CN202034410U - Packaging structure capable of improving LED luminance uniformity - Google Patents
Packaging structure capable of improving LED luminance uniformity Download PDFInfo
- Publication number
- CN202034410U CN202034410U CN2011200774057U CN201120077405U CN202034410U CN 202034410 U CN202034410 U CN 202034410U CN 2011200774057 U CN2011200774057 U CN 2011200774057U CN 201120077405 U CN201120077405 U CN 201120077405U CN 202034410 U CN202034410 U CN 202034410U
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- led
- led chip
- lens
- fluorescent powder
- powder layer
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Abstract
The utility model discloses a packaging structure capable of improving LED luminance uniformity, which comprises a base provided with a reflection cup. An LED chip is fixed to the bottom of the reflection cup, a lens is arranged on the top of the reflection cup, a fluorescent powder layer is arranged on the inner side of the lens, and an epoxy resin layer is arranged on the inner side wall of the fluorescent powder layer. Since the fluorescent powder layer is arranged on the inner wall of the LED lens and the epoxy resin layer is arranged on the inner side wall of the fluorescent powder layer, direct contact between fluorescent powder and the LED chip is avoided, precipitation caused by the fluorescent powder coating on the LED chip can be effectively avoided, and luminance uniformity of the fluorescent powder can be improved.
Description
Technical field
The utility model relates to the LED encapsulation technology, particularly a kind of encapsulating structure that improves the LED uniformity of luminance.
Background technology
LED is the english abbreviation of light-emitting diode (Light Emitting Diode), be called as the 4th generation lighting source or green light source, it has characteristics such as energy-saving and environmental protection, volume are little, long service life, therefore is widely used in fields such as various indications, demonstration, decoration, backlight, general lighting and urban landscape.
At present, the encapsulating structure of LED is very many, but great majority adopt following encapsulating structure, pedestal is provided with bowl-shape groove, the led chip correspondence is fixedly mounted on the bottom of bowl-shape groove, and is connected with the electrode of being located at outward on the pedestal, and in the rim of a bowl edge of the bowl-shape groove of pedestal lens is installed.In order to make led chip can produce needed white light, then need it to be excited by fluorescent material, the packaged type that adopts is that fluorescent material is mixed with silica gel usually, is filled in then in the bowl-shape groove of pedestal, and led chip is covered.But fluorescent material appears in this packaged type easily precipitates uneven phenomenon, and the amount of fluorescent material is wayward in practical operation, and apply also can be inhomogeneous, not only can cost of idleness, and also the light efficiency that excites is also inhomogeneous.
Summary of the invention
The purpose of this utility model is to provide a kind of encapsulating structure of the LED of raising uniformity of luminance, and this structure applies layer of fluorescent powder layer and epoxy resin layer by the package lens internal layer at LED, makes the LED illumination effect better, more even.
For achieving the above object, the utility model is mainly by the following technical solutions:
A kind of encapsulating structure that improves the LED uniformity of luminance, comprise pedestal (1), described pedestal (1) is provided with reflector (2), described reflector (2) bottom is fixed with led chip (5), the top is provided with lens (8), described lens (8) inboard is provided with phosphor powder layer (7), and this phosphor powder layer (7) madial wall is provided with epoxy resin layer (6).
Wherein said led chip (5) is fixed on reflector (2) bottom by heat conduction elargol (4).
Wherein said pedestal (1) is provided with electrode (3), and this electrode (3) is connected with above-mentioned led chip (5).
Compared with prior art, the utility model is provided with a phosphor powder layer by the inwall at the LED lens, at this phosphor powder layer madial wall an epoxy resin layer is set, thereby avoided fluorescent material to contact with the direct of led chip, the deposited phenomenon that can effectively avoid fluorescent material to be coated in led chip and produce has improved the uniformity that fluorescent material excites light efficiency.
Description of drawings
Fig. 1 is a structural representation of the present utility model.
Identifier declaration among the figure: pedestal 1, reflector 2, electrode 3, heat conduction elargol 4, led chip 5, epoxy resin layer 6, phosphor powder layer 7, lens 8.
Embodiment
For setting forth thought of the present utility model and purpose, the utility model is described further below in conjunction with the drawings and specific embodiments.
See also shown in Figure 1ly, Fig. 1 is a structural representation of the present utility model.The utility model provides a kind of encapsulating structure of the LED of raising uniformity of luminance, comprises pedestal 1, and pedestal 1 both sides are provided with electrode 3, and the top is provided with reflector 2, and the top of described reflector 2 is equipped with lens 8, and wherein these lens 8 adopt glass to make.
Center fixed has led chip 5 in the bottom of reflector 2, and this led chip 5 is fixed on the bottom of reflector 2 by heat conduction elargol 4; Lens 8 madial walls at the top of reflector 2 are provided with layer of fluorescent powder layer 7, and the madial wall of this phosphor powder layer 7 is provided with epoxy resin layer 6.
Wherein said pedestal 1 top electrode 3 is connected with above-mentioned led chip 5, and when led chip 5 was luminous, the light of generation entered into phosphor powder layer 7 through epoxy resin layer 6, by phosphor powder layer 7 it is excited, and is sent by lens 8 to produce uniform light.
