CN202758885U - Light emitting diode module packaging structure - Google Patents
Light emitting diode module packaging structure Download PDFInfo
- Publication number
- CN202758885U CN202758885U CN2012202963895U CN201220296389U CN202758885U CN 202758885 U CN202758885 U CN 202758885U CN 2012202963895 U CN2012202963895 U CN 2012202963895U CN 201220296389 U CN201220296389 U CN 201220296389U CN 202758885 U CN202758885 U CN 202758885U
- Authority
- CN
- China
- Prior art keywords
- light emitting
- emitting diode
- transparent substrates
- diode module
- encapsulating structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
Abstract
The utility model relates to a light emitting diode module packaging structure comprising a transparent substrate, a light emitting chip and a transparent cover plate. The transparent substrate and the transparent cover plate are respectively provided with two transparent layers, between which a light emitting layer is sandwiched; the transparent substrate is provided with a circuit layer; and the light emitting layer is arranged on the transparent substrate and is electrically connected with the circuit layer through a wire. Therefore, the thermal resistance of the light emitting chip can be reduced; and one transparent cover plate is configured for every light emitting chip or every light emitting chips to achieve the purpose of emitting light from multiple surfaces and increasing the luminous efficiency.
Description
Technical field
The utility model is relevant with the light emitting diode module encapsulating structure, refers to especially a kind of employing transparent substrates and euphotic cover plate, can realize multifaceted light-emitting, and tool improves the light emitting diode module encapsulating structure of light efficiency purpose.
Background technology
Light-emitting diode has the light efficiency height, and long service life is energy-conservation, the many merits such as environmental protection more and more are widely used in numerous fields, along with developing rapidly of LED lighting technology, people are more and more higher to the requirement of various LED lighting apparatus, such as energy saving, useful life, high light efficiency etc.
At present, traditional LED illumination light-emitting face only is one side, causes application to be tied greatly.
Summary of the invention
The technical problem that the utility model solves namely in that a kind of employing transparent substrates and euphotic cover plate are provided, can realize multifaceted light-emitting, and tool improves the light emitting diode module encapsulating structure of light efficiency purpose.
The technological means that the utility model adopts is as follows.
Light emitting diode module encapsulating structure of the present utility model, include: transparent substrates, luminescent wafer and euphotic cover plate, this transparent substrates and euphotic cover plate are provided with between two photic zones and two photic zones and are folded with luminescent layer, be provided with line layer in described transparent substrates, this luminescent wafer is located on this transparent substrates, described luminescent wafer is electrically connected with described line layer by wire, can reduce the thermal resistance of luminescent wafer, and by each luminescent wafer or euphotic cover plate of every several luminescent wafers configuration, to reach the multiaspect bright dipping, improve the purpose of light efficiency.
5 ~ 30 times of the height that described transparent substrates thickness is described luminescent wafer.
Described photic zone material can be metal or the materials such as glass or PV or transparent colloid.
The luminescent layer of described transparent substrates and/or cover plate can or shoot out or the vapor deposition mode realizes by spraying.
The flat shape of described transparent substrates and/or cover plate can be triangle or quadrangle or polygon, and described transparent substrates shape of cross section can be triangle or quadrangle or polygon.
Described line layer can be by stickup or pressing or depositing operation formation.
Be provided with adhesion layer between described transparent substrates and this cover plate.
Described adhesion layer can be the clear, viscous material, also can be non-clear, viscous material, described material shape can be solid-state also can be liquid.
Described lead material is metal conductive materials, can be that simple metal also can be the alloy thing.
The beneficial effect that the utility model produces is that the light emitting diode module encapsulating structure can realize multifaceted light-emitting, and tool improves the purpose of light efficiency.
Description of drawings
Fig. 1 is the cross-sectional view of light emitting diode module encapsulating structure in the utility model.
Fig. 2 ~ Fig. 3 is the processing procedure schematic diagram of light emitting diode module encapsulating structure in the utility model.
The figure number explanation:
Wire 105
Embodiment
Such as Fig. 1 the utility model light emitting diode module encapsulating structure schematic diagram those shown, light emitting diode module encapsulating structure of the present utility model includes transparent substrates 10, luminescent wafer 104 and euphotic cover plate 100.
Wherein: this transparent substrates 10 and euphotic cover plate 100 are provided with between two photic zones 101 and two photic zones 101 and are folded with luminescent layer 102, be provided with line layer 103 in described transparent substrates 10, this luminescent wafer 104 is located on this transparent substrates 10, described luminescent wafer 104 is electrically connected with described line layer 103 by wire 105, can reduce the thermal resistance of luminescent wafer, and by each luminescent wafer or euphotic cover plate of every several luminescent wafers configuration, to reach the multiaspect bright dipping, improve the purpose of light efficiency.
