CN202938048U - White-light LED bulb lamp structure with transparent ceramic package - Google Patents
White-light LED bulb lamp structure with transparent ceramic package Download PDFInfo
- Publication number
- CN202938048U CN202938048U CN2012201109347U CN201220110934U CN202938048U CN 202938048 U CN202938048 U CN 202938048U CN 2012201109347 U CN2012201109347 U CN 2012201109347U CN 201220110934 U CN201220110934 U CN 201220110934U CN 202938048 U CN202938048 U CN 202938048U
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- Prior art keywords
- led chip
- led
- light
- transparent ceramic
- shade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000000919 ceramic Substances 0.000 title claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 12
- 239000011222 crystalline ceramic Substances 0.000 claims description 17
- 229910002106 crystalline ceramic Inorganic materials 0.000 claims description 17
- 239000000084 colloidal system Substances 0.000 claims description 4
- 238000000605 extraction Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- 230000001815 facial effect Effects 0.000 claims description 2
- 238000004064 recycling Methods 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 229910052761 rare earth metal Inorganic materials 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 abstract 2
- 238000004026 adhesive bonding Methods 0.000 abstract 1
- 238000002425 crystallisation Methods 0.000 abstract 1
- 230000008025 crystallization Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 abstract 1
- 239000003292 glue Substances 0.000 abstract 1
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 238000012856 packing Methods 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 239000007787 solid Substances 0.000 abstract 1
- 239000000463 material Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- 229910052684 Cerium Inorganic materials 0.000 description 2
- NMFHJNAPXOMSRX-PUPDPRJKSA-N [(1r)-3-(3,4-dimethoxyphenyl)-1-[3-(2-morpholin-4-ylethoxy)phenyl]propyl] (2s)-1-[(2s)-2-(3,4,5-trimethoxyphenyl)butanoyl]piperidine-2-carboxylate Chemical compound C([C@@H](OC(=O)[C@@H]1CCCCN1C(=O)[C@@H](CC)C=1C=C(OC)C(OC)=C(OC)C=1)C=1C=C(OCCN2CCOCC2)C=CC=1)CC1=CC=C(OC)C(OC)=C1 NMFHJNAPXOMSRX-PUPDPRJKSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The utility model provides a white-light LED bulb lamp structure with a transparent ceramic package. The white-light LED bulb lamp structure with the transparent ceramic package includes an LED chip, a circuit substrate, a transparent ceramic shade and a lamp holder. An LED light source is fixed on the circuit substrate. The LED chip and the ceramic shade are connected together integrally by utilizing gluing body. And the whole of the LED chip and the ceramic shade are installed on a heat dissipation shell of the lamp holder and an electrode is led to the lamp holder from the circuit substrate. The outer face of the transparent ceramic shade is a matt cambered face and an inner flat face is used for realizing solid crystallization with an LED chip. The cambered face of the transparent ceramic shade can disperse highlight emitted by the LED chip. At the same time, since rare earth element is mixed into the transparent ceramic shade when preparing, light emitted by the LED chip can excite the transparent ceramic shade, thereby forming white light. Therefore, the utilization of fluorescent powder is avoided, the chip heat dissipation is enhanced, the lighting effect and heat stability of the white light LED package structure are improved and the light attenuation is reduced. In the meantime, no transparent packing glue and lamp shade are needed, so that the structure is simplified and the cost is reduced distinctively. And an infrared LED chip also can be utilized for exciting the transparent ceramic shade, thereby emitting white light. Or a three-primary color can be utilized for forming a white light packaging structure on an unadulterated transparent ceramic shade.
Description
Technical field
The utility model relates to lighting field, relates in particular to a kind of LED bulb lamp.
