CN102800785A - Separating dimmable surface-mounted light emitting diode (SMDLED) incandescent lamp - Google Patents
Separating dimmable surface-mounted light emitting diode (SMDLED) incandescent lamp Download PDFInfo
- Publication number
- CN102800785A CN102800785A CN2012102170578A CN201210217057A CN102800785A CN 102800785 A CN102800785 A CN 102800785A CN 2012102170578 A CN2012102170578 A CN 2012102170578A CN 201210217057 A CN201210217057 A CN 201210217057A CN 102800785 A CN102800785 A CN 102800785A
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- hole
- luminescence chip
- chip
- reflection
- bowl cup
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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Abstract
The invention relates to a separating dimmable surface-mounted light emitting diode (SMDLED) incandescent lamp, which solves technical problems that in the prior art, chips are packaged in a bowl, are in mutual interference and high in junction temperature, white light decay is high, light color is non-uniform, and a lighting effect is low due to light wave energy mutually absorbed by the chips. The incandescent lamp comprises a base; a bowl hole is formed in the upper surface of the base; pins are arranged in the base; a plurality of luminous chips are arranged at the bottom of the bowl hole; separating plates are arranged in the bowl hole; the bowl hole is separated into a plurality of reflecting holes by the separating plates; each luminous chip is independently arranged in a corresponding reflecting hole; and fluorescent adhesives or potting adhesives are respectively filled in the reflecting holes. The incandescent lamp has the advantages that the separating dimmable SMDLED incandescent lamp is low in junction temperature, long in service life, good in lighting effect, and interference among the luminous chips is avoided.
Description
Technical field
The present invention relates to a kind of LED luminescence technology, especially relate to a kind of junction temperature little, avoided between the luminescence chip disturbing, longer, the white lamp of the better separate type tunable optical of light efficiency paster LED of life-span.
Background technology
Because the white lamp of traditional SMD LED has only a bowl cup; Only encapsulate blue wafer, the luminous yellow fluorescent powder that excites of blue chip produces gold-tinted like this, makes blue light mix the generation white light according to a certain percentage with gold-tinted; This white light only contains blue light and gold-tinted; Spectrum is single, owing to have only a kind of blue chip, color rendering is poor.Or in same bowl cup, encapsulate blue red crystalline substance simultaneously and improve color rendering, this kind packing forms since blue red wafer all be encapsulated in the same fluorescent colloid because blue red chip all is potted in the same bowl cup by fluorescent glue; Two kinds of chips are lighted simultaneously, each other all can heat production, and the phase mutual interference; Junction temperature can be higher than independent encapsulation; Chip can absorb light-wave energy each other, and the energy that simultaneously fluorescent glue also can absorptive red light can cause light efficiency on the low side like this; Because of heat dissipation problem can cause red white light light decay deviation big, cause photochromic consistent causing property very poor.Like the patent No. is 200920206360.1; Name is called the Chinese utility model patent of a kind of full-color SMD LED; Comprise support, chip, gold thread, gold thread connects the PPA plastic plate and the chip of support, and wherein PPA plastic plate surface is provided with border circular areas; The chip yi word pattern is arranged in the border circular areas, the encapsulation glue with Chip Packaging on the PPA of support plastic plate.This patent all is encapsulated in chip in the border circular areas exactly, so just has above-mentioned shortcoming, and chip each other all can heat production; The phase mutual interference; It is high that junction temperature is wanted, and chip can absorb light-wave energy each other, can cause light efficiency on the low side like this; Because of heat dissipation problem can cause white light light decay deviation big, cause photochromic consistency very poor in addition.
Summary of the invention
The present invention mainly be solve phase mutual interference between there is Chip Packaging in prior art in a bowl cup the chip, junction temperature high, cause big, the photochromic consistency of white light light decay poor; And absorption light-wave energy each other between the chip; Cause the low technical problem of light efficiency, provide a kind of junction temperature little, avoided between the luminescence chip disturbing, longer, the white lamp of the better separate type tunable optical of light efficiency paster LED of life-span.
