Invention content
The application is made to the discovery of following facts and problem and understanding based on inventor:In the master for having a glue process
In boards half-finished product procedure for producing, production procedure is:Patch downloads software, dispensing, scoreboard, test, assembling.The mode of production
It has the following disadvantages:In the defective products that test phase tests out, by the upper glue of point, cause maintenance difficult even without Faville
It repaiies.
It, can be by mainboard for this purpose, the present invention proposes that a kind of glue-dropping tool, the glue-dropping tool may be implemented to veneer dispensing
Jigsaw carries out dispensing after being divided into veneer.
The present invention also proposes a kind of dispenser including above-mentioned glue-dropping tool.
The present invention also proposes a kind of mainboard production method.
The glue-dropping tool of embodiment according to a first aspect of the present invention, including:Support plate, the support plate are equipped at least one use
In the storage tank for placing single mainboard, the storage tank is corresponded with the mainboard;And cover board, the cover board are located at the load
The side of plate is the mainboard to be clamped between the cover board and the support plate, side table of the mainboard adjacent to the cover board
There is the first dispensing region, the cover board to be equipped with the first dispensing hollow slots opposite with first dispensing region in face.
Glue-dropping tool according to the ... of the embodiment of the present invention, can the dispensing after mainboard jigsaw to be divided into veneer, make the life of mainboard
Flow is produced by patch → download software → dispensing → scoreboard → test → assembling, becomes patch → download software → scoreboard → test
→ dispensing → assembling, so as to before carrying out dispensing to mainboard, filter out underproof product in time, fundamentally avoid
Mainboard semi-finished product improve the maintenanceability of product before test caused by after dispensing the problems such as maintenance difficult, and reduce
Scrap probability.
According to some embodiments of the present invention, further include location structure, the location structure includes being located at the storage tank
Interior locating piece, the locating piece are arranged in the hole on the mainboard to realize positioning.
According to some embodiments of the present invention, the cover board is connected with the support plate magnetic.
In some embodiments of the invention, the cover board is equipped with the first magnetic absorption member, and the support plate is equipped with the second magnetic
Part is inhaled, first magnetic absorption member coordinates with the second magnetic absorption member magnetic the cover board to be connected on the support plate.
Specifically, first magnetic absorption member and second magnetic absorption member are respectively in the circumferential direction of the cover board and the support plate
It is spaced apart.
Optionally, the spacing d between two neighboring first magnetic absorption member meets:6mm≤d≤10mm.
It is magnetic one of in some embodiments of the present invention, first magnetic absorption member and second magnetic absorption member
Iron, another is the magnetic material pieces that can be connected with magnet magnetic.
In other embodiments of the present invention, first magnetic absorption member and second magnetic absorption member are magnet.
In the still other embodiments of the present invention, magnet is equipped with one of in the cover board and the support plate, separately
One is the magnetic material pieces that can be connected with magnet magnetic.
Some further embodiments according to the present invention, the support plate and the cover board are limited by position limiting structure to be coordinated.
Specifically, the position limiting structure include limited post on one of being located in the support plate and the cover board,
Be formed in the support plate and the cover board another on limit hole.
In some embodiments of the invention, the support plate and the position of cover board limit cooperation are the support plate and institute
State the intersection corner position of cover board.
Some further embodiments according to the present invention, a side surface of the mainboard far from the cover board have second point
Glue region, the support plate are equipped with the second dispensing hollow slots opposite with second dispensing region.
Further, the edge of at least one of the support plate and described cover board, which inwardly concaves to be formed, picks and places slot.
Specifically, the storage tank is multiple, multiple storage tank rectangular array arrangements.
In some embodiments of the invention, the spacing L between two adjacent storage tanks meets:2mm≤L≤
4mm。
The dispenser of embodiment according to a second aspect of the present invention includes the point according to the above-mentioned first aspect embodiment of the present invention
Glue jig.
The dispenser of embodiment according to a second aspect of the present invention, by setting according to the above-mentioned first aspect embodiment of the present invention
Glue-dropping tool, can the dispensing after mainboard jigsaw to be divided into veneer, make the production procedure of mainboard by patch → download software →
Dispensing → scoreboard → test → assembling becomes patch → download software → scoreboard → test → dispensing → assembling, so as to
To mainboard carry out dispensing before, filter out underproof product in time, fundamentally avoid mainboard semi-finished product before test by
Caused by after dispensing the problems such as maintenance difficult, the maintenanceability of product is improved, and reduces and scraps probability.
The mainboard production method of embodiment according to a third aspect of the present invention, includes the following steps:S10:Patch process;S20:
Dividing techniques;S30:Point glue process, wherein described glue process is located at after the dividing techniques.
The mainboard production method of embodiment according to a third aspect of the present invention, by will put glue process be placed on dividing techniques it
Afterwards, mainboard semi-finished product can be effectively prevented from before test caused by dispensing the problems such as maintenance difficult, improve product
Maintenanceability, and reduce and scrap probability.
According to some embodiments of the present invention, further include step before described glue process, after the dividing techniques
S21:Test step.
According to some embodiments of the present invention, further include that step S11 downloads software process before the dividing techniques.
According to some embodiments of the present invention, implement using according to the above-mentioned first aspect of the present invention in described glue process
The glue-dropping tool of example carries out dispensing.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obviously, or practice through the invention is recognized.
