CN204257643U - LED encapsulation structure and luminescent device - Google Patents
LED encapsulation structure and luminescent device Download PDFInfo
- Publication number
- CN204257643U CN204257643U CN201420359615.9U CN201420359615U CN204257643U CN 204257643 U CN204257643 U CN 204257643U CN 201420359615 U CN201420359615 U CN 201420359615U CN 204257643 U CN204257643 U CN 204257643U
- Authority
- CN
- China
- Prior art keywords
- encapsulation structure
- led encapsulation
- light
- emitting diode
- structure according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of LED encapsulation structure and luminescent device, comprise circuit substrate, be arranged at least one light-emitting diode on any surface of circuit substrate, be arranged at circuit substrate and be positioned at least one driving chip of the same side with light-emitting diode, and the sealant of sealing driving chip.By sealant, driving chip is sealed, avoid occurring that the light that light-emitting diode sends is absorbed for a long time by driving chip, and produce amount of heat, and then the situation of the effect affecting driving chip occurs, improve the luminescent properties of LED, improve the useful life of LED.
Description
Technical field
The utility model relates to field of luminescent technology, more particularly, relates to a kind of LED encapsulation structure and luminescent device.
Background technology
Along with the sustainable development of industry, constantly bringing forth new ideas of technology, the application of LED (Light Emitting Diode, light-emitting diode) luminescent device is more and more extensive.The LED luminescent device known relative to people is compared, and it has the advantages such as easy light modulation, lower calorific value, low energy consumption.And in production LED process, due to without the need to using mercury or discharge gas, LED also has the advantage of environmental protection.
But although existing LED has plurality of advantages, its luminescent properties has much room for improvement.
Utility model content
In view of this, the utility model provides a kind of LED encapsulation structure and luminescent device, its good luminescence property, high life.
For achieving the above object, the utility model provides following technical scheme:
A kind of LED encapsulation structure, comprising:
Circuit substrate;
Be arranged at least one light-emitting diode on any surface of described circuit substrate;
Be arranged at described circuit substrate and be positioned at least one driving chip of the same side with described light-emitting diode; And,
Seal the sealant of described driving chip.
Preferably, described sealant is sealant layer.
Preferably, described sealant layer is resin seal glue-line.
Preferably, described resin seal glue-line comprises the one of epoxy resin, unsaturated polyester resin, phenolic resins, polyacrylic resin, Corvic.
Preferably, described sealant layer is rubber seal glue-line.
Preferably, described rubber seal glue-line comprises the one of polysulfide rubber, silicon rubber, polyurethane rubber, neoprene, butyl rubber.
Preferably, described sealant is white sealant.
Preferably, also comprise:
Cover the transparent heat-conducting layer of described light-emitting diode.
Preferably, described transparent heat-conducting layer is transparent heat conduction glue-line.
Preferably, described light-emitting diode and described driving chip have difference in height.
Preferably, described circuit substrate is metal-based circuit board or ceramic circuit board.
Preferably, described circuit substrate comprises reflecting surface towards described light-emitting diode side.
Preferably, described reflecting surface is silverskin.
A kind of luminescent device, comprises above-mentioned LED encapsulation structure.
Compared with prior art, technical scheme provided by the utility model has the following advantages:
LED encapsulation structure provided by the utility model and luminescent device, comprise circuit substrate, be arranged at least one light-emitting diode on any surface of circuit substrate, be arranged at circuit substrate and be positioned at least one driving chip of the same side with light-emitting diode, and the sealant of sealing driving chip.By sealant, driving chip is sealed, avoid occurring that the light that light-emitting diode sends is absorbed for a long time by driving chip, and produce amount of heat, and then the situation of the effect affecting driving chip occurs, improve the luminescent properties of LED, improve the useful life of LED.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The structural representation of a kind of LED encapsulation structure that Fig. 1 provides for the embodiment of the present application;
The structural representation of the another kind of LED encapsulation structure that Fig. 2 provides for the embodiment of the present application;
The structural representation of another LED encapsulation structure that Fig. 3 provides for the embodiment of the present application.