Above-mentioned technical problem of the present invention mainly is able to solve through following technical proposals: the white lamp of a kind of separate type tunable optical patch SMD LED; Comprise pedestal; Be provided with bowl cup hole at pedestal upper surface, be provided with pin in the pedestal, be provided with some luminescence chips in bottom, bowl cup hole; It is characterized in that: in said bowl cup hole, be provided with demarcation strip; Demarcation strip is separated into several reflection holes with bowl cup hole, and said luminescence chip is arranged on separately respectively in the reflection hole, in each reflection hole, is filled with fluorescent glue or casting glue respectively.Luminescence chip of the present invention is installed and is adopted separate type, and demarcation strip is separated into some uniform reflection holes with bowl cup hole, and luminescence chip independently is arranged in each reflection hole and encapsulates separately; Avoided absorbing between the luminescence chip interference of light-wave energy each other like this; Reduced the junction temperature of chip, improved thermal diffusivity, made that white light light decay deviation is little; Also avoided the absorption of fluorescent glue simultaneously, improved light efficiency the energy of the luminescence chip light that need not the fluorescent glue encapsulation.Adopt dividing plate that setting is separated in bowl cup hole, it is compacter to make that each reflection hole distributes, and has reduced the area of pedestal greatly, makes the LED lamp body long-pending littler, has satisfied the higher LED display of pixel and has made requirement.
As a kind of preferred version; Said demarcation strip is separated into two reflection holes with bowl cup hole; Said pin is provided with two; Two pins reveal respectively to put in two reflection holes and form pad, and said luminescence chip comprises first luminescence chip and second luminescence chip, and first luminescence chip and second luminescence chip are separately positioned on the pad of two reflection holes bottoms.This demarcation strip is a yi word pattern, and is horizontal in the middle of bowl cup hole, and bowl cup hole is divided into monosymmetric reflection hole, and it is compacter to make that like this reflection hole distributes, and conserve space has more reduced the volume of LED lamp.
As a kind of preferred version, in the reflection hole that is provided with first luminescence chip, be filled with fluorescent glue, in being provided with the radiation hole of second luminescence chip, be filled with casting glue.Mix forming white light behind the optical excitation fluorescent glue that first luminescence chip sends, mix forming the more white light of high color rendering index (CRI) again with second luminescence chip.
As a kind of preferred version, said first luminescence chip is a blue chip, and said second luminescence chip is red light chips or gold-tinted chip.Second luminescence chip is red light chips or gold-tinted chip and fluorescent glue mixed light formation white light.
As a kind of preferred version, said fluorescent glue is the fluorescent glue that includes yellow fluorescent powder, and said casting glue is transparent epoxy resin.
As a kind of preferred version, the hole that bowl cup Kong Weisi bar arc limit constitutes.This makes the general circular port of bowl cup boring ratio want big, makes bowl cup hole can be separated out more reflection hole and is used to be provided with luminescence chip.
As a kind of preferred version, the face of said demarcation strip both sides is the inclined-plane.Make that the reflection hole light extraction efficiency after separating is higher.
Therefore; Advantage of the present invention is: 1. adopt separate type, avoided absorbing the interference of light-wave energy each other between the luminescence chip, reduced the junction temperature of chip; Improved thermal diffusivity; Make that white light light decay deviation is little, also avoided the absorption of fluorescent glue simultaneously, improved light efficiency the energy of the luminescence chip light that need not the fluorescent glue encapsulation; 2. it is compacter to make that each reflection hole distributes, and has reduced the area of pedestal greatly, makes the LED lamp body long-pending littler, has satisfied the higher LED display of pixel and has made requirement.
Description of drawings
Accompanying drawing 1 is the not preceding a kind of structural representation of sealing of the present invention;
Accompanying drawing 2 is a kind of structural representations after the sealing of the present invention.
The 1-pedestal 2-pin 3-bowl cup hole 4-demarcation strip 5-luminescence chip 6-fluorescent glue 7-casting glue 8-reflection hole 9-first luminescence chip 10-second luminescence chip.
Embodiment
Pass through embodiment below, and combine accompanying drawing, do further bright specifically technical scheme of the present invention.
