CN201681972U - Light-emitting diode encapsulated by transparent crystal glass - Google Patents
Light-emitting diode encapsulated by transparent crystal glass Download PDFInfo
- Publication number
- CN201681972U CN201681972U CN2010202098444U CN201020209844U CN201681972U CN 201681972 U CN201681972 U CN 201681972U CN 2010202098444 U CN2010202098444 U CN 2010202098444U CN 201020209844 U CN201020209844 U CN 201020209844U CN 201681972 U CN201681972 U CN 201681972U
- Authority
- CN
- China
- Prior art keywords
- light
- chip
- emitting diode
- crystal glass
- pebble
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000005355 lead glass Substances 0.000 title abstract description 13
- 239000011521 glass Substances 0.000 claims description 26
- 238000004806 packaging method and process Methods 0.000 claims description 14
- 241000218202 Coptis Species 0.000 claims description 9
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 8
- 239000004568 cement Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- 239000000843 powder Substances 0.000 abstract 2
- 239000010931 gold Substances 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- 239000004411 aluminium Substances 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000007499 fusion processing Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to the field of lighting. A light-emitting diode encapsulated by transparent crystal glass is composed of a transparent crystal glass block (1), and a chip (2), a support (4), gold wires (5) and fluorescent powder (3) which are all fixed in the transparent crystal glass block; the chip (2) is welded with the support (4) through the gold wire (5), and the fluorescent powder (3) is coated on the chip (2). The light-emitting diode of the utility model has advantages of high utilization rate of light, low cost of production, and wide application of light-emitting diode industry.
Description
Technical field
The utility model relates to the lighting apparatus field.
Background technology
Energy shortage is the hot issue of the world today, and in illuminating industry, the LED light-emitting diode is because multiple advantages such as its efficient, energy-saving and environmental protection, long-life are to replace the energy consumption height, the first-selection of the traditional lighting that the life-span is short.The light emitting diode construction of existing employing pebble glass packaging such as publication number are " CN201141564 ", it is described that name is called " a kind of employing crystal glass encapsulated LED ", comprise the LED on aluminium base and the aluminium base, aluminium base is provided with the bowl-type groove, and LED is located in the bowl-type groove; LED comprises chip and fluorescent material, and chip is fixed on the bottom surface of bowl-type groove, and fluorescent material is coated with and is located at the chip top; The substrate on bowl-type groove top is provided with the crystal glass piece, and the crystal glass piece seals the bowl-type groove.It is the top that the light-emitting diode of existing pebble glass packaging is only used pebble glass packaging chip, be equivalent to one deck crystal film, the aluminium base structure is still adopted in the below, the defective of existing product is that a light part is blocked by aluminium base, the utilance of light is low, has adopted the aluminium base production cost than higher in addition.
Summary of the invention
Goal of the invention of the present utility model is in order to overcome the existing deficiency that adopts the light-emitting diode existence of pebble glass packaging, to provide a kind of utilance height of light, the light-emitting diode of the employing pebble glass packaging that production cost is low.
In order to realize the foregoing invention purpose, the utility model has adopted following technical scheme:
A kind of light-emitting diode that adopts the pebble glass packaging reaches fixing chip, support, gold thread and fluorescent material within it by the pebble glass blocks and constitutes; Chip and support weld by gold thread, and fluorescent material is coated on the chip.
As preferably, described pebble glass blocks is two of being adhesively fixed mutually, and wherein one is provided with the groove of placing chip, and chip is fixed in the groove by insulating cement, and two pebble glass blocks are bonding mutually, process just more convenient.
As preferably, described chip is a plurality of, is connected in parallel on the support by gold thread.
As preferably, the operating voltage of described chip in 3V, crystal glass fusing point height, good heat dissipation effect, there is not heat dissipation problem in few heat that 3V voltage produces, the long service life of light-emitting diodes.
A kind of light-emitting diode that adopts the pebble glass packaging by the technique scheme design, do not re-use traditional aluminium base structure, chip directly is fixed in the groove of pebble glass blocks, the top is adopted the encapsulation of pebble glass blocks again, be that the encapsulation of pebble glass blocks is all adopted at the four sides of chip, the light that sends by crystal glass to six surface launchings, light transmission and can not being blocked arbitrarily, the utilance of light is more than doubled, and production cost reduces greatly.In sum, the advantage of the light-emitting diode of this employing pebble glass packaging is the utilance height of light, and production cost is low.
Description of drawings
Fig. 1: the structural representation of the utility model embodiment.
Fig. 2: the structural representation of placing the pebble glass blocks of chip among the utility model embodiment.
Embodiment
Be described further below in conjunction with accompanying drawing 1, Fig. 2 the utility model.
A kind of light-emitting diode that adopts the pebble glass packaging as shown in Figure 1 and Figure 2 reaches fixing chip 2, support 4, gold thread 5 and fluorescent material 3 within it by pebble glass blocks 1 and constitutes.
The foregoing description only is a better embodiment of the present utility model, and it also can be a plurality of can being 1 as chip 2, and all equalizations of being done according to the utility model claim change and modify, and all should belong to the covering scope of the utility model patent.
