CN103363378A - Method for manufacturing LED backlight module by aid of liquid glue - Google Patents
Method for manufacturing LED backlight module by aid of liquid glue Download PDFInfo
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- CN103363378A CN103363378A CN2012100859891A CN201210085989A CN103363378A CN 103363378 A CN103363378 A CN 103363378A CN 2012100859891 A CN2012100859891 A CN 2012100859891A CN 201210085989 A CN201210085989 A CN 201210085989A CN 103363378 A CN103363378 A CN 103363378A
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Abstract
The invention relates to a method for manufacturing an LED backlight module by the aid of liquid glue. The method has the advantages that the liquid glue is particularly used for filling flaws and holes on the surface of a cover substrate, so that the problem of board explosion or separation of a circuit layer under the action of air in the flaws and the holes is prevented after the circuit layer is arranged on the surface of the cover substrate, and the yield of a process for the LED backlight module can be effectively increased owing to the liquid glue.
Description
Technical field
The present invention relates to a kind of backlight module process, particularly relate to a kind of for the designed a kind of LED-backlit module manufacture method of using liquid glue of the LED-backlit module with slim cover body.
Background technology
Light emitting diode (light-Emitting Diode, LED) is the light-emitting component of present extensive use, because it has the advantages such as volume is little, long service life, thereby is widely used among the human daily life.
The most normal lighting device that is applied to of light emitting diode, and, except being applied to lighting device, light emitting diode is applied among the backlight module in a larger amount, see also Fig. 1, be the stereogram of existing a kind of light-emitting diode (LED) backlight module of commonly using, as shown in Figure 1, this light-emitting diode (LED) backlight module 1 ' comprising: a cover body 11 ', a line layer 12 ', a plurality of LED element 13 ', a reflecting element 14 ', a LGP 15 ' and an end reflector plate 16 '.
Consulting unceasingly Fig. 1, and please consult simultaneously Fig. 2, is the schematic diagram of the combination of cover body, line layer and LED element.As shown in Figure 2, cover body 11 ' is to be made by an aluminium base, and line layer 12 ' is to be arranged on the lower surface of cover body 11 ' by an insulating heat-conductive glue 18 '; Afterwards, these a plurality of LED elements 13 ' are welded in the pad of line layer 12 ' surface programming again, so that LED element 13 ' can be controlled and drive by line layer 12 '.Generally speaking, it is front that aluminium base is made cover body 11 ', and aluminium base must be processed through an anode first and form a diaphragm with the surface at aluminium base, and wherein, this diaphragm can be filled up the hole on aluminium base surface, and so that the surface of aluminium base has anti-etching ability.
General anode is processed formed diaphragm, and its thickness is about 5 μ m, yet, for more deeply, for the larger hole, the diaphragm of such thickness is to fill up described hole; In case the hole on the surface of aluminium base is not is not filled and led up fully, so, when line layer 12 ' was arranged at the lower surface (aluminium base surface) of cover body 11 ', then line layer 12 ' was subject to easily the effect of the air in the hole and the phenomenon of plate bursting or disengaging occurs.
Therefore, via above-mentioned, the process that can learn the existing light-emitting diode (LED) backlight module of commonly using is to have obvious shortcoming with not enough, in view of this, the present inventor does one's utmost the ground study and composition, and finally develop a kind of LED-backlit module manufacture method of using liquid glue, and the present inventor's expectation replaces the process of the existing light-emitting diode (LED) backlight module of commonly using with the LED-backlit module manufacture method of this use liquid glue.
This shows that above-mentioned existing backlight module process obviously still has inconvenience and defective, and demands urgently further being improved in manufacture method and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but have no for a long time applicable design is finished by development always, and general manufacture method does not have appropriate manufacture method to address the above problem, and this obviously is the problem that the anxious wish of relevant dealer solves.Therefore how to found a kind of LED-backlit module manufacture method of new use liquid glue, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Summary of the invention
The object of the invention is to, overcome the defective that existing backlight module process exists, and provide a kind of LED-backlit module manufacture method of new use liquid glue, technical problem to be solved is that a kind of LED-backlit module manufacture method of using liquid glue is being provided, fill up defective and hole on the cover body substrate surface with liquid glue, the phenomenon of plate bursting or disengaging occurs effectively to prevent line layer to be subject to the effect of the air in described defective and the hole, and then the process yield of lifting LED-backlit module, be very suitable for practicality.
