CN104218139A - Novel LED package structure - Google Patents
Novel LED package structure Download PDFInfo
- Publication number
- CN104218139A CN104218139A CN201410408560.0A CN201410408560A CN104218139A CN 104218139 A CN104218139 A CN 104218139A CN 201410408560 A CN201410408560 A CN 201410408560A CN 104218139 A CN104218139 A CN 104218139A
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- CN
- China
- Prior art keywords
- brand
- encapsulating structure
- film plates
- glass cover
- glass film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
Abstract
The invention discloses a novel LED package structure which is characterized by particularly comprising a glass bottom plate, a glass cover plate, a fluorescent powder layer, a circuit, accommodating points, LED chips and filling adhesive. The fluorescent powder layer is arranged in a semicircular inner cavity of the glass cover plate and a region of the glass bottom plate, and the region of the glass bottom plate corresponds to the semicircular inner cavity of the glass cover plate; the circuit is arranged on the glass bottom plate, and the accommodating points are arranged on the circuit; the LED chips are arranged at the accommodating points and are packaged and arranged in the semicircular inner cavity by the aid of the filling adhesive. The novel LED package structure has the advantages that the fluorescent powder printing layer and the LED chips can be inversely mounted and arranged, so that soft light can be emitted by LED lamps, the LED lamps are excellent in heat dissipation performance, and 360-degree light emitting effects of the LED lamps can be realized.
Description
Technical field
The present invention relates to LED encapsulation technology field, relate in particular a kind of brand-new LED encapsulating structure.
Background technology
Light-Emitting Diode LED is a kind of solid-state semiconductor device that can be visible ray by electric energy conversion, and it can directly be converted into light electricity.The internal characteristics of LED has determined that it is that optimal light source goes to replace traditional light source, has purposes widely.LED light source has following features: energy-conservation, long-lived, environmental protection, solid-state encapsulation, belong to cold light source type.
Tradition LED light source, in order to improve rising angle, need install the optics of lens and so on additional, but affect lighting effect, can reduce the due energy-saving effect of LED light source.Along with the development of LED encapsulation technology, in nowadays LED Packaging Industry, the luminous LED light source of 360 degree is the trend of future development, realizes LED lamp wide-angle luminous and do not need to add lens, becomes three-dimensional light source.Yet the general packing forms of LED lamp is at present: on frivolous small and exquisite transparency carrier or sheet metal, carry out LED encapsulation, need to use the sealing of high-viscosity glue mixed fluorescent powder, photochromic difficult control of product, and without heat-dissipating channel structure, the life-span such as can not be guaranteed at the drawback.
Therefore, how to provide a kind of good heat dissipation effect, photochromic easy to control, and can to realize LED lamp be the problem that those skilled in the art need solution badly from the luminous LED encapsulating structure of 360 degree.
Summary of the invention
In view of this, the invention provides a kind of brand-new LED encapsulating structure, 360 degree of not only having realized LED lamp are luminous, and illumination effect is softer, heat dispersion is better.
For achieving the above object, the invention provides following technical scheme:
A brand-new LED encapsulating structure, specifically comprises:
Glass film plates; Glass cover-plate; At the semicircle inner chamber of described glass cover-plate, and with the phosphor powder layer in the semicircle corresponding described glass film plates of inner chamber of described glass cover-plate region; Be placed in the circuit on described glass film plates; Be placed in the settlement on described circuit; Be placed on the LED chip of described settlement; Encapsulate the filling glue that described LED chip is placed in semicircle inner chamber.
Preferably, in above-mentioned a kind of brand-new LED encapsulating structure, described glass film plates and described glass cover-plate are all-transparent, and the described phosphor powder layer being arranged on described glass film plates and described glass cover-plate is to adopt mode of printing to form.
Preferably, in above-mentioned a kind of brand-new LED encapsulating structure, the circuit on described glass film plates is starched printing by low-temperature silver and is carried out sintering formation.
Preferably, in above-mentioned a kind of brand-new LED encapsulating structure, described LED chip can send blue light from 360 degree, and excites described phosphor powder layer generation quantum effect around to produce white light.
Preferably, in above-mentioned a kind of brand-new LED encapsulating structure, described LED chip utilizes the upside-down mounting of high-accuracy die bond equipment to be placed on described settlement, and with low temperature tin cream bonded-electrode, uses low temperature reflux weldering welding.
