CN204216087U - A kind of Novel LED encapsulating structure - Google Patents
A kind of Novel LED encapsulating structure Download PDFInfo
- Publication number
- CN204216087U CN204216087U CN201420716424.3U CN201420716424U CN204216087U CN 204216087 U CN204216087 U CN 204216087U CN 201420716424 U CN201420716424 U CN 201420716424U CN 204216087 U CN204216087 U CN 204216087U
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- CN
- China
- Prior art keywords
- lens
- heat sink
- pedestal
- led chip
- encapsulating structure
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Abstract
The utility model discloses a kind of Novel LED encapsulating structure, comprise pedestal, heat sink, interior lens, outer lens and be located at heat sink on LED chip, it is characterized in that: in the middle part of described pedestal, be provided with mounting groove, mounting groove is installed with heat sink, radiating gasket is fixed with on heat sink, LED chip is fixed on radiating gasket, LED chip both positive and negative polarity is drawn by gold thread, pedestal staggers successively from the inside to the outside and is fixed with interior lens and outer lens, described interior lens are glass lens, outer lens is plastic lens, plastic lens is removably mounted on pedestal by plug piece, the light-emitting area of plastic lens is coated with one deck nanoscale fluorescence coating.The utility model is by adopting interior lens and the outer lens being coated with nanoscale fluorescence coating, by the engagement process of LED chip and fluorescent material independent of outside encapsulation process, simplify the packaging technology of LED light source, improve light efficiency simultaneously, keep colour temperature consistent, eliminate hot spot, delayed the aging of fluorescent material.
Description
Technical field
The utility model relates to LED technology field, especially relates to a kind of Novel LED encapsulating structure.
Background technology
LED is as a kind of new type light source, the advantages such as it has efficiently, response fast, environmental protection, energy-conservation, the life-span is long, unprecedented development is being obtained in recent years compared to conventional light source. and universal along with LED application, is converted to the requirement to diversification such as light efficiency, colour temperature, color rendering index, life-span, stability gradually to the requirement of the requirement of the LED performance single index such as high light flux, specular removal from the beginning.At present, in LED encapsulation process, the indexs such as the colour temperature needed for guarantee light source, usually will add fluorescent material, and fluorescent material is directly filled on LED chip, but the phosphor concentration of each angle is inconsistent and cause existing hot spot during owing to filling, in addition because fluorescent material directly contacts with LED wafer, part light directly excites on LED wafer surface, and LED wafer temperature raises, be unfavorable for that wafer dispels the heat, accelerate the aging of fluorescent material.
Summary of the invention
In order to overcome above-mentioned prior art problem, the utility model provides that a kind of light efficiency is high, colour temperature is consistent, the Novel LED encapsulating structure of good heat dissipation effect.
The technical solution of the utility model is: a kind of Novel LED encapsulating structure, comprise pedestal, heat sink, interior lens, outer lens and be located at heat sink on LED chip, it is characterized in that: in the middle part of described pedestal, be provided with mounting groove, mounting groove is installed with heat sink, radiating gasket is fixed with on heat sink, LED chip is fixed on radiating gasket, LED chip both positive and negative polarity is drawn by gold thread, pedestal staggers successively from the inside to the outside and is fixed with interior lens and outer lens, described interior lens are glass lens, outer lens is plastic lens, plastic lens is removably mounted on pedestal by plug piece, the light-emitting area of plastic lens is coated with one deck nanoscale fluorescence coating.
Described radiating gasket is copper sheet, is separated with one deck thermal conductive silicon glue-line between LED chip and radiating gasket, can be delivered on radiating gasket by the heat that LED chip produces in time, effectively improve radiating effect.
Described heat sink be aluminium base heat sink, heat sink bottom be provided with some heat radiation grooves, by heat radiation groove can effectively make LED chip dispel the heat further, raising LED chip useful life.
Described nanoscale fluorescence coating is by nano level spraying coating process, is evenly fitly distributed in the light-emitting area of lens by fluorescent material, thus improves light efficiency, greatly reduces the loss of all kinds of former LED chip exciting light.
Described plastic lens is detachably changed; make fluorescence radiation face no longer single fixing; impel the change of the luminous index of lamp body more flexible; further; interior lens and outer lens with the use of effectively eliminating hot spot; again can available protecting nanoscale fluorescence coating, delay the aging of fluorescent material on nanoscale fluorescence coating.
Further, described plastic lens is sealed by sealing ring and pedestal link position.
The pin of drawing gold thread is provided with outside described pedestal.
The beneficial effects of the utility model are: the utility model is by adopting interior lens and the outer lens being coated with nanoscale fluorescence coating, by the engagement process of LED chip and fluorescent material independent of outside encapsulation process, simplify the packaging technology of LED light source, improve light efficiency simultaneously, keep colour temperature consistent, eliminate hot spot, delayed the aging of fluorescent material, further, adopt radiating gasket and be with reeded heat sink, LED chip being dispelled the heat timely and effectively, extends the useful life of LED chip.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In figure, 1-pedestal, 2-is heat sink, 3-LED chip, 4-radiating gasket, 5-glass lens, 6-plastic lens, 7-nanoscale fluorescence coating, 8-plug piece, 9-gold thread, 10-pin, and 11-dispels the heat groove.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described further.
