CN206098435U - Full zhou faguang LED of two -sided encapsulation - Google Patents
Full zhou faguang LED of two -sided encapsulation Download PDFInfo
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- CN206098435U CN206098435U CN201621096508.7U CN201621096508U CN206098435U CN 206098435 U CN206098435 U CN 206098435U CN 201621096508 U CN201621096508 U CN 201621096508U CN 206098435 U CN206098435 U CN 206098435U
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- printing opacity
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- opacity support
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Abstract
The utility model discloses a full zhou faguang LED of two -sided encapsulation. Including first printing opacity support, second printing opacity support and chip, be equipped with first slot on first printing opacity support, be equipped with the second slot on second printing opacity support, be filled with the viscose at first slot and the intussuseption of second slot, first printing opacity support and second printing opacity support pass through the viscose and connect, be equipped with first depressed part on first lens support, be equipped with first pad in first depressed part, be equipped with on the first pad the chip, be equipped with the second depressed part on second lens support, be equipped with the second pad in the second depressed part, be equipped with on the second pad the chip, upper and lower chip dislocation set. The utility model discloses inorganic encapsulation can be realized, and full zhou faguang can be realized.
Description
Technical field
The utility model is related to LED.
Background technology
Because LED has the advantages that low small volume, power consumption, life-span length, environmental protection, present LED is widely used.
Existing 360 ° of luminous LED are a lot, such as in the patent document that Chinese Patent Application No. is 201310368523.7
In disclose a kind of 360 ° of luminous LED components, including for the fixed support for supporting LED chip, by the both positive and negative polarity of LED chip
The pin of extraction, and encapsulate the shaping glue of whole support and part pin；Pin is located at the two ends of support, and and support assorted
Form the support frame of whole LED component；Support is triangular prism structure, and LED chip is divided into three groups, and the three of support are pasted on respectively
Individual outer surface.The structure, compared with conventional LED chip, its surface area is bigger, and radiating is more preferable；Shaping glue encapsulate whole support and
After the pin of part, a structure with rotational symmetry is formed, the structure causes LED component luminous in 360 ° of space uniforms.
But the device needs encapsulated moulding glue, realized using the structure of triangular prism all-round luminous.
In addition, existing filament is typically also 360 ° of luminous devices, its basic structure is：Including substrate, in substrate
Two sides is respectively mounted chip, and the wrapping and encapsulating glue on substrate and chip.
Device above substantially needs packing colloid, and the light that chip sends is most of by colloid injection, and device exists
After longer use time, easily there is the phenomenon such as yellow side, aging in colloid, affects light.
The content of the invention
It is all-round emitting led that the purpose of this utility model is to provide a kind of double-faced packaging, using LED of the present utility model, energy
Inorganic encapsulated is realized, and can be realized all-round luminous.
To reach above-mentioned purpose, a kind of double-faced packaging is all-round emitting led, including the first printing opacity support, the second printing opacity support
And chip；First groove is provided near edge on the upper surface of the first printing opacity support, on the lower surface of the second printing opacity support
Second groove is provided near edge, viscose glue is filled with first groove, viscose glue, the first printing opacity are filled with second groove
Frame and the second printing opacity support are connected by viscose glue；Set in the region that first groove is surrounded in the upper surface of the first lens carrier
There is the first depressed part, the first pad is provided with the first depressed part, the first pad is provided with described chip, is located at the first pad
On the upper surface of chip be less than or flush in the upper surface of the first printing opacity support；The is located in the lower surface of the second lens carrier
The second depressed part is provided with the region that two grooves are surrounded, the second pad is provided with the second depressed part, the second pad is provided with institute
The chip stated, the lower surface of the chip being located on the second pad is higher than or flushes in the lower surface of the second printing opacity support；Positioned at
Chip on one pad is with the chip on the second pad in the plane that the first printing opacity support is combined with the second printing opacity support
Shift to install.
