CN103904191A - LED packaging substrate and LED packaging structure - Google Patents
LED packaging substrate and LED packaging structure Download PDFInfo
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- CN103904191A CN103904191A CN201210576631.9A CN201210576631A CN103904191A CN 103904191 A CN103904191 A CN 103904191A CN 201210576631 A CN201210576631 A CN 201210576631A CN 103904191 A CN103904191 A CN 103904191A
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- 239000000758 substrate Substances 0.000 title claims abstract description 115
- 238000004806 packaging method and process Methods 0.000 title abstract 4
- 239000003292 glue Substances 0.000 claims abstract description 22
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims description 6
- 238000003491 array Methods 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims 3
- 238000009826 distribution Methods 0.000 abstract description 49
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 12
- 229910052782 aluminium Inorganic materials 0.000 abstract description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 12
- 229910052802 copper Inorganic materials 0.000 abstract description 12
- 239000010949 copper Substances 0.000 abstract description 12
- 229910052751 metal Inorganic materials 0.000 abstract description 12
- 239000002184 metal Substances 0.000 abstract description 12
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 230000004907 flux Effects 0.000 description 32
- 238000010586 diagram Methods 0.000 description 24
- 238000000354 decomposition reaction Methods 0.000 description 13
- 239000004411 aluminium Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 7
- 238000005286 illumination Methods 0.000 description 7
- 230000011514 reflex Effects 0.000 description 6
- 239000004954 Polyphthalamide Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229920006375 polyphtalamide Polymers 0.000 description 3
- 230000014509 gene expression Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED packaging substrate and an LED packaging structure adopting the substrate. The substrate in the invention is of metal (such as aluminum, copper) or ceramic material, an upper surface of the substrate is provided with a reflective structure and a chip slot, the reflective structure of the upper surface of the substrate is reflected as two segments of disconnected arc-shaped structures in a top view, the chip slot is used for placing an LED chip and filling fluorescent glue, and the reflective structure is located outside the chip slot; and the reflective structure of the upper surface of the substrate adjusts the direction of a portion of light through reflection, further adjusts spatial light intensity distribution, thereby decreasing beam angles of some directions, or enabling light to lean to one side, and light color uniformity of light spots can be improved.
Description
Technical field
The present invention relates to LED lighting technical field, relate in particular to a kind of LED package substrates, and adopt the LED encapsulating structure of this substrate.
Background technology
In recent years along with the rise of worldwide energy-conservation concept, the general illumination technology of application white light LEDs has obtained fast development, especially the street lamp application field of illumination out of doors, more than white light LEDs list lamp source efficiency laboratory level using blue-light LED chip as excitaton source has reached 200lm/W, and general application level on market has also exceeded 120lm/W, considerably beyond the light efficiency of common energy-saving lamp, and along with white light LEDs technology is applied more and more widely in general illumination market, luminous efficiency to white light LED part and the requirement of luminescent quality are also more and more higher.
LED encapsulating structure (referring to Fig. 1-3) in prior art, comprise: rack body 1, substrate 2, LED chip 5, fluorescent glue 6, in rack body, there is metal (as aluminium, copper etc.) or ceramic bases 2, substrate 2 upper surfaces are planes, LED chip is arranged on substrate 2 upper surfaces 21, and fluorescent glue 6 is coated on the upper surface 21 of substrate 2 and wraps up LED chip 5.
The luminous light intensity spatial distribution of LED encapsulating structure can adopt C-planar system to describe, C-planar system be a kind of conventional measurement and light source is described or light fixture spatial light intensity distribute coordinate system, this system can be used in the luminosity measurement of LED light source or light fixture.The spatial light intensity of measuring and describe LED light source or light fixture under C-planar system distributes, and light distribution is generally described by distribution curve flux; Distribution curve flux is under polar coordinate system or rectangular coordinate system, the corresponding light intensity value of all angles in certain the luminous intensity distribution plane marking, and depict the curve that light intensity value changes with angle; What people generally paid close attention to and analyzed is the distribution curve flux in C0-C180 and these two luminous intensity distribution planes of C90-C270; From distribution curve flux figure, the distribution curve flux in these two planes can overlap, and can be also diverse; The angle that we define the left side of 0 degree angle line in distribution curve flux figure is that the angle on the right side of positive-angle (representing with "+"), 0 degree angle line is negative angle (representing with "-"), distribution curve flux in so each plane can be symmetrical expression (symmetrical with respect to 0 degree angle line), can be also (asymmetric with respect to 0 degree angle line left and right) of asymmetric.Value that can reading optical beam angle from distribution curve flux, the angle value that the beam angle that we define distribution curve flux in certain luminous intensity distribution plane turns over while going to the angle line of 50% largest light intensity for: the angle value+largest light intensity angle line dextrorotation turning over when largest light intensity angle line is rotated counterclockwise the angle line to 50% largest light intensity on beam angle=distribution curve flux.In addition, in order to express easily, we will be called C0-C180 cross section with the face of C0-C180 luminous intensity distribution planes overlapping in LED encapsulating structure, are called C90-C270 cross section with the face of C90-C270 luminous intensity distribution planes overlapping, and C0-C180 cross section and C90-270 cross section are as the cutaway view plane of LED encapsulating structure.