As shown in Figure 1, a kind of Novel LED encapsulating structure, comprise pedestal 1, heat sink 2, LED chip 3, radiating gasket 4, glass lens 5 and plastic lens 6, mounting groove is provided with in the middle part of described pedestal 1, mounting groove is installed with heat sink 2, radiating gasket 4 is fixed with on heat sink 2, LED chip 3 is fixed on radiating gasket 4, LED chip 3 both positive and negative polarity is drawn by gold thread 9, the pin 10 of drawing gold thread 9 is provided with outside pedestal, pedestal 1 staggers successively from the inside to the outside and is fixed with glass lens 5 and plastic lens 6, glass lens and LED chip form a cavity sealed, optical clear silicone grease is filled with in body of wall, glass lens is adopted to improve light transmittance, described plastic lens 6 is fixed on pedestal 1 by plug piece 8, detachable replacing, make fluorescence radiation face no longer single fixing, impel the change of the luminous index of lamp body more flexible, the light-emitting area of plastic lens 6 is coated with one deck nanoscale fluorescence coating 7, this nanoscale fluorescence coating 7 is by nano level spraying coating process, fluorescent material is evenly fitly distributed in the light-emitting area of lens, keep colour temperature consistent, improve light efficiency, secondly, by the engagement process of fluorescent material and LED chip independent of outside encapsulation process, greatly reduce the loss of all kinds of former LED chip exciting light, simplify the packaging technology of LED light source, secondly, glass lens 5 and plastic lens 6 with the use of, effectively can eliminate hot spot, again can available protecting nanoscale fluorescence coating, delay the aging of fluorescent material on nanoscale fluorescence coating.
Described radiating gasket 4 is copper sheet, further, is coated with one deck thermal conductive silicon glue-line between LED chip 3 and radiating gasket 4, and can be delivered on radiating gasket by the heat that LED chip produces in time, effectively improve radiating effect, described thermal conductive silicon glue-line be 0.1-0.5mm.
Described heat sink 2 is that aluminium base heat sink, heat sink upper end, middle part to bottom is provided with some heat radiation grooves, can effectively make LED chip dispel the heat in time further, improve the useful life of LED chip by heat radiation groove.
The above; be only principle of the present utility model and preferred embodiment; but the invention is not limited to described embodiment; those of ordinary skill in the art also can make all equivalent variations or replacement under the prerequisite without prejudice to the utility model spirit; everyly carry out any simple amendment and change according to essence of the present utility model, all belong within the protection range required by the utility model.
Claims (7)
1. a Novel LED encapsulating structure, comprise pedestal, heat sink, interior lens, outer lens and be located at heat sink on LED chip, it is characterized in that: in the middle part of described pedestal, be provided with mounting groove, mounting groove is installed with heat sink, radiating gasket is fixed with on heat sink, LED chip is fixed on radiating gasket, LED chip both positive and negative polarity is drawn by gold thread, pedestal staggers successively from the inside to the outside and is fixed with interior lens and outer lens, described interior lens are glass lens, outer lens is plastic lens, plastic lens is removably mounted on pedestal by plug piece, the light-emitting area of plastic lens is coated with one deck nanoscale fluorescence coating.
2. Novel LED encapsulating structure according to claim 1, is characterized in that: described radiating gasket is copper sheet.
3. Novel LED encapsulating structure according to claim 1 and 2, is characterized in that: be separated with one deck thermal conductive silicon glue-line between described LED chip and radiating gasket.
4. Novel LED encapsulating structure according to claim 1, is characterized in that: described heat sink upper end, middle part to bottom is provided with some heat radiation grooves.
5. Novel LED encapsulating structure according to claim 1, is characterized in that: described heat sink for aluminium base heat sink.
6. Novel LED encapsulating structure according to claim 1, is characterized in that: described plastic lens is sealed by sealing ring and pedestal link position.
7. Novel LED encapsulating structure according to claim 1, is characterized in that: be provided with the pin of drawing gold thread outside described pedestal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420716424.3U CN204216087U (en) | 2014-11-26 | 2014-11-26 | A kind of Novel LED encapsulating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420716424.3U CN204216087U (en) | 2014-11-26 | 2014-11-26 | A kind of Novel LED encapsulating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204216087U true CN204216087U (en) | 2015-03-18 |
Family
ID=52984734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420716424.3U Expired - Fee Related CN204216087U (en) | 2014-11-26 | 2014-11-26 | A kind of Novel LED encapsulating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204216087U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105276382A (en) * | 2015-08-17 | 2016-01-27 | 苏州艾莱科光电科技有限公司 | Medium-power LED module in doublet lens and system |
| CN110047395A (en) * | 2019-05-22 | 2019-07-23 | 江苏米优光电科技有限公司 | A kind of micro- pitch surface attachment LED of outdoor display screen |
-
2014
- 2014-11-26 CN CN201420716424.3U patent/CN204216087U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105276382A (en) * | 2015-08-17 | 2016-01-27 | 苏州艾莱科光电科技有限公司 | Medium-power LED module in doublet lens and system |
| CN110047395A (en) * | 2019-05-22 | 2019-07-23 | 江苏米优光电科技有限公司 | A kind of micro- pitch surface attachment LED of outdoor display screen |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150318 Termination date: 20171126 |