Above-mentioned LED, is packaged chip by the first printing opacity support, the second printing opacity support and viscose glue, it is not necessary in core
Packing colloid on piece, described viscose glue is inorganic silica gel or waterglass, it is thereby achieved that inorganic encapsulated.It is saturating due to being located at first
Chip on light support and the second printing opacity support is shifted to install, therefore, most of light that the chip on the first printing opacity support sends
Project from the second printing opacity support, most of light that the chip on the second printing opacity support sends is projected from the first printing opacity support, chip
Part light project from the side of the first printing opacity support and the second printing opacity support, the most of light for changing chip is projected from colloid
Go out light mode, realize a kind of new all-round luminous LED structure.Because chip is shifted to install, therefore, going out light is not in
The phenomenon of interference.Using manufacture craft of the present utility model, it is not necessary to packing colloid, therefore, simplify manufacture craft.
Further, described first groove is first annular groove, and described second groove is the second ring-shaped groove.This
Sample, can realize fully sealing chip.
Further, the first described depressed part includes first recessed groove being parallel to each other of more than two, per one the
The chip of more than two is provided with one recessed groove；The second described depressed part includes second depression being parallel to each other of more than two
Groove, is provided with the chip of more than two in per one second recessed groove.
Further, the plane that the first recessed groove is combined in the first printing opacity support with the second recessed groove with the second printing opacity support
On shift to install.
Further, the first recessed groove and the second recessed groove are in the vertical direction against setting.
Further, the first electrode storage tank that the bottom processing of the first printing opacity support is communicated with first through hole, the
First electrode is provided with one electrode storage tank, the second electrode that the top processing of the second printing opacity support is communicated with the second through hole is housed
Groove, in second electrode storage tank second electrode is provided with, by the top in the bottom of the first printing opacity support and the second printing opacity support
First electrode storage tank and second electrode storage tank are respectively equipped with, and are divided in first electrode storage tank and second electrode storage tank
First electrode and second electrode are not provided with, directly electrode layer is provided with printing opacity support when being welded so as to be effectively prevented
There are problems that electrode layer holds caducous.
Description of the drawings
Fig. 1 is the all-round emitting led schematic diagram of the double-faced packaging of embodiment 1.
Fig. 2 is A-A sectional views in Fig. 1.
Fig. 3 is B-B sectional views in Fig. 1.
Fig. 4 is the schematic diagram of the printing opacity support of embodiment 1 first.
Fig. 5 is the schematic diagram of the chip on the first printing opacity support of embodiment 1.
Fig. 6 is the schematic diagram of the printing opacity support of embodiment 1 second.
Fig. 7 is the all-round emitting led schematic diagram of the double-faced packaging of embodiment 2.
Fig. 8 is C-C sectional views in Fig. 7.
Fig. 9 is D-D sectional views in Fig. 7.
Figure 10 is the schematic diagram of the printing opacity support of embodiment 2 first.
Figure 11 is the schematic diagram of the chip on the first printing opacity support of embodiment 2.
Figure 12 is the schematic diagram of the printing opacity support of embodiment 2 second.
Specific embodiment
The utility model is further elaborated with reference to the accompanying drawings and detailed description.
Embodiment 1.
As shown in Figure 1 to Figure 3, double-faced packaging is all-round emitting led including the first printing opacity support 1, the second printing opacity support 2 and core
Piece 3.
In the present embodiment, the first printing opacity support 1 is fluorescence ceramics support or clear glass support.Such as Fig. 4 and Fig. 5 institutes
Show, be provided with first groove 11 near edge on the upper surface of the first printing opacity support 1, first groove 11 is first annular groove.
Viscose glue 4 is filled with first annular groove, described viscose glue 4 is inorganic silica gel or waterglass.In the upper of the first lens carrier 1
Surface is located in the region that first groove 11 is surrounded and is provided with the first depressed part, and in the present embodiment, the first depressed part is by three phases
Mutually the first parallel recessed groove 12 is constituted, and is provided with first pad 13 of more than two in per one first recessed groove 12, and same the
Connected by the first electric connection layer 14 between adjacent first pad in one recessed groove 12.In the upper surface of the first printing opacity support 1
Positioned at first groove 15 that is respectively arranged at two ends with of the first recessed groove 12, the first groove connects all of first recessed groove 12.