Embodiment:
The white lamp of a kind of separate type tunable optical of present embodiment patch SMD LED, as depicted in figs. 1 and 2, it includes a pedestal 1; This pedestal is processed by the PPA material; Be provided with bowl cup hole 3 in the middle of this pedestal upper surface, in order to increase area, this bowl cup hole is the hole body with four arc limit structures.
In pedestal, be provided with two pins 2, expose respectively in the pedestal both sides at these pin two ends, forms anodal pin and negative pole pin, and pin exposes the pad that is formed for installing luminescence chip 5 on top, bottom, bowl cup hole.
In bowl cup hole, also be provided with the demarcation strip 4 of an in-line, this demarcation strip and pedestal are made into integration, and demarcation strip is divided into two symmetrical reflection holes 8 with bowl cup hole, and in order to improve light extraction efficiency, the demarcation strip both sides are designed to ramp structure.Article two, the pad of pin formation lays respectively at two reflection holes bottoms; Luminescence chip comprises first luminescence chip 9 and second luminescence chip 10; This first luminescence chip is used for mixing the generation white light, and first luminescence chip is a blue chip in the present embodiment, and second luminescence chip 10 is used for becoming with the white light colour mixture white light of high colour developing; Present embodiment adopts red light chips; Two luminescence chips are separately positioned in two reflection holes, and luminescence chip is anodal to be connected with the pin positive terminal, and the luminescence chip negative pole is connected on the negative pole end of pin through gold thread.Two luminescence chips form the circuit of parallel connection, can regulate through the electric current of each luminescence chip, and this makes the LED lamp can realize the light modulation toning.
As shown in Figure 2, in being provided with the reflection hole of blue chip, be filled with fluorescent glue 6, this fluorescent glue is the fluorescent glue that contains yellow fluorescent powder.And in being provided with the reflection hole of red light chips, be filled with the casting glue 7 that constitutes by transparent epoxy resin.Blue chip is exactly the yellow fluorescent powder generation mixed white light in the independent excitation fluorescent glue like this, and red chip realizes mixed light with white light after then seeing through transparent casting glue, obtains the white light of higher colour developing.In addition, this red chip can also change yellow chip into, and its effect also is the same.Present embodiment adopts separate type; Avoided absorbing between the luminescence chip interference of light-wave energy each other; Reduced the junction temperature of chip, improved thermal diffusivity, made that white light light decay deviation is little; Also avoided the absorption of fluorescent glue simultaneously, improved light efficiency the energy of the luminescence chip light that need not the fluorescent glue encapsulation; 2. it is compacter to make that each reflection hole distributes, and has reduced the area of pedestal greatly, makes the LED lamp body long-pending littler, has satisfied the higher LED display of pixel and has made requirement.
Specific embodiment described herein only is that the present invention's spirit is illustrated.Person of ordinary skill in the field of the present invention can make various modifications or replenishes or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present invention or surmount the defined scope of appended claims.
Although this paper has used terms such as pedestal, bowl cup hole, reflection hole, pin, demarcation strip morely, do not get rid of the possibility of using other term.Using these terms only is in order to describe and explain essence of the present invention more easily; It all is contrary with spirit of the present invention being construed to any additional restriction to them.
Claims (7)
1. the white lamp of separate type tunable optical patch SMD LED comprises pedestal, is provided with bowl cup hole at pedestal upper surface; Be provided with pin in the pedestal; Be provided with some luminescence chips in bottom, bowl cup hole, it is characterized in that: in said bowl cup hole (3), be provided with demarcation strip (4), demarcation strip is separated into several reflection holes (8) with bowl cup hole; Said luminescence chip is arranged on separately respectively in the reflection hole, in each reflection hole, is filled with fluorescent glue (6) or casting glue (7) respectively.
2. the white lamp of a kind of separate type tunable optical patch SMD LED according to claim 1; It is characterized in that said demarcation strip (4) is separated into two reflection holes (8) with bowl cup hole (3); Said pin is provided with two; Two pins reveal respectively to put in two reflection holes and form pad, and said luminescence chip comprises first luminescence chip (9) and second luminescence chip (10), and first luminescence chip and second luminescence chip are separately positioned on the pad of two reflection holes bottoms.
