WO2016078002A1 - Led glue dispensing auxiliary fixture - Google Patents

Led glue dispensing auxiliary fixture Download PDF

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Publication number
WO2016078002A1
WO2016078002A1 PCT/CN2014/091511 CN2014091511W WO2016078002A1 WO 2016078002 A1 WO2016078002 A1 WO 2016078002A1 CN 2014091511 W CN2014091511 W CN 2014091511W WO 2016078002 A1 WO2016078002 A1 WO 2016078002A1
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Prior art keywords
fixture
led
dispensing
glue dispensing
hole
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PCT/CN2014/091511
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French (fr)
Chinese (zh)
Inventor
何素华
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何素华
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Priority to PCT/CN2014/091511 priority Critical patent/WO2016078002A1/en
Priority to CN201490000312.6U priority patent/CN204680686U/en
Publication of WO2016078002A1 publication Critical patent/WO2016078002A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

Definitions

  • the present application relates to the field of light emitting diodes, and in particular to an LED dispensing assistant.
  • LED Light Emitting Diode
  • the dispensing is carried out by using a special device such as a dispenser, which has a needle set composed of a plurality of dispensing needles.
  • a dispenser which has a needle set composed of a plurality of dispensing needles.
  • the LED chip of a certain area on the carrier is dispensed by the needle group.
  • the needle set moves to another area to complete dispensing of the area. In this way, the serial operation of dispensing is completed one by one, which reduces the production efficiency of the LED and is not conducive to mass production of the LED chip.
  • the present application aims to solve at least one of the above technical problems to some extent.
  • the present application provides an LED dispensing aid, comprising: a fixture body, a receiving cavity formed on the fixture body for accommodating the LED dispensing fixture, and being coated on the inner wall of the receiving cavity To prevent the separation layer from being glued to the LED dispensing jig by a dispensing gel.
  • an opening of the fixture body for taking out the LED dispensing fixture is disposed on the fixture body near the receiving cavity.
  • the opening is disposed on both sides of the accommodating cavity.
  • the isolation layer is an ink layer.
  • the LED dispensing aid is made of stainless steel or copper.
  • the utility model provides an LED dispensing auxiliary fixture, comprising: a fixture body, a receiving cavity formed on the fixture body for accommodating the LED dispensing fixture, and being coated on the inner wall of the accommodating cavity An isolation layer that is adhered to the LED dispensing fixture by a dispensing gel is prevented.
  • the LED dispensing fixture is placed on the auxiliary fixture to close one side of the through hole on the LED dispensing fixture, so that the colloid can be injected and accommodated in the through hole through the other side of the through hole, and the colloid is heated by heating.
  • FIG. 1 is a schematic structural view of an LED dispensing assistant fixture according to an embodiment of the present application.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” and “second” may include one or more of the features either explicitly or implicitly.
  • the meaning of "a plurality” is two or more unless specifically and specifically defined otherwise.
  • the terms “installation”, “connected”, “connected”, “fixed” and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or connected integrally; may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • installation shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or connected integrally; may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements.
  • the specific meanings of the above terms in the present application can be understood on a case-by-case basis.
  • the first feature "on” or “under” the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them.
  • the first feature “above”, “above” and “above” the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature.
  • the first feature “below”, “below” and “below” the second feature includes the first feature directly above and above the second feature, or merely the first feature level being less than the second feature.
  • the present application provides an LED dispensing assistant fixture, which is matched with an LED glue fixture and a heating device. Set to use, to achieve LED chip dispensing process.
  • the auxiliary fixture mainly comprises: a fixture body 1 , a receiving cavity 3 for housing the LED dispensing fixture 2 on the fixture body 1 , and coating on the inner wall of the accommodating cavity 3 to prevent dispensing with the LED
  • the barrier layer 4 is bonded between the jigs 2 by a dispensing gel.
  • the LED dispensing fixture comprises: a hard plate body and a plurality of through holes for solidifying the dispensing gel on the hard plate body, and the through hole size is matched with the size of the LED chip dispensing area.
  • the LED dispensing fixture is placed on the auxiliary fixture to close one side of the through hole on the LED dispensing fixture, so that the colloid can be injected and accommodated in the through hole through the other side of the through hole, and by drying,
  • the colloid is temporarily solidified in the through hole, and the LED dispensing jig is taken out from the auxiliary jig, and the dispensing jig is assembled with the LED chip carrier so that the through hole is opposite to the LED chip, and the colloid in the through hole is melted to make the colloid adhere.
  • the jig is removed and the LED chip is dried, so that the LED chip on the whole carrier can be dispensed through a one-time process, thereby improving production efficiency.
  • the opening 11 of the fixture body 1 is provided with an opening 11 for the LED dispensing fixture 2 to be taken out.
  • the opening 11 can be disposed on both sides or one side of the accommodating cavity 3, or a periphery or the like.
  • the LED dispensing fixture cannot be removed from the auxiliary fixture, and the isolation layer 4 can be an ink layer or be separated from the dispensing gel. s material.
  • the LED dispensing aid can be made of metal materials, such as stainless steel or copper materials, or ceramic materials.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Coating Apparatus (AREA)

