CN103456870B - The COB light source of phosphor gel coating and manufacture method thereof - Google Patents
The COB light source of phosphor gel coating and manufacture method thereof Download PDFInfo
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- CN103456870B CN103456870B CN201310411508.6A CN201310411508A CN103456870B CN 103456870 B CN103456870 B CN 103456870B CN 201310411508 A CN201310411508 A CN 201310411508A CN 103456870 B CN103456870 B CN 103456870B
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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Abstract
The present invention relates to LED/light source, particularly relate to LED/light source and the manufacture method thereof of COB encapsulation. The manufacture method of this COB light source, comprises the steps: A, first produces the transparent substrates that one side has phosphor gel coating; B, gets the transparent substrates that step A described in a slice makes, makes circuit on the another side that it deviates from phosphor gel face; C, the transparent substrates of the transparent substrates and the making of described step B of getting step A making described in a slice is used as the upper and lower substrate of this COB light source and carries out LED, thus produces COB light source. This COB light source, comprise: carry out stacking by upper strata transparent substrates, lower floor's transparent substrates and fix, layer of fluorescent powder glue-line all adheres in the lower floor of upper strata, lower floor's transparent substrates, wherein the upper strata of lower floor's transparent substrates is fixed with some LEDs chips, and be provided with circuit, and by conductive wire bonding welding LED chip and circuit. The present invention for the manufacture of going out simple and reliable for structure, thermal diffusivity, get light rate, light effect and Light distribation angle all preferably COB light source.
Description
Technical field
The present invention relates to LED/light source, particularly relate to LED/light source and the manufacture method thereof of COB encapsulation.
Background technology
COB encapsulation is encapsulation technology on direct plate, is a kind of emerging integrated LED encapsulation technology. Along with the rising of LED cost, the characteristic of low cost of this kind of integrated form encapsulation starts to highlight, and obtains numerous concern. COB by assembly glue or solder by multiple LED chip directly and circuit board interconnect, then realizes encapsulation by lead-in wire bonding. The LED-baseplate of COB encapsulation current mainly aluminium base and ceramic substrate. The former cost is low, but thermal diffusivity is poor, get light rate, Light distribation can affect restriction by the surface of the load district specular aluminium/silver of substrate, then thermal diffusivity is good for the latter, get light result to affect by ceramic surface diffuse-reflectance, get light rate and Light distribation angle is all better than aluminium base, but cost height.
The application for a patent for invention that publication number is CN102664229A discloses a kind of luminous dipolar object light source structure, but this complex structure, the LED component comprise transparent substrates, being fixed on transparent substrates and printing opacity top board, printing opacity side plate etc. The fluorescent adhesive layer that its transparent substrates, top board comprise both sides slide and be coated with therebetween. In this light-source structure, slide at least needs more than 4-6 block, and fiber-loss is big, and light path is long, and light extraction efficiency is low, complex process.
Summary of the invention
For the weak point of existing LED/light source, the COB light source that transparent substrates that the present invention proposes the coating of a kind of phosphor gel, the transparent substrates applied based on this phosphor gel realize and manufacture method thereof, it is possible to produce simple and reliable for structure, thermal diffusivity, get light rate, light effect and Light distribation angle (being greater than 240 ��) all preferably COB light source.
A manufacture method for COB light source, comprises the steps:
A, first produces the transparent substrates that one side has phosphor gel coating;
B, gets the transparent substrates that step A described in a slice makes, makes circuit on the another side that it deviates from phosphor gel face;
C, the transparent substrates of the transparent substrates and the making of described step B of getting step A making described in a slice is used as the upper and lower substrate of this COB light source and carries out LED, thus produces COB light source.
Wherein, steps A adopts silk-screen printing technique or adopt atomizing spraying technique to produce the transparent substrates that one side has phosphor gel coating.
