CN107482101A - A kind of LED packagings with more glasss of supports and preparation method thereof - Google Patents
A kind of LED packagings with more glasss of supports and preparation method thereof Download PDFInfo
- Publication number
- CN107482101A CN107482101A CN201710846261.9A CN201710846261A CN107482101A CN 107482101 A CN107482101 A CN 107482101A CN 201710846261 A CN201710846261 A CN 201710846261A CN 107482101 A CN107482101 A CN 107482101A
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- Prior art keywords
- plastic cement
- electrode region
- led
- chip
- glasss
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 35
- 238000002360 preparation method Methods 0.000 title claims abstract description 23
- 239000004568 cement Substances 0.000 claims abstract description 61
- 239000010410 layer Substances 0.000 claims abstract description 57
- 239000000758 substrate Substances 0.000 claims abstract description 50
- 239000002184 metal Substances 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- 239000012790 adhesive layer Substances 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- 238000005516 engineering process Methods 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 3
- 230000008033 biological extinction Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 7
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000011324 bead Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000013007 heat curing Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 241001640034 Heteropterys Species 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000005619 thermoelectricity Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The present invention provides a kind of LED packagings with more glasss of supports, including LED chip, support, electric connection line, fluorescent adhesive layer, the support include plastic cement substrate, the metal substrate in plastic cement substrate, plastic cement baffle plate, reflective plastic layer；Reflective plastic layer is coated on the surrounding of the plastic cement substrate surface with bowl shape, forms support bowl；The number of plastic cement baffle plate is at least one, and plastic cement baffle plate is on the metal substrate；Plastic cement baffle plate and the reflective plastic layer, form at least two independent bowls.A kind of LED packagings with more glasss of supports provided by the invention, clever structure, not only adjustable color temperature, and mutual extinction phenomenon will not be produced between chip.Present invention also offers a kind of preparation method of the LED packagings with more glasss of supports, preparation is simple for it, and preparation efficiency is high.
Description
Technical field
The invention belongs to light emitting diode (LED) technical field, and in particular to a kind of LED wrappers with more glasss of supports
Part and preparation method thereof.
Background technology
Light emitting diode (LED) has the characteristics that service life length, colour rendering index height, economical environment-protective, brightness are high.Therefore,
Country is all vigorously advocated using LED, at present in building decoration, backlight, stage glory, car headlamp, indoor and outdoor lighting, friendship
The technical fields such as messenger are widely used.
Existing LED support is mostly one cup support, and it has following weak point：The selection of chip is single, if using
Multi-chip can only prepare the LED air lockings of colour temperature of the same race in parallel or in series, and the color of its lamp bead is also single.In addition, multicore
Piece in parallel or in series when, chip chamber easily produces mutual extinction phenomenon.
At present, disclosing a kind of double cup adjustable color temperatures of LED, aobvious finger and seven coloured silks in existing Chinese patent CN104183685A can
Adjust LED.The patent isolates two reflectors by insulating body with withe, so as to reach the lamp for preparing different-colour
The purpose of pearl.But two kinds of LED wafers can be set in each reflector and there is conducting terminal independent mutually, structure is more
It is complicated；And preparation technology difficulty is bigger, preparation efficiency is low, and it is higher to prepare cost.
Therefore, need badly find a kind of more excellent method for LED encapsulation technologies among, LED devices that it is prepared
Part adjustable color temperature, and mutual extinction phenomenon will not be produced between chip.
The content of the invention
To make up the deficiencies in the prior art, object of the present invention is to provide a kind of LED encapsulation with more glasss of supports
Device, its clever structure, not only adjustable color temperature, and mutual extinction phenomenon will not be produced between chip.
