CN202564430U

CN202564430U - Large-power white light LED packaging structure

Info

Publication number: CN202564430U
Application number: CN2012200203680U
Authority: CN
Inventors: 周波
Original assignee: SHENZHEN MTC LIGHTING CO Ltd
Current assignee: SHENZHEN MTC LIGHTING CO Ltd
Priority date: 2012-01-17
Filing date: 2012-01-17
Publication date: 2012-11-28
Anticipated expiration: 2022-01-17

Abstract

The utility model discloses a large-power white light LED packaging structure, comprising a substrate with a groove and an LED chip which is arranged in the groove, wherein the inner side wall of the groove is formed as a reflecting surface for gathering the lights; the bottom of the groove is provided with a boss; the LED chip is supported on the top of the boss; a fluorescent powder colloid layer is formed and coated on the LED chip on the bottom of the groove taking the LED chip as the center; and the fluorescent powder colloid layer and the reflecting layer are separated by a preset distance. The large-power white light LED packaging structure achieves the aim for improving the technical effect that the bright dipping directivity between the large-power white light LED chip and the metal contact part, and the reflectivity and bright dipping ratio of the reflecting surface are improved.

Description

The large power white light LED encapsulating structure

Technical field

The utility model relates to the LED lighting field, relates in particular to a kind of large power white light LED encapsulating structure.

Background technology

Light-emitting diode (Light Emitting Diode is called for short LED) is a kind of solid-state semiconductor device, and it can directly be converted into light to electricity.Because of LED has the lighting source that the life-span is long, light efficiency is high, radiationless and advantage of low power consumption becomes main flow gradually.

Please refer to Fig. 1; Existing large power white light LED is provided with chip 300 in the bottom of metal substrate 100 corresponding groove, and 200 of fluorescent glues are in groove and be coated on the outside of chip 300, and the reflecting wall of groove has adhered to irregular fluorescent powder grain; Thereby reflecting in disorderly, light emission rate is lower.

The utility model content

The utility model embodiment technical problem to be solved is, a kind of bright dipping directive property and new structure albedo, that light emission rate is high that promotes large power white light LED chip and Metal Contact place is provided.

In order to solve the problems of the technologies described above; The utility model embodiment has proposed a kind of large power white light LED encapsulating structure; Comprise the substrate that is provided with groove and be located at the led chip in the groove, the madial wall of groove is formed for converging the reflecting surface of light, and the bottom of groove is provided with the boss that end face carries led chip; The bottom of groove is that the center coats formation fluorescent powder colloid layer, the preset distance of being separated by between fluorescent powder colloid layer and the reflecting surface in the led chip outside with the led chip.

Further, the fluorescent powder colloid layer only is covered on the end face of boss.

Further, the fluorescent powder colloid layer is covered on the end face of bottom surface and boss of groove simultaneously.

Further, coat the formation lens jacket in the fluorescent powder colloid layer outside.

Further, the substrate outside is installed with housing.

Further, the both sides of housing are embedded with support respectively.

Further, substrate is a metal substrate.

Further, the led chip of the end face of boss carrying is one or more.

The beneficial effect of the large power white light LED encapsulating structure of the utility model embodiment is: the bottom through being employed in groove is provided with boss; The bottom of groove coats in the led chip outside and forms the fluorescent powder colloid layer; The technological means of preset distance of being separated by between fluorescent powder colloid layer and the reflecting surface promotes large power white light LED chip and the bright dipping directive property at Metal Contact place and technique effect albedo, that light emission rate is high of reflecting surface thereby reached.

Description of drawings

Fig. 1 is the sketch map of existing large power white light LED encapsulating structure.

Fig. 2 is the overall structure sketch map of the large power white light LED encapsulating structure of the utility model embodiment.

Fig. 3 is the structural representation of the large power white light LED encapsulating structure of the utility model embodiment.

Fig. 4 is the structural representation of the large power white light LED encapsulating structure of another embodiment of the utility model.

Embodiment

Please refer to Fig. 2, the large power white light LED encapsulating structure of the utility model embodiment comprises substrate 10, led chip 20, housing 30, fluorescent powder colloid layer 40 and lens jacket 50.

Substrate 10 is a metal substrate 10, has thermolysis.One side of substrate 10 is provided with groove, and the madial wall of groove is formed with the reflecting surface 11 that is used to converge light, and the bottom of groove is provided with boss; The end face of boss carries led chip 20; The structure that boss is set in this groove has the effect of convenient some glue, in other words, even some fluorescent glues of multiple spot; Also only can drop on groove corresponding on the bottom surface outside the boss, and can not contact and then influence light emission rate with reflecting surface 11.Further, the groove of said substrate 10 and boss integrated formed structure for processing through methods such as punching press, die casting or casting.

Led chip 20 is one or more.

Substrate 10 outsides are installed with housing 30, and in this execution mode, housing 30 is a plastic casing 30, and the both sides of housing 30 are embedded with support 31 respectively.

Fluorescent powder colloid layer 40 coats the bottom that is formed at groove, and is that the center is coated on the led chip outside with the led chip, and the preset distance of being separated by between the reflecting surface 11.It is silica gel or epoxy resin that fluorescent powder colloid layer 40 adopts material, is mixed with the fluorescent material, the antisolvent precipitation powder that strengthen light efficiency in the colloid.As shown in Figure 3; In first execution mode of the utility model; Fluorescent powder colloid layer 40 only is covered on the end face of boss; The lateral edges of fluorescent powder colloid layer 40 is concordant with the lateral edges of the end face of boss, and perhaps the corresponding profile of the lateral edges of fluorescent powder colloid layer 40 is comprised in the corresponding profile of lateral edges of end face of boss; As shown in Figure 4; In second execution mode of the utility model; Fluorescent powder colloid layer 40 is covered on the end face of bottom surface and boss of groove simultaneously; The bottom margin of the lateral edges of fluorescent powder colloid layer 40 and reflecting surface 11 keeps preset distance, and this preset distance can be 0, and promptly both are adjacent; Perhaps be greater than 0 and smaller or equal to a distance of length between the bottom margin of reflecting surface 11 and the boss bottom margin, the corresponding profile of the lateral edges of fluorescent powder colloid layer 40 is comprised in the corresponding profile of bottom margin of reflecting surface 11.Thereby; Reflecting surface 11 nothings of the madial wall of the groove of the large power white light LED encapsulating structure of the utility model are adhered to granular object such as fluorescent material, antisolvent precipitation powder and spread powder and are influenced light extraction efficiency; Reflecting surface 11 smooth surfaces; Albedo and to converge the ability of light stronger, whole light extraction efficiency is high.

Lens jacket 50 coats and is formed at fluorescent powder colloid layer 40 outside.

The above is the embodiment of the utility model; Should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle; Can also make some improvement and retouching, these improvement and retouching also are regarded as the protection range of the utility model.

Claims

1. large power white light LED encapsulating structure; Comprise the substrate that is provided with groove and be located at the led chip in the groove; The madial wall of groove is formed for converging the reflecting surface of light, it is characterized in that, the bottom of groove is provided with the boss that end face carries led chip; The bottom of groove is that the center coats formation fluorescent powder colloid layer, the preset distance of being separated by between fluorescent powder colloid layer and the reflecting surface in the led chip outside with the led chip.

2. large power white light LED encapsulating structure as claimed in claim 1 is characterized in that the fluorescent powder colloid layer only is covered on the end face of boss.

3. large power white light LED encapsulating structure as claimed in claim 1 is characterized in that, the fluorescent powder colloid layer is covered on the end face of bottom surface and boss of groove simultaneously.

4. large power white light LED encapsulating structure as claimed in claim 1 is characterized in that, coats in the fluorescent powder colloid layer outside and forms lens jacket.

5. large power white light LED encapsulating structure as claimed in claim 1 is characterized in that, the substrate outside is installed with housing.

6. large power white light LED encapsulating structure as claimed in claim 5 is characterized in that the both sides of housing are embedded with support respectively.

7. large power white light LED encapsulating structure as claimed in claim 1 is characterized in that, substrate is a metal substrate.

8. like each described large power white light LED encapsulating structure in the claim 1～7, it is characterized in that the led chip that the end face of boss carries is one or more.