CN104600180A - LED printed circuit board having fluorescence converting function and manufacturing method thereof - Google Patents
LED printed circuit board having fluorescence converting function and manufacturing method thereof Download PDFInfo
- Publication number
- CN104600180A CN104600180A CN201510033567.3A CN201510033567A CN104600180A CN 104600180 A CN104600180 A CN 104600180A CN 201510033567 A CN201510033567 A CN 201510033567A CN 104600180 A CN104600180 A CN 104600180A
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- led
- electrically conductive
- conductive ink
- coating
- transparent substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
Abstract
The invention discloses an LED printed circuit board having a fluorescence converting function and a manufacturing method thereof and belongs to the field of printed circuit boards. The problem that the LED printed circuit board does not have the fluorescence converting function is solved. An LED circuit (3) simultaneously provided with a fluorescent ink coating (2) and conductive ink print is arranged on the same side surface of the transparent substrate (1). The fluorescent ink coating (2) is printed or coated in advance of the substrate (1), and then the LED circuit (3) is printed, or the LED circuit (3) is printed in advance of the substrate (1), and then the fluorescent ink coating (2) is overprinted. In application, an LED flip chip (4) is reversely installed on the LED circuit (3), and solid-phase crystallization is performed, namely two blue light LED lamp wicks are oppositely buckled and packaged together face to face to form a double-face 360-degree light-emitting white-light LED lamp wick. The LED printed circuit board is simple in structure, easy to manufacture, long in service life and convenient to apply, and the white-light LED lamp wick is simple to manufacture, convenient to use, reliable and good in application effect.
Description
Technical field
The invention belongs to art of printed circuit boards, relate to LED printed circuit board (PCB) with fluorescence translation function and preparation method thereof.
Background technology
In prior art, LED printed circuit board (PCB) only has circuit board function, all do not have fluorescence translation function, and the fluorescent glass disclosed in ZL2012102284193 only has fluorescence translation function, and does not have LED printed circuit board (PCB) function; Solve the way of fluorescence conversion, one is fluorescent material is directly applied the surface being bonded in illuminating part, and weak point is, has inconvenience in implementing process more, and fluorescent material coating is easily aging comes off; Two is be that illuminating part sealed type covers transparent fluorescent plate, and weak point is, make, assembling is more complicated, sealing is easily gone wrong.
Summary of the invention
The technical problem solved:
LED printed circuit board (PCB) with fluorescence translation function and preparation method thereof is provided, make LED printed circuit board (PCB) have fluorescence translation function simultaneously, can the deficiencies in the prior art be overcome, be conveniently used in LED illumination facility, and cost of manufacture is low, be easy to application.
The technical scheme adopted:
There is the manufacture method of the LED printed circuit board (PCB) of fluorescence translation function, it is characterized in that: adopt first method, in the same side of the transparent substrate of glass or pottery on the surface, first print or apply fluorescent ink coating and heat-treat, and then in fluorescent ink coating with electrically conductive ink or claim silver-colored electrically conductive ink print LED circuit, afterwards, then heat-treat, obtain finished product; Or employing second method, in the same side of described transparent substrate on the surface, elder generation is with electrically conductive ink or claim silver-colored electrically conductive ink to print LED circuit, and heat-treat, then, then relative to described LED circuit chromatography fluorescent ink coating, afterwards, then heat-treat, obtain finished product; Or adopt the third method, in the same side of described transparent substrate on the surface, first printing or coating fluorescent ink coating, through solidification after, then in fluorescent ink coating with electrically conductive ink or claim silver-colored electrically conductive ink print LED circuit, afterwards, carry out disposable thermal process, both obtain finished product; Or adopt the 4th kind of method, in the same side of described transparent substrate on the surface, elder generation is with electrically conductive ink or claim silver-colored electrically conductive ink to print LED circuit, after solidification, then relative to LED circuit chromatography fluorescent ink coating, afterwards, carry out disposable thermal process, both obtain finished product;
There is the LED printed circuit board (PCB) of fluorescence translation function, it is characterized in that: in the same side of the transparent substrate of glass or pottery on the surface there is printing or coating simultaneously and through the fluorescent ink coating of heat treatment and with electrically conductive ink or claim silver-colored electrically conductive ink to print and through the LED circuit of heat treatment.