Embodiment
As described in background, although existing LED has plurality of advantages, its luminescent properties has much room for improvement.Inventor studies discovery, and the driving chip causing the reason of this defect to mainly contain LED absorbs the light that light-emitting diode sends for a long time, and effect of driving chip is reduced, and then reduces luminescent properties and the useful life of LED.
Based on this, the utility model provides a kind of LED encapsulation structure, to overcome the problems referred to above that prior art exists, comprising:
Circuit substrate;
Be arranged at least one light-emitting diode on any surface of described circuit substrate;
Be arranged at described circuit substrate and be positioned at least one driving chip of the same side with described light-emitting diode; And,
Seal the sealant of described driving chip.
The utility model additionally provides a kind of luminescent device, comprises above-mentioned LED encapsulation structure.
LED encapsulation structure provided by the utility model and luminescent device, comprise circuit substrate, be arranged at least one light-emitting diode on any surface of circuit substrate, be arranged at circuit substrate and be positioned at least one driving chip of the same side with light-emitting diode, and the sealant of sealing driving chip.By sealant, driving chip is sealed, avoid occurring that the light that light-emitting diode sends is absorbed for a long time by driving chip, and produce amount of heat, and then the situation of the effect affecting driving chip occurs, improve the luminescent properties of LED, improve the useful life of LED.
Be more than core concept of the present utility model, for enabling above-mentioned purpose of the present utility model, feature and advantage become apparent more, are described in detail embodiment of the present utility model below in conjunction with accompanying drawing.
Set forth a lot of detail in the following description so that fully understand the utility model, but the utility model can also adopt other to be different from alternate manner described here to implement, those skilled in the art can when doing similar popularization without prejudice to when the utility model intension, and therefore the utility model is by the restriction of following public specific embodiment.
Secondly, the utility model is described in detail in conjunction with schematic diagram, when describing the utility model embodiment in detail; for ease of explanation; represent that the profile of device architecture can be disobeyed general ratio and be made partial enlargement, and described schematic diagram is example, it should not limit the scope of the utility model protection at this.In addition, the three-dimensional space of length, width and the degree of depth should be comprised in actual fabrication.
The embodiment of the present application provides a kind of LED encapsulation structure, shown in figure 1, is the structural representation of a kind of LED encapsulation structure that the embodiment of the present application provides.
Wherein, LED encapsulation structure comprises:
Circuit substrate 1;
Circuit substrate is mainly used in fixing and is electrically connected light-emitting diode and driving chip, for providing connecting circuit between light-emitting diode and driving chip, and then make single driving chip can drive the light on and off of single light-emitting diode, or single driving chip drives multiple light-emitting diode according to the light on and off of a definite sequence, or multiple driving chip controls the light on and off etc. of multiple light-emitting diode according to a definite sequence.
For the circuit substrate that the embodiment of the present application provides, can be metal-based circuit board or ceramic base circuit board, make circuit substrate under providing the prerequisite of driving connecting circuit for driving chip and light-emitting diode, better the heat that lumination of light emitting diode produces can also be derived, improve the luminescent properties of LED.
Further, towards light-emitting diode side, there is emitting surface at circuit substrate, improve the utilance of light, improve the luminosity of LED.Further, reflecting surface is the silverskin that stickup or coating process are fixed on circuit substrate surface, ensures under the prerequisite of the utilance improving light, better the heat that lumination of light emitting diode produces can also be passed to circuit substrate by silverskin.
Be arranged at least one light-emitting diode 2 on any surface of described circuit substrate 1;
Light-emitting diode has environmental protection, long service life, the plurality of advantages such as energy-conservation, and the embodiment of the present application does not do concrete restriction for the glow color of light-emitting diode, chooses according to actual needs.In addition, light-emitting diode can by being welded and fixed and being electrically connected on circuit substrate, and light-emitting diode can be paster type light emitting type, also can be direct insertion LED.
Be arranged at described circuit substrate 1 and be positioned at least one driving chip 3 of the same side with described light-emitting diode 2;
And,
Seal the sealant 4 of described driving chip 3.
Driving chip is the silicon chip being integrated with drive circuit, and due to himself feature, easy extinction heating, finally affects its performance.Therefore the LED encapsulation structure that provides of the embodiment of the present application, by driving chip seal isolation, avoid driving chip, after long-time extinction heating, harmful effect is caused to its performance, improve the luminescent properties of luminescent device, and improve the useful life of driving chip, improve the useful life of luminescent device.
