CN208750435U - A kind of on-chip power type LED light with 4 π luminescent screens - Google Patents

Abstract

The utility model provides a kind of on-chip power type LED light with 4 π luminescent screens, including bulb housing, the core print seat with exhaust pipe, capacitor, lamp cap and a 4 π LED lighting boards.4 π LED lighting boards are placed in the bulb housing of sealing by the utility model, safe and reliable；And the capacitor of the utility model, power utilization rate is improved using capacitor filtering feature and capacitor is placed in lamp cap, solves the problems, such as that capacitor is easy to damage under high temperature environment.And the fluorescent adhesive layer containing thermal-radiating material is arranged in the tow sides of the 4 π LED lighting board, the heat that LED chip and driver generate can be directly converted into 2 ~ 20 μm of infrared waves, then the silicate Glass blister through ir transmissivity greater than 0.8 is transmitted in ambient enviroment；It in addition it can which gaseous exchange is transmitted in glass bulb by the high thermal conductivity gas in bulb housing, and then is transmitted in ambient enviroment, multi-faceted realization heat dissipation.

Description

A kind of on-chip power type LED light with 4 π luminescent screens

Technical field

The utility model relates to arrive lighting technical field, more particularly to a kind of on-chip power type with 4 π luminescent screens LED light.

Background technique

The appearance of tungsten lamp of 19th century leads the whole world to come into the artificial light epoch.Occur from 20th century revolutionary New light sources-LED, by feat of energy conservation and environmental protection, the advantages that service life is long, becomes much more popular rapidly illumination market, LED at the following mainstream photograph Mingguang City source is widely used in commercial lighting, industrial lighting, outdoor lighting etc..But previous LED light source, as plug-in unit LED, patch Piece LED, COB(Chip On Board, chip on board encapsulation), the LED lamp beads such as integrated high-power, in the light that lens etc are not added It all can only be planar light source in the case of learning device.

2008, Japanese oxtail light source was released with the bulb-type lamps and lanterns of incandescent lamp prototype configuration LED filament." LED filament The appearance of lamp " really realizes 360 degree of full angle light-emitting 3 D light sources, meets the luminous demand of client's full view, brings preceding institute The lighting experience that does not have and more energy saving.Take the lead in releasing simultaneously volume production from Japanese oxtail light source, using LED filament as the candle of light source The gradually favor by more and more consumer on the market of the products such as lamp, bulb housing.

The LED light-emitting section that existing LED light generally uses 4 π luminous is sealed in the blister filled with gas, and by driver In lamp cap.Its 4 π luminous LED light-emitting section is usually the transparent substrate of strip, is distributed the luminous LED chip of 4 π thereon, and It is wrapped up with phosphor powder layer to realize that 4 π shine.

However, there is following problems for existing LED light, the further development of LED light is constrained.

First is that heat dissipation problem.The heat of LED light is mainly generated by the power device of LED chip and driving circuit.Existing skill The LED light of art generally uses the power-type LED of low-voltage, high-current, one PN junction of a LED chip, and operating current arrives greatly 0.35A very To several A, 1W to several W or bigger electrical power is concentrated on the chip of 1 to several square millimeters, and its external quantum efficiency only only has About 30%, in addition the energy of photon and the photon being finally emitted that the energy difference of injection electronics and the photon of generation, PN junction generate Difference has about 70% electrical power to will convert to heat, how this large amount of heat dissipation is fallen the crucial problem of always LED filament lamp One of.LED is semiconductor devices, and the junction temperature of PN junction, which increases, will lead to luminous efficiency declines rapidly, even burns PN junction, and As temperature increases, the silica gel for wrapping up LED chip will will appear cracking problem, and directly affect LED filament lamp uses the longevity Life.

For single led, if heat concentrates on effectively shedding in small-sized chip, it will lead to Chip temperature increases, and the non-uniform Distribution, chip light emitting efficiency and fluorescent powder lasing efficiency of thermal stress is caused to decline.Study table Bright: when temperature is more than certain value, the crash rate of device will exponentially rule rise, and component temperature is every to rise 2 DEG C, reliability decrease 10%.In order to guarantee the service life of device, generally require PN junction junction temperature at 110 DEG C or less.With the temperature rise of PN junction, white light LED part Emission wavelength red shift will occur.Statistics shows: 100 DEG C at a temperature of, wavelength can with 4 ~ 9nm of red shift, so as to cause YAG fluorescent powder is increased with temperature, leads to the non-radiative increase of fluorescent powder, and conversion light energy is reduced, so that decrease in efficiency, Total luminous intensity can be reduced, and white light coloration is deteriorated.In near room temperature, temperature is every to increase 1 DEG C, and the luminous intensity of LED can be corresponding Reduce 1% or so in ground.

