CN102032483A - Light-emitting diode (LED) plane light source - Google Patents
Light-emitting diode (LED) plane light source Download PDFInfo
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- CN102032483A CN102032483A CN2010102929461A CN201010292946A CN102032483A CN 102032483 A CN102032483 A CN 102032483A CN 2010102929461 A CN2010102929461 A CN 2010102929461A CN 201010292946 A CN201010292946 A CN 201010292946A CN 102032483 A CN102032483 A CN 102032483A
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- good conductor
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- minute surface
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
Abstract
The invention relates to a light-emitting diode (LED) plane light source, which is characterized in that a bearing body of light-emitters (chips) is the mirror surface of a hot good conductor mirror plate and is the light extraction side of the chips; the chips are stuck to a transparent thermally conductive insulating paste thin film coating at the mirror side of the hot good conductor mirror plate by electrically conductive silver paste; and the chips are connected with each other by directly connecting positive and negative leads with pads on the LED chips. Due to the reflecting function of the mirror of the hot good conductor mirror plate, the light extraction efficiency of the light extraction ends of the LED chips and the illuminance of the light emitting end are greatly improved. PECC treatment is carried out on the surface of the non-light extraction end of the hot good conductor mirror plate, thus further improving the heat dissipation conditions of the LED plane light source. The procedures causing environmental pollution such as etching are eliminated after removing the metal core printed circuit board (MCPCB). The chips are directly connected in series by leads, thus greatly improving the processing efficiency while saving the materials. The optical system and the heat dissipating system of the whole LED plane light source system are established on a more perfect platform while the cost is lowered.
Description
Technical field:
The present invention relates to the light source that uses in a kind of electric lighting, especially a kind ofly make illuminator with LED, be connected into after the illuminator group in parallelly again between each illuminator (chip) earlier, and the supporting body of illuminator (chip) is that the specular surface of the good conductor minute surface sheet material of heat is the LED area source of chip light-emitting side.
Technical background:
As a kind of light source of electric lighting, traditional to make the method for illuminating source a kind of with led chip be to adopt to separate LED lamp pearl and carry out the beam split color separation, is connected in parallelly after the illuminator group to be integrated into that module realizes again.Another kind is to adopt earlier chip to be attached on copper clad plate is finished MCPCB (metal inner core PCB) plate of circuit fabrication after the making sheet etching after the MCPCB plate applies chip installation position on the copper wire, again the electrode of chip and the deposited copper film patchboard on the etched circuit on the MCPCB plate are connected into the illuminator group, are parallel to again on the major loop line that the deposited copper film on the etched circuit makes and realize (promptly adopting wafer directly-mounting type structure on the COB plate).Preceding a kind of mode solved the aberration problem in the lighting source preferably, but its light source light-emitting efficiency is also higher, but its manufacturing process automaticity is not high, and the labour consumes greatly, realizes comparatively difficulty of whole process automation.A kind of mode in back is with regard to existing chip, after the second time, optical lens was handled, can satisfy the requirement of the especially commercial lighting of throwing light on, realize automated job easily, but the heat radiation of led chip is bad in this mode, and because MCPCB production itself need be carried out outside the special processing such as gluing, calendering, also need the MCPCB plate is carried out special circuit processing such as taking a picture, making sheet, the chemical treatment of etching and plating one class, therefore it is many to form process farm labourer preface, and to the bigger pollution of environment, therefore above-mentioned two kinds of form of light source all exist defective.
For this reason at Chinese invention patent application CN1873292, in a kind of LED luminescence unit is disclosed, this LED luminescence unit seals single led chip admittedly with transparent epoxy resin, is coated with fluorescent material outward, constitutes luminescence unit.A plurality of luminescence units are through the lead parallel connection and be enclosed in admittedly with transparent epoxy resin on the conduction reflective surface of refractive body.The positive pole of led chip links to each other through the negative pole of lead with the output of led chip drive circuit with conduction reflective surface welding, the negative pole of led chip, and the positive pole of led chip drive circuit output links to each other with the conduction reflective surface of refractive body through another lead, constitutes super brightness line lamp.The good heat dispersion performance of this light source, but utilize refractive body conduction to cause short circuit and other hidden danger easily, and refractive body is exposed to and also is easy to generate oxidation in the air and reduces reflecting effect.
