CN202796943U - SMDLED white lamp - Google Patents
SMDLED white lamp Download PDFInfo
- Publication number
- CN202796943U CN202796943U CN2012204187808U CN201220418780U CN202796943U CN 202796943 U CN202796943 U CN 202796943U CN 2012204187808 U CN2012204187808 U CN 2012204187808U CN 201220418780 U CN201220418780 U CN 201220418780U CN 202796943 U CN202796943 U CN 202796943U
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- CN
- China
- Prior art keywords
- smdled
- reflection
- hole
- pedestal
- white
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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Abstract
The utility model relates to an SMDLED white lamp, and helps to solve problems of the prior art that chips packaged inside a bowl-shaped cup are liable to interfere with each other and are high in junction temperature so as to cause high white light decay and poor color consistency, and the luminous efficiency is low because the chips absorb light wave energy from each other. The SMDLED white lamp comprises a pedestal. A bowl-shaped cup hole is arranged on the pedestal. Pins are arranged inside the pedestal. A separation plate is disposed inside the bowl-shaped cup hole to divide the bowl-shaped cup hole into two reflection holes. Each reflection hole is provided with a light emitting chip. Fluorescent glue of different kinds is respectively packaged inside the two reflection holes. The advantages of the SMDLED white lamp are that the adoption of a separated structure helps to prevent interference of light wave energy absorption among the light emitting chips, enables the junction temperature of the chips to be lowered, enables heat dissipation to be improved, allows white light decay to be low, helps to prevent the fluorescent glue from absorbing energy of the light emitting chips, and enables the luminous efficiency to be improved; and the reflection holes are distributed in a more compact manner, so that the area of the pedestal is reduced and the size of the LED lamp is smaller.
Description
Technical field
The utility model relates to a kind of LED luminescence technology, especially relate to a kind of junction temperature little, avoided between the luminescence chip disturbing, the life-span is longer, light efficiency is better, the white lamp of the SMDLED of separate type.
Background technology
Because the white lamp of traditional SMD LED only has a bowl cup, only encapsulate blue wafer, the luminous yellow fluorescent powder that excites of blue chip produces gold-tinted like this, so that blue light mixes the generation white light according to a certain percentage with gold-tinted, this white light only contains blue light and gold-tinted, spectrum is single, owing to only have a kind of blue chip, color rendering is poor.Or in same bowl cup, encapsulate simultaneously blue red crystalline substance and improve color rendering, this kind packing forms all is encapsulated in the same fluorescent colloid owing to blue red wafer, because blue red chip all is potted in the same bowl cup by fluorescent glue, two kinds of chips are lighted simultaneously, each other all can heat production, the phase mutual interference, junction temperature can be higher than independent encapsulation, chip can absorb light-wave energy each other, the energy that simultaneously fluorescent glue also can absorptive red light, can cause like this light efficiency on the low side, because heat dissipation problem can cause red white light light decay deviation large, cause photochromic unanimously causing property very poor.Be 200920206360.1 such as the patent No., name is called the Chinese utility model patent of a kind of full-color SMD LED, comprise support, chip, gold thread, PPA plastic plate and the chip of gold thread connection bracket, wherein be provided with border circular areas on the PPA plastic plate surface, the chip yi word pattern is arranged in the border circular areas, the encapsulation glue with chip package on the PPA of support plastic plate.This patent all is encapsulated in chip in the border circular areas exactly, so just has above-mentioned shortcoming, chip each other all can heat production, the phase mutual interference, it is high that junction temperature is wanted, and chip can absorb light-wave energy each other, can cause like this light efficiency on the low side, because heat dissipation problem can cause white light light decay deviation large, cause photochromic consistency very poor in addition.
Summary of the invention
The utility model mainly be solve phase mutual interference between there is chip package in prior art in a bowl cup the chip, junction temperature high, cause large, the photochromic consistency of white light light decay poor, and absorption light-wave energy each other between the chip, cause the low technical problem of light efficiency, provide a kind of junction temperature little, avoided between the luminescence chip disturbing, longer, the white lamp of the better SMDLED of light efficiency of life-span.