The object of the invention to solve the technical problems realizes by the following technical solutions.Its that proposes according to the present invention comprises following steps: (1) provides a cover body substrate; (2) use a liquid glue tool to take and get a liquid glue; (3) use this liquid glue tool that this liquid glue is inserted a circuit setting area of cover body substrate surface, wherein, liquid glue can be filled and led up defective and the hole on the cover body substrate surface; (4) one line layer is arranged on the surface of cover body substrate by an insulating heat-conductive glue; And (5) use a LED element tool that a plurality of LED elements are placed on the surface of this line layer, will these a plurality of LED elements to be welded in the pad of line layer surface programming.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The LED-backlit module manufacture method of aforesaid use liquid glue, wherein said its more may further comprise the steps: (6) are inserted a reflecting layer in this cover body, wherein this reflecting layer have a plurality of holes can so that the light emitting surface of this LED element pass; And (7) are inserted a LGP and an end reflector plate in the cover body.
The LED-backlit module manufacture method of aforesaid use liquid glue, wherein said its can spray a white paint to form this reflecting layer in this cover body.
The LED-backlit module manufacture method of aforesaid use liquid glue, the surface of wherein said this liquid glue tool is to process from shape through one.
The LED-backlit module manufacture method of aforesaid use liquid glue more may further comprise the steps between wherein said this step (3) and the step (4): (31) baking places this liquid glue, so that liquid glue presents the state of curing.
The LED-backlit module manufacture method of aforesaid use liquid glue, wherein said this liquid glue be following any: polyimides glue, polymethyl methacrylate glue, silica gel and epoxide-resin glue.
The LED-backlit module manufacture method of aforesaid use liquid glue, wherein said its this cover body by this cover body substrate institute moulding be following any: sheet metal cover body and crowded type cover body.
The LED-backlit module manufacture method of aforesaid use liquid glue, wherein said its more may further comprise the steps: (51) are a cover body with this cover body molding substrate.
The LED-backlit module manufacture method of aforesaid use liquid glue, more may further comprise the steps between wherein said this step (1) and the step (2): (11) are a cover body with this cover body molding substrate.
The LED-backlit module manufacture method of aforesaid use liquid glue, more may further comprise the steps between wherein said this step (4) and this step (5): (41) are a cover body with this cover body molding substrate.
The present invention compared with prior art has obvious advantage and beneficial effect.As known from the above, for achieving the above object, the invention provides a kind of LED-backlit module manufacture method of using liquid glue, may further comprise the steps:
(1) provides a cover body substrate;
(2) use a liquid glue tool to take and get a liquid glue;
(3) use this liquid glue tool that this liquid glue is inserted a circuit setting area of cover body substrate surface, wherein, liquid glue can be filled and led up defective and the hole on the cover body substrate surface;
(4) one line layer is arranged on the surface of cover body substrate by an insulating heat-conductive glue; And
(5) use a LED element tool that a plurality of LED elements are placed on the surface of this line layer, will these a plurality of LED elements to be welded in the pad of line layer surface programming.
By technique scheme, the present invention uses the LED-backlit module manufacture method of liquid glue to have at least following advantages and beneficial effect:
1. the present invention uses liquid glue 17 to fill up this cover body substrate 10 lip-deep defective and holes especially, so, be arranged on the surface of cover body substrate 10 when line layer 12 after, then line layer 12 can not be subject to the effect of the air in described defective and the hole and the phenomenon of plate bursting or disengaging occurs.
2. holding above-mentioned the 1st point, so, by the use of liquid glue 17, is the process yield that effectively promotes the LED-backlit module.