Background technology
LED is as a kind of new type light source, because characteristics such as having energy-saving and environmental protection, life-span length are applied to lighting field increasingly extensively.Wherein the LED bulb lamp is along with the rise of LED illumination becomes one of light fixture of most possible replacement electricity-saving lamp.But at present the LED bulb lamp generally needs light shield, thereby this total reflection that has increased light has reduced the light efficiency of LED, runs in the opposite direction with the original intention of LED energy-conserving and environment-protective.Because LED chip is monochromatic light, need to applies fluorescent material above chip monochromatic light is mixed into white light in addition, thereby and fluorescent material be heated rear launching efficiency will descend further affected the light efficiency of bulb lamp with stability.Traditional LED ball bulb lamp structure adopts LED light source and PC lampshade mode, and LED light source adopts the mode of blue-light LED chip laser gold-tinted fluorescent material to realize white light.This complicated structure, the heat management difficulty, light decay is serious, and light efficiency is low, and especially the light loss of lampshade is up to more than 7%.
The utility model content
The utility model is intended to solve the foregoing problems of prior art, and provide a kind of simple in structure, light efficiency is high and the LED bulb lamp of dependable performance.
the utility model is a kind of crystalline ceramics packaged LED ball bulb lamp structure, comprise LED chip, circuit substrate, the crystalline ceramics cover, lamp socket, described LED light source is fixed on described circuit substrate, the recycling colloid is connected to an integral body with described LED chip and described ceramic shield, and with this integral installation in extraction electrode on the heat-dissipating casing of described lamp socket and on by described circuit substrate to lamp socket, described crystalline ceramics cover outside is inferior arc of lighting face, interior facial plane is used for and the LED chip die bond, the high light that its cambered surface can be sent LED is broken up, simultaneously because the crystalline ceramics cover mixes rare earth element in the preparation, the light that described LED chip sends can excite described crystalline ceramics cover and form white light, avoided the use of fluorescent material, strengthened chip cooling, light efficiency and the heat endurance of white light LEDs encapsulating structure have been improved, reduced light decay, need not simultaneously transparent sealing and lampshade, designs simplification, significantly reduce costs.Also can utilize ultraviolet LED chip laser crystalline ceramics to send white light, perhaps utilize the three-primary color LED chip to form the white light encapsulating structure at doping transparent ceramic surface not.
Described LED light source is the monochromatic light of peak wavelength in 250nm～480nm scope.
Described LED light source closely links into an integrated entity by colloid and ceramic shield
The utility model LED bulb lamp on the plane of ceramic shield, and is broken up through ceramic shield the LED light source direct irradiation with light, penetrate in its cambered surface, thereby form the arc light source.So just reduce the light shield of common bulb lamp, reduced the loss at total reflection of light.Ceramic wafer forms for having mixed the rare earth element sintering simultaneously, through exciting of LED chip blue light or ultraviolet light, can form white light and penetrate.Thereby avoided the use of fluorescent material, also just avoided the emission effciency that fluorescent material causes because of chip high temperature to descend and light decay.This has further improved light efficiency and the service life of LED bulb lamp.
Description of drawings
Fig. 1. a kind of crystalline ceramics packaged LED bulb lamp decomposing schematic representation.
The specific embodiment
Below, introduce the specific embodiment of the present utility model in conjunction with Figure of description 1.
As shown in Figure 1, a kind of LED bulb lamp comprises crystalline ceramics cover 1, circuit substrate 2, LED light source 3, heat-dissipating casing 4, lamp socket 5.LED light source 3 can be blue light SMD-3528 light source, and circuit substrate 2 is aluminum PCB circuit board, and ceramic shield 1 is the yttrium aluminium garnet YAG crystalline ceramics that cerium oxide-doped or rare earth are mixed altogether, and the ceramic shield transmitance can reach theoretical transmitance.Utilize reflow soldering process or transparent adhesive tape technique to be fixed on circuit board 2 LED light source 3, and on circuit board 2 extraction electrode.Putting transparent silica gel on every SMD-3528 light source 3, the YAG ceramic shield 1 of cerium oxide-doped is aimed at and is overlying on the silica gel of light source 3 with circuit board 2.After solidifying, silica gel make PCB circuit board 2 and YAG crystalline ceramics cover 1 be linked as an integral body.At last with this integral installation in the upper surface of heat-dissipating casing 4 and the electrode of drawing on circuit substrate 2 be connected with lamp socket 5.Complete the assembling of LED bulb lamp.