Above-mentioned
The preferred realization of silk-screen printing technique is:
A1, makes the silk printing screen version of array arrangement pattern, and the order number of silk printing screen version is 10 ~ 1000 orders;
A2, configuration fluorescent material sizing material, fluorescent material adopts wherein one or more the mixing of yellow powder, green powder, rouge and powder;
A3, cleans silk printing screen version made in super white float flat glass, steps A 1, scraper and other operation associated materials, instrument;
A4, with silk printing screen version apart from this sheet glass certain distance scraper under certain overdraft and scraper speed, make phosphor gel scraper extrude under, be evenly coated on this operation surface of this sheet glass from silk screen through hole;
A5, is cured process to the phosphor gel of the print of silk on above-mentioned sheet glass;
A6, cuts the sheet glass of above-mentioned making, cuts out independent cell substrate.
Wherein, step B is the electrode circuit adopting plasma sputtering method to form ITO, or adopt mull technique to attach the electrode circuit of conductive metal sheet, or adopt the electrode circuit of stencil attachment conductive metal layer, or adopt the electrode circuit of vapour deposition method attachment conductive metal layer.
The preferred realization of the electrode circuit that above-mentioned plasma sputtering method forms ITO is:
B1, the transparent substrates that one side made in steps A has phosphor gel coating cleans;
B2, make one there is the electrode circuit figure to be formed cover plate;
B3, covers, by this, the another side deviating from phosphor gel face that plate is attached at transparent substrates;
B4, adopt plasma sputtering method to be deposited on by tin indium oxide (ITO) this posts the transparent substrates of covering plate this on the surface;
B5, removes and covers plate, thus forms ITO electrode circuit on the surface of transparent substrates.
The preferred realization of the electrode circuit that above-mentioned mull technique attaches conductive metal sheet is:
B1 ', the transparent substrates that one side made in steps A has phosphor gel coating cleans;
B2 ', cuts 2 conductive metal sheets as electrode circuit in conductive metal thin plate;
These 2 conductive metal sheet bondings are attached to two side positions of the another side deviating from phosphor gel face of transparent substrates, thus form the electrode circuit of electric metal sheet on this glass surface of glass substrate by B3 '.
Wherein, the step C lower transparent substrates that to be the upper transparent substrates that adopts transparent colloid and box dam mode described step A to be made make with described step B is fixed or to adopt transparent cured glue directly to bond fixing, adopts single super-high-power LED chip or several high-power chips to carry out connecting or more middle low power chips carry out series-parallel connection by LED chip and lower transparent substrates nation calmly.
The preferred realization of above-mentioned step C is:
C1, by bonder, many blue-light LED chips are fixed on the face deviating from phosphor gel face of the lower transparent substrates that described step B makes, composition matrix form arrangement, multiple chips series connection and parallel connection, after LED chip solidifies, with conducting metal silk thread (such as Jin Si or Si-Al wire) bonding welding LED chip and circuit;
C2, at the surface use box dam glue box dam of lower transparent substrates, and solidifies;
C3, fills transparent colloid in box dam district, covers the upper transparent substrates of another sheet, is heating and curing.
Or, the preferred realization of above-mentioned step C is:
C1 ', by bonder, many blue-light LED chips are fixed on the face deviating from phosphor gel face of the lower transparent substrates that described step B makes, multiple chips series connection or in parallel, after LED chip solidifies, with conducting metal silk thread (such as Jin Si or Si-Al wire) bonding welding LED chip and circuit;
C2 ', at the surface use box dam glue box dam of lower transparent substrates, and solidifies;
C3 ', fills transparent colloid in box dam district, covers the upper transparent substrates of another sheet, is heating and curing.
Or, the preferred realization of above-mentioned step C is:
C1 ", by bonder, 1 blue-light LED chip is fixed on the face deviating from phosphor gel face of the lower transparent substrates that described step B makes, after LED chip solidifies, with conducting metal silk thread (such as Jin Si or Si-Al wire) bonding welding LED chip and electrode circuit;
C2 ", lower transparent substrates is solidified with and above LED chip and on periphery surface, injects Photosetting glue;
C3 ", cover the upper transparent substrates of another sheet, it is cured by UV-light.