Referring to Fig. 4, Figure 37, Fig. 4 is the distribution curve flux schematic diagram of LED encapsulating structure in prior art, and Figure 37 is the light key diagram of LED encapsulating structure in prior art; As can be seen from the figure in prior art, the C0-180 distribution curve flux of LED encapsulating structure and C90-270 distribution curve flux are identical, and are all symmetrical expressions, and light is towards certain direction directional illumination, or not in certain set of regions; In addition, the light at wide-angle region (being greater than 160 degree) that the LED encapsulating structure of prior art sends is partially yellow, and the light of low-angle (being less than 30 degree) is partially blue, therefore cause its hot spot edge generally to there is partially yellow aperture, and spot center has partially blue region, hot spot is photochromic inhomogeneous.
Summary of the invention
For optimizing prior art means, an object of the present invention is to provide a kind of LED package substrates, adjust with the trend to light, make light towards certain direction directional illumination or light in certain set of regions, improve the photochromic uniformity of hot spot simultaneously.
Another object of the present invention is to provide a kind of LED encapsulating structure that adopts above-mentioned substrate.
For achieving the above object, the invention provides following technical scheme:
A kind of LED package substrates, upper surface of substrate has chip groove, and chip groove outside is provided with reflective structure, and this reflective structure is presented as two sections of arcuate structures that do not join in top view (vertical view).Substrate can be metal (as aluminium, copper) or ceramic material.
Described chip groove is suprabasil groove, and its bottom surface is lower than upper surface of substrate, and its edge is higher than upper surface of substrate, trickles to other regions in substrate to prevent the fluorescent glue of filling in chip groove from exceeding chip groove region; Between the edge of chip groove and reflective structure, form two sections of spaces or be considered as two sections of grooves the two is separated; Chip groove is oval, its major axis on C0-180 cross section, minor axis on C90-270 cross section, the basal region of short-axis direction can reserve sufficient room reflective structure is set, and reflects with the light to region.
Described suprabasil reflective structure is presented as two sections of arcuate structures in top view; Two sections of arcuate structures are about C0-180 cross section symmetry in top view, and the two corresponding central angle can be that equate or unequal; And two sections of arcuate structures corresponding central angle in top view is all less than 180 degree, two sections of arcuate structures are not join mutually.
The radian of two sections of arcuate structures is limited to chip trough rim edge and substrate edge, and from top view, the top profile of reflective structure, the arc of bottom profile, with chip groove elliptical center and the substrate center of circle, be generally concentric; " arc length " changeable (its corresponding central angle is 90 degree, 45 degree etc., but is less than 180 degree) of reflective structure in the present invention; The outer edge of reflective structure bottom profile generally overlaps with substrate edge, and the curvature of the arc of its inside edge or radius of curvature are limited to chip trough rim edge, are first concentric with chip groove, then change with chip channel profiles; Reflective structure top profile outer edge overlaps with substrate edge in top view, and its inside edge is concentric with outer edge, and curvature or the radius of curvature of the arc of inside edge change along with the top thickness of reflective structure.
Described suprabasil reflective structure is presented as rectangle structure in C0-180 sectional view, or the arc-shaped structure that has peak and reduce gradually to both sides height in the middle of being presented as.
Described suprabasil reflective structure is presented as symmetrical or asymmetrical bowl cup-shaped structure in C90-270 sectional view, and its side wall profile is the linear pattern of arc or inclination.
Suprabasil reflective structure has reflex to light projected thereon, by reflection, the trend of a part of light is adjusted, and then adjust spatial light intensity distribution, and especially can dwindle by reflection the beam angle of subregion light beam, can improve the photochromic uniformity of hot spot simultaneously.