Beneficial effect:
LED printed circuit board (PCB) with fluorescence translation function and preparation method thereof, fluorescence translation function and LED printed circuit board (PCB) function i ntegration are on same transparent substrate, and structure is simple, easily make, globality is strong; Consistency is good, and rate of finished products is high, and application is convenient, long service life; Simple, convenient, and reliable with the described print circuit plates making white light LEDs wick with fluorescence translation function, effect is good, especially very easily realize two-sided 360 degree luminous.
Accompanying drawing explanation
Fig. 1, main assembly structural perspective;
The structural representation of the white light LEDs wick of Fig. 2, the first two-sided 360 degree of luminescence;
The structural representation of the white light LEDs wick of the two-sided 360 degree of luminescences of Fig. 3, the second;
Embodiment
Illustrate in detail further by reference to the accompanying drawings;
As described in Figure 1, the manufacture method with the LED printed circuit board (PCB) of fluorescence translation function is, adopt first method, in the same side of the transparent substrate 1 of glass or pottery on the surface, first printing or coating fluorescent ink coating 2 are also heat-treated, and then with electrically conductive ink or claim silver-colored electrically conductive ink to print LED circuit 3 in fluorescent ink coating 2, afterwards, heat-treat again, obtain finished product; Or employing second method, in the same side of described transparent substrate 1 on the surface, elder generation is with electrically conductive ink or claim silver-colored electrically conductive ink to print LED circuit, and heat-treat, then, then relative to described LED circuit 3 chromatography fluorescent ink coating 2, afterwards, then heat-treat, obtain finished product; Or adopt the third method, in the same side of described transparent substrate 1 on the surface, first printing or coating fluorescent ink coating 2, through solidification after, then in fluorescent ink coating 2 with electrically conductive ink or claim silver-colored electrically conductive ink print LED circuit 3, afterwards, carry out disposable thermal process, both obtain finished product; Or adopt the 4th kind of method, in the same side of described transparent substrate 1 on the surface, elder generation is with electrically conductive ink or claim silver-colored electrically conductive ink to print LED circuit 3, after solidification, then relative to LED circuit 3 chromatography fluorescent ink coating 2, afterwards, carry out disposable thermal process, both obtain finished product.
As shown in Figure 2,3, during application, first, first by corresponding LED flip chip 4 with bonder upside-down mounting on the described relevant position with the LED circuit 3 of the LED printed circuit board (PCB) of fluorescence translation function, and die bond, afterwards again with reflow machine by the reflow soldering of corresponding LED flip chip 4 in described LED circuit 3, be blue-ray LED wick, connect LED constant current power supply and bright, second, with identical with transparent substrate 1 geometric specifications of described blue-ray LED wick, and a side has printing or coating and through the transparent glass of heat treated whole fluorescent ink coating 6 or transparent ceramic wafer 5, snap together with the face-to-face relative type motor of described blue-ray LED wick, and described transparent glass or between transparent ceramic wafer 5 and the transparent substrate 1 of described blue-ray LED wick, fill with transparent silica gel or epoxide-resin glue, thus firmly, adhesive seal formula is packaged as a whole reliably, namely the white light LEDs wick that the first has two-sided 360 degree of luminescences is become, as shown in Figure 2, or, there are described in identical with two transparent substrate 1 geometric specifications described two blue-ray LED wicks of the LED print circuit plates making of fluorescence translation function, face-to-face relative type motor snaps together, and between described two transparent substrates 1, fill with transparent silica gel or epoxide-resin glue, thus firmly, adhesive seal formula is packaged as a whole reliably, namely the white light LEDs wick that the second has two-sided 360 degree of luminescences is become, when described two blue-ray LED wicks snap together face-to-face relatively, corresponding LED circuit 3 and LED flip chip 4 mutual dislocation should be made, as shown in Figure 3, in order to avoid impact heat radiation and fluorescent effect, the Technology for Heating Processing of described whole fluorescent ink coating 6 adopts the technical scheme disclosed in ZL2012102284193, the thickness of LED flip chip 4 is 0.2mm, therefore, when described " relatively snapping together face-to-face " is packaged as a whole reliably, transparent glass or between transparent ceramic wafer 5 and transparent substrate 1, or the spacing all having 0.2mm between two pieces of transparent substrates 1 at least.