For the present invention to reach its purpose, the technical scheme of use is as follows：
A kind of LED packagings with more glasss of supports, including LED chip, support, electric connection line, fluorescent adhesive layer, it is described
Support includes plastic cement substrate, the metal substrate in the plastic cement substrate, plastic cement baffle plate, reflective plastic layer；The reflective modeling
Glue-line is coated on the surrounding of the plastic cement substrate surface with bowl shape, forms support bowl；The number of the plastic cement baffle plate is extremely
Few one, the plastic cement baffle plate is on the metal substrate；The plastic cement baffle plate and the reflective plastic layer, form at least two
Individual independent bowl.
Further, the height of the plastic cement baffle plate and the support bowl is highly consistent.
Further, the metal substrate is etching copper sheet；It is described etching copper sheet include chip rest area, positive electrode region and
Negative electrode region.
Further, the positive electrode region and negative electrode region are respectively arranged on the both sides of the chip rest area.LED chip
Residing chip rest area separates with positive electrode region and negative electrode region, realizes the structure of thermoelectricity separation.
Further, the reflective plastic layer is also coated between the chip rest area, positive electrode region and negative electrode region
Metallic substrate surfaces and chip rest area outer surface.By increasing the surface area of reflective plastic layer, also increase this
The reflecting effect of LED packagings is invented, so as to which the present invention has the advantages of improving light efficiency, increase photochromic effect.
Further, the reflective plastic layer is white reflection plastic layer.
Further, the plastic cement baffle plate is located on the chip rest area, positive electrode region and negative electrode region.Plastic cement baffle plate
Simultaneously on chip rest area, positive electrode region and negative electrode region, multiple LED chips same a positive electrode region and negative electrode
Area, reduce the area of metal substrate.
Further, the quantity of the plastic cement baffle plate is 1, and the plastic cement baffle plate is located at chip rest area, positive electrode
On the axial line of area and negative electrode region.
Further, the LED chip, which is set, is fixed on the chip rest area；The LED chip passes through the electrical connection
Line electrically connects with chip rest area, positive electrode region or the negative electrode region, forms circuit loop；The fluorescent adhesive layer is with heat cure
Form coats the LED chip and the electric connection line completely.
Further, it is silver coated on the surface of the etching copper sheet.
Further, a kind of LED packagings with more glasss of supports, the support also includes reflector layer, described reflective
Reflective plastic cement layer surface of the layer inside the support bowl.Reflective plastic cement layer surface inside support bowl is provided with reflective
Layer, further increases its reflecting effect, further improves light efficiency, increase photochromic effect.
In addition, another object of the present invention is to accordingly provide a kind of LED packagings with more glasss of supports
Preparation method, preparation is simple for it, and preparation efficiency is high.
For the present invention to reach its purpose, the technical scheme of use is as follows：
A kind of preparation of the LED packagings with more glasss of supports, this method comprise the following steps：
S10：Metal substrate is fixed in plastic cement substrate；
S20：Plastic cement baffle plate is made on the metal substrate；
S30：The reflective plastic layer of bowl shape is made in the surrounding of the plastic cement substrate surface；
S40：The LED chip is fixed on the chip rest area；The LED chip passes through electric connection line and the chip
Rest area, positive electrode region or negative electrode region electrical connection, form circuit loop；
S50：Coat the LED chip and the electric connection line completely with fluorescent adhesive layer, be packaged into LED packagings.
Further, after step slo with it is further comprising the steps of before step S20：
S11：The etched processing of metal substrate, form chip rest area, positive electrode region and negative electrode region；
S12：Silver layer is plated on the surface of the chip rest area, positive electrode region and negative electrode region by electroplating technology.
Further, it is further comprising the steps of before step S40 after step S30：
S31：Metallic substrate surfaces and the chip between the chip rest area, positive electrode region and negative electrode region are put
Put area's circumferential surface and coat the reflective plastic layer；
S32：Reflective plastic cement layer surface in the inside of the support bowl makes reflector layer.
Further, in the step S20, institute's plastic cement baffle plate is made using injection or Molding techniques；Institute
State in step S30 and step S31, the reflective plastic layer of institute is made using injection or Molding techniques.