Above-mentioned technical problem of the present utility model is mainly solved by following technical proposals: the white lamp of a kind of SMDLED, comprise pedestal, be provided with bowl cup hole at pedestal upper surface, be provided with pin in the pedestal, be provided with some luminescence chips in bottom, bowl cup hole, be provided with demarcation strip in described bowl cup hole, demarcation strip is separated into two reflection holes with bowl cup hole, in reflection hole, be respectively arranged with luminescence chip, and in two reflection holes, be packaged with respectively different fluorescent glues.The utility model luminescence chip install to adopt separate type, and this demarcation strip is yi word pattern, and is horizontal in the middle of bowl cup hole, and bowl cup hole is divided into monosymmetric reflection hole, and like this so that the reflection hole distribution is compacter, conserve space has more reduced the volume of LED lamp.Luminescence chip independently is arranged in each reflection hole and encapsulates separately, avoided like this absorbing between the luminescence chip the each other interference of light-wave energy, reduced the junction temperature of chip, improved thermal diffusivity, so that white light light decay deviation is little, also avoid simultaneously fluorescent glue to the absorption of the energy of the luminescence chip light that need not the fluorescent glue encapsulation, improved light efficiency.Adopt dividing plate that setting is separated in bowl cup hole, so that each reflection hole distribution is compacter, greatly reduced the area of pedestal, so that the LED lamp body is long-pending less, has satisfied the higher LED display of pixel and made requirement.
As a kind of preferred version, described pin is provided with two, and two pins reveal respectively to put in two reflection holes and form pad, and described luminescence chip is separately positioned on the pad of two reflection holes bottoms.
As a kind of preferred version, described luminescence chip is blue chip.
As a kind of preferred version, be packaged with yellow fluorescent glue in the described reflection hole, be packaged with warm white fluorescent glue in another reflection hole.Encapsulation yellow fluorescent glue in the reflection hole, under luminous the exciting of blue chip, can send out separately white light positive, and the warm white fluorescent glue of another launch hole encapsulation issues the warm colour white light in luminous the exciting of blue chip, so just realizes that the white light of different-colour section is realized mixed light at single packaging body.
As a kind of preferred version, described two luminescence chips are connected with power supply unit separately, form two independently circuit.Two luminescence chips are to encapsulate respectively, and circuit is two autonomous channels, can realize the light modulation toning on a packaging body.
As a kind of preferred version, the hole that bowl cup Kong Weisi bar arc-shaped side consists of.This is used for arranging luminescence chip so that the general circular port of bowl cup boring ratio wants large so that bowl cup hole can be separated out more reflection hole.
As a kind of preferred version, the face of described demarcation strip both sides is the inclined-plane.So that the reflection hole light extraction efficiency after separating is higher.
Therefore, the utility model advantage is: adopt separate type 1., avoided absorbing between the luminescence chip the each other interference of light-wave energy, reduced the junction temperature of chip, improved thermal diffusivity, so that white light light decay deviation is little, also avoided simultaneously the absorption of fluorescent glue to the energy of luminescence chip light, improved light efficiency; 2. so that each reflection hole distribution is compacter, greatly reduced the area of pedestal, so that the LED lamp body is long-pending less, has satisfied the higher LED display of pixel and made requirement.
Description of drawings
Accompanying drawing 1 is the not front a kind of structural representation of sealing of the utility model;
Accompanying drawing 2 is a kind of structural representations after the utility model sealing.
1-pedestal 2-pin 3-bowl cup hole 4-demarcation strip 5-luminescence chip 6-yellow fluorescent glue 7-warms up white fluorescent glue 8-reflection hole.
Embodiment
Below by embodiment, and by reference to the accompanying drawings, the technical solution of the utility model is described in further detail.
Embodiment:
The white lamp of a kind of SMDLED of present embodiment, as depicted in figs. 1 and 2, it includes a pedestal 1, and this pedestal is made by the PPA material, is provided with bowl cup hole 3 in the middle of this pedestal upper surface, and for area increased, this bowl cup hole is the hole body with four arc-shaped side structures.
Be provided with two pins 2 in pedestal, expose respectively in the pedestal both sides at these pin two ends, forms anodal pin and negative pole pin, and pin exposes on top, bottom, bowl cup hole and divides the pad that forms for luminescence chip 5 is installed.