In sum, the present invention uses the LED-backlit module manufacture method of liquid glue, and wherein, the present invention fills up defective and hole on the cover body substrate surface with liquid glue especially; So, be arranged on the surface of cover body substrate when line layer after, then line layer can not be subject to the effect of the air in described defective and the hole and the phenomenon of plate bursting or disengaging occurs; Therefore, the present invention is the use by liquid glue, so that the process yield of LED-backlit module can be raised effectively.The present invention is a significant progress in technology, and has obvious good effect, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above and other objects of the present invention, feature and advantage can be become apparent, below especially exemplified by preferred embodiment, and the cooperation accompanying drawing, be described in detail as follows.
Description of drawings
Fig. 1 is the stereogram of existing a kind of light-emitting diode (LED) backlight module of commonly using.
Fig. 2 is the schematic diagram of combination of a cover body, a line layer and a plurality of LED elements of the existing light-emitting diode (LED) backlight module of commonly using.
Fig. 3 is a kind of method flow diagram that uses the LED-backlit module manufacture method of liquid glue of the present invention.
Fig. 4 A to Fig. 4 E is the manufacturing process schematic diagram that uses the LED-backlit module manufacture method of liquid glue.
Fig. 5 is the method flow diagram of the second embodiment of a kind of LED-backlit module manufacture method of using liquid glue of the present invention.
Fig. 6 A to Fig. 6 F is the manufacturing process schematic diagram of the second embodiment that uses the LED-backlit module manufacture method of liquid glue.
Fig. 7 is the method flow diagram of the 3rd embodiment of a kind of LED-backlit module manufacture method of using liquid glue of the present invention.
1 ': light-emitting diode (LED) backlight module 10: the cover body substrate
102: circuit setting area 11,11 ': cover body
12,12 ': line layer 13,13 ': the LED element
14,14 ': reflecting layer 15,15 ': LGP
16,16 ': end reflector plate 141: hole
17: liquid glue 171: the liquid glue tool
18,18 ': insulating heat-conductive glue S01-S03: method step
S031: method step S04-S051: method step
S01 ': method step S011 ': method step
S02 '-S05 ': method step S01 "-S03 ": method step
S031 ": method step S04 ": method step
S041 ": method step S05 ": method step
The specific embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, its specific embodiment of LED-backlit module manufacture method, manufacture method, step, feature and the effect thereof of the use liquid glue that foundation the present invention is proposed are described in detail as follows.
In order more clearly to describe a kind of LED-backlit module manufacture method of using liquid glue proposed by the invention, below will cooperate graphicly, elaborate embodiments of the invention.
Seeing also Fig. 3, is the method flow diagram of the manufacture method of a kind of LED-backlit module of using liquid glue of the present invention.Wherein, the LED-backlit module manufacture method of use liquid glue of the present invention mainly comprises 7 steps.Please consulting simultaneously in addition Fig. 4 A to Fig. 4 E, is the manufacturing process schematic diagram that uses the LED-backlit module manufacture method of liquid glue.Wherein, shown in Fig. 3 and Fig. 4 A, this manufacture method is first execution in step (S01), and a cover body substrate 10 is provided; Then, shown in Fig. 4 B, execution in step (S02) is used a liquid glue tool 171 to take and is got a liquid glue 17.
Completing steps (S02) afterwards, shown in Fig. 4 C, then continue execution in step (S03) and step (S031), use this liquid glue tool 171 this liquid glue 17 to be inserted a circuit setting area 102 on cover body substrate 10 surfaces, and toast this liquid glue 17, so that liquid glue 17 presents the state of curing; So, liquid glue 17 just can be filled and led up cover body substrate 10 lip-deep defective and holes.Among the present invention, liquid glue 17 can be polyimides glue, polymethyl methacrylate glue, silica gel and epoxide-resin glue, and wherein polyimides glue is commonly referred to as heat resistant adhesive tape.