Disclose a kind of method for packing of white light LED area lighting source module in Chinese invention patent application CN101137255A, it is made up of processing steps such as making wiring board, solid crystalline substance, bonding, the basic glue-line of encapsulation.The present invention adopts many particles low-power LED chip disperse to distribute in the circuit board, and overall package forms high-power LED light source together, makes thermal source disperse to distribute, and has reduced the caloric value on the unit are, and the radiating requirements standard is reduced.Wherein proposed with the technical scheme of copper-clad plate as wiring board, this scheme can be by covering the copper layer and increase the radiating effect of wiring board, but because the easily oxidizable of copper, PCB surface still need be done anti-oxidation processing, and whole wiring board still needs to cover copper on substrate, and it is made flow process and does not simplify.
Summary of the invention:
Purpose of the present invention: structure and processing method to existing LED area source are improved, provide a kind of structure simpler, manufacturing procedure is shorter, makes the LED area source under the prerequisite that quality improves, cost is lower, makes process more the LED area source version and the processing method of environmental protection.
LED area source of the present invention, good conductor minute surface sheet material with heat, on the good conductor minute surface sheet material of heat, also have at least one pair of and the seal wire power supply outer electrode that insulate mutually of good conductor minute surface sheet material of heat, every pair of seal wire power supply outer electrode comprises that a seal wire power supply draws positive electrode outward and a seal wire power supply draws negative electrode outward, on the mirrored sides of the good conductor minute surface sheet material of heat, be coated with the bright thermal conductive insulation glue of one deck, led chip is bonded on the transparent thermal conductive insulation glue, each led chip all has led chip negative terminal pad and led chip positive terminal pad, led chip is connected in series between a pair of seal wire power supply outer electrode, wherein connect lead by chip between each led chip negative terminal pad and the led chip positive terminal pad and connect the series connection that realizes led chip, on the good conductor minute surface sheet material of heat and led chip, be coated with mixed fluorescent powder colloid coating, the colloid lens.
The preferred technical solution of the present invention is as follows:
Chip is pasted on the transparent thermal conductive insulation glue film coating by conductive silver glue.
It is aluminum steel that chip connects lead, and aluminum steel is welded on led chip positive terminal pad and the led chip negative terminal pad by cold welding.
The good conductor minute surface sheet material of heat is preferably specular aluminium sheet material.
The seal wire first power supply outer electrode, seal wire second source outer electrode is the guide wire of the outer electrode butt welding of heavy in section copper or copper alloy post and small bore copper or copper alloy wire, is convenient to outer electrode and is connected with major loop line conduction in parallel and heavy in section copper or copper alloy post and the welding of chip lead-out wire.
Among the present invention, can carry out corresponding also joint group plate at different Switching Power Supply input voltages and constant current parameter, use many to the power supply outer electrode, for example: being connected in parallel between seal wire first power supply outer electrode and seal wire second source outer electrode welded to be communicated with main shunt circuit line by outer electrode and realized.When adopting higher civil power directly as input voltage, seal wire electrode first power supply outer electrode and seal wire second source outer electrode directly and the current-limiting circuit output on the external circuit major loop join, this form is applicable to the long occasion of continued access length when needing as building profile decoration, can save greatly and install and manufacturing expense.When external circuits adopts buffer circuit and have the low pressure access to require, for the surface of many mirrored sides with series connection illuminator group joins and joins with constant voltage constant current power after major loop is in parallel again through the good conductor minute surface sheet material light source of the heat of transparent thermal conductive insulation glue thin film coated is parallel by the seal wire first power supply outer electrode and seal wire second source outer electrode, this form is applicable to the use occasion of low-voltage safety requirement, such as the fluorescent tube that has the low pressure input to require, lighting ball bubble etc.
Beneficial effect of the present invention is: the surface of applying chip is the good conductor minute surface sheet material reflective surface of the heat of surperficial transparent thermal conductive insulation glue film coating, and purpose is that the light that the light that chip sends projects with the opposing direction of bright dipping end is reflected specular into the illuminance that the bright dipping end strengthens light extraction efficiency and light ejecting end.
Wafer directly-mounting type structure makes its working (machining) efficiency higher on the good conductor minute surface sheet material of employing heat, easily be automated, employing is at the transparent thermal conductive insulation glue film coating of surface-coated of the good conductor minute surface sheet material mirrored sides of heat, cancelled in the LED area source MCPCB as illuminator (chip) carrier, manufacturing procedure such as making sheet etching plating on the cancellation MCPCB wiring board, because adopting, the series connection of chip chamber electrode directly uses wire bonds simultaneously, make pad reduce 50%, thereby improved working (machining) efficiency greatly, because the surface of mirrored sides is through the employing of the good conductor minute surface sheet material of the heat of transparent thermal conductive insulation glue film coating, connection lead in the process is isolated with the good conductor minute surface sheet material insulation of heat and guarantee that reflective surface is not scratched, because transparent thermal conductive insulation glue film coating can not form big thermal resistance as thin as a wafer between chip substrate and sheet material, because of mirror reflection surface accounts for more than 90% of light source board area, make the exhausted major part of light that projects on this face be reflected to the bright dipping end, the light extraction efficiency of led chip bright dipping end and the illuminance of light ejecting end have been improved greatly, adopt the surface through the good conductor minute surface sheet material of the heat of transparent thermal conductive insulation glue film coating and the method that chip is pasted by conductive silver glue, thermal resistance on the heat dissipation channel of chip is reduced greatly is greatly improved the radiating state of chip PN junction, in order further to improve the radiating condition of LED area source, the non-bright dipping end of the good conductor minute surface sheet material of heat is carried out PECC (anode oxidation process that the plasma arc discharge strengthens) thus handle the radiating condition that further improves the LED area source, the heat dissipation design of whole LED surface light source system is based upon on the new platform, through experimental verification under the same conditions, LED surface light source system thermal equilibrium temperature after said method is handled descends more than 8 ℃, makes the fault probability of occurrence of whole LED surface light source system descend nearly one times.
And because the covering of transparent thermal conductive insulation glue film coating and mixed fluorescent powder colloid coating, colloid lens, in use can be after the good conductor minute surface sheet material of heat and led chip connecting line are capped because of not oxidized and reduce reflectance and electric conductivity.
Further,, can obtain better heat dispersion, and because the oxidation resistent susceptibility of aluminium plate is better than materials such as copper material, uselessly do preservative treatment, and in process, be difficult for reducing reflectance because of oxidation on the surface if use specular aluminium sheet material.
Further use aluminum steel can save cost with respect to gold thread as the led chip connecting line, and adopt aluminum steel to be convenient to adopt the mode of cold welding to weld, the mode of cold welding can avoid in the fusion weld process localized hyperthermia to the influence of led chip and minute surface sheet material, avoids the oxidation of led chip infringement and minute surface sheet material.
Content of the present invention is done further explanation in conjunction with following embodiment.But content of the present invention is not limited only to related content among the embodiment.
Description of drawings:
Fig. 1 is the structural representation of LED area source strip cloth sheet
Fig. 2 is the longitudinal profile enlarged drawing of LED area source strip cloth sheet
Fig. 3 is the structure chart of LED area source dot matrix cloth sheet
Fig. 4 is the longitudinal profile enlarged drawing of LED area source dot matrix cloth sheet
The specific embodiment:
Embodiments of the invention 1, as shown in Figure 1, a kind of structure of LED area source strip cloth sheet has: the seal wire first power supply outer electrode 1; The led chip 2 of strip cloth sheet; The led chip positive terminal pad 4 of strip cloth sheet; The led chip negative terminal pad 5 of strip cloth sheet; The positive terminal pad 4 of series connection different LED chip 2 and the chip of negative terminal pad 5 are connected lead 3; Seal wire second source outer electrode 6.
As shown in Figure 2, the mixed fluorescent powder colloid coating 7 that on the led chip 2 of the good conductor minute surface sheet material 16 of tabular heat and strip cloth sheet, applies, wherein Re good conductor minute surface sheet material 16 can be the metallic mirror surface sheet material or the minute surface sheet materials of ceramic material such as minute surface aluminium sheet or copper coin nickel plating; And the colloid lens 8 of mixed fluorescent powder colloid coating 7 strip cloth sheets; The PECC rete 9 of strip cloth sheet; The electrode of strip cloth sheet is introduced insulation sleeve 10; The chip applying heat conduction elargol coating 11 of strip cloth sheet; The transparent thermal conductive insulation glue film coating 12 of strip cloth sheet; The good conductor minute surface sheet material 13 of strip heat; First parallel conducting wire 14 of strip cloth sheet; Second parallel conducting wire 15 of strip cloth sheet.
Embodiments of the invention 2, as shown in Figure 3, a kind of structure of LED planar light source dot matrix cloth sheet has: the good conductor minute surface sheet material 16 of tabular heat; Seal wire power supply outer electrode 17; The led chip 18 of dot matrix cloth sheet; The chip of dot matrix cloth sheet connects lead 19; The led chip positive terminal pad 20 of dot matrix cloth sheet; The led chip negative terminal pad 21 of dot matrix cloth sheet;
The mixed fluorescent powder colloid coating 22 of dot matrix cloth sheet as shown in Figure 4; The colloid lens 23 of dot matrix cloth sheet; The transparent thermal conductive insulation glue film coating 24 of dot matrix cloth sheet; The PECC rete 25 of dot matrix cloth sheet; The electrode of dot matrix cloth sheet is introduced insulation sleeve 26; The parallel conducting wire 27 of dot matrix cloth sheet; The chip applying heat conduction elargol 28 of dot matrix cloth sheet.
Making of the present invention realizes in the following manner: to the structure of LED planar light source strip cloth sheet, at first the good conductor sheet material punching out with minute surface heat becomes the rectangular of given size; After again the non-specular surface side surface of the good conductor minute surface sheet material of punch forming heat being fastened relatively, with chimeric adhesive tape around rectangular, periphery is sealed fully, again with its whole immersion in the liquid, make whole minute surface aluminium sheet apply transparent thermal conductive insulation glue film coating 12, take out and curing; The rectangular chimeric adhesive tape of minute surface aluminium sheet is removed again with behind the relative fastening in mirrored sides surface, with chimeric adhesive tape around rectangular, make the periphery quilt partly carry out the PECC rete 9 that PECC (anode oxidation process that the plasma arc discharge strengthens) handles formation strip cloth sheet to non-specular surface in the sealing back fully; After carrying out integrated grinding to the seal wire first power supply outer electrode 1 with to the heavy in section copper alloy post solder joint of seal wire second source outer electrode 6 with upper part, chemical nickel plating; Again finish on the punch press minute surface aluminium sheet after handling carried out the stamping-out moulding after, again the seal wire power supply is introduced good conductor minute surface sheet material series connection seat hole shape that post is pressed into heat first parallel conducting wire 14 of cloth sheet into strips; It is to introduce insulation sleeve 10 by the electrode of strip cloth sheet to realize with the rectangular insulation of the good conductor minute surface sheet material of heat for second parallel conducting wire 15 of strip cloth sheet; Again the good conductor minute surface sheet material 13 of the strip heat that makes is put into that to implement some glue on the integrated anchor clamps solid brilliant, the chip 11 applying heat conduction elargol that are about to strip cloth sheet are coated to chip needs the fixed position, implement solid brilliant back oven dry fixed chip, the chip to led chip 2 usefulness the strip cloth sheets of strip cloth sheet connects the led chip negative terminal pad 5 series connection welding connections of lead 3 with the LED4 strip cloth sheet of strip cloth sheet on wire bonder again; The illuminator group of again series connection being finished is connected with seal wire first power supply outer electrode 1 and seal wire second source outer electrode 6 and is welded to connect; Again with its integrated be placed on the point gum machine implement, the generation of the colloid lens 8 of the mixed fluorescent powder colloid coating 7 of strip cloth sheet and strip cloth sheet, baking makes the LED area source after colloid is solidified.