The same side of the described transparent substrate 1 at glass or pottery on the surface, " print or apply fluorescent ink coating and heat-treat " technique, and to the technical scheme all adopted with electrically conductive ink or " heat treatment " technique after claiming silver-colored electrically conductive ink to print LED circuit disclosed in ZL2012102284193;
Described " in fluorescent ink coating with electrically conductive ink or claim silver-colored electrically conductive ink print LED circuit ", or the same side of the described transparent substrate at glass or pottery on the surface, " with electrically conductive ink or claim silver-colored electrically conductive ink print LED circuit ", wherein said " printing ", namely silk screen printing is adopted, flexo or gravure technique;
Described " relative to described LED circuit chromatography fluorescent ink coating ", namely avoids LED circuit (comprising the position of respective electronic components and parts and LED flip chip) cover with silk screen printing, flexo or gravure technique by fluorescent ink slurry and is imprinted on " on the same side of the transparent substrate of glass or pottery " of having printed LED circuit;
The product that described electrically conductive ink or title silver electrically conductive ink adopt Shanghai Zheng Yin Electron Material Co., Ltd to produce, name of product is: Ag-2680L;
Described fluorescent ink, namely refers to " the fluorescent glass powder slurry " in the technical scheme disclosed in ZL2012102284193;
Described fluorescence translation function, refers to and utilizes fluorescent material, the light of a certain wave band is converted to the light of another wave band, if Ce:YAG yellow fluorescent powder Absorbable rod wavelength is the blue light of 455nm, gives off the gold-tinted that wavelength is 555nm, realizes fluorescence conversion.
Claims (3)
1. there is the manufacture method of the LED printed circuit board (PCB) of fluorescence translation function, it is characterized in that: adopt first method, in the same side of the transparent substrate of glass or pottery on the surface, first print or apply fluorescent ink coating and heat-treat, and then in fluorescent ink coating with electrically conductive ink or claim silver-colored electrically conductive ink print LED circuit, afterwards, then heat-treat, obtain finished product; Or employing second method, in the same side of described transparent substrate on the surface, elder generation is with electrically conductive ink or claim silver-colored electrically conductive ink to print LED circuit, and heat-treat, then, then relative to described LED circuit chromatography fluorescent ink coating, afterwards, then heat-treat, obtain finished product; Or adopt the third method, in the same side of described transparent substrate on the surface, first printing or coating fluorescent ink coating, through solidification after, then in fluorescent ink coating with electrically conductive ink or claim silver-colored electrically conductive ink print LED circuit, afterwards, carry out disposable thermal process, both obtain finished product; Or adopt the 4th kind of method, in the same side of described transparent substrate on the surface, elder generation is with electrically conductive ink or claim silver-colored electrically conductive ink to print LED circuit, after solidification, then relative to LED circuit chromatography fluorescent ink coating, afterwards, carry out disposable thermal process, both obtain finished product.
2. the LED printed circuit board (PCB) with fluorescence translation function of method making according to claim 1, it is characterized in that: in the same side of the transparent substrate (1) of glass or pottery on the surface there is printing or coating simultaneously and through the fluorescent ink coating (2) of heat treatment and with electrically conductive ink or claim silver-colored electrically conductive ink to print and through the LED circuit (3) of heat treatment.