Second is that the problem that power-efficient is low.Existing LED light is powered using AC power source, and LED is one with PN junction The semiconductor devices of structure has barrier potential, and which forms turn-on threshold voltage, the voltage value being added on LED is more than this LED just can be sufficiently conductive when a threshold voltage.By taking alternating current 220V as an example, when using 220V mains-supplied, due to alternating current Voltage changes according to SIN function rule, and the threshold voltage of LED is 1.2 times of average voltage 220V, i.e. 260 ~ 280V works as voltage When lower than this numerical value, LED light can't be bright, therefore its power-efficient is only 30% or so.

Third is that the stroboscopic problem of LED light.As described above, LED light would not be bright when voltage is lower than the threshold voltage of LED, Thus stroboscopic problem is just brought, harm is brought to human body.To solve stroboscopic problem, someone joined filtered electrical in the drive Hold, solves stroboscopic problem.But capacitor is the device very sensitive to temperature, the hot environment in LED light can reduce capacitor Service life, thereby reduce the service life of LED light.

Fourth is that the driver of existing LED light is generally placed upon in lamp cap, and lamp cap is conductive metal, so driver will cover It can be put into lamp cap after upper insulation sleeve, need manual operations, process is loaded down with trivial details, low efficiency, and due to the narrow space in lamp cap, Make the bonding space of lamp cap and bulb housing inadequate after being put into driver, adhesive fastness decline, be easy to fall off, and bonding need through 300 degree of high temperature is crossed, this is big to the aging effects of the electronic device in driver, and resultant fault rate is high.

In order to solve this problem, also someone is by on-chip power to bulb housing, but as described above, capacitor in driver It is the device very sensitive to temperature, and LED light is at work, the temperature in bulb housing can be very high, it is be easy to cause capacitance damage, Influence the service life of LED light.On the other hand, the volume of capacitor is also bigger, is mounted on inside bulb housing and will also result in production Process complications.

Fifth is that existing LED light is generally used with standoff stem, the bracket is the glass for extending into light bulb center Bracket, LED filament dispersion are fixed on glass supporter.LED filament is a kind of fine and small industrial part product, is had only certainly Dynamicization production of machinery is just able to maintain their consistency, reliability.Therefore the production of filament substrate, pin and bracket peace Dress, the binding die bond of LED lamp bead, gold thread connection, fluorescent powder wrap up in painting etc. all should industrialization automatic production machine device equipment in from It is dynamic to complete.Existing LED filament one end is welded on pedestal upper end, and the other end is welded on core print seat lower end, and welding point is divided into up and down Both ends, and existing LED filament generally uses series connection or in series and parallel to adapt to the requirement of voltage, this just needs more LED filaments, Welding point further increases, and wick assembling is more complicated.

In conclusion the prior art needs further to improve and send out to enable LED light further to be developed Exhibition.

Utility model content

Utility model aims to solve in terms of at least one of the above-mentioned problems in the prior art and defect. Correspondingly, excellent, simple production process that the purpose of the utility model is to provide a kind of heat dissipation performances, without stroboscopic, power-efficient it is high, 4 π with long service life luminous LED light.

To solve the above problems, the technical solution of the utility model is as follows:

A kind of on-chip power type LED light with 4 π luminescent screens, including bulb housing, the core print seat with exhaust pipe, capacitor, Lamp cap and a 4 π LED lighting boards；The bulb housing and core print seat vacuum sealing form vacuum sealing cavity, the vacuum sealing High thermal conductivity gas is equipped in cavity；The 4 π LED lighting board is located at vacuum sealing inside cavity, passes through at least two wires Be fixed on core print seat, if the 4 π LED lighting board include plate type substrate and the driver being arranged on the plate type substrate and A dry LED chip, the plate type substrate be it is transparent, the driver is electrically connected with LED chip, and the LED chip is mutually gone here and there Connection or series-parallel connection, the tow sides of the 4 π LED lighting board are provided with fluorescent adhesive layer, and the fluorescent adhesive layer includes refractive index Greater than 1.4 and thermal emissivity rate is greater than 0.8 thermal-radiating material；Capacitor setting is in the vacuum-sealed cavity lamp cap in vitro It is interior, it is electrically connected by the metal wire with the driver.

