CN204011469U - LED package and lighting device - Google Patents
LED package and lighting device Download PDFInfo
- Publication number
- CN204011469U CN204011469U CN201420112490.XU CN201420112490U CN204011469U CN 204011469 U CN204011469 U CN 204011469U CN 201420112490 U CN201420112490 U CN 201420112490U CN 204011469 U CN204011469 U CN 204011469U
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- China
- Prior art keywords
- light
- emitting diode
- diode chip
- backlight unit
- transparent substrates
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of LED package, comprises transparent substrates, at least one light-emitting diode chip for backlight unit, the first encapsulated layer and the second encapsulated layer.Transparent substrates has first surface and with respect to the second surface of first surface.Light-emitting diode chip for backlight unit is disposed on the first surface of transparent substrates.The first encapsulated layer is disposed on the first surface of transparent substrates and covering luminousing diode chip.The second encapsulated layer is disposed on the second surface of transparent substrates and is overlapping with light-emitting diode chip for backlight unit in the direction perpendicular to transparent substrates.Light-emitting diode chip for backlight unit is in order to send a light beam.The light beam of part leaves LED package through transparent substrates and the second encapsulated layer.In addition, a kind ofly comprise that the lighting device of above-mentioned LED package is also suggested.
Description
Technical field
The utility model relates to a kind of photoelectric subassembly, and particularly relevant for a kind of LED package and lighting device.
Background technology
The operation principle of light-emitting diode chip for backlight unit is as follows: by light-emitting diode chip for backlight unit is applied to electric current, being adjacent to the electric hole of the first type semiconductor layer of light-emitting diode chip for backlight unit and the electronics at Second-Type semiconductor junction layer place can be compound, and then makes light-emitting diode chip for backlight unit send light beam.Be different from the illumination modes such as traditional heating or electric discharge, because the luminescence phenomenon of light-emitting diode chip for backlight unit is that to belong to cold property luminous, so light-emitting diode chip for backlight unit has advantages of long service life.In addition, light-emitting diode chip for backlight unit has more the advantages such as reaction speed is fast, volume is little, power saving, low pollution, so light-emitting diode chip for backlight unit is used in various fields widely.
In order to promote further useful life and the reliability of light-emitting diode chip for backlight unit, after completing, light-emitting diode chip for backlight unit how can carry out again an encapsulation procedure, to form LED package.Fig. 1 is the schematic diagram of the LED package of prior art.Please refer to Fig. 1, generally speaking, the light-emitting diode chip for backlight unit 10 after completing can be fixed in a cup 20, the die bond processing procedure being commonly called as.Then, then by two electrodes 12 of light-emitting diode chip for backlight unit 10 be electrically connected with two conductive connecting pins 30 respectively.Afterwards, then the encapsulating material 40 with fluorescent material is inserted to cup 20, with covering luminousing diode chip 10, in this, just completed LED package 50.Yet, because conductive connecting pin 30 and cup 20 mostly are light tight material, therefore from the first type semiconductor layer 14 of light-emitting diode chip for backlight unit 10, can be stopped by conductive connecting pin 30 and cup 20 with the segment beam L that Second-Type semiconductor layer 16 intersections 15 send, thereby reduce the light extraction efficiency of LED package 50.
Utility model content
The utility model provides a kind of LED package, and its light extraction efficiency is high.
The utility model provides a kind of lighting device, and its light extraction efficiency is high.
LED package of the present utility model, comprises transparent substrates, at least one light-emitting diode chip for backlight unit, the first encapsulated layer and the second encapsulated layer.Transparent substrates has first surface and with respect to the second surface of first surface.Light-emitting diode chip for backlight unit is disposed on the first surface of transparent substrates.The first encapsulated layer is disposed on the first surface of transparent substrates and covering luminousing diode chip.The second encapsulated layer is disposed on the second surface of transparent substrates and is overlapping with light-emitting diode chip for backlight unit in the direction perpendicular to transparent substrates.Light-emitting diode chip for backlight unit is in order to send a light beam.The light beam of part leaves LED package through transparent substrates and the second encapsulated layer.