Further, in the step S32, the reflector layer uses the technique that Mask adds spraying.
Relative to prior art, the present invention has following advantageous effects：
1st, clever structure of the present invention, plastic cement baffle plate are formed on the metal substrate with the white reflection plastic layer
At least two independent bowls so that the brightness between multi-chip will not interact, and thoroughly solve the mutual extinction of multi-chip
Phenomenon, while solve the problems, such as that lamp bead color is single in the prior art；
2nd, a kind of LED packaging preparation methods with more glasss of supports provided by the invention, preparation technology is simpler,
It is easy to process, significantly improve preparation efficiency, reduce preparation cost.
Brief description of the drawings
Fig. 1 is a kind of top view of structure of support of the present invention；
Fig. 2 is the profile in A portions in Fig. 1；
Fig. 3 is the profile in B portions in Fig. 1；
Fig. 4 is LED chip of the present invention top view in parallel on the support shown in Fig. 1；
Fig. 5 is the profile in A portions in Fig. 4；
Fig. 6 is the profile in B portions in Fig. 4；
Fig. 7 is a kind of schematic diagram of preparation flow of the LED packagings shown in Fig. 4；
Fig. 8 is the top view that LED chip of the present invention is connected on the support shown in Fig. 1；
Fig. 9 is the profile in A portions in Fig. 7；
Figure 10 is the top view of support another kind structure of the present invention；
Reference：
100-LED packagings；1- supports；11- plastic cement substrates；12- metal substrates；121- chips rest area；122- is just
Electrode district；123- negative electrode regions；13- plastic cement baffle plates；The reflective plastic layers of 14-；15- reflector layers；2-LED chips；3- electric connection lines；
4- fluorescent adhesive layers.
Embodiment
Technical scheme is described further below in conjunction with the accompanying drawings：
Embodiment 1
As shown in figures 1-8, present embodiment discloses a kind of LED packagings 100 with more glasss of supports to include LED chip
2nd, support 1, electric connection line 3, fluorescent adhesive layer 4.
Specifically, as Figure 1-3, support 1 include plastic cement substrate 11, the metal substrate 12 in plastic cement substrate 11,
Plastic cement baffle plate 13, reflective plastic layer 14.Metal substrate 12 is etching copper sheet, and etching copper sheet includes chip rest area 121, positive electrode
Area 122 and negative electrode region 123.Preferably, positive electrode region 121 and negative electrode region 122 are respectively arranged on the two of chip rest area 121
Side.Preferably, etch silver coated on the surface of copper sheet.In the present embodiment, the size of positive electrode region 122 and negative electrode region 123
For 0.3 millimeter × 0.1 millimeter.Reflective plastic layer 14 is coated on the surrounding on the surface of plastic cement substrate 11 with bowl shape, forms support bowl
Cup.The number of plastic cement baffle plate 13 is at least one, and plastic cement baffle plate 13 is on metal substrate 12.Specifically, 13, plastic cement baffle plate
In on chip rest area 121, positive electrode region 122 and negative electrode region 123.Plastic cement baffle plate 13 and reflective plastic layer 14, are formed at least
Two independent bowls.Therefore, the brightness between multiple LED chips 2 will not interact, while can be used for making adjustable color temperature
LED packagings.In the present embodiment, the quantity of plastic cement baffle plate 13 is 1, and plastic cement baffle plate 13 is located at chip rest area 121, just
On the axial line of electrode district 122 and negative electrode region 123, two independent bowls are formed with reflective plastic layer 14.Plastic cement baffle plate 13
Height and support bowl it is highly consistent.The thickness of plastic cement baffle plate 13 is 0.2-0.5 millimeters.
