging structure Download PDFInfo
- Publication number
- CN203165934U CN203165934U CN 201320023621 CN201320023621U CN203165934U CN 203165934 U CN203165934 U CN 203165934U CN 201320023621 CN201320023621 CN 201320023621 CN 201320023621 U CN201320023621 U CN 201320023621U CN 203165934 U CN203165934 U CN 203165934U
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- wafer
- aluminium base
- mlcob
- base plate
- thermal resistance
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Abstract
The utility model discloses an MLCOB packaging structure comprising an aluminium base plate provided with a number of blind hole grooves, a wafer which is fixed in the blind hole grooves, gold threads for connecting the wafer and the aluminium base plate, and a packaging glue body for sealing the wafer. The MLCOB packaging structure is characterized in that the wafer is directly installed on the aluminium base plate. Thus compared with a conventional LED fluorescent lamp made by installing a light emitting diode on the aluminium base plate, the MLCOB packaging structure is advantaged by elimination of device structure thermal resistance, elimination of contact thermal resistance of a device and the aluminium base plate, low thermal resistance, good vertical heat radiation performance, lowered PN junction temperature, improved illuminating efficiency and lumen, and prolonged service life. The wafer is placed in multiple optical cups and then packaged, a luminous flux is improved, package characterized by LED face luminescence can be realized conveniently, power of a single light source is increased, glare can be prevented to the largest extent, and illuminating efficiency per watt can be improved.
Description
Technical field
The utility model relates to the LED technical field, particularly the encapsulating structure of a kind of MLCOB.
Background technology
LED (light-emitting diode) uses very extensive, because thermal resistance is big, and poor radiation for the white light SMD (surface attaching type, Surface Mounted Devices) that prior art provides, heat does not in time shed, and can only be applied to the less demanding lighting field of properties of product.
The utility model content
Main purpose of the present utility model provides the encapsulating structure of a kind of MLCOB, is intended to improve its light efficiency, reduces thermal resistance, improves vertical heat dispersion.
The utility model proposes the encapsulating structure of a kind of MLCOB, comprise the aluminium base that is provided with some blind hole grooves, the packing colloid that is fixed in the interior wafer of this blind hole groove, is used for connecting the gold thread of this wafer and described aluminium base and is used for the described wafer of seal protection.
Preferably, described aluminium base is the strip setting, and it is long to be 285mm, and wide is 18.6mm.
Preferably, described wafer is blue wafer.
The encapsulating structure of the utility model MLCOB directly is installed to wafer on the aluminium base by adopting, be installed in making LED fluorescent lamp on the aluminium base than traditional light-emitting diode, can remove the contact heat resistance of device architecture thermal resistance and device and aluminium base from, thermal resistance is low, the good vertical heat dispersion, be conducive to reduce the PN junction temperature, improve luminous efficiency, lumen and life-saving.Wafer is placed in a plurality of optics cups encapsulates, improve luminous flux, can also conveniently realize the encapsulation that the LED face is luminous, increase the power of single source, avoid dazzle to greatest extent, improve every watt of light efficiency.
Description of drawings
Fig. 1 is the structural representation of the encapsulating structure of the utility model MLCOB.
The realization of the utility model purpose, functional characteristics and advantage will be in conjunction with the embodiments, are described further with reference to accompanying drawing.
Embodiment
Be described further with regard to the technical solution of the utility model below in conjunction with drawings and the specific embodiments.Should be appreciated that specific embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.
The utility model proposes the encapsulating structure of a kind of MLCOB.
With reference to Fig. 1, Fig. 1 is the structural representation of the encapsulating structure of the utility model MLCOB.
In the present embodiment, the encapsulating structure of this MLCOB comprises the aluminium base 105 that is provided with some blind hole grooves, the packing colloid 102 that is fixed in the interior wafer 101 of this blind hole groove, is used for connecting the gold thread 103 of this wafer 101 and aluminium base 105 and is used for seal protection wafer 101 and gold thread 103.Wherein, wafer 101 is fixed in the blind hole groove of aluminium base 105 by crystal-bonding adhesive 104.The effect that aluminium base 105 can play conduction and support on the one hand, just the heat that produces of wafer 101 in time derives on the other hand.
In the above-described embodiments, aluminium base 105 is the strip setting, its long 285mm, the wide 18.6mm that is preferably of being preferably.
In the above-described embodiments, wafer 101 is preferably blue wafer.
The encapsulating structure of this MLCOB directly is installed to wafer 101 on the aluminium base 105 by adopting, be installed in making LED fluorescent lamp on the aluminium base than traditional light-emitting diode, can remove the contact heat resistance of device architecture thermal resistance and device and aluminium base from, thermal resistance is low, the good vertical heat dispersion, be conducive to reduce the PN junction temperature, improve luminous efficiency, lumen and life-saving.Wafer 101 is placed in a plurality of optics cups encapsulates, improve luminous flux, can also conveniently realize the encapsulation that the LED face is luminous, increase the power of single source, avoid dazzle to greatest extent, improve every watt of light efficiency.
The above only is preferred embodiment of the present utility model; be not so limit claim of the present utility model; every equivalent structure transformation that utilizes the utility model specification and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present utility model.
Claims (3)
1. the encapsulating structure of a MLCOB is characterized in that, comprises the aluminium base that is provided with some blind hole grooves, the packing colloid that is fixed in the interior wafer of this blind hole groove, is used for connecting the gold thread of this wafer and described aluminium base and is used for the described wafer of seal protection.
2. the encapsulating structure of MLCOB as claimed in claim 1 is characterized in that, described aluminium base is the strip setting, and it is long to be 285mm, and wide is 18.6mm.
3. the encapsulating structure of MLCOB as claimed in claim 2 is characterized in that, described wafer is blue wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320023621 CN203165934U (en) | 2013-01-15 | 2013-01-15 | MLCOB packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320023621 CN203165934U (en) | 2013-01-15 | 2013-01-15 | MLCOB packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203165934U true CN203165934U (en) | 2013-08-28 |
Family
ID=49027097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320023621 Expired - Lifetime CN203165934U (en) | 2013-01-15 | 2013-01-15 | MLCOB packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203165934U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015078003A1 (en) * | 2013-11-29 | 2015-06-04 | 广州市鸿利光电股份有限公司 | Manufacturing method for mlcob light source module |
-
2013
- 2013-01-15 CN CN 201320023621 patent/CN203165934U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015078003A1 (en) * | 2013-11-29 | 2015-06-04 | 广州市鸿利光电股份有限公司 | Manufacturing method for mlcob light source module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN KINGLIGHT CO., LTD. Free format text: FORMER NAME: JINGTAI OPTOELECTRONICS CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 518000, Guangdong, Baoan District, Fuyong Shenzhen Street (west side of Fu Garden Road) run Heng Industrial plant 4, plant third, fourth, fifth floor Patentee after: SHENZHEN JINGTAI Co.,Ltd. Address before: 518000 Guangdong city of Shenzhen province Baoan District Xixiang Baoan Avenue Fisheries Industrial Park Building 4 floor B measurements Patentee before: SHENZHEN JINGTAI OPTOELECTRONICS Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130828 |