Also be provided with the demarcation strip 4 of an in-line in bowl cup hole, this demarcation strip and pedestal are made into integration, and demarcation strip is divided into two symmetrical reflection holes 8 with bowl cup hole, and in order to improve light extraction efficiency, the demarcation strip both sides are designed to ramp structure.Article two, the pad of pin formation lays respectively at two reflection holes bottoms, luminescence chip comprises two blue chips, two blue chips are installed in respectively on the pad of two launch hole bottoms, blue chip is anodal to be connected with the pin positive terminal, and the blue chip negative pole is connected on the negative pole end of pin by gold thread.Two blue chips are connected with power supply unit separately, form two independently circuit, can regulate through the electric current of each luminescence chip, and this is so that the LED lamp can be realized the light modulation toning.
As shown in Figure 2, in a reflection hole, be packaged with yellow fluorescent glue 6, and in another reflection hole, be packaged with warm white fluorescent glue 7.Blue chip independent excitation yellow fluorescent glue and warm white fluorescent glue produce just white and warm in vain light like this, have realized like this mixed light, owing to add the composition of warm white in the positive white light, obtain the white light of higher colour developing.Present embodiment adopts separate type, avoided absorbing between the luminescence chip the each other interference of light-wave energy, reduced the junction temperature of chip, improved thermal diffusivity, so that white light light decay deviation is little, also avoid simultaneously fluorescent glue to the absorption of the energy of the luminescence chip light that need not the fluorescent glue encapsulation, improved light efficiency; 2. so that each reflection hole distribution is compacter, greatly reduced the area of pedestal, so that the LED lamp body is long-pending less, has satisfied the higher LED display of pixel and made requirement.
Specific embodiment described herein only is to the explanation for example of the utility model spirit.The utility model person of ordinary skill in the field can make various modifications or replenishes or adopt similar mode to substitute described specific embodiment, but can't depart from spirit of the present utility model or surmount the defined scope of appended claims.
Although this paper has more used the terms such as pedestal, bowl cup hole, reflection hole, pin, demarcation strip, do not get rid of the possibility of using other term.Using these terms only is in order to describe more easily and explain essence of the present utility model; They are construed to any additional restriction all is contrary with the utility model spirit.
Claims (7)
1. white lamp of SMDLED, comprise pedestal, be provided with bowl cup hole at pedestal upper surface, be provided with pin in the pedestal, be provided with some luminescence chips in bottom, bowl cup hole, it is characterized in that: be provided with demarcation strip (4) in described bowl cup hole (3), demarcation strip is separated into two reflection holes (8) with bowl cup hole, in reflection hole, be respectively arranged with luminescence chip (5), and in two reflection holes, be packaged with respectively different fluorescent glue (6).
2. the white lamp of a kind of SMDLED according to claim 1 is characterized in that described pin (2) is provided with two, and two pins reveal respectively to put in two reflection holes and form pad, and described luminescence chip is separately positioned on the pad of two reflection holes bottoms.
3. the white lamp of a kind of SMDLED according to claim 2 is characterized in that described luminescence chip (9) is blue chip.
4. according to claim 1 and 2 or the white lamp of 3 described a kind of SMDLED, it is characterized in that in a described reflection hole (8), being packaged with yellow fluorescent glue, be packaged with warm white fluorescent glue in another reflection hole (8).
5. according to claim 1 and 2 or the white lamp of 3 described a kind of SMDLED, it is characterized in that described two luminescence chips (5) are connected with power supply unit separately, form two independently circuit.
6. according to claim 1 and 2 or the white lamp of 3 described a kind of SMDLED, it is characterized in that the holes that four arc-shaped sides in position, bowl cup hole (3) consist of.
7. according to claim 2 or the white lamp of 3 described separate type tunable optical patch SMD LED, it is characterized in that the face of described demarcation strip (4) both sides is the inclined-plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012204187808U CN202796943U (en) | 2012-08-22 | 2012-08-22 | SMDLED white lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012204187808U CN202796943U (en) | 2012-08-22 | 2012-08-22 | SMDLED white lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202796943U true CN202796943U (en) | 2013-03-13 |
Family
ID=47824146
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012204187808U Expired - Fee Related CN202796943U (en) | 2012-08-22 | 2012-08-22 | SMDLED white lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202796943U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104613337A (en) * | 2014-09-23 | 2015-05-13 | 深圳市三浦半导体有限公司 | Double-color LED lamp bead and lamp set |
-
2012
- 2012-08-22 CN CN2012204187808U patent/CN202796943U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104613337A (en) * | 2014-09-23 | 2015-05-13 | 深圳市三浦半导体有限公司 | Double-color LED lamp bead and lamp set |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130313 Termination date: 20210822 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |