CN203118944U - Sealing structure of light-emitting diode (LED) lamp - Google Patents

Sealing structure of light-emitting diode (LED) lamp Download PDF

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Publication number
CN203118944U
CN203118944U CN2013201092548U CN201320109254U CN203118944U CN 203118944 U CN203118944 U CN 203118944U CN 2013201092548 U CN2013201092548 U CN 2013201092548U CN 201320109254 U CN201320109254 U CN 201320109254U CN 203118944 U CN203118944 U CN 203118944U
Authority
CN
China
Prior art keywords
led
sealing structure
circuit board
lamp
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2013201092548U
Other languages
Chinese (zh)
Inventor
江向东
江浩澜
郭运昌
吴小军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ANHUI AZURE OPTOELECTRONICS TECHNOLOGY Co Ltd
Original Assignee
ANHUI AZURE OPTOELECTRONICS TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ANHUI AZURE OPTOELECTRONICS TECHNOLOGY Co Ltd filed Critical ANHUI AZURE OPTOELECTRONICS TECHNOLOGY Co Ltd
Priority to CN2013201092548U priority Critical patent/CN203118944U/en
Application granted granted Critical
Publication of CN203118944U publication Critical patent/CN203118944U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

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  • Led Device Packages (AREA)

Abstract

The utility model discloses a sealing structure of a light-emitting diode (LED) lamp. The sealing structure of the LED lamp comprises a circuit board and a plurality of LED chips. The sealing structure of the LED lamp is characterized in that bottom glue is coated on the bottoms of the LED chips, the LED chips are fixed on the circuit board through the bottom glue, fluorescent colloid is filled around the LED chips, and a bearing seat is arranged in the middle of the circuit board. The sealing structure of the LED lamp has the advantages of being consistent in color temperature of a color zone, simple in technology, and low in cost.

Description

A kind of encapsulating structure of LED lamp
Technical field
The utility model relates to a kind of LED lamp, is specifically related to a kind of encapsulating structure of LED lamp.
Background technology
Along with domestic and international energy-saving and emission-reduction policy execution, the ratio that white LED light source is applied in lighting field increases day by day, more and more widely.LED production efficiency, colour temperature consistency, the performance of technology, cost, cost performance aspect still is focus.And present LED lamp look district colour temperature after encapsulation can't obtain consistency, thereby affects illuminating effect.
Summary of the invention
Technical problem to be solved in the utility model is to provide a kind of look district colour temperature unanimity, the encapsulating structure of a kind of LED lamp that technology is simple, cost is low.
Technical problem to be solved in the utility model realizes by the following technical solutions.
A kind of encapsulating structure of LED lamp, comprise circuit board and some LEDs chips, it is characterized in that: described some LEDs chip bottom scribble primer, and be fixed on the circuit board by primer, fill fluorescent colloid around described some LEDs chips, described circuit board centre position is provided with stacker.
The beneficial effects of the utility model are: look district colour temperature unanimity, technology is simple, cost is low.
Description of drawings
Fig. 1 is the utility model structural representation.
Embodiment
For technological means, creation characteristic that the utility model is realized, reach purpose and effect is easy to understand, below in conjunction with concrete diagram, further set forth the utility model.
As shown in Figure 1, a kind of encapsulating structure of LED lamp comprises circuit board 1 and some LEDs chips 2, some LEDs chips 2 bottoms scribble primer 3, and be fixed on the circuit board 1 by primer 3, fill fluorescent colloid 4 around some LEDs chips 2, circuit board 1 centre position is provided with stacker 5.
More than show and described basic principle of the present utility model and principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; that describes in above-described embodiment and the specification just illustrates principle of the present utility model; under the prerequisite that does not break away from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall in claimed the utility model scope.The claimed scope of the utility model is defined by appending claims and equivalent thereof.

Claims (1)

1. the encapsulating structure of a LED lamp, comprise circuit board and some LEDs chips, it is characterized in that: described some LEDs chip bottom scribble primer, and be fixed on the circuit board by primer, fill fluorescent colloid around described some LEDs chips, described circuit board centre position is provided with stacker.
CN2013201092548U 2013-03-12 2013-03-12 Sealing structure of light-emitting diode (LED) lamp Expired - Fee Related CN203118944U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2013201092548U CN203118944U (en) 2013-03-12 2013-03-12 Sealing structure of light-emitting diode (LED) lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2013201092548U CN203118944U (en) 2013-03-12 2013-03-12 Sealing structure of light-emitting diode (LED) lamp

Publications (1)

Publication Number Publication Date
CN203118944U true CN203118944U (en) 2013-08-07

Family

ID=48899263

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2013201092548U Expired - Fee Related CN203118944U (en) 2013-03-12 2013-03-12 Sealing structure of light-emitting diode (LED) lamp

Country Status (1)

Country Link
CN (1) CN203118944U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130807

Termination date: 20210312

CF01 Termination of patent right due to non-payment of annual fee