Further, the plate type substrate is rectangular substrate, square substrate, circular substrate, elliptical base or irregular Any one of shaped substrates, the plate type substrate are transparent glass substrate, appointing in transparent or semitransparent ceramic substrate It is a kind of.

Further, the plate type substrate be vertically put, level is put or is tilted and is put.

Further, the one or both sides of the 4 π luminescent screen are arranged in the LED chip.

Further, the quantity of the metal wire is 2 or 4.

Further, the fluorescent adhesive layer includes fluorescent powder, thermal-radiating material and colloid, the matter of the thermal-radiating material Amount accounts for the 0.5 ~ 10% of the fluorescent adhesive layer gross mass；The quality of the fluorescent powder accounts for the 25 ~ 45% of the fluorescent adhesive layer gross mass； The quality of the colloid accounts for the 45 ~ 74.5% of the fluorescent adhesive layer gross mass.

Further, the thermal-radiating material refractive index is by mica powder, boron nitride, aluminium oxide, silica or calcirm-fluoride One or more compositions, can also by one of mica powder and boron nitride, aluminium oxide, silica or calcirm-fluoride or it is a variety of covalently Key is combined into.

Further, the bulb housing is the silicate Glass blister that ir transmissivity is greater than 0.8.

Further, the driver further includes actuator housing and driving circuit；The driving circuit is located at driver The inside of shell, the driving circuit are any one of resistance-capacitance depressurization power supply, linear constant current power supply or switch constant-current supply.

Further, the bulb housing uses A type blister, G type blister, PAR type blister, T-type blister, candle type blister, p-type Blister, PS type blister, BR type blister, ER type blister or BRL type blister；The lamp cap uses E12 type, E14 type, E27 type, E26 Type, E40 type, GU type, BX type, BA type, EP type, EX type, GY type, GX type, GR type, GZ type or G type.

The beneficial effects of the utility model include:

Securely and reliably, the service life is long.A kind of on-chip power type LED light with 4 π luminescent screens provided by the utility model, will Driver is arranged in 4 π LED lighting boards and is both placed in the bulb shell of sealing, since high working voltage is isolated in blister It is interior, it is safe and reliable, it overcomes existing LED bulb radiator and is easy band high-voltage electricity, unsafe problem；Driver is placed on In the biggish bulb shell in space, the bonding of lamp cap and bulb shell is not influenced, to keep the bonding of lamp cap and bulb shell white with tradition The Binder Phase of vehement lamp is same, and machine can be used and assembled, production efficiency is substantially increased, and can also ensure the electronics device of driver The part service life.And driver and LED filament are sealed in inert gas filled blister, and it can also be to avoid the water of ambient enviroment The influence of vapour etc., long service life.

High production efficiency.The utility model uses 4 π LED lighting boards, is arranged on transparent plate type substrate to connect or go here and there Several LED chips that mode in parallel is electrically connected realize that 360 degrees omnidirection shines, can integrate the LED of multi-quantity, weld Point is few, simplifies production technology, substantially increases production efficiency.And the existing LED light using light-emitting section, it puts on each light-emitting section The LED chip limited amount put can only be combined with a plurality of light-emitting section, and every light-emitting section both ends require to weld, and produce work Skill is complicated.

Good heat dissipation effect.For the heat dissipation problem that driver and LED chip generate, the utility model shines in 4 π LED The tow sides of plate are provided with fluorescent adhesive layer, combine thermal-radiating material in the fluorescent glue, can be directly by LED chip and fluorescence The heat that glue generates is converted into 2 ~ 20 μm of infrared waves, then saturating greater than 0.8 silicate Glass blister through ir transmissivity It is mapped in ambient enviroment, without additional setting radiator or spraying thermal dispersant coatings, and heat dissipation performance is good；Moreover, bulb housing Interior high thermal conductivity gas can also be conducted heat in glass bulb by gaseous exchange, and then be transmitted to ambient enviroment In, multi-faceted realization heat dissipation.