Lighting device of the present utility model, comprises lampshade, crosses the lamp holder of an accommodation space and above-mentioned LED package with lampshade.LED package is disposed in accommodation space.
In an embodiment of the present utility model, above-mentioned transparent substrates is glass substrate.
In an embodiment of the present utility model, each above-mentioned light-emitting diode chip for backlight unit comprises the first semiconductor layer, the second semiconductor layer being connected with the first semiconductor layer, be disposed at the first electrode on the first semiconductor layer and be disposed on the second semiconductor layer and with the second electrode of the first electrode separation.
In an embodiment of the present utility model, above-mentioned at least one light-emitting diode chip for backlight unit is a plurality of light-emitting diode chip for backlight unit.Transparent substrates has more the first current electrode and second current electrode separated with the first current electrode.Light-emitting diode chip for backlight unit is lined up at least one light-emitting diode chip for backlight unit by the first current electrode to the second current electrode and is listed as.LED package more comprises many wires.In light-emitting diode chip for backlight unit row, except a light-emitting diode chip for backlight unit of the most close the first current electrode, the second electrode of each light-emitting diode chip for backlight unit of a plurality of light-emitting diode chip for backlight unit of part is electrically connected by the first electrode of a wire and an adjacent light-emitting diode chip for backlight unit.The first electrode of a light-emitting diode chip for backlight unit of the most close the first current electrode is electrically connected by a wire and the first current electrode.And the second electrode of a light-emitting diode chip for backlight unit of the most close the second current electrode is electrically connected by a wire and the second current electrode.Simply say, a plurality of light-emitting diode chip for backlight unit of same light-emitting diode chip for backlight unit row are one another in series.
In an embodiment of the present utility model, above-mentioned light-emitting diode chip for backlight unit is lined up a plurality of light-emitting diode chip for backlight unit row.These light-emitting diode chip for backlight unit row are connected in parallel to each other.
In an embodiment of the present utility model, each above-mentioned light-emitting diode chip for backlight unit has bottom surface towards transparent substrates, with respect to the end face of bottom surface and the side that connects bottom surface and end face.Light-emitting diode chip for backlight unit is apart to be opened.
In an embodiment of the present utility model, the first fluorescent material that the first above-mentioned encapsulated layer comprises the first encapsulating material and sneaks into the first encapsulating material, and the second fluorescent material that the second encapsulated layer comprises the second encapsulating material and sneaks into the second encapsulating material.
In an embodiment of the present utility model, the above-mentioned light beam of part is converted to second coloured light different from light beam color after the second fluorescent material of the second encapsulated layer, and the light beam of another part is converted to first coloured light different from light beam color after the first fluorescent material of the first encapsulated layer.
In an embodiment of the present utility model, above-mentioned the first coloured light and the second coloured light are all white light.
Based on above-mentioned, in the LED package and lighting device of the utility model one embodiment, to utilize transparent substrates to carry out encapsulation LED chip, therefore the light beam sending except the end face from light-emitting diode chip for backlight unit, side can be passed to LED package, the light beam sending from the bottom surface of light-emitting diode chip for backlight unit also can pass transparent substrates, and then is used by user.Thus, the light extraction efficiency of LED package and lighting device just can improve.
For above-mentioned feature and advantage of the present utility model can be become apparent, special embodiment below, and coordinate appended graphic being described in detail below.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the LED package of prior art.
Fig. 2 A be the utility model one embodiment LED package on look schematic diagram.
The generalized section that Fig. 2 B is the LED package that illustrates along the hatching line A-A ' of Fig. 2 A.
Fig. 3 is the schematic diagram of the lighting device of the utility model one embodiment.