3. the white lamp of a kind of separate type tunable optical patch SMD LED according to claim 2; It is characterized in that in the reflection hole that is provided with first luminescence chip (9) (8), being filled with fluorescent glue, in the reflection hole that is provided with second luminescence chip (10) (8), be filled with casting glue.
4. according to claim 2 or the white lamp of 3 described a kind of separate type tunable optical patch SMD LED, it is characterized in that said first luminescence chip (9) is a blue chip, said second luminescence chip (10) is red light chips or gold-tinted chip.
5. according to claim 1 or the white lamp of 2 or 3 described a kind of separate type tunable optical patch SMD LED, it is characterized in that said fluorescent glue (6) for including the fluorescent glue of yellow fluorescent powder, said casting glue (7) is transparent epoxy resin.
6. according to claim 1 or the white lamp of 2 or 3 described a kind of separate type tunable optical patch SMD LED, it is characterized in that the hole that four arc limits, position, bowl cup hole (3) constitute.
7. according to claim 2 or the white lamp of 3 described a kind of separate type tunable optical patch SMD LED, it is characterized in that the face of said demarcation strip (4) both sides is the inclined-plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102170578A CN102800785A (en) | 2012-06-25 | 2012-06-25 | Separating dimmable surface-mounted light emitting diode (SMDLED) incandescent lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102170578A CN102800785A (en) | 2012-06-25 | 2012-06-25 | Separating dimmable surface-mounted light emitting diode (SMDLED) incandescent lamp |
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| Publication Number | Publication Date |
|---|---|
| CN102800785A true CN102800785A (en) | 2012-11-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012102170578A Pending CN102800785A (en) | 2012-06-25 | 2012-06-25 | Separating dimmable surface-mounted light emitting diode (SMDLED) incandescent lamp |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103904069A (en) * | 2014-03-13 | 2014-07-02 | 黄云仙 | Double-light bead structure fixed on the same chip |
| CN103904191A (en) * | 2012-12-26 | 2014-07-02 | 中微光电子(潍坊)有限公司 | LED packaging substrate and LED packaging structure |
| CN105024001A (en) * | 2014-04-21 | 2015-11-04 | 重庆四联光电科技有限公司 | LED support bowl cup structure and LED lamp bead having the support bowl cup structure |
| CN107482101A (en) * | 2017-09-18 | 2017-12-15 | 广东晶科电子股份有限公司 | A kind of LED packagings with more glasss of supports and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100030805A (en) * | 2008-09-11 | 2010-03-19 | 서울반도체 주식회사 | Multi-chip light emitting diode package |
| CN102263098A (en) * | 2010-05-24 | 2011-11-30 | Lg伊诺特有限公司 | Light emitting device and light unit having the same |
-
2012
- 2012-06-25 CN CN2012102170578A patent/CN102800785A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20100030805A (en) * | 2008-09-11 | 2010-03-19 | 서울반도체 주식회사 | Multi-chip light emitting diode package |
| CN102263098A (en) * | 2010-05-24 | 2011-11-30 | Lg伊诺特有限公司 | Light emitting device and light unit having the same |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103904191A (en) * | 2012-12-26 | 2014-07-02 | 中微光电子(潍坊)有限公司 | LED packaging substrate and LED packaging structure |
| CN103904191B (en) * | 2012-12-26 | 2016-09-28 | 中微光电子(潍坊)有限公司 | A kind of LED package substrates and LED encapsulation structure |
| CN103904069A (en) * | 2014-03-13 | 2014-07-02 | 黄云仙 | Double-light bead structure fixed on the same chip |
| CN105024001A (en) * | 2014-04-21 | 2015-11-04 | 重庆四联光电科技有限公司 | LED support bowl cup structure and LED lamp bead having the support bowl cup structure |
| CN107482101A (en) * | 2017-09-18 | 2017-12-15 | 广东晶科电子股份有限公司 | A kind of LED packagings with more glasss of supports and preparation method thereof |
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Application publication date: 20121128 |