By contrast as can be known, LED packaged type at present commonly used all is the surface that is coated in the LED wafer after fluorescent material and silica gel are mixed in proportion, or directly fluorescent material is coated in the LED surface, cover again afterwards and go up silica gel, its operation is more loaded down with trivial details, and cause the precipitation of fluorescent material easily, cause non-uniform light.The utility model is then directly made phosphor powder layer uniform excitation layer and lens and is combined, and directly contact with the direct of led chip inside for the mode phosphor powder layer simultaneously, also between led chip and phosphor powder layer, be provided with one deck epoxy resin layer, thereby led chip and phosphor powder layer are isolated the uneven phenomenon of optical excitation of avoiding phosphor powder layer that LED is sent.
More than the encapsulating structure of a kind of LED of raising uniformity of luminance described in the utility model is described in detail, used specific case herein principle of the present utility model and execution mode are set forth, above explanation just is used for helping to understand core concept of the present utility model; Simultaneously, for one of ordinary skill in the art, according to thought of the present utility model, the part that all can change in specific embodiments and applications, in sum, this description should not be construed as restriction of the present utility model.
Claims (3)
1. encapsulating structure that improves the LED uniformity of luminance, it is characterized in that comprising pedestal (1), described pedestal (1) is provided with reflector (2), described reflector (2) bottom is fixed with led chip (5), the top is provided with lens (8), described lens (8) inboard is provided with phosphor powder layer (7), and this phosphor powder layer (7) madial wall is provided with epoxy resin layer (6).
2. the encapsulating structure of raising LED uniformity of luminance according to claim 1 is characterized in that described led chip (5) is fixed on reflector (2) bottom by heat conduction elargol (4).
3. the encapsulating structure of raising LED uniformity of luminance according to claim 1 is characterized in that described pedestal (1) is provided with electrode (3), and this electrode (3) is connected with above-mentioned led chip (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200774057U CN202034410U (en) | 2011-03-22 | 2011-03-22 | Packaging structure capable of improving LED luminance uniformity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200774057U CN202034410U (en) | 2011-03-22 | 2011-03-22 | Packaging structure capable of improving LED luminance uniformity |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202034410U true CN202034410U (en) | 2011-11-09 |
Family
ID=44896698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200774057U Expired - Lifetime CN202034410U (en) | 2011-03-22 | 2011-03-22 | Packaging structure capable of improving LED luminance uniformity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202034410U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103247744A (en) * | 2012-02-09 | 2013-08-14 | 威士玻尔光电(苏州)有限公司 | Remote fluorescent powder and preparation method thereof |
| CN103271645A (en) * | 2013-06-03 | 2013-09-04 | 苏州原点工业设计有限公司 | Water dispenser capable of emitting light |
| CN106784260A (en) * | 2016-11-30 | 2017-05-31 | 深圳市聚飞光电股份有限公司 | A kind of preparation method of direct LED backlight |
| CN106784261A (en) * | 2016-11-30 | 2017-05-31 | 深圳市聚飞光电股份有限公司 | A kind of preparation method of laminated devices quantum dot LED backlight |
-
2011
- 2011-03-22 CN CN2011200774057U patent/CN202034410U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103247744A (en) * | 2012-02-09 | 2013-08-14 | 威士玻尔光电(苏州)有限公司 | Remote fluorescent powder and preparation method thereof |
| CN103271645A (en) * | 2013-06-03 | 2013-09-04 | 苏州原点工业设计有限公司 | Water dispenser capable of emitting light |
| CN106784260A (en) * | 2016-11-30 | 2017-05-31 | 深圳市聚飞光电股份有限公司 | A kind of preparation method of direct LED backlight |
| CN106784261A (en) * | 2016-11-30 | 2017-05-31 | 深圳市聚飞光电股份有限公司 | A kind of preparation method of laminated devices quantum dot LED backlight |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| DD01 | Delivery of document by public notice |
Addressee: Guoye-Xingguang Electronics Co., Ltd., Shenzhen Document name: Notification to Go Through Formalities of Registration |
|
| C53 | Correction of patent for invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Wu Ming Inventor after: Kang Qi Inventor after: Li Yimin Inventor before: Wu Ming Inventor before: Lin Ming Inventor before: Li Yimin |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: INVENTOR; FROM: WU MING LIN MING LI YIMIN TO: WU MING KANG QI LI YIMIN |
|
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000, Shenzhen, Guangdong, Fuyong Baoan District street, Chongqing Road No. 128, the Han Dynasty Laser Industry Park 6, 4 floor, 5 floor Patentee after: Shenzhen Guoyexing Optoelectronics Technology Co., Ltd. Address before: 518000, Shenzhen, Guangdong, Fuyong Baoan District street, Chongqing Road No. 128, the Han Dynasty Laser Industry Park 6, 4 floor, 5 floor Patentee before: Guoye-Xingguang Electronics Co., Ltd., Shenzhen |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20111109 |