Abstract

An LED glue dispensing auxiliary fixture, comprising: a fixture body (1), an accommodating cavity (3) opened and provided on the fixture body (1) for accommodating an LED glue dispensing fixture (2), and an isolation layer (4) coated on an inner wall of the accommodating cavity (3) to prevent adhesion to the LED glue dispensing fixtures through dispensed glue. The LED glue dispensing fixture (2) is provided on the auxiliary fixture to close one side of a through-hole on the LED glue dispensing fixture, thereby allowing glue to be injected and accommodated in the through-hole from another side thereof. The glue is temporarily cured within the through-hole via drying, the LED glue dispensing fixture (2) is taken out from the auxiliary fixture, the glue dispensing fixture and a LED chip carrier are assembled such that the through-hole and the LED chip are opposite to each other, the glue within the through-hole is then melted to adhere to the LED chip, the fixture is taken away, and the LED chip is dried and formed. Therefore, the glue dispensing of the LED chip on the entire carrier can be finished through a one-pass process, thus improving the production efficiency.

Description

LED点胶辅助治具LED dispensing aid 技术领域Technical field
本申请涉及发光二极管领域，尤其涉及一种LED点胶辅助治具。The present application relates to the field of light emitting diodes, and in particular to an LED dispensing assistant.
背景技术Background technique
随着发光二极管(Light Emitting Diode，LED)制造工艺的迅猛发展，LED已在诸多领域有着广泛应用。由于LED的能耗低、寿命长，并且随着LED芯片的亮度的提高，LED灯具取代传统光源进入照明领域是大势所趋，因此对LED生产工艺的逐步改进以提高生产效率，对于LED的应用产品意义十分重大。With the rapid development of the manufacturing process of Light Emitting Diode (LED), LED has been widely used in many fields. Due to the low energy consumption and long life of LEDs, and with the increase of the brightness of LED chips, it is an irresistible trend that LED lamps replace traditional light sources into the lighting field. Therefore, the LED production process is gradually improved to improve production efficiency, and the significance of LED application products. Very significant.
在LED芯片制程中，需要对承载于LED芯片承载体上的数量较庞大的LED芯片进行荧光胶点胶。通常，点胶是采用点胶机这种特有装置进行，其具有多个点胶针组成的针组，在进行点胶时，由针组对承载体上某个区域的LED芯片进行点胶，当完成这个区域的点胶时，针组移动到另一区域完成该区域的点胶。这样，逐个区域完成点胶的串行式动作，降低了LED的生产效率，不利于大批量生产LED芯片。In the LED chip process, it is necessary to perform fluorescent glue dispensing on a relatively large number of LED chips carried on the LED chip carrier. Usually, the dispensing is carried out by using a special device such as a dispenser, which has a needle set composed of a plurality of dispensing needles. When dispensing, the LED chip of a certain area on the carrier is dispensed by the needle group. When dispensing in this area is completed, the needle set moves to another area to complete dispensing of the area. In this way, the serial operation of dispensing is completed one by one, which reduces the production efficiency of the LED and is not conducive to mass production of the LED chip.
发明内容Summary of the invention
本申请旨在至少在一定程度上解决上述技术问题之一。The present application aims to solve at least one of the above technical problems to some extent.
本申请提供一种LED点胶辅助治具，包括：治具本体、开设于所述治具本体上用于容置LED点胶治具的容置腔，以及涂覆于所述容置腔内壁以防止与所述LED点胶治具之间通过点胶胶体粘合的隔离层。The present application provides an LED dispensing aid, comprising: a fixture body, a receiving cavity formed on the fixture body for accommodating the LED dispensing fixture, and being coated on the inner wall of the receiving cavity To prevent the separation layer from being glued to the LED dispensing jig by a dispensing gel.
进一步地，所述治具本体上近所述容置腔位置设置有供所述LED点胶治具取出的开口。Further, an opening of the fixture body for taking out the LED dispensing fixture is disposed on the fixture body near the receiving cavity.
进一步地，所述开口设置于所述容置腔两侧。Further, the opening is disposed on both sides of the accommodating cavity.
进一步地，所述隔离层为油墨层。Further, the isolation layer is an ink layer.
进一步地，所述LED点胶辅助治具采用不锈钢或铜材料。Further, the LED dispensing aid is made of stainless steel or copper.
本申请的有益效果是：The beneficial effects of the application are:
