CN203839378U - Flip-chip adopting LED lamp - Google Patents

Flip-chip adopting LED lamp Download PDF

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Publication number
CN203839378U
CN203839378U CN201420220607.6U CN201420220607U CN203839378U CN 203839378 U CN203839378 U CN 203839378U CN 201420220607 U CN201420220607 U CN 201420220607U CN 203839378 U CN203839378 U CN 203839378U
Authority
CN
China
Prior art keywords
flip
junction
chip
substrate
led lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420220607.6U
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Chinese (zh)
Inventor
李文博
缪勇斌
邹军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHEJIANG EMITTING OPTOELECTRONIC TECHNOLOGY Co Ltd
Original Assignee
ZHEJIANG EMITTING OPTOELECTRONIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ZHEJIANG EMITTING OPTOELECTRONIC TECHNOLOGY Co Ltd filed Critical ZHEJIANG EMITTING OPTOELECTRONIC TECHNOLOGY Co Ltd
Priority to CN201420220607.6U priority Critical patent/CN203839378U/en
Application granted granted Critical
Publication of CN203839378U publication Critical patent/CN203839378U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a flip-chip adopting LED lamp comprising a lamp cover, wherein an excitation substrate is mounted in the lamp cover, a number of LED chips are mounted on the excitation substrate, and the outer periphery of the excitation substrate is packaged through a transparent cover body which is provided with a fluorescent powder layer, the LED chips are flip chips; each flip chip comprises two support racks that are the same in size, the near ends of the two support racks are coated with electric conduction adhesives that are used for connecting with a substrate and a PN junction, a sapphire is mounted on the PN junction, and the end face of the bottom end of the sapphire is connected with the top face of the PN junction. According to the flip-chip adopting LED lamp, the LED chips are improved in structure, and therefore improved heat conductivity and increased electric current diffusion speed are achieved.

Description

A kind of LED lamp that adopts flip-chip
Technical field
The utility model relates to LED field of light fittings, specifically, specially refers to a kind of LED lamp that adopts flip-chip.
Background technology
LED be called as the 4th generation lighting source or green light source, along with the development of LED, LED is energy-conservation owing to having, power saving, high efficiency, the reaction time is fast, life cycle is long and not mercurous, has the advantages such as environmental benefit and enjoys the concern of all circles.At present, LED is widely used in the fields such as various instructions, demonstration, decoration, backlight, general lighting and urban landscape.
The defect of traditional LED light fixture is:
1. support is connected by wire with PN junction, causes current spread speed excessively slow.
2. the structural design of support, sapphire and PN junction is improper, causes in complex manufacturing.
3. traditional production technology is not reverse installation process, the support that need vary in size and PN junction, and therefore the positive and negative electrode of whole LED chip varies in size, and affects useful life.
Utility model content
The purpose of this utility model is for deficiency of the prior art, provides a kind of LED lamp that adopts flip-chip, to address the above problem.
The technical problem that the utility model solves can realize by the following technical solutions:
A LED lamp that adopts flip-chip, comprises lampshade, in described lampshade, be provided with and excite substrate, described in excite some LED chips be installed on substrate, described in excite the periphery of substrate to be encapsulated by transparent cover, on described transparent cover, be provided with phosphor powder layer; Described LED chip is flip-chip, it comprises two measure-alike supports, scribbles conductive adhesive at the near-end of two supports, and described conductive adhesive is for connection substrate and PN junction, sapphire is installed on PN junction, and described sapphire bottom end face is connected with the end face of PN junction.
Further, described PN junction comprises Part I and Part II, and the size shape of described Part I and Part II is identical, and is connected with the support of both sides respectively.
Further, described conductive adhesive is alloy tin cream.
Compared with prior art, the beneficial effects of the utility model are as follows:
1.PN knot is directly connected with support by conductive adhesive, and current spread is fast.
2. support, PN junction and sapphire set gradually from the bottom to top, and thermal conductivity is high.
3. adopt reverse installation process, the support that preferred dimension is identical and PN junction, long service life.
Brief description of the drawings
Fig. 1 is the schematic diagram of the LED lamp of employing flip-chip described in the utility model.
Fig. 2 is the schematic diagram of LED chip described in the utility model.
Number in the figure explanation: excite substrate 1, LED chip 2, transparent cover 3, phosphor powder layer 4, conductive adhesive 5, PN junction 6, sapphire 7.
Embodiment
For technological means, creation characteristic that the utility model is realized, reach object and effect is easy to understand, below in conjunction with embodiment, further set forth the utility model.
Referring to Fig. 1 and Fig. 2, a kind of LED lamp that adopts flip-chip described in the utility model, comprise lampshade, in described lampshade, be provided with and excite substrate 1, described exciting is provided with some LED chips 2 on substrate 1, the described periphery that excites substrate 1 is encapsulated by transparent cover 3, on described transparent cover 3, is provided with phosphor powder layer 4; Described LED chip 2 is flip-chip, it comprises two measure-alike supports, scribble conductive adhesive 5 at the near-end of two supports, described conductive adhesive 5 is for connection substrate and PN junction 6, sapphire 7 is installed on PN junction 6, and the bottom end face of described sapphire 7 is connected with the end face of PN junction 6.
It is pointed out that described PN junction 6 comprises Part I and Part II, the size shape of described Part I and Part II is identical, and is connected with the support of both sides respectively.Owing to adopting reverse installation process, more convenient in the time producing, life of product is higher.
In addition, described conductive adhesive 5 is alloy tin cream, and it is Halogen and lead not, at high temperature can not produce pollutant, more environmental protection.
More than show and described general principle of the present utility model and principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; that in above-described embodiment and specification, describes just illustrates principle of the present utility model; do not departing under the prerequisite of the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.