Power utilization rate is high.The driver of the utility model is also connect with capacitor, when rectified voltage is higher than capacitance voltage When capacitor charging, when rectified voltage be lower than capacitance voltage when capacitor discharge, keep output voltage basicly stable, thus using capacitor filter Wave characteristic improves power utilization rate, and the utility model is by capacitor setting in the vacuum-sealed cavity lamp cap in vitro It is interior, it solves the problems, such as that capacitor is easy to damage under high temperature environment, improves capacitor service life, also solved while improving power-efficient It has determined stroboscopic problem.

Detailed description of the invention

Fig. 1 is to be shown according to the structure of the on-chip power type LED light with 4 π luminescent screens of one embodiment of utility model It is intended to.

Fig. 2 shows according to the structure of the on-chip power type LED light with 4 π luminescent screens of another embodiment of utility model It is intended to.

Fig. 3 is the structural schematic diagram of 4 π LED lighting board of on-chip power type.

Fig. 4 is the side structure schematic diagram of 4 π LED lighting board of on-chip power type.

Fig. 5 is the schematic diagram of the section structure of 4 π LED lighting boards.

Fig. 6 is the circuit diagram of the on-chip power type LED light with 4 π luminescent screens of the utility model.

Fig. 7 is the structure principle chart of the on-chip power type LED light with 4 π luminescent screens of the utility model.

Description of symbols: 1, bulb housing；2, core print seat；3, capacitor；4, lamp cap；5,4 π LED lighting board；6, high thermal conductivity Gas；7, metal wire；21, exhaust pipe；51, LED chip；52, plate type substrate；53, electric connection line；54, fluorescent adhesive layer；55, it drives Dynamic device.

Specific embodiment

The embodiments of the present invention is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein Same or similar label indicates same or similar element or element with the same or similar functions from beginning to end.Lead to below It crosses the embodiment being described with reference to the drawings to be exemplary, is only used for explaining the utility model, and should not be understood as practical to this Novel limitation.

In the description of the present invention, it should be understood that term " center ", " longitudinal direction ", " transverse direction ", " length ", " width Degree ", " thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", etc. The orientation or positional relationship of instruction is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description the utility model It is described with simplifying, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific orientation structure It makes and operates, therefore should not be understood as limiting the present invention.In the description of the present invention, it should be noted that Unless otherwise clearly defined and limited, term " installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be fixed Connection, may be a detachable connection, or be integrally connected；Can be mechanical connection, be also possible to electrical connection or can be mutual Communication；It can be directly connected, the connection inside two elements or two can also be can be indirectly connected through an intermediary The interaction relationship of element.For the ordinary skill in the art, above-mentioned term can be understood as the case may be Concrete meaning in the present invention.

In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or it "lower" may include that the first and second features directly contact, and also may include that the first and second features are not direct contacts but lead to Cross the other characterisation contact between them.Moreover, fisrt feature includes above the second feature " above ", " above " and " above " One feature is right above second feature and oblique upper, or is merely representative of first feature horizontal height higher than second feature.First is special Sign is directly below and diagonally below the second feature including fisrt feature under the second feature " below ", " below " and " below ", or only Indicate that first feature horizontal height is less than second feature.

Following disclosure provides many different embodiments or example is used to realize the different structure of the utility model. In order to simplify the disclosure of the utility model, hereinafter the component of specific examples and setting are described.Certainly, they are only Example, and purpose does not lie in limitation the utility model.In addition, the utility model can in different examples repeat reference numerals And/or reference letter, this repetition are for purposes of simplicity and clarity, itself not indicate discussed various embodiments And/or the relationship between setting.In addition, the example of various specific techniques and material that the utility model provides, but this Field those of ordinary skill can be appreciated that the application of other techniques and/or the use of other materials.

Fig. 1 is one embodiment according to the on-chip power type LED light with 4 π luminescent screens of the utility model.The tool Have the on-chip power type LED light of 4 π luminescent screens, including bulb housing 1, the core print seat 2 with exhaust pipe 21, capacitor 3, lamp cap 4 and One 4 π LED lighting board 5.In practical applications, bulb housing 1 and 2 joint place of core print seat utilize high-temperature heating treatment by the two Sealing constitutes vacuum sealing cavity, and technique is identical as the sealing technique of traditional incandescent lamp, and details are not described herein.It is sealing When, after exhaust pipe 21 vacuumizes vacuum sealing cavity, it is filled with high thermal conductivity gas 6.High thermal conductivity gas 6 is helium or hydrogen The mixed gas of gas or helium and hydrogen, any one value of the gas pressure between 50-1520 Torr at room temperature, is easy Effective heat loss through convection is formed, the heat generated when 4 π LED lighting boards 5 are worked is taken away, and further, each component is by helium It waits inert gas shieldings and is vacuum sealed, therefore do not influenced completely by steam in ambient enviroment, so that LED service life is more It is long.