Claims (4)
1. a light-emitting diode that adopts the pebble glass packaging is characterized in that reaching fixing chip (2), support (4), gold thread (5) and fluorescent material (3) within it by pebble glass blocks (1) constitutes; Chip (2) welds by gold thread (5) with support (4), and fluorescent material (3) is coated on the chip (2).
2. a kind of light-emitting diode that adopts the pebble glass packaging according to claim 1, it is characterized in that two piece (11,12) of pebble glass blocks (1) for being adhesively fixed mutually, wherein a pebble glass blocks (11) is provided with the groove (13) of placing chip (2), and chip (2) is fixed in the groove (13) by insulating cement.
3. a kind of light-emitting diode that adopts the pebble glass packaging according to claim 1 and 2 is characterized in that chip (2) is a plurality of, is connected in parallel on the support (4) by gold thread (5).
4. a kind of light-emitting diode that adopts the pebble glass packaging according to claim 3, the operating voltage that it is characterized in that chip (2) is in 3V.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202098444U CN201681972U (en) | 2010-05-31 | 2010-05-31 | Light-emitting diode encapsulated by transparent crystal glass |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010202098444U CN201681972U (en) | 2010-05-31 | 2010-05-31 | Light-emitting diode encapsulated by transparent crystal glass |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201681972U true CN201681972U (en) | 2010-12-22 |
Family
ID=43347007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010202098444U Expired - Fee Related CN201681972U (en) | 2010-05-31 | 2010-05-31 | Light-emitting diode encapsulated by transparent crystal glass |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201681972U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104638091A (en) * | 2014-12-18 | 2015-05-20 | 上海大学 | LED (light emitting diode) glass base plate |
| CN104916757A (en) * | 2015-04-09 | 2015-09-16 | 广州市祺虹电子科技有限公司 | TLP making technology |
-
2010
- 2010-05-31 CN CN2010202098444U patent/CN201681972U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104638091A (en) * | 2014-12-18 | 2015-05-20 | 上海大学 | LED (light emitting diode) glass base plate |
| CN104638091B (en) * | 2014-12-18 | 2017-10-24 | 上海大学 | LED glass substrates |
| CN104916757A (en) * | 2015-04-09 | 2015-09-16 | 广州市祺虹电子科技有限公司 | TLP making technology |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201866576U (en) | LED bulb | |
| CN202058732U (en) | High-power LED (light-emitting diode) white light panel with separated chip and fluorescent powder | |
| CN203288644U (en) | Distributed high-voltage LED (Light-Emitting Diode) module group | |
| CN201868426U (en) | LED light source | |
| CN202259395U (en) | LED (light-emitting diode) light source | |
| CN102447049A (en) | LED (light-emitting diode) package structure based on COB (chip on board) package technology and LED illuminator | |
| CN101958387A (en) | Novel LED light resource module packaging structure | |
| CN205752232U (en) | A kind of COB light module | |
| CN205177876U (en) | AC flexible LED filament that gives off light | |
| CN201681972U (en) | Light-emitting diode encapsulated by transparent crystal glass | |
| CN201141564Y (en) | LED adopting crystal encapsulation | |
| CN102738136A (en) | Distributed high-voltage light emitting diode (LED) module | |
| CN206539910U (en) | A kind of LED bulb | |
| CN201717286U (en) | Led light source module packaging structure | |
| CN209418539U (en) | A kind of high-efficient large power LED light source encapsulating structure | |
| CN201513764U (en) | Novel capsulation structure for multiple-wafer paster-type high power LED | |
| CN203477964U (en) | LED area light source lamp emitting light by 360 degrees | |
| CN202633304U (en) | Distributed high-voltage LED die set | |
| CN201758139U (en) | Novel LED light source module packaging structure | |
| CN207781647U (en) | A kind of specular removal White-light LED package structure | |
| CN205177836U (en) | High stable high -voltage ceramic COB LED | |
| CN201804862U (en) | Single three-chip LED particle | |
| CN205303506U (en) | High light efficiency led light source | |
| CN205859624U (en) | Photo engine LED filament | |
| CN204885214U (en) | LED lamp pearl structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: ZHEJIANG SINGBEE LIGHTING TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: WANG YUANCHENG Effective date: 20110707 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 322200 NO. 88, XINGBI AVENUE, ECONOMIC DEVELOPMENT ZONE, PUJIANG COUNTY, ZHEJIANG PROVINCE TO: 322200 NO. 88, XINGBI AVENUE, ECONOMIC DEVELOPMENT ZONE, PUJIANG COUNTY, JINHUA, ZHEJIANG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20110707 Address after: 322200 No. 88, Bi Bi Avenue, Pujiang Economic Development Zone, Jinhua, Zhejiang Patentee after: ZHEJIANG SINGBEE LIGHTING TECHNOLOGY CO., LTD. Address before: 322200 No. 88, Bi Bi Avenue, Pujiang Economic Development Zone, Zhejiang Province Patentee before: Wang Yuancheng |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101222 Termination date: 20160531 |