3. the application with the LED printed circuit board (PCB) of fluorescence translation function of method making according to claim 1, first, first by corresponding LED flip chip (4) with bonder upside-down mounting on the relevant position of the described LED circuit (3) with the LED printed circuit board (PCB) of fluorescence translation function, and die bond, afterwards again with reflow machine by corresponding LED flip chip (4) reflow soldering in described LED circuit (3), be blue-ray LED wick, connect LED constant current power supply and bright, second, with identical with transparent substrate (1) geometric specifications of described blue-ray LED wick, and a side has printing or coating and through the transparent glass of heat treated whole fluorescent ink coating (6) or transparent ceramic wafer (5), snap together with the face-to-face relative type motor of described blue-ray LED wick, and described transparent glass or between transparent ceramic wafer (5) and the transparent substrate (1) of described blue-ray LED wick, fill with transparent silica gel or epoxide-resin glue, thus firmly, adhesive seal formula is packaged as a whole reliably, namely the white light LEDs wick that the first has two-sided 360 degree of luminescences is become, or, there are described in identical with two transparent substrate (1) geometric specifications described two blue-ray LED wicks of the LED print circuit plates making of fluorescence translation function, face-to-face relative type motor snaps together, and between described two transparent substrates (1), fill with transparent silica gel or epoxide-resin glue, thus firmly, adhesive seal formula is packaged as a whole reliably, namely the white light LEDs wick that the second has two-sided 360 degree of luminescences is become, when described two blue-ray LED wicks snap together face-to-face relatively, corresponding LED circuit (3) and LED flip chip (4) mutual dislocation should be made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510033567.3A CN104600180A (en) | 2015-01-23 | 2015-01-23 | LED printed circuit board having fluorescence converting function and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510033567.3A CN104600180A (en) | 2015-01-23 | 2015-01-23 | LED printed circuit board having fluorescence converting function and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN104600180A true CN104600180A (en) | 2015-05-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510033567.3A Pending CN104600180A (en) | 2015-01-23 | 2015-01-23 | LED printed circuit board having fluorescence converting function and manufacturing method thereof |
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| Country | Link |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104882525A (en) * | 2015-06-02 | 2015-09-02 | 张国生 | White LED lamp wick with single glass substrate and manufacturing method thereof |
| CN109050029A (en) * | 2018-06-04 | 2018-12-21 | 刘丙炎 | A kind of vial rapid-curing cutback character printing method |
Citations (5)
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| CN2645243Y (en) * | 2003-08-13 | 2004-09-29 | 光楠科技股份有限公司 | Light emitting diode with fluorescent ink |
| KR20060034976A (en) * | 2004-10-20 | 2006-04-26 | 알티전자 주식회사 | White led and method for producing the same |
| CN102730980A (en) * | 2012-07-04 | 2012-10-17 | 张国生 | High-reliability and high-efficiency fluorescent glass for packaging LED (light emitting diode) and preparation method thereof |
| CN103456870A (en) * | 2013-09-11 | 2013-12-18 | 厦门华联电子有限公司 | COB light source coated by fluorescent powder glue and manufacturing method thereof |
| CN103824924A (en) * | 2014-02-18 | 2014-05-28 | 张红卫 | Method for manufacturing substrate used for packaging white LED |
-
2015
- 2015-01-23 CN CN201510033567.3A patent/CN104600180A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2645243Y (en) * | 2003-08-13 | 2004-09-29 | 光楠科技股份有限公司 | Light emitting diode with fluorescent ink |
| KR20060034976A (en) * | 2004-10-20 | 2006-04-26 | 알티전자 주식회사 | White led and method for producing the same |
| CN102730980A (en) * | 2012-07-04 | 2012-10-17 | 张国生 | High-reliability and high-efficiency fluorescent glass for packaging LED (light emitting diode) and preparation method thereof |
| CN103456870A (en) * | 2013-09-11 | 2013-12-18 | 厦门华联电子有限公司 | COB light source coated by fluorescent powder glue and manufacturing method thereof |
| CN103824924A (en) * | 2014-02-18 | 2014-05-28 | 张红卫 | Method for manufacturing substrate used for packaging white LED |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104882525A (en) * | 2015-06-02 | 2015-09-02 | 张国生 | White LED lamp wick with single glass substrate and manufacturing method thereof |
| CN109050029A (en) * | 2018-06-04 | 2018-12-21 | 刘丙炎 | A kind of vial rapid-curing cutback character printing method |
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Effective date of registration: 20161216 Address after: A 101407 street Beijing city Huairou District Yanqi Yanqi Economic Development Zone No. 2 South Building 1 layer two Applicant after: Beijing Wanfang Ronghui Technology Co. Ltd. Address before: 102600 Beijing city Daxing District Xinghua street two No. 1 Beijing Institute of Graphic Communication Applicant before: Zhang Guosheng |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150506 |
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