In practical applications, referring to Fig. 1 or Fig. 2, exhaust pipe 21 is located at the inside of core print seat 2, and the end port of exhaust pipe 21 is set There is sealing head.

In practical applications, there is no extend into bulb housing for fixing the long and narrow of LED filament in the prior art for core print seat 2 Internal pillar or bracket, the fixed point of 4 π LED lighting boards 5 is on the same plane of 2 upper end of core print seat.Carrying out wick assembling When technique, 4 π LED lighting boards 5 can be directly welded at 2 upper end of core print seat by metal wire 7, and welding point is few, simplify production work Skill.In practical applications, metal wire 7 can be two or four, and in the present embodiment, metal wire is four, so that 4 π LED are sent out Fixation of the tabula rasa 5 on core print seat 2 is stronger.Preferably, hardware metal can be used in metal wire 7, to reinforce its mechanical strength, guarantees The fixed stability of 4 π LED lighting boards 5.

As shown in Figure 1,4 π LED lighting boards 5 are located at vacuum sealing inside cavity, it is fixed on core print seat 2 by metal wire 7,4 π LED lighting board 5 includes transparent plate type substrate 52.Preferably, plate type substrate 52 can vertically be put, level is put or is tilted It puts.In the present embodiment, plate type substrate 52 is vertically to put.Preferably, plate type substrate 52 can be rectangular substrate, rectangular base Any one of plate, circular substrate, elliptical base or irregular shape substrate, in the present embodiment, plate type substrate 52 are square Shape substrate.Further, plate type substrate 52 is transparent glass substrate or transparent ceramic substrate, is also possible to translucent pottery Porcelain substrate, the light that several LED chips 51 being arranged on plate type substrate 52 issue is emitted to transparent substrate, comprehensive to realize Light i.e. 4 π shine out, and since vacuum sealing inside cavity is filled with the progress rapid cooling of high thermal conductivity gas 6, without that can hold The transparent glass or crystalline ceramics material used by the material for the high temperature that LED chip 51 generates, the transparent substrate 52 of the utility model Material more par, can substantially reduce the cost of manufacture of 4 π LED lighting boards 5, and in the present embodiment, transparent substrate 52 is transparent glass Glass substrate.

As shown in Figure 1,4 π LED lighting boards 5 further include the driver 55 being arranged on plate type substrate 52 and several LED cores Piece 51.In practical applications, driver 55 may include actuator housing and driving circuit, and the driving circuit is located at driver The inside of shell, the driving circuit are any one of resistance-capacitance depressurization power supply, linear constant current power supply or switch constant-current supply, sheet In embodiment, the driving circuit is linear constant current power supply, as shown in fig. 7, the bridge rectifier of specially four diodes. Several LED chips 51 are connected by electric connection line 53 or series-parallel mode is electrically connected, further, driver 55 and string The LED chip group electrical connection that connection or series-parallel mode are electrically connected.As shown in fig. 7, the chipset is in parallel with capacitor 3 again, Power utilization rate is improved using capacitor filtering feature, the circuit theory is as shown in Figure 6.

As shown in figure 3, driver 55 is electrically connected with LED chip group is encapsulated in 4 π LED lighting boards 5 by fluorescent adhesive layer 54 On.As shown in Figure 1, capacitor 3 is arranged in the external lamp cap 4 of vacuum-sealed cavity, driver 55 and capacitor 3 pass through metal wire 7 electrical connections.In the embodiment shown in fig. 1, driver 55 and capacitor 3 pass through four wires 7, two wires therein Electrical connection.In practical applications, LED chip 51 is blue-light LED chip, red LED chip, green LED chip, yellow light LED core One of piece, purple LED chip or any combination thereof.Further, LED chip 51 be arranged in plate type substrate 52 one side or Two sides, in the embodiment in figure 1, the LED chip group that driver 55 is electrically connected with series connection or series-parallel mode is by fluorescent glue Layer 54 is encapsulated on the single side of plate type substrate 52, and 360 degrees omnidirection can be realized with small number of LED chip 51 and shine, Luminous efficiency is high.

