CN202259437U - Multi-reflection cup integrated type LED (light emitting diode) packaging structure - Google Patents
Multi-reflection cup integrated type LED (light emitting diode) packaging structure Download PDFInfo
- Publication number
- CN202259437U CN202259437U CN2011203479698U CN201120347969U CN202259437U CN 202259437 U CN202259437 U CN 202259437U CN 2011203479698 U CN2011203479698 U CN 2011203479698U CN 201120347969 U CN201120347969 U CN 201120347969U CN 202259437 U CN202259437 U CN 202259437U
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- Prior art keywords
- led
- groove
- light
- luminescence chip
- led luminescence
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000004806 packaging method and process Methods 0.000 title abstract description 6
- 239000000463 material Substances 0.000 claims abstract description 4
- 238000004020 luminiscence type Methods 0.000 claims description 39
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 22
- 239000003292 glue Substances 0.000 claims description 8
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000005286 illumination Methods 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000009795 derivation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49113—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
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- Led Device Packages (AREA)
Abstract
The utility model discloses a multi-reflection cup integrated type LED (light emitting diode) packaging structure in the LED technical field. The LED packaging structure comprises a base frame and a plurality of LED luminous chips arranged on the base frame, wherein the base frame is provided with a plurality of grooves matched with the LED luminous chips; each groove is in a big-end-up conical structure; the internal surface of each groove is provided with a light-reflecting layer made of a light-reflecting material; and each LED luminous chip is arranged in each groove with the light-reflecting layer. The light-reflecting intensity is improved through the light-reflecting layers, so that the light emitted from each LED luminous chip can be more effectively emitted, the luminous utilization rate of each LED luminous chip is high, the light can be effectively output to prevent the heat from being accumulated in the base frame, the heat dissipation performance is good, and the service life of the LED packaging structure disclosed by the utility model is effectively ensured.
Description
Technical field
The utility model relates to the LED technical field, relates in particular to a kind of multiple reflection cup integrated LED encapsulating structure.
Background technology
LED is the english abbreviation of light-emitting diode (Light Emitting Diode); Be called as the 4th generation lighting source or green light source; Also extensively be considered to top quality light source of 21 century; It has characteristics such as energy-saving and environmental protection, volume are little, long service life, therefore is widely used in fields such as various indications, demonstration, decoration, backlight, general lighting and urban landscape.
LED integrated form encapsulating structure is used more and more wider at high-power illumination at present; Its most basic characteristic be with some LED luminescence chip integrated grounds on the pedestal of certain specification through series of processes operations such as solid crystalline substance, bonding wire, test, sealing and curing after, be packaged into the LED module that an integral body has some LED luminescence chips and can satisfy the electrical requirement of unification.The advantage of this LED module is that production technology is simple, and efficient is high and cost is low.Yet usually the LED luminescence chip sends when light gets into sealing and can reflect, and the luminous energy of leading paper LED can not be launched greatly and be reflected in the pedestal, causes very big luminous energy waste, at the bottom of the utilance of luminous energy; In addition, when luminous energy was transmitted in the pedestal, heat will accumulate in the pedestal, led paper LED luminescence chip and continued operation at high temperature, produced very big light decay, had influenced its useful life; And, when encapsulating, this LED module needs a large amount of packing colloids, and production cost is high.
The utility model content
The purpose of the utility model is to provide a kind of multiple reflection cup integrated LED encapsulating structure, and it can be derived luminous energy effectively, improves the utilance of luminous energy, and perfect heat-dissipating.
For realizing above-mentioned purpose; The technical scheme of the utility model is for providing a kind of multiple reflection cup integrated LED encapsulating structure; Comprise that pedestal is arranged on a plurality of LED luminescence chips on the pedestal with arranging, and offers the groove of a plurality of and said LED luminescence chip coupling, the pyramidal structure that said groove is big up and small down on the said pedestal; The inner surface of said groove has the reflector layer of the reflective material of one deck, and said LED luminescence chip is installed in the said groove with reflector layer; Improve intensity of light reflection through reflector layer, more effective the launching of luminous energy who makes the emission of LED luminescence chip, the luminous utilance of LED luminescence chip is high.
Preferably, said LED luminescence chip is installed in the said groove through heat-conducting glue; The heat of the luminous generation of LED luminescence chip is derived from pedestal through heat-conducting glue is more effective, and thermal diffusivity is good.