Be provided with the first printing opacity support 1 communicate with the two ends of the first recessed groove be passed into the bottom of the first printing opacity support 1
First through hole 16, be machined with first electrode layer in the bottom of the first printing opacity support 1, first electrode layer can be by saturating first
The bottom direct plating upper electrode layer of light support 1 is realized, in the present embodiment, by leading to first in the processing of the bottom of the first printing opacity support 1
The first electrode storage tank 17 that hole 16 communicates, in first electrode storage tank 17 first electrode 52 is provided with.In first through hole 16
The first electrical connector 51 being electrically connected with first pad at the first recessed groove two ends is provided with, the first electrical connector is electrically connected for first
Connect post.The electric binding post of first electrode 52 and first is electrically connected with.
Chip 3 is installed on the first pad 13, the upper surface of the chip being located on the first pad 13 is less than or flushes in
The upper surface of the first printing opacity support 1.
In the present embodiment, the second printing opacity support 2 is fluorescence ceramics support or clear glass support.As shown in fig. 6,
Second groove 21 is provided near edge on the lower surface of two printing opacity supports 2, second groove 21 is the second ring-shaped groove.In the second ring
Viscose glue 4 is filled with shape groove, described viscose glue 4 is inorganic silica gel or waterglass.It is located in the lower surface of the second lens carrier 2
The second depressed part is provided with the region that second groove 21 is surrounded, in the present embodiment, the second depressed part is parallel to each other by two
Second recessed groove 22 is constituted, and second pad 23 of more than two, same second recessed groove are provided with per 2 second recessed grooves 22
Connected by the second electric connection layer 24 between adjacent second pad in 22.Second is located in the lower surface of the second printing opacity support 2
Recessed groove 22 is respectively arranged at two ends with the second groove 25, and the second groove connects all of second recessed groove 22.
Be provided with the second printing opacity support 2 communicate with the two ends of the second recessed groove be passed into the top of the second printing opacity support 2
The second through hole, be machined with the second electrode lay at the top of the second printing opacity support 2, the second electrode lay can be by the second printing opacity
The top direct plating upper electrode layer of support, in the present embodiment, by being provided with and the second through hole phase at the top of the second printing opacity support 2
Logical second electrode storage tank, in second electrode storage tank second electrode is provided with.It is provided with the second through hole and the second recessed groove
The second electrical connector that second pad at two ends is electrically connected with, the second electrical connector is the second electric binding post.Second electrode and the
Two electric binding posts are electrically connected with.
Chip is installed on the second pad 23, the lower surface of the chip being located on the second pad 23 is less than or flushes in the
The lower surface of two printing opacity supports 2.
First printing opacity support 1 and the second printing opacity support 2 are connected by viscose glue, and chip is sealed in into the first printing opacity support 1
In the second printing opacity support 2.Chip on the first pad 13 is with the chip being located on the second pad in the first printing opacity support
Shift to install in the plane combined with the second printing opacity support.In the present embodiment, as shown in Figures 2 and 3, the first recessed groove and
Two recessed grooves are parallel to each other, and the first recessed groove 12 is combined in the first printing opacity support 1 with the second recessed groove 22 with the second printing opacity support 2
Plane on shift to install.
The all-round emitting led preparation method of above-mentioned double-faced packaging is：
（1）In upper surface processing first groove 11, the first recessed groove 12 and first groove 15 of the first printing opacity support 1, the
The first through hole 16 for being passed into the bottom of the first printing opacity support 1 communicated with the first depressed part is processed on one printing opacity support 1, first
The first electrode storage tank 17 that the bottom processing of printing opacity support 1 is communicated with first through hole.