As shown in figure 3, the tow sides of the 4 π LED lighting board 5 are provided with fluorescent adhesive layer 54, to guarantee filament whole quilt Phosphor powder layer package will not leak blue light.Further, the fluorescent adhesive layer 54 includes fluorescent powder, thermal-radiating material and colloid, The quality of the thermal-radiating material accounts for the 0.5 ~ 10% of the fluorescent adhesive layer gross mass；The quality of the fluorescent powder accounts for the fluorescence The 25 ~ 45% of glue-line gross mass；The quality of the colloid accounts for the 45 ~ 74.5% of the fluorescent adhesive layer gross mass.

In practical applications, wherein the fluorescent powder is YAG series bloom, yellowish green powder or silicate series bloom, yellowish green Powder, orange powder or nitride, nitrous oxides series rouge and powder or YAG series phosphor powder, silicate series fluorescent powder, nitride, nitrogen oxygen Any combination of compound series phosphor powder, the partial size of the fluorescent powder are 5 ~ 20um.

In practical applications, the thermal-radiating material refractive index is greater than 1.4 and thermal emissivity rate is greater than 0.8, it is preferable that by cloud One of female powder, boron nitride, aluminium oxide, silica or calcirm-fluoride or a variety of compositions, can also be by mica powder and boron nitride, oxidation One of aluminium, silica or calcirm-fluoride or a variety of Covalent bonding togethers form, mica powder and other thermal-radiating materials by key with Combination between key has more stable structure, and mica powder is also used as good dispersing agent and coupling agent, will Thermal-radiating material and fluorescent powder are evenly dispersed among colloid.

Wherein, the colloid is methyl class organic silica gel or phenyl class organic silica gel, such as can be organic silica gel, epoxy One of resin, modified epoxy, plastics, transparent adhesive tape, the colored varnish and polymer are a variety of.Due to this kind of glue and the glass The optical index of glass substrate or translucent ceramic substrate is close, and light loss of the LED emergent light on each medium interface is seldom, because And the 4 π light emission rates of LED are high.

Correspondingly, bulb housing 1 is the silicate Glass blister that ir transmissivity is greater than 0.8, silicate Glass bubble is gathered around There is good ir transmissivity, ir transmissivity is 0.9 or more, can efficiently easily when heat is converted into infrared waves Ground is sent out.In practical applications, bulb housing 1 can be transparent bulb case, milky white blister, frosted according to different requirements, Blister, coloured blister, part of the surface have the blister in reflecting layer, part of the surface has the blister of prism, part of the surface is with saturating The blister or silicon systems blister of mirror.

In practical applications, according to different requirements, bulb housing 1 can using A type blister, G type blister, PAR type blister, T-type blister, candle type blister, p-type blister, PS type blister, BR type blister, ER type blister or BRL type blister；The lamp cap uses E12 type, E14 type, E27 type, E26 type, E40 type, GU type, BX type, BA type, EP type, EX type, GY type, GX type, GR type, GZ type or G Type, to adapt to different lamp holders.As shown in Figure 2 or Figure 3, the bulb housing 1 in these embodiments using A60 model light bulb Shell is one of the bulb housing of existing light bulb.

Fig. 2 is another embodiment according to the on-chip power type LED light with 4 π luminescent screens of the utility model.At this In embodiment, plate type substrate 52 is put for level.Preferably, in the present embodiment, 4 π LED lighting boards 5 are fixed on core print seat 2 Metal wire 7 is four, to enhance the stability of horizontal positioned plate type substrate 52.In the present embodiment, plate type substrate 52 is ellipse The LED chip group that circle, series connection or series-parallel mode are electrically connected is encapsulated in driver 55 by fluorescent adhesive layer 54 board-like Substrate 52 and core print seat 2 can be realized 360 degrees omnidirection with small number of LED chip 51 and shine with respect on the reverse side of that side.This Other settings in embodiment are identical as the embodiment in Fig. 1.