Preferably, the said LED luminescence chip that is positioned at same row is connected each other.
Preferably, be arranged in same row's said LED luminescence chip, the electrode contacts of adjacent said LED luminescence chip electrically connects through lead is corresponding, and is simple in structure.
Preferably, be arranged in same row's groove, be provided with corresponding the connecting a little of electrode contacts with said led chip between the adjacent said groove, said connecting a little through the corresponding electric connection of LED luminescence chip of lead with adjacent both sides, compact conformation.
The utility model compared with prior art; Multiple reflection cup integrated LED encapsulating structure is through being provided with reflector layer in the groove of pedestal; Improve intensity of light reflection, the luminous energy of the LED luminescence chip emission that is arranged in the groove is launched through reflector layer is more effective, thereby improved light emission rate; Realize highlight illumination, improve the utilance of luminous energy; And luminous energy is exported effectively, prevents heat accumulation in pedestal, and perfect heat-dissipating effectively guarantees useful life of the utility model; Simultaneously, only need during sealing each groove is carried out a glue encapsulation, this kind encapsulating structure effectively reduces the consumption of packaging plastic, reduces production costs.
Description of drawings
Fig. 1 is the structural representation of the utility model multiple reflection cup integrated LED encapsulating structure pedestal.
Fig. 2 is the vertical view of the utility model multiple reflection cup integrated LED encapsulating structure first embodiment.
Fig. 3 is the cross sectional view of the utility model multiple reflection cup integrated LED encapsulating structure first embodiment.
Fig. 4 is the vertical view of the utility model multiple reflection cup integrated LED encapsulating structure second embodiment.
Fig. 5 is the cross sectional view of the utility model multiple reflection cup integrated LED encapsulating structure second embodiment.
Embodiment
Below in conjunction with accompanying drawing and preferred embodiment the utility model is described further.
Please with reference to shown in Figure 1; Structural representation for the utility model multiple reflection cup integrated LED encapsulating structure pedestal; Comprise that pedestal 1 is arranged on a plurality of LED luminescence chips 2 on the pedestal 1 with arranging; Offer the groove 3 of a plurality of and said LED luminescence chip 2 couplings on the said pedestal 1, the pyramidal structure that said groove 3 is big up and small down, the inner surface of said groove 3 has the reflector layer 5 of the reflective material of one deck.
Extremely shown in Figure 3 like Fig. 2; Vertical view and cross sectional view for the utility model first embodiment; Said LED luminescence chip 2 is arranged in the said groove 3, and preferably, said LED luminescence chip 2 is arranged in the said groove 3 through heat-conducting glue 4; So design makes that the heat of LED luminescence chip 2 luminous generations is more effective from pedestal 1 derivation through heat-conducting glue 4, and thermal diffusivity is good.More specifically, the utility model can be fixed on LED luminescence chip 2 in the groove 3 through the alternative heat-conducting glue 4 of mode of elargol or eutectic welding according to the needs of reality, not to exceed.Improve intensity of light reflection through said reflector layer 5, more effective the launching of luminous energy who makes 2 emissions of LED luminescence chip, LED luminescence chip 2 luminous utilances are high.
Preferably, be arranged in same row's said LED luminescence chip 2, the electrode contacts of adjacent said LED luminescence chip 2 electrically connects through lead 6, makes the said LED luminescence chip 2 that is positioned at same row connect each other, forms LED luminescence unit group 2a, and it is simple in structure; Said lead 6 is a gold thread.These practical pedestal 1 both sides are provided with the electrode line 8 and negative line 9 that connects positive and negative electrode, pass through electrode line 8, negative line 9 parallel connections between the adjacent said LED luminescence unit group 2a respectively.
Preferably; Extremely shown in Figure 5 like Fig. 4 is vertical view and the cross sectional view of the utility model second embodiment; Itself and the first embodiment difference are: in same row's groove 3; Be provided with between the adjacent said groove 3 electrode contacts with said led chip 2 corresponding connect a little 7, connect a little 7 LED luminescence chips 2 and electrically connect compact conformation through lead 6 and adjacent both sides.