（2）In lower surface processing second groove 21, the second recessed groove 22 and second groove 25 of the second printing opacity support 2, the
The second through hole for being passed into the second printing opacity cradle top communicated with the second depressed part is processed on two printing opacity supports 2, it is saturating second
The second electrode storage tank that the top processing of light support is communicated with the second through hole.
（3）Arrange in the first recessed groove 12 in first pad 13 and the first electric connection layer 14, first through hole 16 and arrange the
One electric-conductor 51, arranges first electrode 52 in first electrode storage tank 17,；Second pad is set in the second recessed groove 22
23rd, the second electric connection layer 24, arranges the second electric-conductor in the second through hole, and in second electrode storage tank second electrode is arranged.
（4）The chip 3 on the first pad 13, the chip 3 on the second pad 23.
（5）The filling viscose glue 4 in first groove 11, the filling viscose glue 4 in second groove 21.
（6）The first printing opacity support 1 and the second printing opacity support 2 are linked together by viscose glue.
Above-mentioned LED, is packaged chip 3 by the first printing opacity support 1, the second printing opacity support 2 and viscose glue 4, it is not necessary to
The packing colloid on chip 3, described viscose glue is inorganic silica gel or waterglass, it is thereby achieved that inorganic encapsulated.Due to being located at
Chip on one printing opacity support 1 and the second printing opacity support 2 is shifted to install, therefore, it is big that the chip on the first printing opacity support 1 sends
Part light is projected from the second printing opacity support 2, and most of light that the chip on the second printing opacity support 2 sends is from the first printing opacity support 1
Project, the part light of chip is projected from the side of the first printing opacity support 1 and the second printing opacity support 2, changes the major part of chip
Light goes out light mode from what colloid was projected, realizes a kind of new all-round luminous LED structure.Because chip is shifted to install, therefore,
Go out the phenomenon that light is not in interference.Using manufacture craft of the present utility model, it is not necessary to packing colloid, therefore, simplify system
Make technique.
Embodiment 2.
As shown in Figure 7 to 9, double-faced packaging is all-round emitting led including the first printing opacity support 1, the second printing opacity support 2 and core
Piece 3.
In the present embodiment, the first printing opacity support 1 is fluorescence ceramics support or clear glass support.Such as Figure 10 and Figure 11 institutes
Show, be provided with first groove 11 near edge on the upper surface of the first printing opacity support 1, first groove 11 is first annular groove.
Viscose glue 4 is filled with first annular groove, described viscose glue 4 is inorganic silica gel or waterglass.In the upper of the first lens carrier 1
Surface is located in the region that first groove 11 is surrounded and is provided with the first depressed part, and in the present embodiment, the first depressed part is by three phases
Mutually the first parallel recessed groove 12 is constituted, and is provided with first pad 13 of more than two in per one first recessed groove 12, and same the
Connected by the first electric connection layer 14 between adjacent first pad in one recessed groove 12.In the upper surface of the first printing opacity support 1
Positioned at first groove 15 that is respectively arranged at two ends with of the first recessed groove 12, the first groove connects all of first recessed groove 12.
Be provided with the first printing opacity support 1 communicate with the two ends of the first recessed groove be passed into the bottom of the first printing opacity support 1
First through hole 16, be machined with first electrode layer in the bottom of the first printing opacity support 1, first electrode layer can be by saturating first
The bottom direct plating upper electrode layer of light support 1 is realized, in the present embodiment, by leading to first in the processing of the bottom of the first printing opacity support 1
The first electrode storage tank 17 that hole 16 communicates, in first electrode storage tank 17 first electrode 52 is provided with.In first through hole 16
The first electrical connector 51 being electrically connected with first pad at the first recessed groove two ends is provided with, the first electrical connector is electrically connected for first
Connect post.The electric binding post of first electrode 52 and first is electrically connected with.
Chip 3 is installed on the first pad 13, the upper surface of the chip being located on the first pad 13 is less than or flushes in
The upper surface of the first printing opacity support 1.