The manufacture method of the transparent substrates of a kind of phosphor gel coating, it is characterised in that, following steps:
A, is mixed into the mixture of fluorescent material and glue by fluorescent material and glue;
B, the surface cleaning of transparent substrates is clean, and by other surface protection good seals of its non-spraying, it is placed in sealing spray chamber;
C, is sent in sealing spray chamber after being atomized by the mixture of fluorescent material and glue;
The fog of the mixture of D, fluorescent material and glue be attached to this transparent substrates by spraying one treats on operation surface;
E, takes out this transparent substrates and carries out solid glue, makes the transparent substrates that one side has phosphor gel coating.
The manufacture method of the transparent substrates of a kind of phosphor gel coating, it is characterised in that, following steps:
A, makes the silk printing screen version of phosphor gel layer pattern;
B, configuration fluorescent material sizing material;
C, cleans transparent substrates, silk printing screen version, scraper and other operation associated materials, instrument;
D, the silk printing screen version distance certain spacing of transparent substrates, makes phosphor gel under scraper extrudes, is evenly coated on this operation surface of this sheet glass from silk screen through hole;
E, is cured process to the phosphor gel of the print of silk on transparent substrates.
Wherein, the preferred realization of steps A is: the order number of silk printing screen version selects 50 ~ 400 orders.
Wherein, the preferred realization of step D is: silk printing screen version distance transparent substrates 1 ~ 5mm, scraper overdraft is 0.1 ~ 1kg, and scraper speed is 0.1-20cm/s.
The transparent substrates of a kind of phosphor gel coating, it is characterised in that, the wherein one side of transparent substrates is coated with fluorescent material glue-line.
A kind of COB light source, comprise: carry out stacking by upper strata transparent substrates, lower floor's transparent substrates and fix, layer of fluorescent powder glue-line all adheres in the lower floor of upper strata, lower floor's transparent substrates, wherein the upper strata of lower floor's transparent substrates is fixed with some LEDs chips, and be provided with circuit, and by conductive wire bonding welding LED chip and circuit.
Wherein, the upper strata of lower floor's transparent substrates is arranged with box dam at the outer of LED chip, is perfused with transparent colloid between the upper strata of stacking, lower floor's transparent substrates within box dam, for fixing the two.
Or, the upper strata of lower floor's transparent substrates on LED chip and periphery be marked with transparent cured glue, this transparent cured glue is arranged between the upper strata of stacking, lower floor's transparent substrates, for fixing the two.
The manufacture method of COB light source realized based on phosphor gel coated glass substrates of the present invention, it is possible to produce simple and reliable for structure, thermal diffusivity, get light rate, light effect and Light distribation angle (being greater than 240 ��) all preferably COB light source.
Accompanying drawing explanation
Fig. 1 is the structural representation of the sheet glass with phosphor gel coating made by an embodiment.
Fig. 2 is the structural representation of the COB light source manufactured by an embodiment.
Embodiment
The manufacture of the COB light source of the present invention mainly comprise 3 big step: A, first produce one side have phosphor gel coating transparent substrates. B, gets the transparent substrates that step A described in a slice makes, makes circuit on the another side that it deviates from phosphor gel face. C, the transparent substrates of the transparent substrates and the making of described step B of getting step A making described in a slice is used as the upper and lower substrate of this COB light source and carries out LED, thus produces the COB light source of the present invention. Manufacturing processed to be above described in detail below in conjunction with the drawings and specific embodiments.
The transparent substrates making that the one side of steps A has phosphor gel coating can adopt silk-screen printing technique or adopt the technique of atomizing spraying to carry out.
The technique of atomizing spraying is adopted to comprise: fluorescent material and glue are mixed into the mixture of fluorescent material and glue by (1); (2) surface cleaning of transparent substrates (such as sheet glass) is clean, and by other surface protection good seals of its non-spraying, it is placed in sealing spray chamber; (3) it is sent in sealing spray chamber after the mixture of fluorescent material and glue being atomized; (4) fog of the mixture of fluorescent material and glue is attached to of this transparent substrates and treats on operation surface by spraying; (5) this transparent substrates is taken out and carry out solid glue, make the transparent substrates that one side has phosphor gel coating. It is more emerging technique that atomizing spraying technique compares silk-screen printing technique, and about the detailed process of atomizing spraying, those skilled in the art can consult what the patent application such as publication number 102832329A disclosed.
