CN204834618U - Cup type 5050 LED paster devices of four -core of two reflection of light - Google Patents
Cup type 5050 LED paster devices of four -core of two reflection of light Download PDFInfo
- Publication number
- CN204834618U CN204834618U CN201520603450.XU CN201520603450U CN204834618U CN 204834618 U CN204834618 U CN 204834618U CN 201520603450 U CN201520603450 U CN 201520603450U CN 204834618 U CN204834618 U CN 204834618U
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- China
- Prior art keywords
- led
- reflector
- reflection
- core
- light
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- Led Device Packages (AREA)
Abstract
The utility model discloses a cup type 5050 LED paster devices of four -core of two reflection of light contains LED support, metal pad and LED chip, be equipped with first reflection of light cup and second reflection of light cup on the LED support, the interior correspondence of first reflection of light cup is equipped with three pairs of metal pads, places 3 blue LED chips on these three pairs of metal pads, and it arouses yellow fluorescent powder to produce the white light, the interior correspondence of second reflection of light cup is equipped with a pair of metal pad, places red LED chip on this a pair of metal pad. This novel original creation ground design on 5050 same LED paster devices has two reflection of light cup structures, and wherein place 3 blue LED chips in the first reflection of light cup, it arouses yellow fluorescent powder to produce the white light, place red LED chip in the second reflection of light cup, this design makes 5050 LED paster devices of four -core become the white light LED device that possesses the ruddiness compensation, can satisfy high color rendering index's lighting needs, can be used to indoor lighting, especially, desk lamp, mother and infant lamp etc.
Description
Technical field
The utility model belongs to LED light source field, is specifically related to a kind of two reflective cup type four-core 5050LED surface-mounted device.
Background technology
At present, the LED surface-mounted device of 5050 specifications is main materials of LED, is generally three chips monochrome or white light LEDs.Just white, the warm white 5050LED surface-mounted device of general employing is used for undercut LED, and employing is red, green, blue LED die forms three core 5050LED surface-mounted devices, may be used for the color LED of RGB seven.
But common 5050LED surface-mounted device is generally a luminous zone, and three cores can not meet the requirement of high color rendering index (CRI) sometimes.Such as, red, green and blue three 5050LED surface-mounted device, may be used for seven color LED, pixel screen etc.When 5050LED surface-mounted device is used for pixel screen, each device is as pixel cell, and pixel cell comprises RGB three chips.In order to reach the white balance of pixel cell, need RGB ratio to be 3:6:1, the brightness of general green, blue two kinds of chips is higher, and the luminance shortage of red chip, need the quantity increasing chip, and common 5050LED surface-mounted device can not meet the encapsulation of four-core 5050LED surface-mounted device.
Given this, the present inventor furthers investigate for the problems referred to above, and proposes the four-core 5050LED surface-mounted device of a kind of pair of reflector.
Utility model content
The purpose of this utility model is to provide a kind of two reflective cup type four-core 5050LED surface-mounted device, can meet the lighting demand of high color rendering index (CRI), can be used for the especially room lighting such as desk lamp, mother and baby's lamp.
In order to reach above-mentioned purpose, solution of the present utility model is:
A two reflective cup type four-core 5050LED surface-mounted device, comprises LED support, metal pad and LED chip; LED support is provided with the first reflector and the second reflector; In first reflector, correspondence is provided with three pairs of metal pads, and these three pairs of metal pads place 3 blue LED die, and it excites yellow fluorescent powder to produce white light; In second reflector, correspondence is provided with pair of metal pad, and this pair of metal pad places red LED chips.
Described metal pad is embedded in injected plastics material when LED support injection moulding, and this metal pad one end is positioned at the first reflector or the second reflector, for drawing chip electrode; The other end is positioned at outside the first reflector or the second reflector, welds LED surface-mounted device for SMT.
The injection moulding base material of described LED support is any one in PCT, PPA, EMC material; When 5050 power are that 0.1-0.5 watt-hour adopts PPA material; When 5050 power are that 0.2-1 watt-hour adopts PCT material; When 5050 power are that 1-5 watt-hour adopts EMC material.
The cup profile of described first reflector and the second reflector is the hexagon hypotenuse structure of accurate side's shape.
After adopting such scheme, this novel two reflective cup type four-core 5050LED surface-mounted device, two reflecting cup structure is designed with originally on same 5050LED surface-mounted device, and wherein place 3 blue LED die in the first reflector, it excites yellow fluorescent powder to produce white light, red LED chips is placed in second reflector, the white light LED part that this design makes four-core 5050LED surface-mounted device become to possess ruddiness to compensate, the lighting demand of high color rendering index (CRI) can be met, can be used for room lighting, especially desk lamp, mother and baby's lamp etc.
Accompanying drawing explanation
Fig. 1 is the stereogram of this novel two reflective cup type four-core 5050LED surface-mounted device;
Fig. 2 is the front view of this novel two reflective cup type four-core 5050LED surface-mounted device.