Sealant can be sealant layer, and optionally, sealant layer is resin seal glue-line, comprise epoxy resin, unsaturated polyester resin, phenolic resins, polyacrylic resin, Corvic one or more.In addition, sealant layer also can for rubber seal glue-line, comprise polysulfide rubber, silicon rubber, polyurethane rubber, neoprene, butyl rubber one or more.In other embodiments of the application, sealant can also be ceramic material.
Sealant can be the sealant of black, and the light avoiding light-emitting diode to send shines directly into driving chip.Preferably, the sealant that the embodiment of the present application provides is white sealant, can not only play and stop that the illumination that sends of light-emitting diode is mapped to the function of driving chip, and the sealant absorbing ability of white is poor, avoid extinction and generate heat and the performance that affects driving chip.
Known by foregoing, driving chip seals by sealant, avoid occurring that the light that light-emitting diode sends is absorbed for a long time by driving chip, and produce amount of heat, and then the situation of the effect affecting driving chip occurs, improve the luminescent properties of LED, improve the useful life of LED.
On the basis of the embodiment corresponding to Fig. 1, the embodiment of the present application additionally provides a kind of LED encapsulation structure, and shown in concrete reference diagram 2, LED encapsulation structure also comprises:
Cover the transparent heat-conducting layer 5 of light-emitting diode 2.
Transparent heat-conducting layer can be transparent heat conduction glue-line, and the heat produced by lumination of light emitting diode by transparent heat-conducting layer is derived, and effective protection light-emitting diode is not damaged, improves the useful life of light-emitting diode.
Different fluorescent material can be added, to improve the luminous efficiency of light-emitting diode wave band in transparent heat-conducting layer.
On the basis of the embodiment corresponding to Fig. 1, the embodiment of the present application additionally provides a kind of LED encapsulation structure, and shown in concrete reference diagram 3, light-emitting diode 2 and the driving chip 3 of LED encapsulation structure have difference in height.
Light-emitting diode and driving chip are set to different height, the light being irradiated to sealant by lumination of light emitting diode can be reduced to a certain extent.
In addition, in the some other embodiment of the application, according to the size of circuit substrate, can also driving chip be set to away from light-emitting zone, to weaken the light intensity being irradiated to sealant.
Present invention also provides a kind of luminescent device, comprise above-mentioned LED encapsulation structure.
The LED encapsulation structure that the embodiment of the present application provides and luminescent device, comprise circuit substrate, be arranged at least one light-emitting diode on any surface of circuit substrate, be arranged at circuit substrate and be positioned at least one driving chip of the same side with light-emitting diode, and the sealant of sealing driving chip.By sealant, driving chip is sealed, avoid occurring that the light that light-emitting diode sends is absorbed for a long time by driving chip, and produce amount of heat, and then the situation of the effect affecting driving chip occurs, improve the luminescent properties of LED, improve the useful life of LED.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the utility model.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein when not departing from spirit or scope of the present utility model, can realize in other embodiments.Therefore, the utility model can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (14)
1. a LED encapsulation structure, is characterized in that, comprising:
Circuit substrate;
Be arranged at least one light-emitting diode on any surface of described circuit substrate;
Be arranged at described circuit substrate and be positioned at least one driving chip of the same side with described light-emitting diode; And,
Seal the sealant of described driving chip.
2. LED encapsulation structure according to claim 1, is characterized in that, described sealant is sealant layer.
3. LED encapsulation structure according to claim 2, is characterized in that, described sealant layer is resin seal glue-line.
4. LED encapsulation structure according to claim 3, is characterized in that, described resin seal glue-line comprises the one of epoxy resin, unsaturated polyester resin, phenolic resins, polyacrylic resin, Corvic.
5. LED encapsulation structure according to claim 2, is characterized in that, described sealant layer is rubber seal glue-line.
6. LED encapsulation structure according to claim 5, is characterized in that, described rubber seal glue-line comprises the one of polysulfide rubber, silicon rubber, polyurethane rubber, neoprene, butyl rubber.