Adopt silk-screen printing technique mainly to comprise: make silk printing screen version, transparent substrates carrier surface cleans, fluorescent powder paste material configuration, fluorescent powder paste material is printed on transparent substrates carrier, solidification etc. Owing to silk-screen printing technique is a kind of maturation process, thus production cost is lower, and the present invention preferably adopts. Only be further elaborated with the implementation step of a preferred silk screen printing below, but and be not used in limitation this steps A realize process. The enforcement mode of this steps A, specifically comprises:
A1, makes array 3 �� 3, the silk printing screen version (abbreviation silk screen) of the square pattern of length of side 30mm. Preferably, the order number of silk printing screen version is 10 ~ 1000 orders, it is more preferable to be 100 ~ 200 orders. General, in order to provide manufacturing efficiency, the mode of multiple dice splicing in a layout all can be adopted. Certain, the pattern of silk printing screen version should design according to needs of production, and it is not limited to above-mentioned array 3 �� 3, the square of length of side 25mm, as being the circle of diameter 1 ~ 30mm, or the square of the length of side 1 ~ 30mm, or the rectangle of long 10 ~ 50mm, width ~ 10mm, arrange in single or multiple array;
A2, configuration fluorescent material sizing material. In this embodiment, colloid is adopted as silica gel, and fluorescent material adopts the yellow powder of aluminate, and the mass ratio of fluorescent material and colloid is 1:2. Certain, the colloid material of this fluorescent material sizing material, fluorescent material material and the proportioning of the two should design according to needs of production, and be not limited thereto, if phosphor material powder component can be wherein one or more the mixing of aluminate yellow powder, Suse green powder, nitride rouge and powder etc., colloid can be silica gel, epoxy resin etc. The mass ratio of fluorescent material and colloid is 1:(0.1 ~ 20);
A3, by being of a size of in the super white float flat glass of 100mm �� 100mm, A1, operation associated materials, the instrument such as made silk printing screen version and scraper clean, it is preferred to use plasma cleans 1 ~ 20 minute. Certain, super white float flat glass is because having high transmission rate, therefore the transparent substrates in this embodiment is for super white float flat glass, but actual production can be as required, other transparent substrates are adopted to realize, as adopted the light-transmissive resin substrate of the materials such as PMMA, PC;
A4, with silk printing screen version apart from this sheet glass 1mm, scraper overdraft is 0.5kg, and scraper speed is 0.1cm/s, makes phosphor gel under scraper extrudes, is evenly coated on this operation surface of this sheet glass from silk screen through hole. Certain, each control condition of above-mentioned silk print operation can carry out adjustment according to needs of production and change, such as silk screen distance sheet glass 1 ~ 5mm, scraper overdraft 0.1 ~ 1kg, scraper speed 0.1 ~ 20cm/s, and form the fluorescent material glue-line of different thickness, such as 0.01-0.8mm;
A5, is cured process to the phosphor gel of the print of silk on above-mentioned sheet glass. Solidification treatment should adopt corresponding curing mode according to the difference of the fluorescent material sizing material adopted;
A6, cuts the sheet glass (as shown in Figure 1, the one side of sheet glass 101 is coated with the fluorescent material glue-line 102 of 9 30mm �� 30mm squares) of above-mentioned making, cuts out the square substrate of 9 30mm �� 30mm.
The circuit of step B makes the electrode circuit that plasma sputtering method can be adopted to form ITO, or directly adopt mull technique to attach the electrode circuit of conductive metal sheet, or also can adopt the electrode circuit of stencil attachment conductive metal layer, or adopt the electrode circuit of vapour deposition method attachment conductive metal layer.
