CN105336733A - LED package structure and light-emitting device - Google Patents
LED package structure and light-emitting device Download PDFInfo
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- CN105336733A CN105336733A CN201410310533.XA CN201410310533A CN105336733A CN 105336733 A CN105336733 A CN 105336733A CN 201410310533 A CN201410310533 A CN 201410310533A CN 105336733 A CN105336733 A CN 105336733A
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Abstract
The invention discloses an LED package structure and a light-emitting device. The LED package structure comprises a circuit substrate, an annular shielding layer, at least one light-emitting diode and at least one driving chip, wherein the annular shielding layer, the at least one light-emitting diode and the at least one driving chip are arranged on the circuit substrate; and the light-emitting diode is surrounded by the annular shielding layer, the driving chip is arranged at the periphery of the annular shielding layer, and the height of the driving chip is flush with the height of the annular shielding layer at most. Light emitted by the light-emitting diode is shielded through the annular shielding layer, thereby avoiding a circumstance that the light emitted by the light-emitting diode is absorbed by the driving chip for a long time, a large amount of heat is generated, and thus the efficacy of the driving chip is affected, improving the light-emitting performance of the LED light-emitting device, and prolonging the service life of the LED light-emitting device.
Description
Technical field
The present invention relates to field of luminescent technology, more particularly, relate to a kind of LED encapsulation structure and luminescent device.
Background technology
Along with the sustainable development of industry, constantly bringing forth new ideas of technology, the application of LED (LightEmittingDiode, light-emitting diode) luminescent device is more and more extensive.The LED luminescent device known relative to people is compared, and it has the advantages such as easy light modulation, lower calorific value, low energy consumption.And in production LED process, due to without the need to using mercury or discharge gas, LED also has the advantage of environmental protection.
But although existing LED has plurality of advantages, its luminescent properties has much room for improvement.
Summary of the invention
In view of this, the invention provides a kind of LED encapsulation structure and luminescent device, its good luminescence property, high life.
For achieving the above object, the invention provides following technical scheme:
A kind of LED encapsulation structure, comprising:
Circuit substrate;
Be arranged at the ring-shaped shield layer on described circuit substrate;
Be arranged at least one light-emitting diode surrounded on described circuit substrate and by described ring-shaped shield layer; And,
To be arranged on described circuit substrate and to be positioned at least one driving chip of described ring-shaped shield layer periphery;
Wherein, described ring-shaped shield layer deviates from described circuit substrate one side surface and is not less than described light-emitting diode and described driving chip deviates from described circuit substrate one side surface.
Preferably, described circuit substrate comprises at least one groove, and described driving chip is arranged in described groove.
Preferably, also comprise:
Cover the sealant of described driving chip.
Preferably, described sealant is sealant layer.
Preferably, described sealant layer is resin seal glue-line.
Preferably, described resin seal glue-line comprise epoxy resin, unsaturated polyester resin, phenolic resins, polyacrylic resin, Corvic one or more.
Preferably, described sealant layer is rubber seal glue-line.
Preferably, described rubber seal glue-line comprise polysulfide rubber, silicon rubber, polyurethane rubber, neoprene, butyl rubber one or more.
Preferably, described sealant is white sealant.
Preferably, also comprise:
Cover the transparent heat-conducting layer of described light-emitting diode.
Preferably, described transparent heat-conducting layer is transparent heat conduction glue-line.
Preferably, described ring-shaped shield layer is ring-shaped shield glue-line.
Preferably, described circuit substrate is metal-base circuit board or ceramic base circuit substrate.
Preferably, described circuit substrate comprises reflecting surface towards described light-emitting diode side.
Preferably, described reflecting surface is silverskin.
A kind of luminescent device, comprises above-mentioned LED encapsulation structure.
Compared with prior art, technical scheme provided by the present invention has the following advantages:
LED encapsulation structure provided by the present invention and luminescent device, comprise circuit substrate, is arranged at the ring-shaped shield layer on circuit substrate, at least one light-emitting diode and at least one driving chip.Wherein, light-emitting diode is surrounded by ring-shaped shield layer, and driving chip is arranged at ring-shaped shield layer periphery, and the height of driving chip maintains an equal level with the height of ring-shaped shield layer at the most.The light sent by light-emitting diode by ring-shaped shield layer is blocked, avoid occurring that the light that light-emitting diode sends is absorbed for a long time by driving chip, and produce amount of heat, and then the situation of the effect affecting driving chip occurs, improve the luminescent properties of LED, improve the useful life of LED.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
The structural representation of a kind of LED encapsulation structure that Fig. 1 a provides for the embodiment of the present application;
The vertical view of the LED encapsulation structure that Fig. 1 b provides for Fig. 1 a;
The structural representation of the another kind of LED encapsulation structure that Fig. 2 provides for the embodiment of the present application;
The structural representation of another LED encapsulation structure that Fig. 3 provides for the embodiment of the present application;
The structural representation of another LED encapsulation structure that Fig. 4 provides for the embodiment of the present application.