7. LED encapsulation structure according to claim 1, is characterized in that, described sealant is white sealant.
8. LED encapsulation structure according to claim 1, is characterized in that, also comprises:
Cover the transparent heat-conducting layer of described light-emitting diode.
9. LED encapsulation structure according to claim 8, is characterized in that, described transparent heat-conducting layer is transparent heat conduction glue-line.
10. LED encapsulation structure according to claim 1, is characterized in that, described light-emitting diode and described driving chip have difference in height.
11. LED encapsulation structure according to claim 1, is characterized in that, described circuit substrate is metal-based circuit board or ceramic base circuit board.
12. LED encapsulation structure according to claim 1, is characterized in that, described circuit substrate comprises reflecting surface towards described light-emitting diode side.
13. LED encapsulation structure according to claim 12, is characterized in that, described reflecting surface is silverskin.
14. 1 kinds of luminescent devices, is characterized in that, comprise the LED encapsulation structure described in claim 1 ~ 13 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420359615.9U CN204257643U (en) | 2014-07-01 | 2014-07-01 | LED encapsulation structure and luminescent device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420359615.9U CN204257643U (en) | 2014-07-01 | 2014-07-01 | LED encapsulation structure and luminescent device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204257643U true CN204257643U (en) | 2015-04-08 |
Family
ID=52961919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420359615.9U Expired - Fee Related CN204257643U (en) | 2014-07-01 | 2014-07-01 | LED encapsulation structure and luminescent device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204257643U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106784193A (en) * | 2017-01-03 | 2017-05-31 | 厦门天微电子有限公司 | A kind of small spacing LED photovoltaic module packaging method |
| WO2023124093A1 (en) * | 2021-12-28 | 2023-07-06 | 佛山市国星光电股份有限公司 | Led backlight source and manufacturing method therefor |
-
2014
- 2014-07-01 CN CN201420359615.9U patent/CN204257643U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106784193A (en) * | 2017-01-03 | 2017-05-31 | 厦门天微电子有限公司 | A kind of small spacing LED photovoltaic module packaging method |
| WO2023124093A1 (en) * | 2021-12-28 | 2023-07-06 | 佛山市国星光电股份有限公司 | Led backlight source and manufacturing method therefor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| WO2011150734A1 (en) | Led bulb with double-layer lampshade | |
| CN102095093A (en) | Novel high-power LED (light emitting diode) integrated light source | |
| CN102364710A (en) | Light emitting diode (LED) white light source device | |
| CN102664229B (en) | Light emitting diode light source structure | |
| CN204257643U (en) | LED encapsulation structure and luminescent device | |
| CN204403830U (en) | A kind of high-effect long distance heat radiation Waterproof LED light projecting lamp | |
| CN105280622A (en) | LED packaging structure and light emitting device | |
| CN105336733A (en) | LED package structure and light-emitting device | |
| CN202938048U (en) | White-light LED bulb lamp structure with transparent ceramic package | |
| CN203322802U (en) | High-light efficiency energy-saving LED (light-emitting diode) tube | |
| CN205191356U (en) | LED secondary packaging structure and lamps and lanterns | |
| CN203848062U (en) | Umbrella-type LED lamp filament | |
| CN203225277U (en) | High-power LED packaging structure | |
| CN202769342U (en) | Full color light-emitting diode (LED) exposure lamp | |
| CN203787466U (en) | LED (light emitting diode) packaging structure | |
| CN105226141A (en) | LED technique, encapsulating structure and luminescent device | |
| CN203384721U (en) | LED (Light Emitting Diode) lamp tube | |
| CN202072655U (en) | Heat-conducting silica gel sheet for light-emitting diode (LED) illuminating lamp | |
| CN201016465Y (en) | Water-proof explosion-proof lamp | |
| CN205101881U (en) | Line type inflatable LED lamp | |
| CN203671408U (en) | Internal combustion locomotive power room LED (light-emitting diode) lamp | |
| CN203848063U (en) | Heat-island effect preventive umbrella-type light-emitting diode (LED) filament | |
| CN203907349U (en) | Waterproof backlight module with lenses | |
| CN202901966U (en) | Light emitting diode (LED) lamp | |
| CN203179948U (en) | Total space-type light emission white light LED device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150408 Termination date: 20180701 |