Structure to LED area source dot matrix cloth sheet: at first the good conductor minute surface sheet material punching out with heat becomes the rectangular of given size; After again the non-specular surface side surface of the good conductor minute surface sheet material of punch forming heat being fastened relatively, with chimeric adhesive tape around rectangular, periphery is sealed fully, again with its whole immersion in the liquid, make the good conductor minute surface sheet material of whole heat apply transparent thermal conductive insulation glue film coating 24, take out and curing; The rectangular chimeric adhesive tape of the good conductor minute surface sheet material of heat is removed again with behind the relative fastening in mirrored sides surface, with chimeric adhesive tape around rectangular, make the periphery quilt partly carry out the PECC rete 25 that PECC (anode oxidation process that the plasma arc discharge strengthens) handles formation dot matrix cloth sheet to non-specular surface in the sealing back fully; After the heavy in section copper alloy post solder joint of seal wire power supply outer electrode 17 carried out integrated grinding with upper part, chemical nickel plating; Again finish on the punch press minute surface aluminium sheet after handling carried out the stamping-out moulding after, the electrode 26 of insert formula cloth sheet is introduced insulation sleeves and seal wire power supply outer electrode 17 is pressed into the parallel conducting wire 27 that minute surface aluminium sheet series connection insulating base hole forms dot matrix cloth sheet again, and it is to introduce insulation sleeves by the electrode 26 of dot matrix cloth sheet to realize with the rectangular insulation of the good conductor minute surface sheet material of heat; The good conductor minute surface sheet material 16 of the tabular heat that will make is put into and is implemented the solid crystalline substance of some glue on the integrated anchor clamps again.Be about to dot matrix cloth sheet led chip 18 usefulness dot matrix cloth sheets chip applying heat conduction elargol 28 be coated to chip need fixed position, implement solid brilliant back oven dry fixed chip, the chip to led chip 18 usefulness the dot matrix cloth sheets of dot matrix cloth sheet connects lead 19 with the led chip positive terminal pad 20 of dot matrix cloth sheet and the led chip negative terminal pad 21 series connection welding connections of dot matrix cloth sheet on wire bonder again; The illuminator group that its series connection is finished is connected with seal wire power supply outer electrode 17 and is welded to connect again; Again with integrated be placed on the point gum machine implement, the generation of the colloid lens 23 of the mixed fluorescent powder colloid coating 22 of dot matrix cloth sheet and dot matrix cloth sheet, baking makes the LED area source after colloid is solidified.
Claims (8)
1. LED area source, it is characterized in that: this LED area source has the good conductor minute surface sheet material of heat, on the good conductor minute surface sheet material of heat, also have at least one pair of and the seal wire power supply outer electrode that insulate mutually of good conductor minute surface sheet material of heat, every pair of seal wire power supply outer electrode comprises that a seal wire power supply draws positive electrode outward and a seal wire power supply draws negative electrode outward, on the mirrored sides of the good conductor minute surface sheet material of heat, be coated with the layer of transparent thermal conductive insulation glue, led chip is bonded on the transparent thermal conductive insulation glue, each led chip all has led chip negative terminal pad and led chip positive terminal pad, led chip is connected in series between a pair of seal wire power supply outer electrode, wherein connect lead by chip between each led chip negative terminal pad and the led chip positive terminal pad and connect the series connection that realizes led chip, on the good conductor minute surface sheet material of heat and led chip, be coated with mixed fluorescent powder colloid coating, the colloid lens.
2. LED area source as claimed in claim 1 is characterized in that: seal wire power supply outer electrode is the soft lead-in wire of butt welding variable cross-section.
3. LED area source as claimed in claim 1 is characterized in that: led chip is bonded on the transparent thermal conductive insulation glue by the heat conduction elargol.
4. LED area source as claimed in claim 1 is characterized in that: the good conductor minute surface sheet material of described heat is specular aluminium sheet material.
5. LED area source as claimed in claim 1 is characterized in that: the back side of the mirrored sides of the good conductor minute surface sheet material of heat is non-bright dipping side, is coated with the PECC rete on the non-bright dipping side.
6. as the described LED area source of one of claim 1 to 5, it is characterized in that: it is aluminum steel that chip connects lead, and aluminum steel is welded on led chip positive terminal pad and the led chip negative terminal pad by cold welding.