Embodiment
As described in background, although existing LED has plurality of advantages, its luminescent properties has much room for improvement.Inventor studies discovery, and the driving chip causing the reason of this defect to mainly contain LED absorbs the light that light-emitting diode sends for a long time, and effect of driving chip is reduced, and then reduces luminescent properties and the useful life of LED.
Based on this, the invention provides a kind of LED encapsulation structure, to overcome the problems referred to above that prior art exists, comprising:
Circuit substrate;
Be arranged at the ring-shaped shield layer on described circuit substrate;
Be arranged at least one light-emitting diode surrounded on described circuit substrate and by described ring-shaped shield layer; And,
To be arranged on described circuit substrate and to be positioned at least one driving chip of described ring-shaped shield layer periphery;
Wherein, described ring-shaped shield layer deviates from described circuit substrate one side surface and is not less than described light-emitting diode and described driving chip deviates from described circuit substrate one side surface.
Present invention also offers a kind of luminescent device, comprise above-mentioned LED encapsulation structure.
LED encapsulation structure provided by the present invention and luminescent device, comprise circuit substrate, is arranged at the ring-shaped shield layer on circuit substrate, at least one light-emitting diode and at least one driving chip.Wherein, light-emitting diode is surrounded by ring-shaped shield layer, and driving chip is arranged at ring-shaped shield layer periphery, and the height of driving chip maintains an equal level with the height of ring-shaped shield layer at the most.The light sent by light-emitting diode by ring-shaped shield layer is blocked, avoid occurring that the light that light-emitting diode sends is absorbed for a long time by driving chip, and produce amount of heat, and then the situation of the effect affecting driving chip occurs, improve the luminescent properties of LED, improve the useful life of LED.
Be more than core concept of the present invention, for enabling above-mentioned purpose of the present invention, feature and advantage become apparent more, are described in detail the specific embodiment of the present invention below in conjunction with accompanying drawing.
Set forth a lot of detail in the following description so that fully understand the present invention, but the present invention can also adopt other to be different from alternate manner described here to implement, those skilled in the art can when without prejudice to doing similar popularization when intension of the present invention, therefore the present invention is by the restriction of following public specific embodiment.
Secondly, the present invention is described in detail in conjunction with schematic diagram, when describing the embodiment of the present invention in detail; for ease of explanation; represent that the profile of device architecture can be disobeyed general ratio and be made partial enlargement, and described schematic diagram is example, it should not limit the scope of protection of the invention at this.In addition, the three-dimensional space of length, width and the degree of depth should be comprised in actual fabrication.
The embodiment of the present application provides a kind of LED encapsulation structure, shown in composition graphs 1a and 1b, is respectively a kind of structural representation of LED encapsulation structure and the vertical view of LED encapsulation structure that the embodiment of the present application provides, wherein,
LED encapsulation structure comprises:
Circuit substrate 1;
Circuit substrate is mainly used in fixing and is electrically connected light-emitting diode and driving chip, for providing connecting circuit between light-emitting diode and driving chip, and then make single driving chip can drive the light on and off of single light-emitting diode, or single driving chip drives multiple light-emitting diode according to the light on and off of a definite sequence, or multiple driving chip controls the light on and off etc. of multiple light-emitting diode according to a definite sequence.
For the circuit substrate that the embodiment of the present application provides, can be metal-based circuit board or ceramic base circuit board, make circuit substrate under providing the prerequisite of driving connecting circuit for driving chip and light-emitting diode, better the heat that lumination of light emitting diode produces can also be derived, improve the luminescent properties of LED.
Further, towards light-emitting diode side, there is emitting surface at circuit substrate, improve the utilance of light, improve the luminosity of LED.Further, reflecting surface is the silverskin that stickup or coating process are fixed on circuit substrate surface, ensures under the prerequisite of the utilance improving light, better the heat that lumination of light emitting diode produces can also be passed to circuit substrate by silverskin.
Be arranged at the ring-shaped shield layer 2 on circuit substrate 1;
Ring-shaped shield layer mainly plays the luminescence of blocking light-emitting diode, and the illumination avoiding light-emitting diode to send is mapped on driving chip.Ring-shaped shield layer can be ring-shaped shield glue-line, is made in the manufacturing process of follow-up LED encapsulation structure; Ring-shaped shield layer also can be identical with circuit base material, and is structure as a whole, and the application does not do concrete restriction to this.
