CN207781647U - A kind of specular removal White-light LED package structure - Google Patents
A kind of specular removal White-light LED package structure Download PDFInfo
- Publication number
- CN207781647U CN207781647U CN201721806409.8U CN201721806409U CN207781647U CN 207781647 U CN207781647 U CN 207781647U CN 201721806409 U CN201721806409 U CN 201721806409U CN 207781647 U CN207781647 U CN 207781647U
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- CN
- China
- Prior art keywords
- chip
- led base
- package structure
- specular removal
- reflective layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of specular removal White-light LED package structures, including LED base, and are located at least two chips of the LED base bottom, are placed in parallel between the chip and chip, and its interval is not less than 1/2 Chip-wide；The LED base bottom be equipped with by the direct Surface Mount of reflecting piece rack inner wall reflective layer, the chip is fixed on by die bond glue-line on reflective layer, it is connected with the lead of positive and negative anodes between the chip and the LED base, fluorescent adhesive layer is filled in the LED base cupulate bowl.Solve the problems, such as that middle low power product light efficiency is low in the prior art, the encapsulating products, light efficiency reaches as high as 230LM/W.
Description
Technical field
The utility model belongs to technical field of semiconductor illumination, is related to a kind of specular removal White-light LED package structure.
Background technology
LED has many advantages, such as that small, low energy consumption, service life is long, environmentally protective.Its core is by P-type semiconductor and N
Type semiconductor group at chip, principle of luminosity is electroluminescence, in the centre of P-type semiconductor and N-type semiconductor there are one transition
Layer, referred to as P-N junction.In P-N junction plus after forward current, free valence electron converts electrical energy into visible radiation with hole-recombination
Energy.
As China prohibits the promulgation of white decree, LED is as new type light source, in will be used wider and wider for lighting area
It is general.But meanwhile market is also higher and higher to the performance requirement of LED component.North America market is especially exported, lamps and lanterns light efficiency is wanted
Ask also higher and higher.And the lamp bead quantity used in lamps and lanterns can not be more often, it is desirable to solve specular removal in potted ends
The problem of.Most of middle low power LED encapsulating products light efficiencies can only achieve 140LM/W currently on the market, this light efficiency can not
Meet market to specular removal, high energy-efficient demand.
Utility model content
The purpose of this utility model is to provide a kind of specular removal White-light LED package structures, in solving in the prior art
The low problem of small-power product light efficiency, the encapsulating products, light efficiency reach as high as 230LM/W.
In order to achieve the above objectives, the embodiments of the present invention adopt the following technical scheme that：
According to one embodiment provided by the utility model, the utility model provides a kind of specular removal white-light LED encapsulation
Structure, including LED base, and at least two chips of the LED base bottom are located at, it is parallel between the chip and chip to put
It sets, and its interval is not less than 1/2 Chip-wide；It is equipped with by the direct Surface Mount of reflecting piece in holder in the LED base bottom
The reflective layer of inner wall, the chip are fixed on by die bond glue-line on reflective layer, are connected between the chip and the LED base
It is connected to the lead of positive and negative anodes, fluorescent adhesive layer is filled in the LED base cupulate bowl.
Further, the LED base is the conical surface or cambered surface.
Further, the reflective layer is the reflective layer of Ag, Al or Au layers of plating or vapor deposition.
Further, the central axes in the chip length direction and holder in the LED base form 0~60 ° of angle.
Further, the chip is bonded in by crystal-bonding adhesive in LED base, and crystal-bonding adhesive is that thermal conductivity is not less than 0.6W/m
The transparent or milky insulating cement of k.
Further, the power at least in two chips per chips is not less than 170mW, the positive and negative anodes of chip by lead simultaneously
Connection is connect with holder positive and negative anodes.
The utility model has the beneficial effects that：No less than two radiant powers are placed on cradling function area reflective layer not
Chip less than 170mW, each chip positive and negative electrode is connect by lead with holder positive and negative anodes, with turned on outside.Chip and chip
Between by lead formed parallel relationship, same electric current driving under, by reduce single chip on by electric current, in turn
So that voltage is reduced, while the light convergence that multiple chips can be sent out, is reflected away, generated more by the high reflection face in cradling function area
High brightness makes encapsulating products light efficiency higher.
Description of the drawings
Attached drawing 1 is the side view of the utility model.
Attached drawing 2 is the vertical view of the utility model.
In figure, 1.LED pedestals, 2. reflective layers, 3. chips, 4. leads, 5. crystal-bonding adhesives, 6. fluorescent adhesive layers.
Specific implementation mode
The utility model is described in detail with reference to the accompanying drawings and detailed description.
As shown in Figure 1 and Figure 2, a kind of specular removal White-light LED package structure, including LED base 1 are set in 1 bottom of LED base
There is reflective layer 2, is equipped with through 5 fixed chip 3 of die bond glue-line on reflective layer, is connected between chip 3 and LED base 1
The lead 4 of positive and negative anodes is filled with fluorescent adhesive layer 6 in 1 cupulate bowl of LED base.