LED encapsulating structure of the present invention, comprise one or more above-mentioned substrates, rack body, LED chip, fluorescent glue, described substrate is installed in rack body, rack body is metal (as aluminium, copper) material or ceramic material or PPA (polyphthalamide) material, described LED chip is positioned in the chip groove of described substrate, and described fluorescent glue covers described LED chip and is filled in described chip groove.
In above-mentioned rack body, can comprise multiple substrates, composition substrate array.
A kind of LED encapsulating structure of the present invention, substrate can be direct forming in rack body, with the inseparable structure of rack body, rack body and substrate are metal (as aluminium, copper) material or ceramic material.
Compared with prior art, technique scheme has the following advantages:
LED package substrates provided by the present invention and the LED encapsulating structure that comprises this substrate, can realize light towards certain direction directional illumination or light in certain set of regions, the photochromic uniform illuminating effect of hot spot simultaneously.
Brief description of the drawings
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the schematic three dimensional views of LED encapsulating structure in prior art;
Fig. 2 is the STRUCTURE DECOMPOSITION figure of LED encapsulating structure in prior art;
Fig. 3 is the schematic three dimensional views of LED encapsulating structure rack body in prior art;
Fig. 4 is the distribution curve flux schematic diagram of LED encapsulating structure in prior art;
The schematic three dimensional views of the LED encapsulating structure that Fig. 5 provides for the embodiment of the present invention one;
The STRUCTURE DECOMPOSITION figure of the LED encapsulating structure that Fig. 6 provides for the embodiment of the present invention one;
The schematic three dimensional views of the LED encapsulating structure rack body that Fig. 7 provides for the embodiment of the present invention one;
The local enlarged diagram of substrate in the LED encapsulating structure that Fig. 8 provides for the embodiment of the present invention one;
The top view of the LED encapsulating structure rack body that Fig. 9 provides for the embodiment of the present invention one;
The C0-180 sectional view of the LED encapsulating structure rack body that Figure 10 provides for the embodiment of the present invention one;
The C90-270 sectional view (a bowl cup sidewall profile is arc) of the LED encapsulating structure rack body that Figure 11 a provides for the embodiment of the present invention one;
The C90-270 sectional view (a bowl cup sidewall profile is linear pattern) of the LED encapsulating structure rack body that Figure 11 b provides for the embodiment of the present invention one;
The affect schematic diagram of reflective structure side wall profile height change on light distribution (beam angle) in the LED encapsulating structure that Figure 12 provides for the embodiment of the present invention one;
The schematic three dimensional views of the LED encapsulating structure that Figure 13 provides for the embodiment of the present invention two;
The STRUCTURE DECOMPOSITION figure of the LED encapsulating structure that Figure 14 provides for the embodiment of the present invention two;
The schematic three dimensional views of the LED encapsulating structure rack body that Figure 15 provides for the embodiment of the present invention two;
The local enlarged diagram of substrate in the LED encapsulating structure that Figure 16 provides for the embodiment of the present invention two;
The top view of the LED encapsulating structure rack body that Figure 17 provides for the embodiment of the present invention two;
The C0-180 sectional view of the LED encapsulating structure rack body that Figure 18 provides for the embodiment of the present invention two;
The C90-270 sectional view of the LED encapsulating structure rack body that Figure 19 provides for the embodiment of the present invention two;
The schematic three dimensional views of the LED encapsulating structure that Figure 20 provides for the embodiment of the present invention three;
The STRUCTURE DECOMPOSITION figure of the LED encapsulating structure that Figure 21 provides for the embodiment of the present invention three;
The schematic three dimensional views of the LED encapsulating structure rack body that Figure 22 provides for the embodiment of the present invention three;
The local enlarged diagram of substrate in the LED encapsulating structure that Figure 23 provides for the embodiment of the present invention three;
The top view of the LED encapsulating structure rack body that Figure 24 provides for the embodiment of the present invention three;
The C0-180 sectional view of the LED encapsulating structure rack body that Figure 25 provides for the embodiment of the present invention three;
The C90-270 sectional view of the LED encapsulating structure rack body that Figure 26 provides for the embodiment of the present invention three;
The distribution curve flux schematic diagram of the LED encapsulating structure that Figure 27 provides for the embodiment of the present invention one, two, three;
The schematic three dimensional views of the LED encapsulating structure that Figure 28 provides for the embodiment of the present invention four;