Completing steps (S03) and step (S031) are followed afterwards, and shown in Fig. 3 and Fig. 4 D, this manufacture method is execution in step (S04), by an insulating heat-conductive glue 18 line layer 12 is arranged on the surface of cover body substrate 10; Afterwards, then execution in step (S05) uses a LED element tool (not icon) that a plurality of LED elements 13 are placed on the surface of this line layer 12, will these a plurality of LED elements 13 to be welded in the pad of line layer 12 surface programmings; Execution in step (S051) then is shaped to a cover body 11 with this cover body substrate 10 at last, for example, is shaped to a sheet metal cover body or and squeezes the type cover body.
So, to step (S051), just can finish the embryo structure of a LED-backlit module via above-mentioned steps (S01); In addition, see also Fig. 4 E, by a reflecting layer 14, a LGP 15 and an end reflector plate 16 are inserted within this cover body 11, can finish the complete structure of this LED-backlit module, and the complete structure of such LED-backlit module just can be applied within the liquid crystal indicator, so that this backlight source of liquid crystal display apparatus to be provided.Wherein, this reflecting layer 14 can be made by a reflecting material, perhaps, and also can be at these cover body 11 interior spraying one white paints to form this reflecting layer 14; And, shown in Fig. 4 E, usually this reflecting layer 14 have a plurality of holes 141 can so that the light emitting surface of this LED element 13 pass.
In fact, in the step for the LED-backlit module manufacture method of aforementioned use liquid glue, be not limited to just finish at last the step of cover body moulding.Based on such factor, at this, the second embodiment of the LED-backlit module manufacture method of this use liquid glue is proposed again.Seeing also Fig. 5, is the method flow diagram of the second embodiment of a kind of LED-backlit module manufacture method of using liquid glue of the present invention, and as shown in Figure 5, the second embodiment of this manufacture method comprises 7 key steps equally.
Please consulting simultaneously in addition Fig. 6 A to Fig. 6 F, is the manufacturing process schematic diagram of the second embodiment that uses the LED-backlit module manufacture method of liquid glue.Wherein, shown in Fig. 5 and Fig. 6 A, at first this manufacture method is execution in step (S01 '), and a cover body substrate 10 is provided; Then, and execution in step (S011 '), this cover body substrate 10 is shaped to a cover body 11.
What be different from previous embodiment is, among the second embodiment of the LED-backlit module manufacture method of using liquid glue, shown in Fig. 5 and Fig. 6 B, among step (S011 '), cover body substrate 10 is to be formed as in advance a cover body 11, for example, a sheet metal cover body or squeezes type cover body (unique sheet metal cover body shown in Fig. 6 B).Completing steps (S011 ') afterwards, shown in Fig. 6 C, this manufacture method is followed execution in step (S02 '), uses a liquid glue tool 171 to take and gets a liquid glue 17.
Unceasingly, shown in Fig. 6 D, the method execution in step (S03 ') and step (S031 '), use liquid glue tool 171 liquid glue 17 to be inserted a circuit setting area 102 on cover body substrate 10 surfaces, and toast this liquid glue 17, so that liquid glue 17 presents the state of curing; So, liquid glue 17 just can be filled and led up cover body substrate 10 lip-deep defective and holes.
Unceasingly, shown in Fig. 6 E, the method is executed in step (S04 ') and step (S05 '), by an insulating heat-conductive glue 18 line layer 12 is arranged on the lower surface of this cover body 11, and via a LED element tool (not icon) a plurality of LED elements 13 are arranged on the surface of this line layer 12, and these a plurality of LED elements 13 are welded in the pad of line layer 12 surface programmings.
To step (S05 '), the embryo structure of a LED-backlit module is just finished via above-mentioned steps (S01 '); In addition, see also Fig. 6 F, by a reflecting layer 14, a LGP 15 and an end reflector plate 16 are inserted within this cover body 11, can finish the complete structure of this LED-backlit module, and the complete structure of such LED-backlit module just can be applied within the liquid crystal indicator, so that this backlight source of liquid crystal display apparatus to be provided.Wherein, this reflecting layer 14 can be made by a reflecting material, perhaps, and also can be at these cover body 11 interior spraying one white paints to form this reflecting layer 14; And, shown in Fig. 6 F, usually this reflecting layer 14 have a plurality of holes 141 can so that the light emitting surface of this LED element 13 pass.