Label declaration
LED support 1 first reflector 11
Second reflector 12 metal pad 21
Electrode pin 211 metal pad 22
Electrode pin 221 blue LED die 31
Red LED chips 32 gold thread 4.
Embodiment
Below in conjunction with the drawings and specific embodiments, this case is described in further detail.
This case relates to a kind of two reflective cup type four-core 5050LED surface-mounted device, as shown in Figure 1-2, comprises LED support 1, metal pad and LED chip.
LED support 1 is provided with abreast the first reflector 11 and the second reflector 12.In first reflector 11, correspondence is provided with three pairs of metal pads 21, these three pairs of metal pads 21 is placed in 3 blue LED die 31, first reflectors 11 and is suitably filled with yellow fluorescent powder, and blue LED die 31 excites yellow fluorescent powder to produce white light.In second reflector 12, correspondence is provided with pair of metal pad 22, and this pair of metal pad 22 places red LED chips 32.
This novel two reflective cup type four-core 5050LED surface-mounted device, two reflecting cup structure is designed with originally on same 5050LED surface-mounted device, and wherein place 3 blue LED die 21 in the first reflector 11, it excites yellow fluorescent powder to produce white light, red LED chips 22 is placed in second reflector 12, the white light LED part that this design makes four-core 5050LED surface-mounted device become to possess ruddiness to compensate, and coordinate two reflecting cup structures to the control of respective light beam, the lighting demand of high color rendering index (CRI) can be met.
Described metal pad 21,22 is embedded in injected plastics material when LED support 1 injection moulding, and this metal pad 21,22 one end correspondence is positioned at first, second reflector 11,12, for drawing chip electrode; The other end is positioned at outside first and second reflector 11,12, as electrode pin 211,221, welds this Novel LED pasted device for SMT.
Preferably, the injection moulding base material of LED support 1 can be any one in PCT, PPA, EMC material; Specifically, when 5050 power are 0.1-0.5 watt-hour, adopt PPA material; When 5050 power are 0.2-1 watt-hour, adopt PCT material; When 5050 power are 1-5 watt-hour, adopt EMC material.
Preferably, the cup profile of the first reflector 11 and the second reflector 12 is the hexagon hypotenuse structure of accurate side's shape, and wherein two hypotenuses are positioned at end positions place in the outer part, and this kind of design is beneficial to out light action and light-out effect.
The foregoing is only the preferred embodiment that this is novel, all equalizations done with this novel right change and modify, and all should belong to the scope of this novel claim.
Claims (4)
1. a two reflective cup type four-core 5050LED surface-mounted device, comprises LED support, metal pad and LED chip; It is characterized in that: LED support is provided with the first reflector and the second reflector; In first reflector, correspondence is provided with three pairs of metal pads, and these three pairs of metal pads place 3 blue LED die, and it excites yellow fluorescent powder to produce white light; In second reflector, correspondence is provided with pair of metal pad, and this pair of metal pad places red LED chips.
2. a kind of two reflective cup type four-core 5050LED surface-mounted device as claimed in claim 1, it is characterized in that: described metal pad is embedded in injected plastics material when LED support injection moulding, this metal pad one end is positioned at the first reflector or the second reflector, for drawing chip electrode; The other end is positioned at outside the first reflector or the second reflector, welds LED surface-mounted device for SMT.
3. a kind of two reflective cup type four-core 5050LED surface-mounted device as claimed in claim 1, is characterized in that: the injection moulding base material of described LED support is any one in PCT, PPA, EMC material; When 5050 power are that 0.1-0.5 watt-hour adopts PPA material; When 5050 power are that 0.2-1 watt-hour adopts PCT material; When 5050 power are that 1-5 watt-hour adopts EMC material.
4. a kind of two reflective cup type four-core 5050LED surface-mounted device as claimed in claim 1, is characterized in that: the cup profile of described first reflector and the second reflector is the hexagon hypotenuse structure of accurate side's shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520603450.XU CN204834618U (en) | 2015-08-12 | 2015-08-12 | Cup type 5050 LED paster devices of four -core of two reflection of light |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520603450.XU CN204834618U (en) | 2015-08-12 | 2015-08-12 | Cup type 5050 LED paster devices of four -core of two reflection of light |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204834618U true CN204834618U (en) | 2015-12-02 |
Family
ID=54692187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520603450.XU Expired - Fee Related CN204834618U (en) | 2015-08-12 | 2015-08-12 | Cup type 5050 LED paster devices of four -core of two reflection of light |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204834618U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115458662A (en) * | 2022-10-24 | 2022-12-09 | 永林电子股份有限公司 | Side-pasting type double-cup support, double-cup support array and transmitting and receiving module |
-
2015
- 2015-08-12 CN CN201520603450.XU patent/CN204834618U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115458662A (en) * | 2022-10-24 | 2022-12-09 | 永林电子股份有限公司 | Side-pasting type double-cup support, double-cup support array and transmitting and receiving module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151202 Termination date: 20170812 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |