CN203481270U - LED (Light-Emitting Diode) packaging structure - Google Patents
LED (Light-Emitting Diode) packaging structure Download PDFInfo
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- CN203481270U CN203481270U CN201320545976.8U CN201320545976U CN203481270U CN 203481270 U CN203481270 U CN 203481270U CN 201320545976 U CN201320545976 U CN 201320545976U CN 203481270 U CN203481270 U CN 203481270U
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Abstract
The utility model discloses an LED packaging structure. The LED packaging structure comprises a substrate with a groove and a chip arranged at the bottom of the groove, wherein the chip is a blue chip, the surface of the chip in the groove is coated with a red fluorescent glue layer, and the red fluorescent glue layer is then coated with a yellow fluorescent glue layer. The red fluorescent glue layer is sprayed with the yellow fluorescent glue layer to effectively inhibit secondary excitation of the red fluorescent layer, thereby being able to effectively improve the color rendering index; and thus, the LED packaging structure has a better luminous efficiency performance while having a high color rendering index.
Description
Technical field
The application relates to LED encapsulation technology field, relates in particular to a kind of LED encapsulating structure.
Background technology
Along with scientific and technological development, LED is more and more extensive with advantage ranges of application such as its Portable energy-saving, long service life, and market is also more and more higher for the performance requirement of LED device.
Because existing white-light LED encapsulation technology is the fluorescent glue mixing by red fluorescence powder and yellow fluorescent powder, then in conjunction with blue chip, form white light LEDs.In this encapsulation technology, red fluorescence powder conversion efficiency is low, and character is unstable, and easily produces secondary excitation, causes light efficiency loss.The LED device that adopts this encapsulating structure to form, its color rendering index is lower, and light efficiency loss is larger.
Summary of the invention
The application provides a kind of LED encapsulating structure, and color rendering index is high, and can effectively avoid light efficiency loss.
The application provides a kind of LED encapsulating structure, comprise the substrate with a groove and the chip that is arranged at bottom portion of groove, described chip is blue chip, and described inside grooves is coated with red fluorescence glue-line in chip surface, and described red fluorescence glue-line is coated with yellow fluorescence glue-line outward.
Further, described substrate adopts thermosets to make.
Further, described thermosets is organosilicon natural gum or epoxy resin.
Further, described chip is electrically connected to the respective electrode on substrate by bonding wire.
Further, on described substrate, negative or positive electrode solder joint place offers to distinguish the through hole of negative or positive electrode solder joint.
Further, in described through hole, be filled with thermosets.
The application's beneficial effect is: by blue chip surface-coated red fluorescence glue-line, and apply yellow fluorescence glue-line outward in red fluorescence glue-line, utilize red fluorescence powder effectively to improve the color rendering index of LED encapsulating structure, and by yellow fluorescent powder, suppress the secondary excitation of red fluorescence powder simultaneously, avoid causing light efficiency loss, improve light utilization efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LED encapsulating structure of the embodiment of the present application.
Embodiment
Below by embodiment, by reference to the accompanying drawings the application is described in further detail.
Please refer to Fig. 1, the LED encapsulating structure of the embodiment of the present application mainly comprises substrate 10, chip 20, red fluorescence glue-line 30 and yellow fluorescence glue-line 40.
Described substrate 10 1 sides are provided with groove, in order to accommodating fixing described chip 22.In the present embodiment, described substrate 10 adopts thermosets to make, and specifically can be set to organosilicon natural gum or epoxy resin.
Described chip 20 is arranged at the bottom of described groove, and is electrically connected to the respective electrode on described substrate 10 by bonding wire 50, further to connect external power source by described substrate 10, in described through hole, is filled with thermosets.Please refer to Fig. 1, on described substrate 10, negative or positive electrode solder joint place offers to distinguish the through hole 11 of negative or positive electrode solder joint.In the present embodiment, one end that is provided with described through hole 11 of described substrate 10 is corresponding to the negative pole solder joint of described substrate 10; As a kind of execution mode, one end that is provided with described through hole 11 of described substrate 10 also can be corresponding to the anodal solder joint of described substrate 10.
In the present embodiment, described chip 20 is blue chip, described red fluorescence glue-line 30 is coated on described chip 20 surfaces, and described yellow fluorescence glue-line 40 is coated on outside described red fluorescence glue-line, and described red fluorescence glue-line 30 and described yellow fluorescence glue-line 40 are all arranged at described inside grooves.Understandable, described red fluorescence glue-line 30 consists of the colloid that is mixed with red fluorescence powder, and described yellow fluorescence glue-line 40 consists of the colloid that is mixed with yellow fluorescent powder.
During concrete operations, prior to carrying out die bond bonding wire in the groove of described substrate 10, described chip 20 is fixed on to the bottom of described groove; Subsequently, in red fluorescence glue-line 30 described in described chip 20 surface-coated; Finally, more described yellow fluorescence glue-line 40 is coated to described red fluorescence glue-line 30 surfaces, and then completes encapsulation.
By in described chip 20 surfaces, described red fluorescence glue-line 30 being set, can effectively improve the color rendering index of described LED encapsulating structure, make the color in light area more saturated, natural, object performance is more clear.Simultaneously, by described yellow fluorescence glue-line 40 being set in described red fluorescence glue-line 30 surfaces, the secondary excitation that can effectively suppress red fluorescence powder, avoid causing light efficiency loss, and then assurance light utilization efficiency, make described LED encapsulating structure when possessing high color rendering index (CRI), still can there is good light efficiency performance.
Above content is the further description of the application being done in conjunction with concrete execution mode, can not assert that the application's concrete enforcement is confined to these explanations.For the application person of an ordinary skill in the technical field, not departing under the prerequisite of the application's design, can also make some simple deduction or replace.
Claims (6)
1. a LED encapsulating structure, it is characterized in that, comprise the substrate with a groove and the chip that is arranged at bottom portion of groove, described chip is blue chip, described inside grooves is coated with red fluorescence glue-line in chip surface, and described red fluorescence glue-line is coated with yellow fluorescence glue-line outward.
2. LED encapsulating structure as claimed in claim 1, is characterized in that, described substrate adopts thermosets to make.
3. LED encapsulating structure as claimed in claim 2, is characterized in that, described thermosets is organosilicon natural gum or epoxy resin.
4. LED encapsulating structure as claimed in claim 1, is characterized in that, described chip is electrically connected to the respective electrode on substrate by bonding wire.
5. LED encapsulating structure as claimed in claim 4, is characterized in that, on described substrate, negative or positive electrode solder joint place offers to distinguish the through hole of negative or positive electrode solder joint.
6. LED encapsulating structure as claimed in claim 5, is characterized in that, in described through hole, is filled with thermosets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320545976.8U CN203481270U (en) | 2013-09-03 | 2013-09-03 | LED (Light-Emitting Diode) packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320545976.8U CN203481270U (en) | 2013-09-03 | 2013-09-03 | LED (Light-Emitting Diode) packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203481270U true CN203481270U (en) | 2014-03-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320545976.8U Expired - Fee Related CN203481270U (en) | 2013-09-03 | 2013-09-03 | LED (Light-Emitting Diode) packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203481270U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103943755A (en) * | 2014-03-20 | 2014-07-23 | 昆山开威电子有限公司 | White light LED packaging structure and packaging method |
| CN105720048A (en) * | 2016-02-19 | 2016-06-29 | 浙江英特来光电科技有限公司 | Packaging method for bonding-wire-free high-color-rendering-index LED lamp filaments and bonding-wire-free high-color-rendering-index LED lamp filaments |
| CN107256912A (en) * | 2017-06-06 | 2017-10-17 | 江苏鸿利国泽光电科技有限公司 | Improve the layering method for packing and layering encapsulation LED of LED light effect |
-
2013
- 2013-09-03 CN CN201320545976.8U patent/CN203481270U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103943755A (en) * | 2014-03-20 | 2014-07-23 | 昆山开威电子有限公司 | White light LED packaging structure and packaging method |
| CN103943755B (en) * | 2014-03-20 | 2017-09-26 | 昆山开威电子有限公司 | A kind of White-light LED package structure and method for packing |
| CN105720048A (en) * | 2016-02-19 | 2016-06-29 | 浙江英特来光电科技有限公司 | Packaging method for bonding-wire-free high-color-rendering-index LED lamp filaments and bonding-wire-free high-color-rendering-index LED lamp filaments |
| CN107256912A (en) * | 2017-06-06 | 2017-10-17 | 江苏鸿利国泽光电科技有限公司 | Improve the layering method for packing and layering encapsulation LED of LED light effect |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20171012 Address after: The Town Lake Anxi County of Quanzhou City, Fujian province 362411 Photoelectric Industrial Park Patentee after: FUJIAN LIGHTNING OPTOELECTRONIC CO., LTD. Address before: Baoan District Shiyan street Shenzhen city Guangdong province 518000 South Road community should be one stone Wentao Science Park building B Patentee before: Lighting Optoectronic(SZ) Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140312 Termination date: 20200903 |