And, based on the reason that is not limited to the cover body forming step, at this, the 3rd embodiment of the LED-backlit module manufacture method of this use liquid glue is proposed.See also Fig. 7, it is the method flow diagram of the 3rd embodiment of a kind of LED-backlit module manufacture method of using liquid glue of the present invention, as shown in Figure 7, the 3rd embodiment of this manufacture method comprises 7 key steps (at this, no longer providing the manufacturing process schematic diagram of the 3rd embodiment) equally.
This manufacture method elder generation execution in step (S01 "), a cover body substrate 10 is provided; Then, then execution in step (S02 ") is used a liquid glue tool 171 to take and is got a liquid glue 17.Completing steps (S02 ") is afterwards; then continue execution in step (S03 ") and step (S031 "); use this liquid glue tool 171 this liquid glue 17 to be inserted a circuit setting area 102 on cover body substrate 10 surfaces; and toast this liquid glue 17, so that liquid glue 17 presents the state of curing; So, liquid glue 17 just can be filled and led up cover body substrate 10 lip-deep defective and holes.Among the present invention, liquid glue 17 can be polyimides glue, polymethyl methacrylate glue, silica gel and epoxide-resin glue.
Completing steps (S03 ") and step (S031 ") afterwards, then, this manufacture method execution in step (S04 "), by an insulating heat-conductive glue 18 line layer 12 is arranged on the surface of cover body substrate 10; Afterwards, then execution in step (S041 ") is shaped to a cover body 11 with this cover body substrate 10, for example, is shaped to a sheet metal cover body or and squeezes the type cover body.After finishing the moulding of this cover body 11, the method step is execution in step (S05 ") just; use a LED element tool (not icon) that a plurality of LED elements 13 are placed on the surface of this line layer 12, will these a plurality of LED elements 13 to be welded in the pad of line layer 12 surface programmings.
So, to step (S051 "), just can finish the embryo structure of a LED-backlit module via above-mentioned steps (S01 "); In addition, relend by a reflecting layer 14, a LGP 15 and an end reflector plate 16 are inserted within this cover body 11, can finish the complete structure of this LED-backlit module, and the complete structure of such LED-backlit module just can be applied within the liquid crystal indicator, so that this backlight source of liquid crystal display apparatus to be provided.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, although the present invention discloses as above with preferred embodiment, yet be not to limit the present invention, any those skilled in the art, within not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be not break away from the technical solution of the present invention content, any simple modification that foundation technical spirit of the present invention is done above embodiment, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (10)
1. LED-backlit module manufacture method of using liquid glue is characterized in that it comprises following steps:
(1) provides a cover body substrate;
(2) use a liquid glue tool to take and get a liquid glue;
(3) use this liquid glue tool that this liquid glue is inserted a circuit setting area of cover body substrate surface, wherein, liquid glue can be filled and led up defective and the hole on the cover body substrate surface;
(4) one line layer is arranged on the surface of cover body substrate by an insulating heat-conductive glue; And
(5) use a LED element tool that a plurality of LED elements are placed on the surface of this line layer, will these a plurality of LED elements to be welded in the pad of line layer surface programming.
2. the LED-backlit module manufacture method of use liquid glue as claimed in claim 1 is characterized in that it more may further comprise the steps:
(6) reflecting layer is inserted in this cover body, wherein this reflecting layer have a plurality of holes can so that the light emitting surface of this LED element pass; And
(7) LGP and an end reflector plate are inserted in the cover body.
3. the LED-backlit module manufacture method of use liquid glue as claimed in claim 2 is characterized in that it can spray a white paint to form this reflecting layer in this cover body.