The STRUCTURE DECOMPOSITION figure of the LED encapsulating structure that Figure 29 provides for the embodiment of the present invention four;
The schematic three dimensional views of the LED encapsulating structure rack body that Figure 30 provides for the embodiment of the present invention four;
The local enlarged diagram of substrate in the LED encapsulating structure that Figure 31 provides for the embodiment of the present invention four;
The top view of the LED encapsulating structure rack body that Figure 32 provides for the embodiment of the present invention four;
The C0-180 sectional view of the LED encapsulating structure rack body that Figure 33 provides for the embodiment of the present invention four;
The C90-270 sectional view of the LED encapsulating structure rack body that Figure 34 provides for the embodiment of the present invention four;
The distribution curve flux schematic diagram of the LED encapsulating structure that Figure 35 provides for the embodiment of the present invention four;
The affect schematic diagram of reflective structure side wall profile height change on light distribution (beam angle) in the LED encapsulating structure that Figure 36 provides for the embodiment of the present invention four;
Figure 37 is the light key diagram of LED encapsulating structure in prior art;
The light key diagram of the LED encapsulating structure that Figure 38 provides for the embodiment of the present invention one;
The schematic three dimensional views of the LED encapsulating structure that Figure 39 provides for the embodiment of the present invention five;
The STRUCTURE DECOMPOSITION figure of the LED encapsulating structure that Figure 40 provides for the embodiment of the present invention five;
The schematic three dimensional views of the LED encapsulating structure rack body that Figure 41 provides for the embodiment of the present invention five;
The top view of the LED encapsulating structure rack body that Figure 42 provides for the embodiment of the present invention five;
The schematic three dimensional views of the LED encapsulating structure that Figure 43 provides for the embodiment of the present invention six;
The STRUCTURE DECOMPOSITION figure of the LED encapsulating structure that Figure 44 provides for the embodiment of the present invention six;
The schematic three dimensional views of the LED encapsulating structure rack body that Figure 45 provides for the embodiment of the present invention six;
The top view of the LED encapsulating structure rack body that Figure 46 provides for the embodiment of the present invention six.
There is shown: 1-rack body, 2-substrate, 21-upper surface of substrate, 3-reflective structure, 4-chip groove, 5-LED chip, 6-fluorescent glue, 7-C0-180 cross section, 8-C90-270 cross section.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
A lot of details are set forth in the following description so that fully understand the present invention, but the present invention can also adopt other to be different from alternate manner described here and implement, those skilled in the art can do similar popularization without prejudice to intension of the present invention in the situation that, and therefore the present invention is not subject to the restriction of following public specific embodiment.
Secondly, the present invention is described in detail in conjunction with schematic diagram, in the time that the embodiment of the present invention is described in detail in detail; for ease of explanation; represent that the profile of device architecture can disobey general ratio and do local amplification, and described schematic diagram is example, it should not limit the scope of protection of the invention at this.In addition in actual fabrication, should comprise, the three-dimensional space of length, width and height.
Embodiment mono-:
With reference to figure 5, Fig. 6, Fig. 7, Fig. 8, the schematic three dimensional views of the LED encapsulating structure that Fig. 5 provides for the embodiment of the present invention one, the STRUCTURE DECOMPOSITION figure of the LED encapsulating structure that Fig. 6 provides for the embodiment of the present invention one, the schematic three dimensional views of the LED encapsulating structure rack body that Fig. 7 provides for the embodiment of the present invention one, the local enlarged diagram of substrate in the LED encapsulating structure that Fig. 8 provides for the embodiment of the present invention one, as can be seen from the figure, the LED encapsulating structure that embodiment mono-provides comprises rack body 1, substrate 2, LED chip 5, fluorescent glue 6, in rack body 1, there is substrate 2, substrate 2 is that metal is (as aluminium, copper) or ceramic material, in substrate 2 with reflective structure 3 and chip groove 4, chip groove 4 is oval-shaped, be used for placing LED chip 5 and fill fluorescent glue 6, the edge of chip groove 4 exceeds substrate 2 upper surfaces 21, trickle to prevent the fluorescent glue 6 of 4 li of fillings of chip groove from exceeding chip groove 4 regions to other regions in substrate 2, between chip groove 4 and reflective structure 3, there are two sections of spaces, or be considered as two sections of grooves the two is separated.