During making, as shown in Figure 2, photic zone 101 for the size that designs, these photic zone 101 materials can be metal or glass or PV or transparent colloid material, in the middle of two photic zones 101 by spraying or shoot out or the mode such as vapor deposition, it is middle that luminescent layer 102 (can be luminescent phosphor materials) is implemented in two photic zones 101, form transparent substrates or the euphotic cover plate of design, 5 ~ 30 times of the height that this transparent substrates thickness is described luminescent wafer, the flat shape of this transparent substrates and/or cover plate can be triangle or quadrangle or polygon, and described transparent substrates shape of cross section can be triangle or quadrangle or polygon.
Again this luminescent wafer 104 is bonded on this transparent substrates 10, as shown in Figure 3, this line layer 103 can be by stickup or pressing or depositing operation formation, and between luminescent wafer 104 and line layer 103 welding lead 105, these wire 105 materials are metal conductive materials, can be that simple metal also can be the alloy thing; At last, this euphotic cover plate 100 is covered on this transparent substrates 10, as shown in Figure 1, be provided with adhesion layer 106 between this transparent substrates 10 and this euphotic cover plate 100, this adhesion layer 106 can be the clear, viscous material, also can be non-clear, viscous material, described material shape can be solid-state also can be liquid, to consist of fixing of 100 of this transparent substrates 10 and this euphotic cover plates.
Claims (9)
1. a light emitting diode module encapsulating structure is characterized in that, includes:
Transparent substrates, it is provided with between two photic zones and two photic zones and is folded with luminescent layer, is provided with line layer in described transparent substrates;
Luminescent wafer is located on this transparent substrates, and described luminescent wafer is electrically connected with described line layer by wire; And
Euphotic cover plate, lid are established and are fixed in this transparent substrates top, and this euphotic cover plate is provided with between two photic zones and two photic zones and is folded with luminescent layer.
2. light emitting diode module encapsulating structure as claimed in claim 1 is characterized in that, 5 ~ 30 times of the height that this transparent substrates thickness is described luminescent wafer.
3. such as claim 1 a described light emitting diode module encapsulating structure, it is characterized in that this photic zone material can be metal or glass or PV or transparent colloid material.
4. light emitting diode module encapsulating structure as claimed in claim 1 is characterized in that, the luminescent layer of this transparent substrates and/or cover plate is by spraying or shoot out or the vapor deposition mode realizes.
5. light emitting diode module encapsulating structure as claimed in claim 1, it is characterized in that, the flat shape of this transparent substrates and/or cover plate is triangle or quadrangle or polygon, and described transparent substrates shape of cross section is triangle or quadrangle or polygon.
6. light emitting diode module encapsulating structure as claimed in claim 1 is characterized in that, this line layer is by stickup or pressing or depositing operation formation.
7. light emitting diode module encapsulating structure as claimed in claim 1 is characterized in that, is provided with adhesion layer between this transparent substrates and this cover plate.
8. light emitting diode module encapsulating structure as claimed in claim 7 is characterized in that, this adhesion layer is clear, viscous material or nontransparent cohesive material, and described material shape is solid-state or liquid.
9. light emitting diode module encapsulating structure as claimed in claim 1 is characterized in that, this lead material is metal conductive materials or simple metal material or alloy thing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202963895U CN202758885U (en) | 2012-06-21 | 2012-06-21 | Light emitting diode module packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012202963895U CN202758885U (en) | 2012-06-21 | 2012-06-21 | Light emitting diode module packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202758885U true CN202758885U (en) | 2013-02-27 |
Family
ID=47738050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012202963895U Expired - Lifetime CN202758885U (en) | 2012-06-21 | 2012-06-21 | Light emitting diode module packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202758885U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103456870A (en) * | 2013-09-11 | 2013-12-18 | 厦门华联电子有限公司 | COB light source coated by fluorescent powder glue and manufacturing method thereof |
| CN103872224A (en) * | 2014-03-04 | 2014-06-18 | 福建永德吉灯业股份有限公司 | Novel LED (Light Emitting Diode) illuminating element |
| CN104218139A (en) * | 2014-08-20 | 2014-12-17 | 深圳市晶台股份有限公司 | Novel LED package structure |
| WO2020119414A1 (en) * | 2018-12-12 | 2020-06-18 | 维沃移动通信有限公司 | Packaging module and terminal device |
-
2012
- 2012-06-21 CN CN2012202963895U patent/CN202758885U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103456870A (en) * | 2013-09-11 | 2013-12-18 | 厦门华联电子有限公司 | COB light source coated by fluorescent powder glue and manufacturing method thereof |
| CN103456870B (en) * | 2013-09-11 | 2016-06-01 | 厦门华联电子有限公司 | The COB light source of phosphor gel coating and manufacture method thereof |
| CN103872224A (en) * | 2014-03-04 | 2014-06-18 | 福建永德吉灯业股份有限公司 | Novel LED (Light Emitting Diode) illuminating element |
| CN104218139A (en) * | 2014-08-20 | 2014-12-17 | 深圳市晶台股份有限公司 | Novel LED package structure |
| WO2020119414A1 (en) * | 2018-12-12 | 2020-06-18 | 维沃移动通信有限公司 | Packaging module and terminal device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130227 |