Foregoing is a specific embodiment of the present utility model, and be not limitation of the utility model, every any trickle modification, equivalent variations and modification of top embodiment being done according to the novel technical spirit of this use, for example ceramic shield is become dome-type or potsherd, all still belong to technology contents of the present utility model and scope.
Claims (3)
1. a crystalline ceramics encapsulates the white-light LED bulb structure, comprise LED chip, circuit substrate, the crystalline ceramics cover, lamp socket, described LED chip is fixed on described circuit substrate, the recycling colloid is connected to an integral body with described LED chip and described ceramic shield, and with this integral installation in extraction electrode on the heat-dissipating casing of described lamp socket and on by described circuit substrate to lamp socket, described crystalline ceramics cover outside is inferior arc of lighting face, interior facial plane is used for being connected die bond with LED chip, the high light that its cambered surface can be sent LED is broken up, the light that described LED chip sends can excite described crystalline ceramics cover and form white light, also can utilize the ultraviolet LED chip to excite crystalline ceramics to send white light, perhaps utilize the three-primary color LED chip at crystalline ceramics surface formation white light encapsulating structure.
2. a kind of LED ball bulb lamp structure according to claim 1, is characterized in that LED chip is the monochromatic light of peak wavelength in 250nm～480nm scope.
3. a kind of LED ball bulb lamp structure according to claim 1, is characterized in that LED chip closely links into an integrated entity by colloid and ceramic shield.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201109347U CN202938048U (en) | 2012-03-22 | 2012-03-22 | White-light LED bulb lamp structure with transparent ceramic package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201109347U CN202938048U (en) | 2012-03-22 | 2012-03-22 | White-light LED bulb lamp structure with transparent ceramic package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202938048U true CN202938048U (en) | 2013-05-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201109347U Expired - Lifetime CN202938048U (en) | 2012-03-22 | 2012-03-22 | White-light LED bulb lamp structure with transparent ceramic package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202938048U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014201774A1 (en) * | 2013-06-19 | 2014-12-24 | 福建省万邦光电科技有限公司 | Led bulb lamp capable of emitting lights in all directions |
| CN106549093A (en) * | 2016-10-25 | 2017-03-29 | 江苏师范大学 | A kind of long-range luminescent device of the LED based on fluorescent transparent ceramic material |
| CN107726056A (en) * | 2016-08-11 | 2018-02-23 | 广州市新晶瓷材料科技有限公司 | The preparation method of high colour gamut laser white light source |
-
2012
- 2012-03-22 CN CN2012201109347U patent/CN202938048U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014201774A1 (en) * | 2013-06-19 | 2014-12-24 | 福建省万邦光电科技有限公司 | Led bulb lamp capable of emitting lights in all directions |
| CN107726056A (en) * | 2016-08-11 | 2018-02-23 | 广州市新晶瓷材料科技有限公司 | The preparation method of high colour gamut laser white light source |
| CN106549093A (en) * | 2016-10-25 | 2017-03-29 | 江苏师范大学 | A kind of long-range luminescent device of the LED based on fluorescent transparent ceramic material |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: FUJIAN INSTITUTE OF RESEARCH ON THE STRUCTURE OF M Free format text: FORMER OWNER: CAO YONGGE Effective date: 20140425 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 100089 HAIDIAN, BEIJING TO: 350002 FUZHOU, FUJIAN PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20140425 Address after: Fuzhou City, Fujian province 350002 Yangqiao Road No. 155 Patentee after: Fujian Institute of Research on the Structure of Matter, Chinese Academy of Scie Address before: 100089, Beijing, Haidian District, far road, Century City, rain garden, No. 12 building, 1F Patentee before: Cao Yongge |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130515 |