With reference to figure 9, the top view of the LED encapsulating structure rack body that Fig. 9 provides for the embodiment of the present invention one; As can be seen from the figure, the reflective structure 3 in substrate 2 is presented as two sections of arcuate structures in top view, and two sections of arcuate structures are about C0-180 cross section symmetry in top view, and the two corresponding central angle is all 90 degree, and two sections of arcuate structures are not join mutually; Chip groove 4 is oval-shaped, its major axis on C0-180 cross section, minor axis is on C90-270 cross section.With reference to Figure 10, Figure 11 a, Figure 11 b, the C0-180 sectional view of the LED encapsulating structure rack body that Figure 10 provides for the embodiment of the present invention one, as can be seen from the figure, the reflective structure 3 in substrate 2 is presented as rectangle structure (seeing Figure 10) in C0-180 sectional view; Reflective structure 3 in substrate 2 is presented as symmetrical bowl cup-shaped structure in C90-270 sectional view, and its side wall profile is that (see Figure 11 a), arc curvature can have larger variation with reflective structure height change to arc; The side wall profile of bowl cup-shaped structure can be also that (see Figure 11 b), its slope can have larger variation with reflective structure height change to linear pattern.
In order to study in the reflective structure that is presented as symmetrical bowl cup-shaped structure in C90-270 sectional view, the impact of reflective structure side wall profile height change on light distribution (beam angle), we pass judgment on the effect of reflective structure height optimization with the beam angle numerical value of reading on C90-270 distribution curve flux, we can set an optimized effect in advance, it is a desired value (not being the smaller the better, depending on actual conditions) of beam angle.Referring to Figure 12, the affect schematic diagram of reflective structure side wall profile height change on light distribution (beam angle) in the LED encapsulating structure that Figure 12 provides for the embodiment of the present invention one.By finding out in Figure 12, reflective structure height is higher, is that reading optical beam angle is less on C90-270 distribution curve flux, illustrates that reflecting effect is more obvious, and the effect of shrinking light beam is more obvious.
Embodiment bis-:
With reference to Figure 13, Figure 14, Figure 15, Figure 16, the schematic three dimensional views of the LED encapsulating structure that Figure 13 provides for the embodiment of the present invention two, the STRUCTURE DECOMPOSITION figure of the LED encapsulating structure that Figure 14 provides for the embodiment of the present invention two, the schematic three dimensional views of the LED encapsulating structure rack body that Figure 15 provides for the embodiment of the present invention two, the local enlarged diagram of substrate in the LED encapsulating structure that Figure 16 provides for the embodiment of the present invention two; As can be seen from the figure, the LED encapsulating structure that embodiment bis-provides comprises rack body 1, substrate 2, LED chip 5, fluorescent glue 6, in rack body 1, there is substrate 2, substrate 2 is metal (as aluminium, copper) or ceramic material, in substrate 2, with reflective structure 3 and chip groove 4, chip groove 4 is oval-shaped, for placing LED chip 5 and filling fluorescent glue 6, the edge of chip groove 4 exceeds substrate 2 upper surfaces 21, between chip groove 4 and reflective structure 3, has two sections of grooves that the two is separated.
With reference to Figure 17, the top view of the LED encapsulating structure rack body that Figure 17 provides for the embodiment of the present invention two; As can be seen from the figure, the reflective structure 3 in substrate 2 is presented as two sections of arcuate structures in top view, and two sections of arcuate structures are about C0-180 cross section symmetry in top view, and the two corresponding central angle is all 90 degree, and two sections of arcuate structures are not join mutually; Chip groove 4 is oval-shaped, its major axis on C0-180 cross section, minor axis is on C90-270 cross section.
With reference to Figure 18, Figure 19, the C0-180 sectional view of the LED encapsulating structure rack body that Figure 18 provides for the embodiment of the present invention two, the C90-270 sectional view of the LED encapsulating structure rack body that Figure 19 provides for the embodiment of the present invention two; As can be seen from the figure, the arc-shaped structure that has peak and reduce gradually to both sides height in the middle of reflective structure 3 in substrate 2 is presented as in C0-180 sectional view, in this structure and C0-180 cross section, be that rectangular structure is distinguished to some extent, it is more that it can make the light of zone line be subject to reflective structure reflection, and the reflex that is subject to reflective structure to two side areas reduces.Reflective structure 3 in substrate 2 is presented as symmetrical bowl cup-shaped structure in C90-270 sectional view, and its side wall profile is arc.