10: light-emitting diode chip for backlight unit
12: electrode
14: the first type semiconductor layer
15: intersection
16: Second-Type semiconductor layer
20: cup
30: conductive connecting pin
40: encapsulating material
50: LED package
100: LED package
110: transparent substrates
110a: first surface
110b: second surface
112: the first current electrodes
114: the second current electrodes
120: light-emitting diode chip for backlight unit
120a: bottom surface
120b: end face
120c: side
122: the first semiconductor layers
124: the second semiconductor layers
126: the first electrodes
128: the second electrodes
130: the first encapsulated layers
132: the first encapsulating materials
134: the first fluorescent material
140: the second encapsulated layers
142: the second encapsulating materials
144: the second fluorescent material
150: printing opacity glue
160: wire
200: lampshade
300: lamp holder
1000: lighting device
A-A ': hatching line
L, L1, L2: light beam
R: light-emitting diode chip for backlight unit row
R1, R2: region
X: accommodation space
Z: direction
Embodiment
Fig. 2 A be the utility model one embodiment LED package on look schematic diagram.The generalized section that Fig. 2 B is the LED package that illustrates along the hatching line A-A ' of Fig. 2 A.Please refer to Fig. 2 A and Fig. 2 B, LED package 100 comprises transparent substrates 110, at least one light-emitting diode chip for backlight unit 120, the first encapsulated layer 130 and the second encapsulated layer 140.Transparent substrates 110 has relative first surface 110a and second surface 110b.In the present embodiment, first surface 110a and second surface 110b can be two planes parallel to each other.Yet the utility model is not limited to this, in other embodiments, first surface 110a and second surface 110b also can be convex surface, concave surface, plane or its combination.The material of transparent substrates 110 be take and selected the material with high transmission rate as good, glass for example, but the utility model is not limited to this, and in other embodiments, transparent substrates 110 also can be selected other suitable light transmissive materials.
At least one light-emitting diode chip for backlight unit 120 is disposed on the first surface 110a of transparent substrates 110.In the present embodiment, at least one light-emitting diode chip for backlight unit 120 can utilize a printing opacity glue 150 to be bonded on the first surface 110a of transparent substrates 110.Yet the utility model is not limited to this, in other embodiments, light-emitting diode chip for backlight unit 120 also can utilize other appropriate ways to be fixed on the first surface 110a of transparent substrates 110.In the present embodiment, at least one light-emitting diode chip for backlight unit 120 can be a plurality of light-emitting diode chip for backlight unit 120, and these light-emitting diode chip for backlight unit 120 can array be arranged on transparent substrates 110.Yet the utility model is not limited to this, the usage quantity of light-emitting diode chip for backlight unit 120 and the arrangement mode all demand of visual reality are done suitable design.
As shown in Figure 2 B, in the present embodiment, each light-emitting diode chip for backlight unit 120 comprises the first semiconductor layer 122 (for example N-shaped semiconductor layer), the second semiconductor layer 124 (for example p-type semiconductor layer) of being connected, is disposed at the first electrode 126 on the first semiconductor layer 122 and is disposed on the second semiconductor layer 124 and second electrode 128 separated with the first electrode 126 with the first semiconductor layer 122.Furthermore, between 124 the first semiconductor layers 122 of the second semiconductor layer and transparency carrier 110.The second semiconductor layer 124 has the region R2 being exposed by the first semiconductor layer 122.The second electrode 128 is configurable on the R2 of region.The first semiconductor layer 122 has the region R1 overlapping with the second semiconductor layer 124.The first electrode 126 is configurable on the R1 of region.Each light-emitting diode chip for backlight unit 120 has bottom surface 120a towards transparent substrates 110, with respect to the end face 120b of bottom surface 120a and the side 120c that connects bottom surface 120a and end face 120b.In the present embodiment, the first electrode 126 and the second electrode 128 are configurable on end face 120b.Yet, it should be noted that, the form of light-emitting diode chip for backlight unit of the present utility model is not limited to shown in this section of institute Fig. 2 A that addresses, Fig. 2 B, and in other embodiments, light-emitting diode chip for backlight unit also can be other appropriate formats.