Be arranged at least one light-emitting diode 3 surrounded on described circuit substrate 1 and by described ring-shaped shield layer 2;
Light-emitting diode has environmental protection, long service life, the plurality of advantages such as energy-conservation, and the embodiment of the present application does not do concrete restriction for the glow color of light-emitting diode and size, chooses according to actual needs.In addition, light-emitting diode can by being welded and fixed and being electrically connected on circuit substrate, and light-emitting diode can be paster type light emitting type, also can be direct insertion LED.
And,
Be arranged on described circuit substrate 1, be positioned at least one driving chip 4 of described ring-shaped shield layer 2 periphery;
Wherein, described ring-shaped shield layer 2 deviates from described circuit substrate 1 one side surface and is not less than described light-emitting diode 3 and described driving chip 4 deviates from described circuit substrate 1 one side surface.
Driving chip is the silicon chip being integrated with drive circuit, and due to himself feature, easy extinction heating, finally affects its performance.Therefore the LED encapsulation structure that provides of the embodiment of the present application, all light-emitting diodes are surrounded by arranging ring-shaped shield layer, and the light sent by light-emitting diode shelters from, avoid driving chip, after long-time extinction heating, harmful effect is caused to its performance, improve the luminescent properties of luminescent device, and improve the useful life of driving chip, improve the useful life of luminescent device.
General, the height of light-emitting diode is within the scope of 70 μm ~ 150 μm, and the height of driving chip is within the scope of 200 μm ~ 300 μm, therefore, if light-emitting diode and driving chip are positioned at same level, time on face, ring-shaped shield layer deviates from circuit substrate one side surface and only needs to be not less than driving chip and deviate from circuit substrate one side surface.
In addition, in order to reduce cost of manufacture, save material, on the basis based on the embodiment corresponding to Fig. 1 a, the embodiment of the present application additionally provides a kind of LED encapsulation structure, shown in concrete reference diagram 2, in LED encapsulation structure,
Circuit substrate 1 comprises at least one groove 11, and driving chip 4 is arranged in groove 11.
Driving chip corresponding in Fig. 2 deviates from circuit substrate one side surface and deviates from circuit substrate one side surface higher than light-emitting diode, therefore, need ring-shaped shield layer to deviate from circuit substrate one side surface to be arranged at and to be not less than driving chip and to deviate from circuit substrate one side surface;
But, when be arranged at the driving chip in groove deviate from circuit substrate one side surface deviate from circuit substrate one side surface lower than light-emitting diode time, ring-shaped shield layer deviates from circuit substrate one side surface and only needs to be not less than light-emitting diode and deviate from circuit substrate one side surface.
On the basis of embodiment corresponding to Fig. 2, the embodiment of the present application additionally provides a kind of LED encapsulation structure, and shown in concrete reference diagram 3, LED encapsulation structure also comprises:
Cover the sealant 5 of described driving chip 4.
By driving chip by sealant seal isolation, further avoid driving chip, after long-time extinction heating, harmful effect is caused to its performance, improve the luminescent properties of luminescent device, and improve the useful life of driving chip, improve the useful life of luminescent device.
Sealant can be sealant layer, and optionally, sealant layer is resin seal glue-line, comprise epoxy resin, unsaturated polyester resin, phenolic resins, polyacrylic resin, Corvic one or more.In addition, sealant layer also can for rubber seal glue-line, comprise polysulfide rubber, silicon rubber, polyurethane rubber, neoprene, butyl rubber one or more.In other embodiments of the application, sealant can also be ceramic material.
Sealant can be the sealant of black, and the light avoiding light-emitting diode to send is spilt by ring-shaped shield layer and shines directly into driving chip.Preferably, the sealant that the embodiment of the present application provides is white sealant, can not only play the function that light leakage prevention is irradiated to driving chip, and the sealant absorbing ability of white is poor, avoids extinction heating and affects the performance of driving chip.
On the basis of embodiment corresponding to Fig. 2, the embodiment of the present application additionally provides a kind of LED encapsulation structure, and shown in concrete reference diagram 4, LED encapsulation structure also comprises:
Cover the transparent heat-conducting layer 6 of light-emitting diode 3.
Transparent heat-conducting layer can be transparent heat conduction glue-line, and the heat produced by lumination of light emitting diode by transparent heat-conducting layer is derived, and effective protection light-emitting diode is not damaged, improves the useful life of light-emitting diode.
Different fluorescent material can be added, to improve the luminous efficiency of light-emitting diode wave band in transparent heat-conducting layer.
Present invention also provides a kind of luminescent device, comprise above-mentioned LED encapsulation structure.
The LED encapsulation structure that the embodiment of the present application provides and luminescent device, comprise circuit substrate, is arranged at the ring-shaped shield layer on circuit substrate, at least one light-emitting diode and at least one driving chip.Wherein, light-emitting diode is surrounded by ring-shaped shield layer, and driving chip is arranged at ring-shaped shield layer periphery, and the height of driving chip maintains an equal level with the height of ring-shaped shield layer at the most.