Preferably, in above-mentioned a kind of brand-new LED encapsulating structure, described filling glue is filled in semicircle inner chamber, and the described filling glue transparent glue that is high heat conduction high transmission rate.
Known via above-mentioned technical scheme, compared with prior art, the present invention openly provide a kind of can 360 the LED encapsulating structure of degree bright dippings, mainly to take glass as carrier, by upside-down mounting, settle chip and remote fluorescence powder printed layers technology to combine, solve photochromic problem rambunctious in heat radiation and encapsulation process, also realized LED lamp 360 degree simultaneously luminous.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiments of the invention, for those of ordinary skills, do not paying under the prerequisite of creative work, other accompanying drawing can also be provided according to the accompanying drawing providing.
Fig. 1 accompanying drawing is structural representation of the present invention.
Fig. 2 accompanying drawing is glass film plates structural representation of the present invention.
In Fig. 1: 1 is that glass film plates, 2 is that glass cover-plate, 3 is that phosphor powder layer, 4 is that LED chip, 6 is that circuit, 7 is settlement for filling glue, 5.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Embodiment based in the present invention, those of ordinary skills, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
The embodiment of the invention discloses a kind of brand-new LED encapsulating structure, specifically comprise: glass film plates 1; Glass cover-plate 2; At the semicircle inner chamber of glass cover-plate 2, and with the phosphor powder layer 3 in the corresponding glass film plates of the semicircle inner chamber of glass cover-plate 21 region; Be placed in the circuit 6 on glass film plates 1; Be placed in the settlement 7 on circuit; Be placed on the LED chip 5 of settlement 7; Packaging LED chips 5 is placed in the filling glue 4 of semicircle inner chamber.
The present invention adopts fluorescent powder printed technology and flip LED chips technology to combine, take glass as carrier upside-down mounting arrangement LED chip, efficiently solve the problem of heat radiation, semicircle internal chamber wall at glass film plates and glass cover-plate covers fluorescent powder printed layer simultaneously, not only can make LED lamp luminous in 360 degree full angle scopes, and can make photochromic being easy to control.Therefore, the present invention can be widely used in various light-emitting devices, and illuminating effect is splendid.
In order further to optimize technique scheme, glass film plates 1 and glass cover-plate 2 are all-transparent, are convenient to printing opacity, and the phosphor powder layer 3 being arranged on glass film plates 1 and glass cover-plate 2 is to adopt mode of printing to form.
In order further to optimize technique scheme, the circuit 6 on glass film plates 1 is starched printing by low-temperature silver and is carried out sintering formation.
In order further to optimize technique scheme, LED chip 5 can send blue light from 360 degree, and excites described phosphor powder layer around 3 that quantum effect generation white light occurs.
In order further to optimize technique scheme, LED chip 5 utilizes the upside-down mounting of high-accuracy die bond equipment to be placed on settlement 7, and with low temperature tin cream bonded-electrode, use low temperature reflux weldering welding, the LED chip of upside-down mounting, be convenient to the heat radiation of LED lamp, increase the service life, while rapid-curing cutback high temperature glue is high temperature resistant and adhesive effect good.
In order further to optimize technique scheme, semicircle inner chamber is used fills glue 4 fillings, and filling glue 4 is the transparent glue of high heat conduction high transmission rate, and the heat conductivility of this glue and translucent effect are good, are convenient to heat radiation and enlarging lighting area.
In this specification, each embodiment adopts the mode of going forward one by one to describe, and each embodiment stresses is the difference with other embodiment, between each embodiment identical similar part mutually referring to.For the disclosed device of embodiment, because it corresponds to the method disclosed in Example, so description is fairly simple, relevant part partly illustrates referring to method.
Above-mentioned explanation to the disclosed embodiments, makes professional and technical personnel in the field can realize or use the present invention.To the multiple modification of these embodiment, will be apparent for those skilled in the art, General Principle as defined herein can, in the situation that not departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (6)
1. a brand-new LED encapsulating structure, is characterized in that, specifically comprises: glass film plates (1); Glass cover-plate (2); At the semicircle inner chamber of described glass cover-plate (2), and with the phosphor powder layer (3) in described glass cover-plate (2) the corresponding described glass film plates of semicircle inner chamber (1) region; Be placed in the circuit (6) on described glass film plates (1); Be placed in the settlement (7) on described circuit; Be placed on the LED chip (5) of described settlement (7); Encapsulate the filling glue (4) that described LED chip (5) is placed in semicircle inner chamber.