As Figure 1-3, reflective plastic layer 14 is also coated on chip rest area 121, positive electrode region 122 and negative electrode region
The surface of metal substrate 12 and the outer surface of chip rest area 121 between 123.Preferably, reflective plastic layer 14 is white reflection
Plastic layer.In the present embodiment, the thickness of reflective plastic layer 14 of coating and the part surface of metal substrate 12 is 0.05 millimeter.A kind of band
There are the LED packagings of more glasss of supports, in addition to reflector layer 15, reflective plastic layer 14 of the reflector layer 15 inside support bowl
Surface.By increasing the surface area of reflective plastic layer 14, and the surface of reflective plastic layer 14 inside support bowl is set instead
Photosphere 15, increase the reflecting effect that LED packagings are prepared by the present invention, so as to which the present invention has raising light efficiency, increase photochromic
The advantages of effect.
As shown in Fig. 4-6 and 8-9, two LED chips 2 are fixed on chip placement area 121, a same positive electrode region 122
With negative electrode region 123, the area of metal substrate 12 is reduced.As Figure 4-Figure 6, LED chip 2 is fixed on chip rest area 121；
Two LED chips 2 are electrically connected by electric connection line 3 with positive electrode region 122 and negative electrode region 123 respectively, two LED chip parallel connections
Connection, form circuit loop.As Figure 8-9, LED chip 2 is fixed on chip rest area 121；One of LED chip 2 is logical
Cross electric connection line 3 to electrically connect with chip rest area 121 and positive electrode region 122, another LED chip 2 passes through electric connection line 3 and core
Piece rest area 121 and negative electrode region 123 are electrically connected, and two LED chips 2 are connected in series, and form circuit loop.Fluorescent adhesive layer 3 with
Heat cure form coats LED chip 2 and electric connection line 3 completely.
It is corresponding, present embodiment discloses a kind of technological process of preparation method of LED packagings 100 as shown in fig. 7,
This method comprises the following steps：
S10：Metal substrate 12 is fixed in plastic cement substrate 11；
S11：12 etched processing of metal substrate, form chip rest area 121, positive electrode region 122 and negative electrode region 123；
S12：Silver is plated on the surface of chip rest area 121, positive electrode region 122 and negative electrode region 123 by electroplating technology
Layer；
S20：Plastic cement baffle plate 13 is made on metal substrate 12；
S30：Surrounding on the surface of plastic cement substrate 11 makes the reflective plastic layer 14 of bowl shape；
S31：Metallic substrate surfaces 12 and core between chip rest area 121, positive electrode region 122 and negative electrode region 123
The circumferential surface of piece rest area 121 coats reflective plastic layer 14；
S32：Reflector layer 15 is made on the surface of reflective plastic layer 14 of the inside of support bowl；
S40：LED chip 2 is fixed on chip rest area 121；LED chip 2 by electric connection line 3 and chip rest area 121,
Positive electrode region 123 or negative electrode region 123 electrically connect, and form circuit loop；
S50：LED chip and electric connection line 3 are coated completely with fluorescent adhesive layer 4, are packaged into LED packagings 100.
Wherein, in step S20, plastic cement baffle plate 13 is made using injection or Molding techniques；In the step S30
In step S31, reflective plastic layer 14 is made using injection or Molding techniques；In step s 32, reflector layer 15 uses
The technique that Mask adds spraying.
Embodiment 2
Present embodiment discloses another LED packagings with more glasss of supports, in structure, itself and the institute of embodiment 1
The difference for the LED packagings 100 stated is：
In the present embodiment, as shown in Figure 10, the quantity of the plastic cement baffle plate 13 of support 1 is 2, and plastic cement baffle plate 13 is located at core
On piece rest area 121, positive electrode region 122 and negative electrode region 123, three independent bowls are formed with reflective plastic layer 14.
Another other structures of LED packagings with more glasss of supports of the present embodiment and preparation method thereof and embodiment
1 is identical, will not be repeated here.
A kind of other contents of LED packagings with more glasss of supports of the present invention and preparation method thereof are referring to existing
Technology.