Adopt plasma sputtering method to form the electrode circuit of ITO, specifically comprise:
B1, it is preferable that, in order to guarantee that transparent substrates has relatively high cleanliness and, so that the making of circuit can be more firm, needs the transparent substrates that one side made in steps A has phosphor gel coating to clean before making. Preferably, this phosphor gel coated glass substrates is carried out plasma and clean 2 minutes;
B2, make one there is the electrode circuit figure to be formed cover plate. Preferably, the electrode circuit figure of 2 1mm �� 30mm is designed in both sides;
B3, covers, by this, the another side (glass surface of unstressed configuration powder glue side) deviating from phosphor gel face that plate is attached at transparent substrates;
B4, adopt plasma sputtering method to be deposited on by tin indium oxide (ITO) this posts the glass substrate of covering plate this on the surface;
B5, removes and covers plate, thus forms ITO electrode circuit on this glass surface of glass substrate.
Adopt mull technique to attach the electrode circuit of conductive metal sheet, specifically comprise:
B1 ', it is preferable that, in order to guarantee that transparent substrates has relatively high cleanliness and, so that the making of circuit can be more firm, needs the transparent substrates that one side made in steps A has phosphor gel coating to clean before making. Preferably, this phosphor gel coated glass substrates is carried out plasma and clean 1 minute;
B2 ', is cut by cutter sanction or laser cutting cuts 2 silver-plated copper sheets of 5mm �� 10mm on silver-plated copper foil (or other conductive metal thin plate).
These 2 silver-plated copper sheet bondings are attached to two side positions of the another side (glass surface of unstressed configuration powder glue side) deviating from phosphor gel face of transparent substrates, thus form the electrode circuit of electric metal sheet on this glass surface of glass substrate by B3 '.
The LED of step C makes and mainly comprises, fixing and LED chip and lower transparent substrates the nation of the stacking of lower transparent substrates is fixed, can adopt: the lower transparent substrates that the upper transparent substrates that described step A is made by transparent colloid+box dam mode and described step B make is fixed or adopted transparent cured glue directly to bond fixing or other modes by upper, lower transparent substrates is fixed, and LED chip surely can adopt single super-high-power LED chip or several high-power chips to carry out connecting or more middle low power chips carry out the multiple modes such as series-parallel connection (i.e. array chip layout) with lower transparent substrates nation, wherein it is bonded, the metal wire of welding can be Jin Si or Si-Al wire or other conduct electricity good conducting metal silk thread. only it is described in the enforcement mode of the encapsulation of 3 step C below.
The enforcement mode one of the encapsulation of step C, comprising:
C1, by bonder, 108 0.03W small power blue-light LED chips are fixed on the glass surface (face that deviate from phosphor gel face, that be manufactured with circuit) of the lower transparent substrates that described step B makes, the matrix form arrangement of composition 12 �� 9,12 chips series connection, 9 tunnels are in parallel. After LED chip solidifies, with Si-Al wire bonding welding LED chip and electrode circuit;
C2, the glass surface at lower transparent substrates uses box dam glue box dam, solidifies 1-4 hour at 100-150 DEG C;
C3, fills transparent colloid (such as transparent silica gel) in box dam district, covers the upper transparent substrates of another sheet, heats 100-150 DEG C of solidification in 1 hour.
The enforcement mode two of the encapsulation of step C, comprising:
20 high-power blue-light LED chips of 1W are fixed on the glass surface (face that deviate from phosphor gel face, that be manufactured with circuit) of the lower transparent substrates that described step B makes by C1 ' by bonder, the matrix form arrangement of composition 10 �� 2,20 chips series connection. After LED chip solidifies, weld LED chip and electrode circuit with gold wire bonding;
C2 ', the glass surface at lower transparent substrates uses box dam glue box dam, solidifies 1-4 hour at 100-150 DEG C;
C3 ', fills transparent colloid (such as transparent silica gel) in box dam district, covers the upper transparent substrates of another sheet, heats 100-150 DEG C until solidify completely.