In the present embodiment, the second printing opacity support 2 is fluorescence ceramics support or clear glass support.As shown in figure 12, exist
Second groove 21 is provided near edge on the lower surface of the second printing opacity support 2, second groove 21 is the second ring-shaped groove.Second
Viscose glue 4 is filled with ring-shaped groove, described viscose glue 4 is inorganic silica gel or waterglass.In the lower surface position of the second lens carrier 2
The second depressed part is provided with the region that second groove 21 is surrounded, in the present embodiment, the second depressed part is parallel to each other by three
The second recessed groove 22 constitute, second pad 23 of more than two is provided with per 2 second recessed grooves 22, same second is recessed
Connected by the second electric connection layer 24 between adjacent second pad in groove 22.The is located in the lower surface of the second printing opacity support 2
Two recessed grooves 22 are respectively arranged at two ends with the second groove 25, and the second groove connects all of second recessed groove 22.
Be provided with the second printing opacity support 2 communicate with the two ends of the second recessed groove be passed into the top of the second printing opacity support 2
The second through hole, be machined with the second electrode lay at the top of the second printing opacity support 2, the second electrode lay can be by the second printing opacity
The top direct plating upper electrode layer of support, in the present embodiment, by being provided with and the second through hole phase at the top of the second printing opacity support 2
Logical second electrode storage tank, in second electrode storage tank second electrode is provided with.It is provided with the second through hole and the second recessed groove
The second electrical connector that second pad at two ends is electrically connected with, the second electrical connector is the second electric binding post.Second electrode and the
Two electric binding posts are electrically connected with.
Chip is installed on the second pad 23, the lower surface of the chip being located on the second pad 23 is less than or flushes in the
The lower surface of two printing opacity supports 2.
First printing opacity support 1 and the second printing opacity support 2 are connected by viscose glue, and chip is sealed in into the first printing opacity support 1
In the second printing opacity support 2.In the present embodiment, the first recessed groove and the second recessed groove align setting, in the vertical direction, position
The chip in the first recessed groove in same plane is shifted to install with the chip in the second recessed groove.
The all-round emitting led preparation method of above-mentioned double-faced packaging is：
（1）In upper surface processing first groove 11, the first recessed groove 12 and first groove 15 of the first printing opacity support 1, the
The first through hole 16 for being passed into the bottom of the first printing opacity support 1 communicated with the first depressed part is processed on one printing opacity support 1, first
The first electrode storage tank 17 that the bottom processing of printing opacity support 1 is communicated with first through hole.
（2）In lower surface processing second groove 21, the second recessed groove 22 and second groove 25 of the second printing opacity support 2, the
The second through hole for being passed into the second printing opacity cradle top communicated with the second depressed part is processed on two printing opacity supports 2, it is saturating second
The second electrode storage tank that the top processing of light support is communicated with the second through hole.
（3）Arrange in the first recessed groove 12 in first pad 13 and the first electric connection layer 14, first through hole 16 and arrange the
One electric-conductor 51, arranges first electrode 52 in first electrode storage tank 17,；Second pad is set in the second recessed groove 22
23rd, the second electric connection layer 24, arranges the second electric-conductor in the second through hole, and in second electrode storage tank second electrode is arranged.
（4）The chip 3 on the first pad 13, the chip 3 on the second pad 23.
（5）The filling viscose glue 4 in first groove 11, the filling viscose glue 4 in second groove 21.
（6）The first printing opacity support 1 and the second printing opacity support 2 are linked together by viscose glue.
Above-mentioned LED, is packaged chip 3 by the first printing opacity support 1, the second printing opacity support 2 and viscose glue 4, it is not necessary to
The packing colloid on chip 3, described viscose glue is inorganic silica gel or waterglass, it is thereby achieved that inorganic encapsulated.Due to being located at
Chip on one printing opacity support 1 and the second printing opacity support 2 is shifted to install, therefore, it is big that the chip on the first printing opacity support 1 sends
Part light is projected from the second printing opacity support 2, and most of light that the chip on the second printing opacity support 2 sends is from the first printing opacity support 1
Project, the part light of chip is projected from the side of the first printing opacity support 1 and the second printing opacity support 2, changes the major part of chip
Light goes out light mode from what colloid was projected, realizes a kind of new all-round luminous LED structure.Because chip is shifted to install, therefore,
Go out the phenomenon that light is not in interference.Using manufacture craft of the present utility model, it is not necessary to packing colloid, therefore, simplify system
Make technique.