Embodiment tri-:
With reference to Figure 20, Figure 21, Figure 22, Figure 23, the schematic three dimensional views of the LED encapsulating structure that Figure 20 provides for the embodiment of the present invention three, the STRUCTURE DECOMPOSITION figure of the LED encapsulating structure that Figure 21 provides for the embodiment of the present invention three, the schematic three dimensional views of the LED encapsulating structure rack body that Figure 22 provides for the embodiment of the present invention three, the local enlarged diagram of substrate in the LED encapsulating structure that Figure 23 provides for the embodiment of the present invention three; As can be seen from the figure, the LED encapsulating structure that embodiment tri-provides comprises rack body 1, substrate 2, LED chip 5, fluorescent glue 6, in rack body 1, there is substrate 2, substrate 2 is metal (as aluminium, copper) or ceramic material, in substrate 2, with reflective structure 3 and chip groove 4, chip groove 4 is oval-shaped, for placing LED chip 5 and filling fluorescent glue 6, the edge of chip groove 4 exceeds substrate 2 upper surfaces 21, between chip groove 4 and reflective structure 3, has two sections of grooves that the two is separated.
With reference to Figure 24, the top view of the LED encapsulating structure rack body that Figure 24 provides for the embodiment of the present invention three; As can be seen from the figure, reflective structure 3 in substrate 2 is presented as two sections of arcuate structures in top view, and two sections of arcuate structures are about C0-180 cross section symmetry in top view, and the two corresponding central angle is unequal, be respectively 90 degree and 45 degree, two sections of arcuate structures are not join mutually; Chip groove 4 is oval-shaped, its major axis on C0-180 cross section, minor axis is on C90-270 cross section.
With reference to Figure 25, Figure 26, the C0-180 sectional view of the LED encapsulating structure rack body that Figure 25 provides for the embodiment of the present invention three, the C90-270 sectional view of the LED encapsulating structure rack body that Figure 26 provides for the embodiment of the present invention three; As can be seen from the figure, the reflective structure 3 in substrate 2 is presented as rectangle structure in C0-180 sectional view; Reflective structure 3 in substrate 2 is presented as symmetrical bowl cup-shaped structure in C90-270 sectional view, and its side wall profile is arc.
With reference to Figure 27, Figure 38, the distribution curve flux schematic diagram of the LED encapsulating structure that Figure 27 provides for the embodiment of the present invention one, two, three, the light key diagram of the LED encapsulating structure that Figure 38 provides for the embodiment of the present invention one; As can be seen from the figure, C0-180 distribution curve flux and C90-270 distribution curve flux are not identical, C0-180 distribution curve flux beam angle is 160 degree, and C90-270 distribution curve flux beam angle is 150 degree, this is because substrate 2 upper surface reflective structures 3 have reflex to light projected thereon, and then adjust spatial light intensity distribution, dwindle C90-270 distribution curve flux beam angle; Meanwhile, the light of wide-angle (being greater than 160 degree) is partially yellow, can arrive smaller angle region the partially blue light mixing in region therewith to this part light reflection, thereby can improve the photochromic uniformity of hot spot by the reflex of reflective structure 3.
Embodiment tetra-:
With reference to Figure 28, Figure 29, Figure 30, Figure 31, the schematic three dimensional views of the LED encapsulating structure that Figure 28 provides for the embodiment of the present invention four, the STRUCTURE DECOMPOSITION figure of the LED encapsulating structure that Figure 29 provides for the embodiment of the present invention four, the schematic three dimensional views of the LED encapsulating structure rack body that Figure 30 provides for the embodiment of the present invention four, the local enlarged diagram of substrate in the LED encapsulating structure that Figure 31 provides for the embodiment of the present invention four; As can be seen from the figure, the LED encapsulating structure that embodiment tetra-provides comprises rack body 1, substrate 2, LED chip 5, fluorescent glue 6, in rack body 1, there is substrate 2, substrate 2 is metal (as aluminium, copper) or ceramic material, in substrate 2, with reflective structure 3 and chip groove 4, chip groove 4 is oval-shaped, for placing LED chip 5 and filling fluorescent glue 6, the edge of chip groove 4 exceeds substrate 2 upper surfaces 21, between chip groove 4 and reflective structure 3, has two sections of grooves that the two is separated.