Continue referring to Fig. 2 A and Fig. 2 B, in the present embodiment, transparent substrates 110 has more the first current electrode 112 and second current electrode 114 separated with the first current electrode 112.The first electrode 126 of each light-emitting diode chip for backlight unit 120 and the second electrode 128 are electrically connected with the first current electrode 112 and second current electrode 114 of transparent substrates 110 respectively.In detail, LED package 100 alternatives comprise many wires 160.Many wire 160 is electrically connected the first electrode 126 of each light-emitting diode chip for backlight unit 120 and the second electrode 128 of the first current electrode 112 and each light-emitting diode chip for backlight unit 120 and the second current electrode 114.In the present embodiment, light-emitting diode chip for backlight unit 120 can utilize mode and the first current electrode 112 and second current electrode 114 electric connections of routing (wire bonding).Yet the utility model is not limited to this, in he embodiment, light-emitting diode chip for backlight unit 120 also can utilize and cover crystalline substance (flip chip) or other suitable modes and the first current electrode 112 and the second current electrode 114 electric connections.
In the present embodiment, as shown in Figure 2 A, a plurality of light-emitting diode chip for backlight unit 120 are lined up a plurality of light-emitting diode chip for backlight unit row R by the first current electrode 112 to the second current electrode 114.LED package 100 more comprises many wires 160.As shown in Figure 2 B, in each light-emitting diode chip for backlight unit row R, except a light-emitting diode chip for backlight unit 120 of the most close the first current electrode 112, the second electrode 128 of each light-emitting diode chip for backlight unit 120 of the light-emitting diode chip for backlight unit 120 of part is electrically connected by a wire 160 and the first electrode 126 of an adjacent light-emitting diode chip for backlight unit 120.The first electrode 126 of a light-emitting diode chip for backlight unit 120 of the most close the first current electrode 112 is electrically connected by a wire 160 and the first current electrode 112.And the second electrode 128 of a light-emitting diode chip for backlight unit 120 of the most close the second current electrode 114 is electrically connected by a wire 160 and the second current electrode 114.In brief, a plurality of light-emitting diode chip for backlight unit 120 of each light-emitting diode chip for backlight unit row R are to be one another in series.In addition, as shown in Figure 2 A, a plurality of light-emitting diode chip for backlight unit row R are connected in parallel to each other.Yet the utility model is not limited to this, in other embodiments, but a plurality of light-emitting diode chip for backlight unit 120 also other suitable modes be electrically connected.
The first surface 110a that the first encapsulated layer 130 is disposed at transparent substrates 110 goes up and covering luminousing diode chip 120.Furthermore, in the present embodiment, first surface 110a that the first encapsulated layer 130 can comprehensive covering transparent substrates 110 is upper and cover end face 120b and side 120c and the wire 160 of each light-emitting diode chip for backlight unit 120.The first fluorescent material 134 that the first encapsulated layer 130 comprises the first encapsulating material 132 and sneaks into the first encapsulating material 132.In the present embodiment, the first fluorescent material 134 is for example yellow phosphorus, but the utility model is not as limit.
When the first current electrode 112 and the second current electrode 114 supply one electric currents are during to the first electrode 126 of each light-emitting diode chip for backlight unit 120 and the second electrode 128, each light-emitting diode chip for backlight unit 120 can send light beam L.In the present embodiment, light beam L through before the first encapsulated layer 130 or the second encapsulated layer 140, for example, is not blue light.The light beam L1 of part can be exchanged into first coloured light different from light beam L color, for example white light after the first fluorescent material 134 of the first encapsulated layer 130.