Claims (3)

1. one kind adopts the LED lamp of flip-chip, it is characterized in that: comprise lampshade, in described lampshade, be provided with and excite substrate, described in excite some LED chips be installed on substrate, the described periphery that excites substrate is encapsulated by transparent cover, on described transparent cover, is provided with phosphor powder layer; Described LED chip is flip-chip, it comprises two measure-alike supports, scribbles conductive adhesive at the near-end of two supports, and described conductive adhesive is for connection substrate and PN junction, sapphire is installed on PN junction, and described sapphire bottom end face is connected with the end face of PN junction.
2. the LED lamp of employing flip-chip according to claim 1, is characterized in that: described PN junction comprises Part I and Part II, the size shape of described Part I and Part II is identical, and is connected with the support of both sides respectively.
3. the LED lamp of employing flip-chip according to claim 1, is characterized in that: described conductive adhesive is alloy tin cream.
CN201420220607.6U 2014-04-30 2014-04-30 Flip-chip adopting LED lamp Expired - Fee Related CN203839378U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420220607.6U CN203839378U (en) 2014-04-30 2014-04-30 Flip-chip adopting LED lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420220607.6U CN203839378U (en) 2014-04-30 2014-04-30 Flip-chip adopting LED lamp

Publications (1)

Publication Number Publication Date
CN203839378U true CN203839378U (en) 2014-09-17

Family

ID=51517183

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420220607.6U Expired - Fee Related CN203839378U (en) 2014-04-30 2014-04-30 Flip-chip adopting LED lamp

Country Status (1)

Country Link
CN (1) CN203839378U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104465634A (en) * 2014-12-04 2015-03-25 中山市川祺光电科技有限公司 Chip pasting structure of SMD LED lamp and manufacturing method thereof
CN111081845A (en) * 2019-12-25 2020-04-28 温州大学新材料与产业技术研究院 Quantum dot material LED filament and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104465634A (en) * 2014-12-04 2015-03-25 中山市川祺光电科技有限公司 Chip pasting structure of SMD LED lamp and manufacturing method thereof
CN111081845A (en) * 2019-12-25 2020-04-28 温州大学新材料与产业技术研究院 Quantum dot material LED filament and preparation method thereof

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140917

Termination date: 20170430

CF01 Termination of patent right due to non-payment of annual fee