With reference to Figure 32, the top view of the LED encapsulating structure rack body that Figure 32 provides for the embodiment of the present invention four; As can be seen from the figure, the reflective structure 3 in substrate 2 is presented as two sections of arcuate structures in top view, and two sections of arcuate structures are about C0-180 cross section symmetry in top view, and the two corresponding central angle is all 90 degree, and two sections of arcuate structures are not join mutually; Chip groove 4 is oval-shaped, its major axis on C0-180 cross section, minor axis is on C90-270 cross section.
With reference to Figure 33, Figure 34, the C0-180 sectional view of the LED encapsulating structure rack body that Figure 33 provides for the embodiment of the present invention four, the C90-270 sectional view of the LED encapsulating structure rack body that Figure 34 provides for the embodiment of the present invention four; As can be seen from the figure the arc-shaped structure that, the reflective structure 3 in substrate 2 has peak and reduces gradually to both sides height in the middle of being presented as in C0-180 sectional view; Reflective structure 3 in substrate 2 is presented as asymmetrical bowl cup-shaped structure in C90-270 sectional view, and its side wall profile is arc.
With reference to Figure 35, the distribution curve flux schematic diagram of the LED encapsulating structure that Figure 35 provides for the embodiment of the present invention four; As can be seen from the figure, C0-180 distribution curve flux and C90-270 distribution curve flux are not identical, C0-180 distribution curve flux beam angle is 160 degree, and C90-270 distribution curve flux is asymmetric, its beam angle is 150 degree, and this is because reflective structure 3 in substrate 2 has reflex to light projected thereon, and then adjusts spatial light intensity distribution, make light towards the favourable side projection of illumination, and dwindled C90-270 distribution curve flux beam angle; , can adjust the trend of wide-angle region light by the reflex of reflective structure 3 meanwhile, thereby can improve the photochromic uniformity of hot spot, its principle is with consistent shown in Figure 38.
In order to study in the reflective structure 3 that is presented as asymmetrical bowl cup-shaped structure in C90-270 sectional view, the impact of side wall profile height change on light distribution (beam angle), we pass judgment on the effect of reflective structure height optimization with the beam angle numerical value of reading on C90-270 distribution curve flux, we can set an optimized effect in advance, it is a desired value (not being the smaller the better, depending on actual conditions) of beam angle.Referring to Figure 36, the affect schematic diagram of reflective structure side wall profile height change on light distribution (beam angle) in the LED encapsulating structure that Figure 36 provides for the embodiment of the present invention four.By finding out in Figure 36, reflective structure left and right sides wall difference in height is larger, and on C90-270 distribution curve flux, largest light intensity angle or drift angle are also larger, and light is more concentrated to a highly low side so.
Embodiment five:
With reference to Figure 39, Figure 40, Figure 41, Figure 42, the schematic three dimensional views of the LED encapsulating structure that Figure 39 provides for the embodiment of the present invention five, the STRUCTURE DECOMPOSITION figure of the LED encapsulating structure that Figure 40 provides for the embodiment of the present invention five, the schematic three dimensional views of the LED encapsulating structure rack body that Figure 41 provides for the embodiment of the present invention five, the top view of the LED encapsulating structure rack body that Figure 42 provides for the embodiment of the present invention five; As can be seen from the figure, the LED encapsulating structure that embodiment five provides comprises rack body 1, substrate 2, LED chip 5, fluorescent glue 6, rack body 1 is metal (as aluminium, copper) material or ceramic material, in rack body 1, have 2, nine substrates of nine substrates 2 and be direct forming in rack body 1, with the inseparable array of structures of rack body 1; Substrate 2 is metal (as aluminium, copper) or ceramic material, in each substrate 2 with reflective structure 3 and chip groove 4, chip groove 4 is oval-shaped, be used for placing LED chip 5 and fill fluorescent glue 6, the edge of chip groove 4 exceeds substrate 2 upper surfaces 21, between chip groove 4 and reflective structure 3, has two sections of grooves that the two is separated.Wherein, the structure of each substrate 2 and light principle are with identical described in embodiment mono-.