2. a kind of brand-new LED encapsulating structure according to claim 1, it is characterized in that, described glass film plates (1) and described glass cover-plate (2) are all-transparent, and the described phosphor powder layer (3) being arranged on described glass film plates (1) and described glass cover-plate (2) is to adopt mode of printing to form.
3. a kind of brand-new LED encapsulating structure according to claim 1, is characterized in that, the circuit (6) on described glass film plates (1) is starched printing by low-temperature silver and carried out sintering formation.
4. a kind of brand-new LED encapsulating structure according to claim 1, is characterized in that, described LED chip (5) can send blue light from 360 degree, and excites described phosphor powder layer (3) around that quantum effect generation white light occurs.
5. according to a kind of brand-new LED encapsulating structure described in claim 1 or 4, it is characterized in that, it is upper that described LED chip (5) utilizes the upside-down mounting of high-accuracy die bond equipment to be placed in described settlement (7), and with low temperature tin cream bonded-electrode, use low temperature reflux weldering welding.
6. a kind of brand-new LED encapsulating structure according to claim 1, is characterized in that, described filling glue (4) is filled in semicircle inner chamber, and described filling glue (4) is the transparent glue of high heat conduction high transmission rate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410408560.0A CN104218139A (en) | 2014-08-20 | 2014-08-20 | Novel LED package structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410408560.0A CN104218139A (en) | 2014-08-20 | 2014-08-20 | Novel LED package structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104218139A true CN104218139A (en) | 2014-12-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410408560.0A Pending CN104218139A (en) | 2014-08-20 | 2014-08-20 | Novel LED package structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104218139A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104882525A (en) * | 2015-06-02 | 2015-09-02 | 张国生 | White LED lamp wick with single glass substrate and manufacturing method thereof |
| CN104916764A (en) * | 2015-06-15 | 2015-09-16 | 刘海兵 | LED lamp wick |
| WO2015149546A1 (en) * | 2014-04-02 | 2015-10-08 | 浙江深度光电科技有限公司 | Led module with total emission angle, manufacturing method therefor and led lamp |
| CN107742668A (en) * | 2017-10-07 | 2018-02-27 | 谭瑞银 | Easily changeable LED |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008135624A (en) * | 2006-11-29 | 2008-06-12 | Kyoritsu Elex Co Ltd | Package for light-emitting diode, manufacturing method therefor, and light-emitting diode using the package |
| CN202758885U (en) * | 2012-06-21 | 2013-02-27 | 东莞李洲电子科技有限公司 | Light emitting diode module packaging structure |
| CN103325927A (en) * | 2013-07-05 | 2013-09-25 | 江苏华英光宝科技股份有限公司 | LED (light-emitting diode) support emitting light at 360 degrees, LED lamp post with support, and preparation method of support |
| CN103915550A (en) * | 2014-03-14 | 2014-07-09 | 苏州晶品光电科技有限公司 | Semiconductor light-emitting device based on fluorescent powder |
-
2014
- 2014-08-20 CN CN201410408560.0A patent/CN104218139A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008135624A (en) * | 2006-11-29 | 2008-06-12 | Kyoritsu Elex Co Ltd | Package for light-emitting diode, manufacturing method therefor, and light-emitting diode using the package |
| CN202758885U (en) * | 2012-06-21 | 2013-02-27 | 东莞李洲电子科技有限公司 | Light emitting diode module packaging structure |
| CN103325927A (en) * | 2013-07-05 | 2013-09-25 | 江苏华英光宝科技股份有限公司 | LED (light-emitting diode) support emitting light at 360 degrees, LED lamp post with support, and preparation method of support |
| CN103915550A (en) * | 2014-03-14 | 2014-07-09 | 苏州晶品光电科技有限公司 | Semiconductor light-emitting device based on fluorescent powder |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015149546A1 (en) * | 2014-04-02 | 2015-10-08 | 浙江深度光电科技有限公司 | Led module with total emission angle, manufacturing method therefor and led lamp |
| CN104882525A (en) * | 2015-06-02 | 2015-09-02 | 张国生 | White LED lamp wick with single glass substrate and manufacturing method thereof |
| CN104916764A (en) * | 2015-06-15 | 2015-09-16 | 刘海兵 | LED lamp wick |
| CN107742668A (en) * | 2017-10-07 | 2018-02-27 | 谭瑞银 | Easily changeable LED |
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| C06 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141217 |