通过提供一种LED点胶辅助治具，包括：治具本体、开设于所述治具本体上用于容置LED点胶治具的容置腔，以及涂覆于所述容置腔内壁以防止与所述LED点胶治具之间通过点胶胶体粘合的隔离层。这样，LED点胶治具置于该辅助治具上以封闭LED点胶治具上通孔的一面，从而通过通孔另一面可将胶体注入并容置于通孔内，通过加热，将胶体暂时固化于通孔内，从辅助治具上取出LED点胶治具，将点胶治具与LED芯片承载体相装配使通孔与 LED芯片相对，再融化通孔内胶体，使胶体附着在LED芯片上，取走治具再加热成型LED芯片，从而整块承载体上的LED芯片可通过一次性的工艺完成点胶，提高了生产效率。The utility model provides an LED dispensing auxiliary fixture, comprising: a fixture body, a receiving cavity formed on the fixture body for accommodating the LED dispensing fixture, and being coated on the inner wall of the accommodating cavity An isolation layer that is adhered to the LED dispensing fixture by a dispensing gel is prevented. In this way, the LED dispensing fixture is placed on the auxiliary fixture to close one side of the through hole on the LED dispensing fixture, so that the colloid can be injected and accommodated in the through hole through the other side of the through hole, and the colloid is heated by heating. Temporarily solidified in the through hole, take out the LED dispensing fixture from the auxiliary fixture, and assemble the dispensing fixture with the LED chip carrier to make the through hole The LED chips are opposite to each other, and the colloid in the through hole is melted, so that the colloid adheres to the LED chip, and the jig is removed and the LED chip is heated, so that the LED chip on the whole carrier can be dispensed through a one-time process, thereby improving the glue chip. Productivity.
附图说明DRAWINGS
图1为本申请实施例的LED点胶辅助治具的结构示意图。FIG. 1 is a schematic structural view of an LED dispensing assistant fixture according to an embodiment of the present application.
具体实施方式detailed description
下面详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，旨在用于解释本申请，而不能理解为对本申请的限制。The embodiments of the present application are described in detail below, and the examples of the embodiments are illustrated in the drawings, wherein the same or similar reference numerals are used to refer to the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are intended to be illustrative, and are not to be construed as limiting.
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。In the description of the present application, it is to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation or position of indications such as "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. The relationship is based on the orientation or positional relationship shown in the drawings, and is merely for the convenience of the description and the simplified description, and is not intended to indicate or imply that the device or component referred to has a specific orientation, and is constructed and operated in a specific orientation. It is not to be construed as limiting the application.
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。Moreover, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, features defining "first" and "second" may include one or more of the features either explicitly or implicitly. In the description of the present application, the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.
在本申请中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。In the present application, the terms "installation", "connected", "connected", "fixed" and the like shall be understood broadly, and may be either a fixed connection or a detachable connection, unless otherwise explicitly stated and defined. , or connected integrally; may be mechanical connection or electrical connection; may be directly connected, or may be indirectly connected through an intermediate medium, and may be internal communication between the two elements. For those skilled in the art, the specific meanings of the above terms in the present application can be understood on a case-by-case basis.
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度小于第二特征。In the present application, the first feature "on" or "under" the second feature may include direct contact of the first and second features, and may also include first and second features, unless otherwise specifically defined and defined. It is not in direct contact but through additional features between them. Moreover, the first feature "above", "above" and "above" the second feature includes the first feature directly above and above the second feature, or merely indicating that the first feature level is higher than the second feature. The first feature "below", "below" and "below" the second feature includes the first feature directly above and above the second feature, or merely the first feature level being less than the second feature.