Embodiment six:
With reference to Figure 43, Figure 44, Figure 45, Figure 46, the schematic three dimensional views of the LED encapsulating structure that Figure 43 provides for the embodiment of the present invention six, the STRUCTURE DECOMPOSITION figure of the LED encapsulating structure that Figure 44 provides for the embodiment of the present invention six, the schematic three dimensional views of the LED encapsulating structure rack body that Figure 45 provides for the embodiment of the present invention six, the top view of the LED encapsulating structure rack body that Figure 46 provides for the embodiment of the present invention six; As can be seen from the figure, the LED encapsulating structure that embodiment six provides comprises rack body 1, substrate 2, LED chip 5, fluorescent glue 6, rack body 1 is PPA material, and in rack body 1, having 2, nine substrates 2 of nine substrates is the arrays that are installed in rack body 1; Substrate 2 is metal (as aluminium, copper) or ceramic material, in each substrate 2 with reflective structure 3 and chip groove 4, chip groove 4 is oval-shaped, be used for placing LED chip 5 and fill fluorescent glue 6, the edge of chip groove 4 exceeds substrate 2 upper surfaces 21, between chip groove 4 and reflective structure 3, has two sections of grooves that the two is separated.Wherein, the structure of each substrate 2 and light principle are with identical described in embodiment mono-.
To the above-mentioned explanation of the disclosed embodiments, make professional and technical personnel in the field can realize or use the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiment, General Principle as defined herein can, in the situation that not departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention will can not be restricted to embodiment illustrated herein, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (15)
1. a LED package substrates, described upper surface of substrate has chip groove, and described chip groove outside is provided with reflective structure, and the top view of described reflective structure is presented as two sections of arcuate structures that do not join.
2. LED package substrates as claimed in claim 1, is characterized in that: two sections of arcuate structures of described reflective structure are about C0-180 cross section symmetry, and the two corresponding central angle equates.
3. LED package substrates as claimed in claim 1, is characterized in that: two sections of arcuate structures of described reflective structure are asymmetrical about C0-180 cross section, and the two corresponding central angle is unequal.
4. LED package substrates as claimed in claim 2 or claim 3, is characterized in that: the central angle corresponding to two sections of arcuate structures of described reflective structure is all less than 180 degree.
5. LED package substrates as claimed in claim 1, is characterized in that: two sections of arcuate structures of described reflective structure are all presented as rectangle in C0-180 sectional view.
6. LED package substrates as claimed in claim 1, is characterized in that: the circular arc that has peak and reduce gradually to both sides height in the middle of two sections of arcuate structures of described reflective structure are all presented as in C0-180 sectional view.
7. LED package substrates as claimed in claim 1, is characterized in that: two sections of arcuate structures of described reflective structure are presented as that in C90-270 sectional view symmetrical bowl is cup-shaped, and the side wall profile of described bowl cup is the linear pattern of arc or inclination.
8. LED package substrates as claimed in claim 1, is characterized in that: two sections of arcuate structures of described reflective structure are presented as that in C90-270 sectional view asymmetrical bowl is cup-shaped, and the side wall profile of described bowl cup is the linear pattern of arc or inclination.
9. LED package substrates as claimed in claim 1, is characterized in that: described chip groove has the edge that exceeds upper surface of substrate, forms two sections of grooves between the edge of described chip groove and described reflective structure.
10. LED package substrates as claimed in claim 1, is characterized in that: the top view of described chip groove is for oval, its major axis on C0-180 cross section, minor axis is on C90-270 cross section.
11. LED package substrates as claimed in claim 1, is characterized in that: described reflective structure reflects light projected thereon.
12. 1 kinds of LED encapsulating structures, comprise one or more substrates as described in as arbitrary in claim 1 to 11, with rack body, LED chip, fluorescent glue, described substrate is installed in described rack body, described LED chip is positioned in the chip groove of described substrate, and described fluorescent glue covers described LED chip and is filled in described chip groove.
13. LED encapsulating structures as claimed in claim 12, is characterized in that, described substrate is metal material or ceramic material, and described rack body is metal material, ceramic material or PPA material.
14. LED encapsulating structures as claimed in claim 12, is characterized in that, comprise multiple substrates, described multiple substrate composition substrate arrays.
15. LED encapsulating structures as described in as arbitrary in claim 12-14, is characterized in that, described substrate direct forming is in rack body, inseparable with rack body, and described rack body and substrate are metal material or ceramic material.
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| CN108843988A (en) * | 2018-06-04 | 2018-11-20 | 广州共望贸易有限公司 | A kind of LED package substrates and LED encapsulation structure |
| CN110594712A (en) * | 2019-08-29 | 2019-12-20 | 深圳市芯联电股份有限公司 | LED packaging substrate and LED packaging structure |
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| CN103904191B (en) | 2016-09-28 |
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