The enforcement mode three of the encapsulation of step C, comprising:
C1 ", by bonder, 1 high-power blue-light LED chip of 15W is fixed on the glass surface (face that deviate from phosphor gel face, that be manufactured with circuit of the lower transparent substrates that described step B makes. After LED chip solidifies, weld LED chip and electrode circuit with gold wire bonding;
C2 ", lower transparent substrates is solidified with and above LED chip and in periphery glass surface, injects Photosetting glue (such as ultra-violet curing glue) by glue-injection machine;
C3 ", cover the upper transparent substrates of another sheet, it is cured by UV-light.
The present invention adopts above-mentioned steps A, B, C can produce simple and reliable for structure, thermal diffusivity, get light rate and Light distribation angle all preferably COB light source. such as, by above-mentioned steps A 1 ~ A6, B1 ' ~ B3 ', C1 ~ C3, a kind of COB light source as shown in Figure 2 can be produced, its structure is: primarily of upper strata transparent substrates 201, lower floor's transparent substrates 201 ' stacking is fixed, lower floor's attachment layer of fluorescent powder glue-line 202 of upper strata transparent substrates 201, lower floor's attachment layer of fluorescent powder glue-line 202 ' of lower floor's transparent substrates 201 ', wherein the upper strata of lower floor's transparent substrates 201 ' is fixed with some LEDs chips 205, both sides are provided with electrode circuit 204, and it is bonded welding LED chip 205 and electrode circuit 204 by conductive wire 206, the periphery of LED chip 205 has box dam 203, the upper strata transparent substrates 201 of stacking, within box dam 203, transparent colloid 207 it is perfused with between lower floor's transparent substrates 201 ', both fixing. certain, if adopting the different step B of circuit making and the step C of encapsulation, the structure of then manufactured COB light source can be slightly different, as adopted step C1 " ~ C3 ", then the periphery of LED chip is inevitable does not possess box dam part, namely the upper strata of lower floor's transparent substrates 201 ' on LED chip 205 and periphery be marked with transparent Photosetting glue, this transparent cured glue is arranged between the upper strata of stacking, lower floor's transparent substrates 201,201 ', both fixing, other same sections illustrate no longer in detail in this.
Although specifically showing in conjunction with preferred embodiment and describing the present invention; but the technician of art should be understood that; not departing from the spirit and scope of the present invention that appended claims limits; the present invention can be made a variety of changes in the form and details, be protection scope of the present invention.
Claims (9)
1. the manufacture method of a COB light source, it is characterised in that, comprise the steps:
A, first produces the transparent substrates that one side has phosphor gel coating;
B, gets the transparent substrates that step A described in a slice makes, makes electrode circuit on the another side that it deviates from phosphor gel face;
C, the transparent substrates of the transparent substrates and the making of described step B of getting step A making described in a slice is used as the upper and lower substrate of this COB light source and carries out LED, thus produces COB light source; Wherein, the modes of emplacement of upper and lower substrate is: the transparent substrates that step A is made is placed as lower floor's attachment layer of fluorescent powder glue-line of transparent substrates, and the lower floor that the transparent substrates that step B is made is placed as transparent substrates adheres to layer of fluorescent powder glue-line, upper strata and has electrode circuit.
2. the manufacture method of COB light source according to claim 1, it is characterised in that, steps A adopts silk-screen printing technique to produce the transparent substrates simultaneously with phosphor gel coating.
3. the manufacture method of COB light source according to claim 2, it is characterised in that, the preferred realization of silk-screen printing technique is:
A1, makes the silk printing screen version of array arrangement pattern, and the order number of silk printing screen version is 10 ~ 1000 orders;
A2, configuration fluorescent material sizing material, fluorescent material adopts wherein one or more the mixing of yellow powder, green powder, rouge and powder;
A3, cleans silk printing screen version made in super white float flat glass, steps A 1, scraper and other operation associated materials, instrument;
A4, with silk printing screen version apart from this sheet glass certain distance scraper under certain overdraft and scraper speed, make phosphor gel scraper extrude under, be evenly coated on this operation surface of this sheet glass from silk screen through hole;
A5, is cured process to the phosphor gel of the print of silk on above-mentioned sheet glass;
A6, cuts the sheet glass of above-mentioned making, cuts out independent cell substrate.