下面通过具体实施方式结合附图对本申请作进一步详细说明。The present application will be further described in detail below with reference to the accompanying drawings.
请参考图1，本申请提供一种LED点胶辅助治具，其与LED点胶治具、加热设备配 套使用，实现LED芯片点胶工艺。Please refer to FIG. 1 , the present application provides an LED dispensing assistant fixture, which is matched with an LED glue fixture and a heating device. Set to use, to achieve LED chip dispensing process.
上述辅助治具主要包括：治具本体1、开设于治具本体1上用于容置LED点胶治具2的容置腔3，以及涂覆于容置腔3内壁以防止与LED点胶治具2之间通过点胶胶体粘合的隔离层4。而LED点胶治具包括：硬质板体，以及开设于硬质板体上的若干用于固化点胶胶体的通孔，通孔大小与LED芯片点胶区域尺寸匹配。The auxiliary fixture mainly comprises: a fixture body 1 , a receiving cavity 3 for housing the LED dispensing fixture 2 on the fixture body 1 , and coating on the inner wall of the accommodating cavity 3 to prevent dispensing with the LED The barrier layer 4 is bonded between the jigs 2 by a dispensing gel. The LED dispensing fixture comprises: a hard plate body and a plurality of through holes for solidifying the dispensing gel on the hard plate body, and the through hole size is matched with the size of the LED chip dispensing area.
这样，LED点胶治具置于该辅助治具上以封闭LED点胶治具上通孔的一面，从而通过通孔另一面可将胶体注入并容置于通孔内，通过烘干，将胶体暂时固化于通孔内，从辅助治具上取出LED点胶治具，将点胶治具与LED芯片承载体相装配使通孔与LED芯片相对，再融化通孔内胶体，使胶体附着在LED芯片上，取走治具再烘干成型LED芯片，从而整块承载体上的LED芯片可通过一次性的工艺完成点胶，提高了生产效率。In this way, the LED dispensing fixture is placed on the auxiliary fixture to close one side of the through hole on the LED dispensing fixture, so that the colloid can be injected and accommodated in the through hole through the other side of the through hole, and by drying, The colloid is temporarily solidified in the through hole, and the LED dispensing jig is taken out from the auxiliary jig, and the dispensing jig is assembled with the LED chip carrier so that the through hole is opposite to the LED chip, and the colloid in the through hole is melted to make the colloid adhere. On the LED chip, the jig is removed and the LED chip is dried, so that the LED chip on the whole carrier can be dispensed through a one-time process, thereby improving production efficiency.
为方便LED点胶治具从辅助治具中取出，治具本体1上近容置腔3位置设置有供LED点胶治具2取出的开口11。开口11可设置于容置腔3两侧或一侧，或周边等。In order to facilitate the removal of the LED dispensing fixture from the auxiliary fixture, the opening 11 of the fixture body 1 is provided with an opening 11 for the LED dispensing fixture 2 to be taken out. The opening 11 can be disposed on both sides or one side of the accommodating cavity 3, or a periphery or the like.
为达到防止辅助治具与LED点胶治具通过点胶胶体而粘合，致使无法从辅助治具中取出LED点胶治具，隔离层4可为油墨层，或采用其他与点胶胶体隔离的材料。In order to prevent the auxiliary fixture and the LED dispensing fixture from being glued by the dispensing gel, the LED dispensing fixture cannot be removed from the auxiliary fixture, and the isolation layer 4 can be an ink layer or be separated from the dispensing gel. s material.
具体应用时，为保证辅助治具的使用寿命，LED点胶辅助治具可采用金属材料，如不锈钢或铜材料等，也可以采用陶瓷材料。For specific application, in order to ensure the service life of the auxiliary fixture, the LED dispensing aid can be made of metal materials, such as stainless steel or copper materials, or ceramic materials.
在本说明书的描述中，参考术语“一个实施方式”、“一些实施方式”、“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本申请的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。In the description of the present specification, reference is made to the descriptions of the terms "one embodiment", "some embodiments", "one embodiment", "some embodiments", "example", "specific examples", or "some examples" The specific features, structures, materials, or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the application. In the present specification, the schematic representation of the above terms does not necessarily mean the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in a suitable manner in any one or more embodiments or examples.
以上内容是结合具体的实施方式对本申请所作的进一步详细说明，不能认定本申请的具体实施只局限于这些说明。对于本申请所属技术领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干简单推演或替换。 The above content is a further detailed description of the present application in conjunction with the specific embodiments, and the specific implementation of the present application is not limited to the description. For the ordinary person skilled in the art to which the present invention pertains, a number of simple deductions or substitutions may be made without departing from the spirit of the present application.

