CN202662601U - LED (light emitting diode) encapsulation structure - Google Patents
LED (light emitting diode) encapsulation structure Download PDFInfo
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- CN202662601U CN202662601U CN 201220232593 CN201220232593U CN202662601U CN 202662601 U CN202662601 U CN 202662601U CN 201220232593 CN201220232593 CN 201220232593 CN 201220232593 U CN201220232593 U CN 201220232593U CN 202662601 U CN202662601 U CN 202662601U
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- led
- groove
- encapsulating structure
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- encapsulation structure
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Abstract
The utility model discloses an LED (light emitting diode) encapsulation structure, which comprises a base plate, wherein a horn-shaped groove is arranged on the base plate, the inner surface of the groove is a polished surface, at least two LED chips are arranged in the groove, fluorescent rubber powder is encapsulated on each LED chip, and an optical lens is encapsulated on the groove. The LED encapsulation structure has the advantages that the structure is simple, the manufacture is convenient, the cost is low, the groove arranged on the base plate realizes a good light reflection effect, the light efficiency is greatly improved, the LED chips are adopted to be encapsulated in the light efficiency lens, the cost is reduced, and meanwhile, the power is also greatly improved.
Description
Technical field
The utility model relates to a kind of LED encapsulating structure, especially relates to a kind of LED encapsulating structure based on the COB technology.
Background technology
Along with developing rapidly of LED technology, LED almost has application in industry-by-industry, and in gradually replacement conventional light source.In order to satisfy the needs in different application field, the LED encapsulation technology is also in continuous progress, and packing forms is very diversification also, and COB is exactly wherein a kind of at present.Traditional COB package module generally all be directly with the chip die bond on substrate, this packing forms thermal resistance is larger, can not reach the picture conventional incandescent light efficiency, the especially encapsulation of high-power LED chip, its production cost is high, be difficult to processing.
The utility model content
The utility model is in order to overcome the deficiencies in the prior art, and a kind of easy to process, with low cost, LED encapsulating structure that light efficiency is good is provided.
To achieve these goals, the utility model is by the following technical solutions: a kind of LED encapsulating structure, comprise substrate, described substrate is provided with trumpet-shaped groove, the inner surface of this groove is burnishing surface, be provided with at least two led chips in it, be packaged with the fluorescence rubber powder on each led chip, be packaged with optical lens on the groove.
As preferably, the inwall of described groove is coated with a reflector layer.
As preferably, be provided with 4 led chips in the described groove, between each led chip by being connected in series.
As preferably, the degree of depth of described groove is 1.8mm-2.1mm.
As preferably, the degree of depth of described groove is 2.0mm.
As preferably, described substrate is aluminium sheet.
As preferably, described substrate is circular or square.
The utlity model has following advantage: the utility model is simple in structure, easily manufactured, with low cost; The groove of being located on the substrate plays good reflecting effect, has greatly improved light efficiency; Adopt a plurality of chip packages in light efficiency lens, also greatly improved power when having reduced cost.
Description of drawings
Fig. 1 is structural representation of the present utility model.
Embodiment
In order to make those skilled in the art person better understand the utility model scheme, below in conjunction with the accompanying drawing among the utility model embodiment, technical scheme among the utility model embodiment is carried out clear, complete description, obviously, described embodiment only is a part of embodiment of the present utility model, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that obtains under the creative work prerequisite, all should belong to the scope of the utility model protection.
As shown in Figure 1, a kind of LED encapsulating structure, the aluminum base plate 1 that comprises strip, have 6 trumpet-shaped grooves 2 on the substrate 1, the inner surface of this groove 2 is burnishing surface, scribbles the reflector layer that one deck is comprised of reflective material within it on the wall, and the led chip 3 of 4 series connection is housed in the groove, be packaged with the fluorescence rubber powder on each led chip 3, be packaged with an optical lens 5 on each groove 2.The degree of depth of groove 2 is 1.8mm-2.1mm, is preferably 2.0mm.
By trumpet-shaped groove is set, this groove is equivalent to a good reflector, and light source is effectively reflected, and has greatly improved light efficiency; And after groove is set, more be conducive to carrying out of glue, do not worry that fluorescent glue can arbitrarily flow; A plurality of chips share an optical lens, have lengthened the transmission range of light, also greatly reduce cost, can according to the needs of scene, select the concrete quantity of chip.Adopt aluminum base plate, improved radiating efficiency, prolonged the useful life of LED.
Claims (7)
1. LED encapsulating structure, comprise substrate (1), it is characterized in that: described substrate (1) is provided with trumpet-shaped groove (2), the inner surface of this groove (2) is burnishing surface, be provided with at least two led chips (3) in it, each led chip is packaged with the fluorescence rubber powder on (3), is packaged with optical lens (5) on the groove (2).
2. LED encapsulating structure according to claim 1, it is characterized in that: the inwall of described groove (2) is coated with a reflector layer.
3. LED encapsulating structure according to claim 2 is characterized in that: be provided with 4 led chips (3) in the described groove (2), between each led chip by being connected in series.
4. LED encapsulating structure according to claim 3, it is characterized in that: the degree of depth of described groove (2) is 1.8mm-2.1mm.
5. LED encapsulating structure according to claim 4, it is characterized in that: the degree of depth of described groove (2) is 2.0mm.
6. LED encapsulating structure according to claim 4, it is characterized in that: described substrate (1) is aluminium sheet.
7. LED encapsulating structure according to claim 5 is characterized in that: described substrate is for circular or square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220232593 CN202662601U (en) | 2012-05-07 | 2012-05-07 | LED (light emitting diode) encapsulation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220232593 CN202662601U (en) | 2012-05-07 | 2012-05-07 | LED (light emitting diode) encapsulation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202662601U true CN202662601U (en) | 2013-01-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220232593 Expired - Fee Related CN202662601U (en) | 2012-05-07 | 2012-05-07 | LED (light emitting diode) encapsulation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202662601U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104779245A (en) * | 2014-01-12 | 2015-07-15 | 广东天下行光电有限公司 | Contiguous automobile reading lamp |
-
2012
- 2012-05-07 CN CN 201220232593 patent/CN202662601U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104779245A (en) * | 2014-01-12 | 2015-07-15 | 广东天下行光电有限公司 | Contiguous automobile reading lamp |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130109 Termination date: 20150507 |
|
| EXPY | Termination of patent right or utility model |