The above described is only a preferred embodiment of the present invention, any formal limitation not is done to the present invention, therefore
All contents without departing from technical solution of the present invention, the technical spirit according to the present invention any are simply repaiied to made for any of the above embodiments
Change, equivalent variations and modification, in the range of still falling within technical solution of the present invention.
Claims (10)
1. a kind of LED packagings with more glasss of supports, including LED chip, support, electric connection line, fluorescent adhesive layer, its feature
It is, the support includes plastic cement substrate, the metal substrate in the plastic cement substrate, plastic cement baffle plate, reflective plastic layer；
The reflective plastic layer is coated on the surrounding of the plastic cement substrate surface with bowl shape, forms support bowl；
The number of the plastic cement baffle plate is at least one, and the plastic cement baffle plate is on the metal substrate；The plastic cement baffle plate
With the reflective plastic layer, at least two independent bowls are formed.
A kind of 2. LED packagings with more glasss of supports according to claim 1, it is characterised in that the plastic cement gear
The height of plate is highly consistent with the support bowl.
A kind of 3. LED packagings with more glasss of supports according to claim 1, it is characterised in that the Metal Substrate
Plate is etching copper sheet；The etching copper sheet includes chip rest area, positive electrode region and negative electrode region.
A kind of 4. LED packagings with more glasss of supports according to claim 3, it is characterised in that the reflective modeling
Glue-line is also placed coated on the metallic substrate surfaces between the chip rest area, positive electrode region and negative electrode region and the chip
Area's outer surface.
5. a kind of LED packagings with more glasss of supports according to claim 3, the plastic cement baffle plate are located at the core
On piece rest area, positive electrode region and negative electrode region.
6. a kind of LED packagings with more glasss of supports according to claim 3, plated on the surface of the etching copper sheet
There is silver layer.
7. a kind of LED packagings with more glasss of supports according to claim 4, it is characterised in that also including reflective
Layer, reflective plastic cement layer surface of the reflector layer inside the support bowl.
8. a kind of preparation method of the LED packagings with more glasss of supports, it is characterised in that comprise the following steps：
S10：Metal substrate is fixed in plastic cement substrate；
S20：Plastic cement baffle plate is made on the metal substrate；
S30：The reflective plastic layer of bowl shape is made in the surrounding of the plastic cement substrate surface；
S40：The LED chip is fixed on the chip rest area；The LED chip is placed by electric connection line and the chip
Area, positive electrode region or negative electrode region electrical connection, form circuit loop；
S50：Coat the LED chip and the electric connection line completely with fluorescent adhesive layer, be packaged into LED packagings.
A kind of 9. preparation method of LED packagings with more glasss of supports according to claim 8, it is characterised in that
After step slo with it is further comprising the steps of before step S20：
S11：The etched processing of metal substrate, form chip rest area, positive electrode region and negative electrode region；
S12：Silver layer is plated on the surface of the chip rest area, positive electrode region and negative electrode region by electroplating technology.
A kind of 10. preparation method of LED packagings with more glasss of supports according to claim 8, it is characterised in that
It is further comprising the steps of after step S30 and before step S40：
S31：Metallic substrate surfaces and the chip rest area between the chip rest area, positive electrode region and negative electrode region
Circumferential surface coats the reflective plastic layer；
S32：Reflective plastic cement layer surface in the inside of the support bowl makes reflector layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710846261.9A CN107482101A (en) | 2017-09-18 | 2017-09-18 | A kind of LED packagings with more glasss of supports and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710846261.9A CN107482101A (en) | 2017-09-18 | 2017-09-18 | A kind of LED packagings with more glasss of supports and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107482101A true CN107482101A (en) | 2017-12-15 |
Family
ID=60585487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710846261.9A Pending CN107482101A (en) | 2017-09-18 | 2017-09-18 | A kind of LED packagings with more glasss of supports and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107482101A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111192949A (en) * | 2020-01-14 | 2020-05-22 | 华域视觉科技(上海)有限公司 | Vehicle lamp light source component and packaging method thereof |
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