The utility model multiple reflection cup integrated LED encapsulating structure is through being provided with reflector layer 5 in the groove 3 of pedestal 1; Improve intensity of light reflection; The luminous energy that makes LED luminescence chip 2 emissions that are arranged in the groove 3 is through reflector layer 5 more effective launching; Thereby the raising light emission rate is realized highlight illumination, improves the utilance of luminous energy; And effective output of luminous energy has prevented heat accumulation in pedestal 1, and perfect heat-dissipating effectively prolongs useful life of the utility model; Simultaneously, only need during sealing each groove is carried out a glue encapsulation, this kind encapsulating structure effectively reduces the consumption of packaging plastic, reduces production costs.
The above disclosed preferred embodiment that is merely the utility model can not limit the interest field of the utility model certainly with this, so according to the equivalent variations that the utility model claim is done, still belong to the scope that the utility model is contained.
Claims (5)
1. multiple reflection cup integrated LED encapsulating structure; Comprise that pedestal is arranged on a plurality of LED luminescence chips on the pedestal with arranging; It is characterized in that: the groove that offers a plurality of and said LED luminescence chip coupling on the said pedestal; The pyramidal structure that said groove is big up and small down, the inner surface of said groove has the reflector layer of the reflective material of one deck, and said LED luminescence chip is installed in the said groove with reflector layer.
2. multiple reflection cup integrated LED encapsulating structure as claimed in claim 1, it is characterized in that: said LED luminescence chip is installed in the said groove through heat-conducting glue.
3. multiple reflection cup integrated LED encapsulating structure as claimed in claim 1 is characterized in that: the said LED luminescence chip that is positioned at same row is connected each other.
4. multiple reflection cup integrated LED encapsulating structure as claimed in claim 1 is characterized in that: be arranged in same row's said LED luminescence chip, the electrode contacts of adjacent said LED luminescence chip electrically connects through lead is corresponding.
5. multiple reflection cup integrated LED encapsulating structure as claimed in claim 1; It is characterized in that: the groove that is arranged in same row; Be provided with corresponding the connecting a little of electrode contacts with said led chip between the adjacent said groove, said connecting a little through the corresponding electric connection of LED luminescence chip of lead with adjacent both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203479698U CN202259437U (en) | 2011-09-16 | 2011-09-16 | Multi-reflection cup integrated type LED (light emitting diode) packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203479698U CN202259437U (en) | 2011-09-16 | 2011-09-16 | Multi-reflection cup integrated type LED (light emitting diode) packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202259437U true CN202259437U (en) | 2012-05-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203479698U Expired - Lifetime CN202259437U (en) | 2011-09-16 | 2011-09-16 | Multi-reflection cup integrated type LED (light emitting diode) packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202259437U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105304794A (en) * | 2015-10-30 | 2016-02-03 | 东莞市光宇实业有限公司 | High-power LED encapsulation structure |
| CN113763828A (en) * | 2021-08-06 | 2021-12-07 | 深圳市思坦科技有限公司 | Display structure and electronic device |
-
2011
- 2011-09-16 CN CN2011203479698U patent/CN202259437U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105304794A (en) * | 2015-10-30 | 2016-02-03 | 东莞市光宇实业有限公司 | High-power LED encapsulation structure |
| CN113763828A (en) * | 2021-08-06 | 2021-12-07 | 深圳市思坦科技有限公司 | Display structure and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: DONGGUAN JINGRUI ELECTRIC APPLIANCE HARDWARE CO., Free format text: FORMER OWNER: LU XUEZHONG Effective date: 20140620 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 523270 DONGGUAN, GUANGDONG PROVINCE TO: 523000 DONGGUAN, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20140620 Address after: 523000 Guangdong Province, Dongguan City Heng Kau Industrial Zone, Gaobu town Patentee after: Dongguan Jingrui Electric Appliance Hardware Co., Ltd. Address before: 523270 Guangdong Province, Dongguan City Gaobu Town Industrial Zone, Dongguan Heng Kau elite Hardware Electrical Appliance Co. Ltd. Patentee before: Lu Xuezhong |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20170324 Address after: Guangdong province Dongguan City Gaobu town 523000 Hu'an Village Patentee after: Guangdong Rui Lu Optoelectronics Technology Co., Ltd. Address before: 523000 Guangdong Province, Dongguan City Heng Kau Industrial Zone, Gaobu town Patentee before: Dongguan Jingrui Electric Appliance Hardware Co., Ltd. |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120530 |
|
| CX01 | Expiry of patent term |