4. the manufacture method of COB light source according to claim 1, it is characterised in that, steps A adopts atomizing spraying technique to produce the transparent substrates simultaneously with phosphor gel coating.
5. the manufacture method of COB light source according to claim 1, it is characterised in that, step B is the electrode circuit adopting plasma sputtering method to form ITO, should
The preferred realization of the electrode circuit that plasma sputtering method forms ITO is:
B1, the transparent substrates that one side made in steps A has phosphor gel coating cleans;
B2, make one there is the electrode circuit figure to be formed cover plate;
B3, covers, by this, the another side deviating from phosphor gel face that plate is attached at transparent substrates;
B4, adopt plasma sputtering method to be deposited on by tin indium oxide (ITO) this posts the transparent substrates of covering plate this on the surface;
B5, removes and covers plate, thus forms ITO electrode circuit on the surface of transparent substrates.
6. the manufacture method of COB light source according to claim 1, it is characterized in that, step B is the electrode circuit adopting mull technique to attach conductive metal sheet, or adopts the electrode circuit of stencil attachment conductive metal layer, or adopts the electrode circuit of vapour deposition method attachment conductive metal layer.
7. the manufacture method of COB light source according to claim 1, it is characterized in that, the step C lower transparent substrates that to be the upper transparent substrates that adopts transparent colloid and box dam mode described step A to be made make with described step B is fixed or to adopt transparent cured glue directly to bond fixing, adopts single super-high-power LED chip or several high-power chips to carry out connecting or more middle low power chips carry out series-parallel connection by LED chip and lower transparent substrates nation calmly.
8. the manufacture method of COB light source according to claim 7, it is characterised in that, the preferred realization of step C is:
C1, the face deviating from phosphor gel face that by bonder, many blue-light LED chips are fixed on the lower transparent substrates that described step B makes, composition matrix form arrangement, multiple chips series connection and/or parallel connection, after LED chip solidifies, with conducting metal silk thread bonding welding LED chip and electrode circuit;
C2, at the surface use box dam glue box dam of lower transparent substrates, and solidifies;
C3, fills transparent colloid in box dam district, covers the upper transparent substrates of another sheet, is heating and curing.
9. the manufacture method of COB light source according to claim 7, it is characterised in that, the preferred realization of step C is:
C1 ', is fixed on the face deviating from phosphor gel face of the lower transparent substrates that described step B makes by bonder by 1 blue-light LED chip, after LED chip solidifies, welds LED chip and electrode circuit with Jin Si or Si-Al wire bonding;
C2 ', is solidified with on lower transparent substrates and injects Photosetting glue above LED chip and on periphery surface;
C3 ', is covered the upper transparent substrates of another sheet, is cured by UV-light.
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| JP2008034473A (en) * | 2006-07-26 | 2008-02-14 | Toyoda Gosei Co Ltd | Surface light source |
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| CN101846256A (en) * | 2010-05-04 | 2010-09-29 | 蔡州 | Led light source |
| CN202712266U (en) * | 2012-05-21 | 2013-01-30 | 苏州晶品光电科技有限公司 | Fluorescent transparent ceramic LED sealing structure |
| CN202758885U (en) * | 2012-06-21 | 2013-02-27 | 东莞李洲电子科技有限公司 | Light emitting diode module packaging structure |
| CN203118987U (en) * | 2013-01-25 | 2013-08-07 | 廖旭文 | Double-sided luminous LED lamp panel structure |
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| CN106159070B (en) * | 2016-08-26 | 2019-01-15 | 曾广祥 | A kind of highly dense display screen unit panel and preparation method thereof |
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Address after: 361000 Fujian Province, Xiamen torch hi tech Industrial Development Zone Hualian electronic building Patentee after: Xiamen Hualian electronic Limited by Share Ltd Address before: 361000 Fujian Province, Xiamen torch hi tech Industrial Development Zone Hualian electronic building Patentee before: Xiamen Hualian Electronics Co., Ltd. |