CN203733795U - LED packaging structure - Google Patents
LED packaging structure Download PDFInfo
- Publication number
- CN203733795U CN203733795U CN201420105102.5U CN201420105102U CN203733795U CN 203733795 U CN203733795 U CN 203733795U CN 201420105102 U CN201420105102 U CN 201420105102U CN 203733795 U CN203733795 U CN 203733795U
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- Prior art keywords
- led
- transparency carrier
- luminescence chip
- encapsulating structure
- chip
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Abstract
The utility model discloses an LED packaging structure comprising LED luminescence chips, a transparent substrate, conductive metal, a metal bracket and a fluorescent film. The LED luminescence chips are fixed on the front surface of the transparent substrate via a COB integrated packaging mode. The LED chips are connected via conductive metal. The transparent substrate is fixed on the metal bracket. The fluorescent film is plastic-packaged on the surface of the transparent substrate. The LED luminescence chips are packaged between the transparent substrate and the fluorescent film. The LED packaging structure has advantages of being comprehensive in luminescence and high in luminescence efficiency.
Description
Technical field
The utility model relates to LED encapsulation technology field.
Background technology
Light-emitting diode (Light Emitting Diode, LED) is as a kind of green light source, has that luminous efficiency is high, power consumption is few, a long service life, safe and reliable and environmentally friendly advantage.Along with the lifting of people's environmental consciousness, LED matrix more and more receives people's concern, and LED matrix application is also more and more wider.
In prior art, the encapsulation of LED is normally carried out on the substrate with good reflective surface, and going out light effect is the light output of LED and the light output sum of reflecting surface, bright dipping bright dipping in the plane like this, affect the total amount of light output, luminous efficiency is reduced.
Utility model content
The technical assignment of the technical problems to be solved in the utility model and proposition is that prior art scheme is improved and improved, and provides a kind of LED encapsulating structure, with the object that reaches omnibearing luminous, luminous efficiency is high.For this reason, the utility model is taked following technical scheme.
A kind of LED encapsulating structure, comprise LED luminescence chip, transparency carrier, conducting metal, metallic support, fluorescence membrane, LED luminescence chip is fixed on the front of transparency carrier by the mode of COB integration packaging, between LED chip, connect by conducting metal, transparency carrier is fixed on metallic support, and fluorescence membrane plastic packaging is on the surface of transparency carrier, by the sealing-in of LED luminescence chip between transparency carrier and fluorescence membrane, can realize omnibearing luminously, effectively improve the luminous efficiency of LED.
Improve as one, described transparency carrier is provided with plural LEDs luminescence chip.
As one improve, described transparency carrier be by but be not limited only to the high grade of transparency homogeneous substrate that PMMA macromolecular material is made.
Improve as one, described LED luminescence chip is blue chip.
Improve as one, described fluorescence membrane is allocated and is formed by a certain percentage by fluorescent material and silica gel.
Owing to adopting technique scheme, that the LED encapsulating structure that the utility model provides has advantages of is omnibearing luminous, luminous efficiency is high.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Fig. 2 is outside schematic diagram of the present utility model.
In figure, LED luminescence chip 1, transparency carrier 2, conducting metal 3, metallic support 4, fluorescence membrane 5.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
With reference to Fig. 1, shown in Fig. 2, the utility model has disclosed a kind of LED encapsulating structure, it comprises: LED luminescence chip 1, transparency carrier 2, conducting metal 3, metallic support 4, fluorescence membrane 5, LED luminescence chip 1 is fixed on the front of transparency carrier 2 by the mode of COB integration packaging, between LED chip 1, connect by conducting metal 3, transparency carrier 2 is fixed on metallic support 4, fluorescence membrane 5 plastic packagings are on the surface of transparency carrier 2, by 1 sealing-in of LED luminescence chip between transparency carrier 2 and fluorescence membrane 5, can realize omnibearing luminous, effectively improve the luminous efficiency of LED.
Transparency carrier 2 is provided with plural LEDs luminescence chip 1, effectively improves the overall brightness of LED encapsulating structure.
Transparency carrier be by but be not limited only to the high grade of transparency homogeneous substrate that PMMA macromolecular material is made, do not lose the luminous flux of LED luminescence chip 1 bottom surface, effectively improve the overall brightness of LED encapsulating structure.
LED luminescence chip 1 is blue chip, after the blue light that LED luminescence chip 1 sends mixes with the fluorescent material in fluorescence membrane 5, forms white light, and fluorescent material caloric value is little, improves the reliability of LED encapsulating structure.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any amendments of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (5)
1. a LED encapsulating structure, comprise LED luminescence chip, transparency carrier, conducting metal, metallic support, fluorescence membrane, it is characterized in that, LED luminescence chip is fixed on the front of transparency carrier by the mode of COB integration packaging, between LED chip, connect by conducting metal, transparency carrier is fixed on metallic support, and fluorescence membrane plastic packaging is on the surface of transparency carrier, by the sealing-in of LED luminescence chip between transparency carrier and fluorescence membrane.
2. LED encapsulating structure according to claim 1, is characterized in that, described transparency carrier is provided with plural LEDs luminescence chip.
3. LED encapsulating structure according to claim 1, is characterized in that, described transparency carrier be by but be not limited only to the high grade of transparency homogeneous substrate that PMMA macromolecular material is made.
4. LED encapsulating structure according to claim 1, is characterized in that, described LED luminescence chip is blue chip.
5. LED encapsulating structure according to claim 1, is characterized in that, described fluorescence membrane is allocated and formed by a certain percentage by fluorescent material and silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420105102.5U CN203733795U (en) | 2014-03-08 | 2014-03-08 | LED packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420105102.5U CN203733795U (en) | 2014-03-08 | 2014-03-08 | LED packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203733795U true CN203733795U (en) | 2014-07-23 |
Family
ID=51203845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420105102.5U Expired - Fee Related CN203733795U (en) | 2014-03-08 | 2014-03-08 | LED packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203733795U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104681703A (en) * | 2015-02-12 | 2015-06-03 | 苏州晶品新材料股份有限公司 | Three-dimensional luminous LED point light source and illumination device |
-
2014
- 2014-03-08 CN CN201420105102.5U patent/CN203733795U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104681703A (en) * | 2015-02-12 | 2015-06-03 | 苏州晶品新材料股份有限公司 | Three-dimensional luminous LED point light source and illumination device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140723 Termination date: 20180308 |