Claims (5)

  1. 一种LED点胶辅助治具，其特征在于，包括：治具本体、开设于所述治具本体上用于容置LED点胶治具的容置腔，以及涂覆于所述容置腔内壁以防止与所述LED点胶治具之间通过点胶胶体粘合的隔离层。An LED dispensing auxiliary fixture, comprising: a fixture body, a receiving cavity formed on the fixture body for accommodating an LED dispensing fixture, and being coated on the receiving cavity The inner wall is a barrier layer that prevents adhesion to the LED dispensing fixture by dispensing gel.
  2. 如权利要求1所述的LED点胶辅助治具，其特征在于，所述治具本体上近所述容置腔位置设置有供所述LED点胶治具取出的开口。The LED dispensing auxiliary fixture according to claim 1, wherein an opening of the LED dispensing fixture is disposed on the fixture body near the receiving cavity.
  3. 如权利要求2所述的LED点胶辅助治具，其特征在于，所述开口设置于所述容置腔两侧。The LED dispensing assistant fixture according to claim 2, wherein the opening is disposed on both sides of the accommodating cavity.
  4. 如权利要求1所述的LED点胶辅助治具，其特征在于，所述隔离层为油墨层。The LED dispensing aid of claim 1 wherein said barrier layer is an ink layer.
  5. 如权利要求1至4中任一项所述的LED点胶辅助治具，其特征在于，所述LED点胶辅助治具采用不锈钢或铜材料。 The LED dispensing auxiliary jig according to any one of claims 1 to 4, wherein the LED dispensing assistant is made of stainless steel or copper.
PCT/CN2014/091511 2014-11-19 2014-11-19 Led glue dispensing auxiliary fixture WO2016078002A1 (en)

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PCT/CN2014/091511 WO2016078002A1 (en) 2014-11-19 2014-11-19 Led glue dispensing auxiliary fixture
CN201490000312.6U CN204680686U (en) 2014-11-19 2014-11-19 LED point glue auxiliary fixture

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PCT/CN2014/091511 WO2016078002A1 (en) 2014-11-19 2014-11-19 Led glue dispensing auxiliary fixture

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CN114798314B (en) * 2022-04-13 2024-04-26 合肥维信诺科技有限公司 Gluing jig and gluing method

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