LED base (containing reflection wall) is the conical surface or cambered surface, and the light that chip module is sent out can be made to be assembled in bowl, subtracted
The scattering for having lacked light improves the utilization rate of light beam, and light is made to have stronger directive property.
LED base (contain reflection wall) bottom is equipped with reflective layer, the reflective layer be using plating or evaporation process by Ag, Al,
One kind in Au being plated in holder bowl inner wall；The direct Surface Mount of reflecting piece is either formed into high reflective surface in rack inner wall.It is reflective
Layer can be such that the light of aggregation more reflects away, and reduce light loss, improve the whole light extraction efficiency of LED component.
Include at least two chips in LED base, the power per chips is not less than 170mW, and the positive and negative anodes of chip are logical
Lead parallel connection is crossed to connect with holder positive and negative anodes.
It is placed in parallel between chip and chip, interval is not less than 1/2 Chip-wide.
The central axes in chip length direction and holder in LED base form 0~60 ° of angle.
It is fixedly connected by crystal-bonding adhesive between chip and LED base.Crystal-bonding adhesive is that thermal conductivity is not less than 0.6W/mk
Transparent or milky insulating cement, enable heat that chip P-N junction sends out being conducted to holder by crystal-bonding adhesive preferably, faster
Functional areas conduct in turn, improve the photoelectric conversion efficiency of chip, promote product light efficiency.
Chip positive and negative anodes are attached by lead and holder positive and negative anodes, are formed by lead between chip and chip in parallel
Relationship, under the driving of same electric current, by reduce in single chip by electric current, and then voltage is made to reduce, while more
The light convergence that chip can be sent out, by the high reflection face in cradling function area, generates higher brightness, makes encapsulating products light efficiency more
It is high.
Fluorescent glue uses the mixture of silica gel and fluorescent powder, makes full use of the light transmittance and higher folding that silica gel material is splendid
Rate is penetrated, the luminous efficiency of LED entirety is improved.
The utility model is not limited to above-described embodiment, on the basis of technical solution disclosed by the utility model, this
For the technical staff in field according to disclosed technology contents, not needing performing creative labour can be special to some of which technology
Sign makes some and replaces and deform, these are replaced and deformation is within the protection scope of the present utility model.
Claims (6)
1. a kind of specular removal White-light LED package structure, it is characterised in that：Including LED base, and it is located at the LED base bottom
At least two chips, be placed in parallel between the chip and chip, and its interval be not less than 1/2 Chip-wide；Institute
It states LED base bottom to be equipped with by the direct Surface Mount of reflecting piece in the reflective layer of rack inner wall, the chip fixed by die bond glue-line
On reflective layer, it is connected with the lead of positive and negative anodes between the chip and the LED base, is filled out in the LED base cupulate bowl
Filled with fluorescent adhesive layer.
2. a kind of specular removal White-light LED package structure according to claim 1, it is characterised in that：The LED base is cone
Face or cambered surface.
3. a kind of specular removal White-light LED package structure according to claim 1, it is characterised in that：The reflective layer is electricity
The reflective layer of Ag, Al or Au layers of plating or vapor deposition.
4. a kind of specular removal White-light LED package structure according to claim 1, it is characterised in that：In the LED base
Chip length direction and the central axes of holder form 0~60 ° of angle.
5. a kind of specular removal White-light LED package structure according to claim 1, it is characterised in that：The chip passes through solid
For brilliant glue sticking in LED base, crystal-bonding adhesive is the transparent or milky insulating cement that thermal conductivity is not less than 0.6W/mk.
6. a kind of specular removal White-light LED package structure according to claim 1, it is characterised in that：In at least two chips
Power per chips is not less than 170mW, and the positive and negative anodes of chip are connect by lead parallel connection with holder positive and negative anodes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721806409.8U CN207781647U (en) | 2017-12-21 | 2017-12-21 | A kind of specular removal White-light LED package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721806409.8U CN207781647U (en) | 2017-12-21 | 2017-12-21 | A kind of specular removal White-light LED package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207781647U true CN207781647U (en) | 2018-08-28 |
Family
ID=63228228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721806409.8U Active CN207781647U (en) | 2017-12-21 | 2017-12-21 | A kind of specular removal White-light LED package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207781647U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114242848A (en) * | 2021-11-17 | 2022-03-25 | 深圳市源磊科技有限公司 | LED packaging method and LED lamp |
-
2017
- 2017-12-21 CN CN201721806409.8U patent/CN207781647U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114242848A (en) * | 2021-11-17 | 2022-03-25 | 深圳市源磊科技有限公司 | LED packaging method and LED lamp |
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190108 Address after: 710075 28 Gaoxin 6 Road, Xi'an High-tech Zone, Shaanxi Province Patentee after: Shaanxi Electronic Information Group Photoelectric Technology Co., Ltd. Address before: 710077 No. 125 Jinye Road, Xi'an High-tech Zone, Shaanxi Province Patentee before: Shaanxi Optoelectronics Technology Co., Ltd. |