Driver 55 is arranged in 4 π LED lighting boards 5 and is both placed in the bulb housing 1 of sealing by the utility model, by It is isolated in blister in high working voltage, it is safe and reliable, it overcomes existing LED bulb radiator and is easy band high-voltage electricity, no The problem of safety；The utility model uses 4 π LED lighting boards, is arranged on transparent plate type substrate to connect or series-parallel side Several LED chips 51 of formula electrical connection, can integrate the LED of multi-quantity, and pad is few, simplify production technology, greatly improve Production efficiency；Wherein the tow sides of the 4 π LED lighting board 5 are provided with fluorescent adhesive layer 54, combine heat in the fluorescent glue The heat that LED chip 51 and fluorescent adhesive layer 54 generate directly can be converted into 2 ~ 20 μm of infrared waves, then penetrated by radiative material Silicate Glass blister of the ir transmissivity greater than 0.8 is transmitted in ambient enviroment, without additional setting radiator or spray Thermal dispersant coatings are applied, and heat dissipation performance is good, the high thermal conductivity gas in bulb housing 1 can also be conducted heat by gaseous exchange It onto glass bulb, and then is transmitted in ambient enviroment, multi-faceted realization heat dissipation；And the driver 55 and capacitor of the utility model Device 3 connects, and the capacitor charging when rectified voltage is higher than capacitance voltage, when rectified voltage is lower than capacitance voltage, capacitor discharges, and makes Output voltage is basicly stable, power utilization rate is thus improved using capacitor filtering feature, and capacitor is arranged in vacuum Outside seal cavity in the lamp cap, solve the problems, such as, raising electricity easy to damage under high temperature environment to the capacitor that temperature is very sensitive Hold service life, and then improves power-efficient and solve LED light stroboscopic problem.

It should be understood that the application of the utility model is not limited to above-mentioned citing, those of ordinary skill in the art are come It says, it can be modified or changed according to the above description, and all these modifications and variations all should belong to the appended power of the utility model The protection scope that benefit requires.

Claims (8)

1. a kind of on-chip power type LED light with 4 π luminescent screens, which is characterized in that including bulb housing, with the core of exhaust pipe Seat, capacitor, lamp cap and a 4 π LED lighting boards；The bulb housing and core print seat vacuum sealing form vacuum sealing cavity, institute It states and is equipped with high thermal conductivity gas in vacuum-sealed cavity body；The 4 π LED lighting board is located at vacuum sealing inside cavity, by least Two wires are fixed on core print seat, and the 4 π LED lighting board includes plate type substrate and is arranged on the plate type substrate Driver and several LED chips, the plate type substrate be it is transparent, the driver is electrically connected with LED chip, the LED Chip is serially connected or connects in series and parallel, and the tow sides of the 4 π LED lighting board are provided with fluorescent adhesive layer, the fluorescent adhesive layer It is greater than 1.4 and thermal-radiating material of the thermal emissivity rate greater than 0.8 comprising refractive index；The capacitor setting is external in vacuum-sealed cavity In the lamp cap, it is electrically connected by the metal wire with the driver.

2. the on-chip power type LED light with 4 π luminescent screens according to claim 1, which is characterized in that the board-like base Plate is any one of rectangular substrate, square substrate, circular substrate, elliptical base, and the plate type substrate is transparent glass Any one of substrate, transparent or semitransparent ceramic substrate.

3. the on-chip power type LED light with 4 π luminescent screens according to claim 1, which is characterized in that the board-like base Plate be vertically put, level is put or is tilted and is put.

4. the on-chip power type LED light with 4 π luminescent screens according to claim 1, which is characterized in that the LED chip The one or both sides of the 4 π luminescent screen are set.

5. the on-chip power type LED light with 4 π luminescent screens according to claim 1, which is characterized in that the metal wire Quantity be 2 or 4.

6. the on-chip power type LED light with 4 π luminescent screens according to claim 1, which is characterized in that the bulb housing It is greater than 0.8 silicate Glass blister for ir transmissivity.

7. as described in claim 1 with the on-chip power type LED light of 4 π luminescent screens, which is characterized in that the driver is also Including actuator housing and driving circuit；The driving circuit is located at the inside of actuator housing, and the driving circuit is capacitance-resistance Any one of voltage dropping power supply, linear constant current power supply or switch constant-current supply.

8. the on-chip power type LED light with 4 π luminescent screens according to claim 1, which is characterized in that the bulb housing Using A type blister, G type blister, PAR type blister, T-type blister, candle type blister, p-type blister, PS type blister, BR type blister, ER type Blister or BRL type blister；The lamp cap uses E12 type, E14 type, E27 type, E26 type, E40 type, GU type, BX type, BA type, EP Type, EX type, GY type, GX type, GR type, GZ type or G type.