Claims (6)
1. a kind of double-faced packaging is all-round emitting led, it is characterised in that：Including the first printing opacity support, the second printing opacity support and chip；
First groove is provided near edge on the upper surface of the first printing opacity support, near edge on the lower surface of the second printing opacity support
Second groove is provided with, viscose glue is filled with first groove, viscose glue, the first printing opacity support and second are filled with second groove
Printing opacity support is connected by viscose glue；It is recessed first to be provided with the upper surface of the first lens carrier in the region that first groove is surrounded
Sunken portion, is provided with the first pad in the first depressed part, and the first pad is provided with described chip, the chip being located on the first pad
Upper surface be less than or flush in the upper surface of the first printing opacity support；Enclose positioned at second groove in the lower surface of the second lens carrier
Into region in be provided with the second depressed part, be provided with the second pad in the second depressed part, the second pad is provided with described chip,
The lower surface of the chip being located on the second pad is higher than or flushes in the lower surface of the second printing opacity support；On the first pad
Chip is shifted to install with the chip on the second pad in the plane that the first printing opacity support is combined with the second printing opacity support.
2. double-faced packaging according to claim 1 is all-round emitting led, it is characterised in that：Described first groove is first
Ring-shaped groove, described second groove is the second ring-shaped groove.
3. double-faced packaging according to claim 1 is all-round emitting led, it is characterised in that：The first described depressed part includes
First recessed groove being parallel to each other of more than two, is provided with the chip of more than two in per one first recessed groove；Described
Two depressed parts include second recessed groove being parallel to each other of more than two, and the core of more than two is provided with per one second recessed groove
Piece.
4. double-faced packaging according to claim 3 is all-round emitting led, it is characterised in that：First recessed groove and the second depression
Groove is shifted to install in the plane that the first printing opacity support is combined with the second printing opacity support.
5. double-faced packaging according to claim 3 is all-round emitting led, it is characterised in that：First recessed groove and the second depression
Groove is in the vertical direction against setting.
6. double-faced packaging according to claim 1 is all-round emitting led, it is characterised in that：The bottom of the first printing opacity support
The first electrode storage tank that portion's processing is communicated with first through hole, is provided with first electrode, the second printing opacity in first electrode storage tank
The second electrode storage tank that the top processing of frame is communicated with the second through hole, in second electrode storage tank second electrode is provided with, and is passed through
First electrode storage tank is respectively equipped with the top of the bottom of the first printing opacity support and the second printing opacity support and second electrode is accommodating
Groove, and it is respectively equipped with first electrode and second electrode in first electrode storage tank and second electrode storage tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621096508.7U CN206098435U (en) | 2016-09-30 | 2016-09-30 | Full zhou faguang LED of two -sided encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621096508.7U CN206098435U (en) | 2016-09-30 | 2016-09-30 | Full zhou faguang LED of two -sided encapsulation |
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| Publication Number | Publication Date |
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| CN206098435U true CN206098435U (en) | 2017-04-12 |
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| Application Number | Title | Priority Date | Filing Date |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106299046A (en) * | 2016-09-30 | 2017-01-04 | 鸿利智汇集团股份有限公司 | A kind of double-faced packaging is all-round emitting led and manufacture method |
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2016
- 2016-09-30 CN CN201621096508.7U patent/CN206098435U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106299046A (en) * | 2016-09-30 | 2017-01-04 | 鸿利智汇集团股份有限公司 | A kind of double-faced packaging is all-round emitting led and manufacture method |
| CN106299046B (en) * | 2016-09-30 | 2018-09-11 | 鸿利智汇集团股份有限公司 | A kind of full light-emitting LED and production method of double-faced packaging |
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