4. the LED-backlit module manufacture method of use liquid glue as claimed in claim 1, the surface that it is characterized in that this liquid glue tool is to process from shape through one.
5. the LED-backlit module manufacture method of use liquid glue as claimed in claim 1 is characterized in that more may further comprise the steps between this step (3) and the step (4):
(31) baking places this liquid glue, so that liquid glue presents the state of curing.
6. the LED-backlit module manufacture method of use liquid glue as claimed in claim 1, it is characterized in that this liquid glue be following any: polyimides glue, polymethyl methacrylate glue, silica gel and epoxide-resin glue.
7. the LED-backlit module manufacture method of use liquid glue as claimed in claim 1, it is characterized in that its this cover body by this cover body substrate institute moulding be following any: sheet metal cover body and crowded type cover body.
8. the LED-backlit module manufacture method of use liquid glue as claimed in claim 5 is characterized in that it more may further comprise the steps:
(51) be a cover body with this cover body molding substrate.
9. the LED-backlit module manufacture method of use liquid glue as claimed in claim 5 is characterized in that more may further comprise the steps between this step (1) and the step (2):
(11) be a cover body with this cover body molding substrate.
10. the LED-backlit module manufacture method of use liquid glue as claimed in claim 5 is characterized in that more may further comprise the steps between this step (4) and this step (5):
(41) be a cover body with this cover body molding substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100859891A CN103363378A (en) | 2012-03-28 | 2012-03-28 | Method for manufacturing LED backlight module by aid of liquid glue |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100859891A CN103363378A (en) | 2012-03-28 | 2012-03-28 | Method for manufacturing LED backlight module by aid of liquid glue |
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| CN103363378A true CN103363378A (en) | 2013-10-23 |
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| CN2012100859891A Pending CN103363378A (en) | 2012-03-28 | 2012-03-28 | Method for manufacturing LED backlight module by aid of liquid glue |
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Citations (6)
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| KR20080019844A (en) * | 2006-08-29 | 2008-03-05 | 삼성전자주식회사 | Backlight unit and liquid crystal display device comprising thereof |
| CN201133990Y (en) * | 2007-06-04 | 2008-10-15 | 亿光电子工业股份有限公司 | Luminous diode backlight module group |
| CN102032483A (en) * | 2010-09-27 | 2011-04-27 | 陈炜旻 | Light-emitting diode (LED) plane light source |
| US20110122334A1 (en) * | 2009-11-20 | 2011-05-26 | Chimei Innolux Corporation | Liquid crystal display, method for assembling same, and display apparatus |
| CN201892148U (en) * | 2010-10-20 | 2011-07-06 | 苏州世鼎电子有限公司 | Side-illuminating light emitting diode lamp shade modified structure |
| CN202109314U (en) * | 2011-05-16 | 2012-01-11 | 苏州世鼎电子有限公司 | Backlight module with three-dimensional circuit structure |
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2012
- 2012-03-28 CN CN2012100859891A patent/CN103363378A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080019844A (en) * | 2006-08-29 | 2008-03-05 | 삼성전자주식회사 | Backlight unit and liquid crystal display device comprising thereof |
| CN201133990Y (en) * | 2007-06-04 | 2008-10-15 | 亿光电子工业股份有限公司 | Luminous diode backlight module group |
| US20110122334A1 (en) * | 2009-11-20 | 2011-05-26 | Chimei Innolux Corporation | Liquid crystal display, method for assembling same, and display apparatus |
| CN102032483A (en) * | 2010-09-27 | 2011-04-27 | 陈炜旻 | Light-emitting diode (LED) plane light source |
| CN201892148U (en) * | 2010-10-20 | 2011-07-06 | 苏州世鼎电子有限公司 | Side-illuminating light emitting diode lamp shade modified structure |
| CN202109314U (en) * | 2011-05-16 | 2012-01-11 | 苏州世鼎电子有限公司 | Backlight module with three-dimensional circuit structure |
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Application publication date: 20131023 |