It is upper and overlapping with light-emitting diode chip for backlight unit 120 on the direction z perpendicular to transparent substrates 110 that the second encapsulated layer 140 is disposed at the second surface 110b of transparent substrates 110.Furthermore, the second surface 110b that the second encapsulated layer 140 can comprehensive covering transparent substrates 110, and the second surface 110b of transparent substrates 110 can fully be covered the bottom surface 120a of each light-emitting diode chip for backlight unit 120 by the second encapsulated layer 140 coverings place.In the present embodiment, the second fluorescent material 144 that the second encapsulated layer 140 comprises the second encapsulating material 142 and sneaks into the second encapsulating material 142.In the present embodiment, the second fluorescent material 144 is for example yellow phosphorus, but the utility model is not as limit.
When the first current electrode 112 and the second current electrode 114 supply one electric currents are during to the first electrode 126 of each light-emitting diode chip for backlight unit 120 and the second electrode 128, each light-emitting diode chip for backlight unit 120 can send light beam L.In the present embodiment, light beam L through before the first encapsulated layer 130 or the second encapsulated layer 140, for example, is not blue light.The light beam L2 of part can be exchanged into second coloured light different from light beam L color, for example white light after the second fluorescent material 144 of the second encapsulated layer 140.
It should be noted that, above-mentioned light beam L not through color, the materials of the first fluorescent material 134 before the first encapsulated layer 130 or the second encapsulated layer 140, the materials of the second fluorescent material 144 are to illustrate the utility model, but not in order to limit the utility model.Light beam L does not determine through the color before the first encapsulated layer 130 or the second encapsulated layer 140, the materials of the first fluorescent material 134, the luminous form that the materials of the second fluorescent material 144 all finally will be presented by LED package 100.Furthermore, in other embodiments, if LED package finally will present multiple coloured light, the first fluorescent material 134, the second fluorescent material 144 also can be selected different materials.
It is worth mentioning that, when utilizing transparent substrates 110 to carry out encapsulation LED chip 120, the light beam L sending except the end face 120b from light-emitting diode chip for backlight unit 120, side 120c can be passed to LED package 100, the light beam L sending from the bottom surface 120a of light-emitting diode chip for backlight unit 120 also can and be passed to LED package 100 through transparent substrates 110 and the second encapsulated layer 140, and then is used by user.That is, utilize transparent substrates 110 encapsulation LED chips 120 can promote the light extraction efficiency of LED package 100.
Another is carried, and the LED package 100 of the present embodiment can select cheap a plurality of light-emitting diode chip for backlight unit 120 as light emitting source.Apart the opening of a plurality of light-emitting diode chip for backlight unit 120, and any light-emitting diode chip for backlight unit 120 exposes bottom surface 120a, end face 120b and the side 120c of remaining each light-emitting diode chip for backlight unit 120.Therefore, total light-emitting area of light emitting source can maximize, and is can realize with LED package 100 with low cost and that have a high brightness.
Fig. 3 is the schematic diagram of the lighting device of the utility model one embodiment.Please refer to Fig. 3, lighting device 1000 comprises lampshade 200, lamp holder 300 and LED package 100.Lampshade 200 crosses accommodation space X with lamp holder 300.LED package 100 is disposed in accommodation space X.The light beam L sending due to the end face 120b from light-emitting diode chip for backlight unit 120, side 120c and bottom surface 120a all can be passed to LED package 100, therefore adopts the lighting device 1000 of LED package 100 can realize a luminous light source to all the winds.
In sum, in the LED package and lighting device of the utility model one embodiment, to utilize transparent substrates to carry out encapsulation LED chip, therefore the light beam sending except the end face from light-emitting diode chip for backlight unit, side can be passed to LED package, and the light beam sending from the bottom surface of light-emitting diode chip for backlight unit also can be used by user through transparent substrates.Thus, the light extraction efficiency of LED package and lighting device just can improve.
Although the utility model openly discloses as above with embodiment; so it is not in order to limit the utility model; under any, in technical field, have and conventionally know the knowledgeable those skilled in the art; within not departing from spirit and scope of the present utility model; when doing a little change, change with retouching, therefore protection range of the present utility model is when being as the criterion with claim limited range depending on accompanying.
