CN202855794U - Direct insert type LED packaging structure - Google Patents
Direct insert type LED packaging structure Download PDFInfo
- Publication number
- CN202855794U CN202855794U CN2012202435358U CN201220243535U CN202855794U CN 202855794 U CN202855794 U CN 202855794U CN 2012202435358 U CN2012202435358 U CN 2012202435358U CN 201220243535 U CN201220243535 U CN 201220243535U CN 202855794 U CN202855794 U CN 202855794U
- Authority
- CN
- China
- Prior art keywords
- packaging body
- led
- conductive pin
- chip
- direct insertion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Abstract
The utility model discloses a direct insert type LED packaging structure, which comprises a conductive pin, a LED chip, a bowl for fixing the LED chip, a metal wire, and a packaging body. The structure is characterized in that the top surface of the packaging body is an arc surface which can increase irritation angle of LED, has effects of original flat square LED and simultaneously increases visual range of viewers.
Description
Technical field
The utility model relates to a kind of LED components and parts, relates in particular to a kind of direct insertion LED encapsulating structure.
Background technology
LED (Light Emitting Diode), namely light-emitting diode is a kind of semiconductor solid luminescence device.It is to utilize the solid semiconductor chip as luminescent material, when two ends add forward voltage, minority carrier in the semiconductor and majority carrier generation combination are emitted superfluous energy and are caused photo emissions, directly send the light of red, orange, yellow, green, blue, blue, purple look.Led light source since have high energy-conservation, the life-span long, be beneficial to the advantage such as environmental protection, and be widely used.
At present, the encapsulation of LED mainly contains: direct insertion LED (DIP LED), adopting surface mounted LED (SMD LED) and great power LED (POWER LED).Wherein, direct insertion LED is because of its brightness is high, energy-conservation, low price, the advantage such as easy to use are subject to people favor.
The encapsulating structure of traditional direct insertion LED of flat-square-shaped, as shown in Figure 1, mainly by elongated conductive pin 21 are connected with conductive pin, chip 24, flat-square-shaped packaging body 26, the bowl cup 23 that is positioned at conductive pin 22 tops, the metal fine 25 that connects chip 24 and conductive pin 21 and conductive pin 22 form.Flat-square-shaped packaging body 26 is shaped by epoxy resin or silica gel.Chip 24 is fixed in the bowl cup 23, and chip 24 issued lights reflect and go out through 23 reflections of bowl cup and flat-square-shaped packaging body 26 after the energising.This kind flat-square-shaped encapsulating structure can allow a plurality of LED closely be arranged in together side by side, but lighting angle is less, ambient light a little less than, reduced observer's visual range.
The utility model content
The purpose of this utility model is to provide a kind of direct insertion LED encapsulating structure that increases lighting angle.
The technical scheme that the invention for solving the technical problem adopts is: a kind of direct insertion LED encapsulating structure, mainly comprise metal fine, the packaging body of bowl cup, connection chip and the conductive pin of conductive pin, chip, fixed chip, it is characterized in that: described packaging body end face is arc surface.
Further, described packaging body is comprised of bottom and top, and the bottom is flat-square-shaped, and top is that flat type and end face are arc surface, and bottom and top are formed in one.
Further, described packaging body is epoxy resin, silica gel or epoxy resin, the silica gel that contains pigment.
The beneficial effects of the utility model are: because end face of the present utility model is the arc face, can increase the lighting angle of LED, when having former flat-square-shaped packaging body effect concurrently, observer's visual range be increased.
Description of drawings
Below in conjunction with accompanying drawing and example the utility model is described further.
Fig. 1 is the direct insertion LED encapsulating structure of traditional deltiod.
Fig. 2 is the direct insertion LED encapsulating structure of the utility model.
Embodiment
With reference to Fig. 2, the direct insertion LED encapsulating structure of the utility model mainly by elongated conductive pin 11 are connected with conductive pin, chip 14, packaging body 16, the bowl cup 13 that is positioned at conductive pin 12 tops, the metal fine 15 that connects chip 14 and conductive pin 11 and conductive pin 12 form.Conductive pin 11 and conductive pin 12 are made by conduction and the good metal of heat conductivility, and pin 11 is parallel with pin 12.Conductive pin 12 links to each other with bowl cup 13, and chip 14 is fixed in the bowl cup 13, and chip 14 links to each other with 12 with pin 11 by metal fine 15.
Packaging body 16 is that epoxy resin, silica gel or epoxy resin, the silica gel that contains pigment are made, and described packaging body 16 bottoms 17 are flat-square-shaped, and described packaging body top 18 is that flat type and end face are arc surface, and described packaging body 16 tops 18 and bottom 17 are formed in one.Chip 14 issued lights send through 13 reflections of bowl cup and packaging body 16 refractions after the energising, increase the LED lighting angle, and observer's visual range is increased.
The above is preferred embodiment of the present utility model, and the utility model is not limited to above-mentioned execution mode, as long as it reaches technique effect of the present utility model with equal means, all should belong to protection range of the present utility model.
Claims (3)
1. a direct insertion LED encapsulating structure mainly comprises conductive pin, chip, bowl cup, metal fine, packaging body, and it is characterized in that: described packaging body end face is arc surface.
2. a kind of direct insertion LED encapsulating structure according to claim 1, it is characterized in that: described packaging body is comprised of bottom and top, and the bottom is flat-square-shaped, and top is that flat type and end face are arc surface, and bottom and top are formed in one.
According to claim 1 and 2 in each described a kind of direct insertion LED encapsulating structure, it is characterized in that: described packaging body is epoxy resin or silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202435358U CN202855794U (en) | 2012-05-25 | 2012-05-25 | Direct insert type LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202435358U CN202855794U (en) | 2012-05-25 | 2012-05-25 | Direct insert type LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202855794U true CN202855794U (en) | 2013-04-03 |
Family
ID=47986960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012202435358U Expired - Fee Related CN202855794U (en) | 2012-05-25 | 2012-05-25 | Direct insert type LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202855794U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106784273A (en) * | 2017-01-05 | 2017-05-31 | 永林电子有限公司 | A kind of LED support of bipod plug-in type lateral emitting |
| CN106784269A (en) * | 2017-01-05 | 2017-05-31 | 永林电子有限公司 | A kind of double angle LED light emitting diodes of cylindrical indent |
-
2012
- 2012-05-25 CN CN2012202435358U patent/CN202855794U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106784273A (en) * | 2017-01-05 | 2017-05-31 | 永林电子有限公司 | A kind of LED support of bipod plug-in type lateral emitting |
| CN106784269A (en) * | 2017-01-05 | 2017-05-31 | 永林电子有限公司 | A kind of double angle LED light emitting diodes of cylindrical indent |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130403 Termination date: 20160525 |