7. LED area source as claimed in claim 6 is characterized in that: described cold welding is the pressure welding.
8. make the described LED area source of claim 1 for one kind, method, comprise following steps:
A, at first the good conductor sheet material plate punching out with minute surface heat becomes given size and shape;
B, the non-specular surface side surface of the good conductor sheet material of the good conductor minute surface heat of punch forming heat fastened relatively after, with chimeric adhesive tape around the sheet material, periphery is sealed fully, again with its whole immersion in the thermal conductive insulation glue liquid, make the good conductor minute surface sheet material of whole heat apply transparent thermal conductive insulation glue film coating, take out and solidify;
C, with the chimeric adhesive tape of the good conductor sheet material of minute surface heat remove again the mirrored sides surface is fastened relatively after, with chimeric adhesive tape around the sheet material, make periphery partly be carried out PECC to non-specular surface and handle and form the PECC rete by sealing back fully;
D, the heavy in section copper alloy post solder joint of the seal wire power supply being introduced post carry out nickel dam with upper part and handle, again after the good conductor minute surface sheet material of finishing the heat after preceding operation handled on the punch press carries out the stamping-out moulding, insulation processing is carried out in series connection seat hole, and the good conductor minute surface sheet material that again seal wire power supply outer electrode is pressed into heat forms outer electrode;
The good conductor minute surface sheet material of e, the heat that will make is again put on the integrated anchor clamps, and it is solid brilliant to implement some glue;
F, again will independently anodal drum with chip both positive and negative polarity connecting line on the wire bonder to the pad on each chip and negative pole drum and seal wire power supply outer electrode connect and be welded to connect;
G, again with its on point gum machine with colloid to the chip of series connection illuminator group be connected lead and cover fully;
After h, series connection illuminator group were parallel on the major loop line, after the glue-line of enforcement phosphor gel was cast in glue-filling slot, baking made the LED area source after colloid is solidified.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2010102929461A CN102032483B (en) | 2010-09-27 | 2010-09-27 | Light-emitting diode (LED) plane light source |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010102929461A CN102032483B (en) | 2010-09-27 | 2010-09-27 | Light-emitting diode (LED) plane light source |
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| CN102032483A true CN102032483A (en) | 2011-04-27 |
| CN102032483B CN102032483B (en) | 2013-06-26 |
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| CN102290410A (en) * | 2011-08-16 | 2011-12-21 | 陈炜旻 | LED (light emitting diode) area light source and manufacturing method thereof |
| CN103115258A (en) * | 2012-12-31 | 2013-05-22 | 安徽问天量子科技股份有限公司 | Area light source with built-in light-emitting diode (LED) protective chips |
| CN103363378A (en) * | 2012-03-28 | 2013-10-23 | 苏州世鼎电子有限公司 | Method for manufacturing LED backlight module by aid of liquid glue |
| CN103438378A (en) * | 2013-09-12 | 2013-12-11 | 彭雯 | LED (Light-Emitting Diode) lamp tube with large light flux and large light-emitting angle and manufacturing method thereof |
| CN103542298A (en) * | 2013-10-28 | 2014-01-29 | 江门市亮大照明有限公司 | LED (Light Emitting Diode) sunlight packaging structure with high production efficiency |
| CN105470247A (en) * | 2015-12-31 | 2016-04-06 | 广州市雷腾照明科技有限公司 | Light emitting diode (LED) light source and package method thereof |
| WO2018027454A1 (en) * | 2016-08-08 | 2018-02-15 | 深圳市蓝月光电子科技有限公司 | Led light string |
| CN112705915A (en) * | 2020-01-21 | 2021-04-27 | 羽源洋(宁波)科技有限公司 | Light source manufacturing method of rotary type curved surface light source production robot |
| CN113497175A (en) * | 2020-04-02 | 2021-10-12 | 马思正 | High-heat-conduction refrigeration chip |
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| WO2018027454A1 (en) * | 2016-08-08 | 2018-02-15 | 深圳市蓝月光电子科技有限公司 | Led light string |
| CN112705915A (en) * | 2020-01-21 | 2021-04-27 | 羽源洋(宁波)科技有限公司 | Light source manufacturing method of rotary type curved surface light source production robot |
| CN112705915B (en) * | 2020-01-21 | 2022-07-01 | 深圳市佳康捷科技有限公司 | Light source manufacturing method of rotary type curved surface light source production robot |
| CN113497175A (en) * | 2020-04-02 | 2021-10-12 | 马思正 | High-heat-conduction refrigeration chip |
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