The light sent by light-emitting diode by ring-shaped shield layer is blocked, avoid occurring that the light that light-emitting diode sends is absorbed for a long time by driving chip, and produce amount of heat, and then the situation of the effect affecting driving chip occurs, improve the luminescent properties of LED, improve the useful life of LED.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (16)
1. a LED encapsulation structure, is characterized in that, comprising:
Circuit substrate;
Be arranged at the ring-shaped shield layer on described circuit substrate;
Be arranged at least one light-emitting diode surrounded on described circuit substrate and by described ring-shaped shield layer; And,
To be arranged on described circuit substrate and to be positioned at least one driving chip of described ring-shaped shield layer periphery;
Wherein, described ring-shaped shield layer deviates from described circuit substrate one side surface and is not less than described light-emitting diode and described driving chip deviates from described circuit substrate one side surface.
2. LED encapsulation structure according to claim 1, is characterized in that, described circuit substrate comprises at least one groove, and described driving chip is arranged in described groove.
3. LED encapsulation structure according to claim 1, is characterized in that, also comprises:
Cover the sealant of described driving chip.
4. LED encapsulation structure according to claim 3, is characterized in that, described sealant is sealant layer.
5. LED encapsulation structure according to claim 4, is characterized in that, described sealant layer is resin seal glue-line.
6. LED encapsulation structure according to claim 5, is characterized in that, described resin seal glue-line comprise epoxy resin, unsaturated polyester resin, phenolic resins, polyacrylic resin, Corvic one or more.
7. LED encapsulation structure according to claim 4, is characterized in that, described sealant layer is rubber seal glue-line.
8. LED encapsulation structure according to claim 7, is characterized in that, described rubber seal glue-line comprise polysulfide rubber, silicon rubber, polyurethane rubber, neoprene, butyl rubber one or more.
9. LED encapsulation structure according to claim 1, is characterized in that, described sealant is white sealant.
10. LED encapsulation structure according to claim 1, is characterized in that, also comprises:
Cover the transparent heat-conducting layer of described light-emitting diode.
11. LED encapsulation structure according to claim 8, is characterized in that, described transparent heat-conducting layer is transparent heat conduction glue-line.
12. LED encapsulation structure according to claim 1, is characterized in that, described ring-shaped shield layer is ring-shaped shield glue-line.
13. LED encapsulation structure according to claim 1, is characterized in that, described circuit substrate is metal-base circuit board or ceramic base circuit substrate.
14. LED encapsulation structure according to claim 1, is characterized in that, described circuit substrate comprises reflecting surface towards described light-emitting diode side.
15. LED encapsulation structure according to claim 14, is characterized in that, described reflecting surface is silverskin.
16. 1 kinds of luminescent devices, is characterized in that, comprise the LED encapsulation structure described in claim 1 ~ 15 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410310533.XA CN105336733A (en) | 2014-07-01 | 2014-07-01 | LED package structure and light-emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410310533.XA CN105336733A (en) | 2014-07-01 | 2014-07-01 | LED package structure and light-emitting device |
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| CN105336733A true CN105336733A (en) | 2016-02-17 |
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| CN201410310533.XA Pending CN105336733A (en) | 2014-07-01 | 2014-07-01 | LED package structure and light-emitting device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2017174007A1 (en) * | 2016-04-08 | 2017-10-12 | 广东欧珀移动通信有限公司 | Chip packaging structure, terminal device, and method |
| CN107546568A (en) * | 2017-08-31 | 2018-01-05 | 新华三技术有限公司 | Pcb board component and light emission component |
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| US20100171142A1 (en) * | 2009-01-05 | 2010-07-08 | Hon Wen Chen | Embedding type solder point-free combination structure of LED beads with substrate or lamp body |
| CN202513205U (en) * | 2012-02-15 | 2012-10-31 | 隆达电子股份有限公司 | Light emitting diode packaging structure |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US20100171142A1 (en) * | 2009-01-05 | 2010-07-08 | Hon Wen Chen | Embedding type solder point-free combination structure of LED beads with substrate or lamp body |
| CN202513205U (en) * | 2012-02-15 | 2012-10-31 | 隆达电子股份有限公司 | Light emitting diode packaging structure |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2017174007A1 (en) * | 2016-04-08 | 2017-10-12 | 广东欧珀移动通信有限公司 | Chip packaging structure, terminal device, and method |
| US10679917B2 (en) | 2016-04-08 | 2020-06-09 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Chip package structure, terminal device, and method |
| CN107546568A (en) * | 2017-08-31 | 2018-01-05 | 新华三技术有限公司 | Pcb board component and light emission component |
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Application publication date: 20160217 |