Claims (7)
1. a LED package, is characterized in that, comprising:
One transparent substrates, has a relative first surface and a second surface;
At least one light-emitting diode chip for backlight unit, is disposed on this first surface of this transparent substrates;
One first encapsulated layer, is disposed on this first surface of this transparent substrates and covers this light-emitting diode chip for backlight unit; And
One second encapsulated layer, be disposed on this second surface of this transparent substrates and overlapping with this light-emitting diode chip for backlight unit in the direction perpendicular to this transparent substrates, this light-emitting diode chip for backlight unit is in order to send a light beam, and this light beam of part leaves this LED package through this transparent substrates and this second encapsulated layer.
2. LED package as claimed in claim 1, this transparent substrates is a glass substrate.
3. LED package as claimed in claim 1, this at least one light-emitting diode chip for backlight unit is a plurality of light-emitting diode chip for backlight unit, each this light-emitting diode chip for backlight unit comprises one first semiconductor layer, one second semiconductor layer being connected with this first semiconductor layer, be disposed at one first electrode on this first semiconductor layer and be disposed on this second semiconductor layer and with one second electrode of this first electrode separation.
4. LED package as claimed in claim 3, this transparent substrates is more provided with one first current electrode and one second current electrode separated with this first current electrode, this light-emitting diode chip for backlight unit is lined up at least one light-emitting diode chip for backlight unit by this first current electrode to this second current electrode and is listed as, this LED package more comprises many wires, in this light-emitting diode chip for backlight unit row except this light-emitting diode chip for backlight unit of the most close this first current electrode, this second electrode of each this light-emitting diode chip for backlight unit of this light-emitting diode chip for backlight unit of part is electrically connected by this first electrode of this wire and adjacent this light-emitting diode chip for backlight unit, and this first electrode of this light-emitting diode chip for backlight unit of the most close this first current electrode is electrically connected by another this wire and this first current electrode, and this second electrode of this light-emitting diode chip for backlight unit of the most close this second current electrode is electrically connected by another this wire and this second current electrode.
5. LED package as claimed in claim 4, this light-emitting diode chip for backlight unit is lined up a plurality of light-emitting diode chip for backlight unit row, and these light-emitting diode chip for backlight unit row are connected in parallel to each other.
6. LED package as claimed in claim 1, this at least one light-emitting diode chip for backlight unit is a plurality of light-emitting diode chip for backlight unit, each this light-emitting diode chip for backlight unit has a bottom surface towards this transparent substrates, with respect to an end face of this bottom surface and a side that connects this bottom surface and this end face, this light-emitting diode chip for backlight unit is apart to be opened.
7. a lighting device, is characterized in that, comprising:
One lampshade;
One lamp holder, this lampshade and this lamp holder cross an accommodation space; And
This LED package as described in any one in claim 1 to 6, is disposed in this accommodation space.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420112490.XU CN204011469U (en) | 2014-03-13 | 2014-03-13 | LED package and lighting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420112490.XU CN204011469U (en) | 2014-03-13 | 2014-03-13 | LED package and lighting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204011469U true CN204011469U (en) | 2014-12-10 |
Family
ID=52051427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420112490.XU Expired - Fee Related CN204011469U (en) | 2014-03-13 | 2014-03-13 | LED package and lighting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204011469U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104654079A (en) * | 2015-01-27 | 2015-05-27 | 浙江英特来光电科技有限公司 | High-performance 360-degree LED (Light-Emitting Diode) lamp |
-
2014
- 2014-03-13 CN CN201420112490.XU patent/CN204011469U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104654079A (en) * | 2015-01-27 | 2015-05-27 | 浙江英特来光电科技有限公司 | High-performance 360-degree LED (Light-Emitting Diode) lamp |
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Granted publication date: 20141210 Termination date: 20170313 |