Specific implementation mode
The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, and is only used for explaining the present invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term "center", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside", " axial direction ",
The orientation or positional relationship of the instructions such as " radial direction ", " circumferential direction " is to be based on the orientation or positional relationship shown in the drawings, merely to just
In the description present invention and simplify description, do not indicate or imply the indicated device or element must have a particular orientation, with
Specific azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, defining " first ", " second "
Feature can explicitly or implicitly include one or more this feature.In the description of the present invention, unless otherwise indicated,
The meaning of " plurality " is two or more.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected;It can
Can also be electrical connection to be mechanical connection;It can be directly connected, can also indirectly connected through an intermediary, Ke Yishi
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
Glue-dropping tool 100 according to the ... of the embodiment of the present invention is described below with reference to Fig. 1-Fig. 2.Point according to the ... of the embodiment of the present invention
Glue jig 100 can be used for the dispensing work production of mainboard semi-finished product.
As depicted in figs. 1 and 2, glue-dropping tool 100 according to the ... of the embodiment of the present invention, including:Support plate 1 and cover board 2.Support plate 1
It can be formed as rectangular slab with cover board 2.
Specifically, support plate 1 is equipped at least one storage tank 11 for placing single mainboard.Wherein, storage tank 11 can
Think one or more.A mainboard can be placed in each storage tank 11.Preferably, storage tank 11 is multiple, Duo Gerong
Slot 11 is set to correspond with multiple mainboards.Multiple storage tanks 11 can be arranged with rectangular array formula.The particular number of storage tank 11
It can be adjusted, be subject to the arrangement of support plate 1 is full according to the specific size of support plate 1.It, can be with for example, according to the apparent size of support plate 1
Arrangement 8 veneers (i.e. single mainboard), 6 veneers, 4 veneers etc..
Cover board 2 is located at the side (for example, upside in Fig. 1) of support plate 1 so that mainboard to be clamped between cover board 2 and support plate 1,
Mainboard adjacent to a side surface (for example, uper side surface in Fig. 1) for cover board 2 there is the first dispensing region, cover board 2 to be equipped with and the
The first opposite dispensing hollow slots 21 of one dispensing region.After cover board 2 is covered on support plate 1 as a result, the first dispensing hollow slots 21 can
With opposite with the first dispensing region, so as to be carried out a little to the first dispensing region of mainboard by the first dispensing hollow slots 21
Glue.
Specifically, when carrying out dispensing using glue-dropping tool 100, the single mainboard after scoreboard can be placed on holding tank
It is interior, then the lid of cover board 2 is located on support plate 1, mainboard is clamped between mainboard and cover board 2, and makes first point on cover board 2
Glue hollow slots 21 are opposite with the first dispensing region on mainboard.Hereafter, mainboard can be carried out by the first dispensing hollow slots 21
Dispensing is handled.
Glue-dropping tool 100 according to the ... of the embodiment of the present invention as a result, can the dispensing after mainboard jigsaw to be divided into veneer, make
The production procedure of mainboard by patch → download software → dispensing → scoreboard → test → assembling, become patch → download software → point
Plate → test → dispensing → assembling, so as to before carrying out dispensing to mainboard, filter out underproof product in time, from basic
On avoid mainboard semi-finished product before test caused by after dispensing the problems such as maintenance difficult, improve repairing for product
Property, and reduce and scrap probability.
According to some embodiments of the present invention, glue-dropping tool 100 further includes location structure, and location structure is accommodating including being located at
Locating piece 111 in slot 11, locating piece 111 are arranged in the hole on mainboard to realize positioning.Locating piece 111 can be formed as column
Shape or convex structure.Specifically, when mainboard to be embedded in storage tank 11, locating piece 111 can take advantage of a situation and penetrate on mainboard
Hole.Thus, it is possible to further increase the reliability of positioning, it is ensured that first waits for that dispensing region is opposite with the first dispensing hollow slots 21
Accuracy.Further, it is to be appreciated that location structure whether include locating piece 111 and locating piece 111 installation position,
It is required to basis and waits for that mainboard for dispensing glue carries out actual design, that is to say, that if waiting for not having hole on mainboard for dispensing glue, this
When, there is no need to locating piece 111 is arranged in storage tank 11.
According to some embodiments of the present invention, cover board 2 is connected with 1 magnetic of support plate.That is, support plate 1 passes through with cover board 2
Magnetic attraction is connected with each other.Thus, it is possible to quickly and easily cover board 2 is connected on support plate 1, operating efficiency is improved, while can be with
The cooperation reliability for improving support plate 1 and cover board 2, so as to will wait for mainboard for dispensing glue be clamped securely to support plate 1 and cover board 2 it
Between, prevent board falling (preventing support plate 1 from being detached with cover board 2).
For example, in some embodiments of the invention, support plate 1 and the position that is connected with 2 magnetic of cover board are along support plate 1 and cover board
2 intersection periphery is uniformly distributed.That is, the thickness direction (i.e. the thickness direction of cover board 2) along support plate 1 projects, support plate 1 and cover board
The profile complete cycle of 2 overlapping regions is evenly distributed with the connected position of magnetic.Thus, it is possible to avoid waiting for that mainboard for dispensing glue bears to answer
Power, it is ensured that the safety of mainboard, and can be slipped between support plate 1 and cover board 2 to avoid mainboard.
In some embodiments of the invention, cover board 2 is equipped with the first magnetic absorption member (not shown), and support plate 1 is equipped with the
Two magnetic absorption members 12, the first magnetic absorption member coordinate with 12 magnetic of the second magnetic absorption member cover board 2 to be connected on support plate 1.In this way, when that will lead
After plate is placed on support plate 1 and fastens cover board 2, mainboard can be clipped in load by the first magnetic absorption member and the second mutually absorption of magnetic absorption member 12
Among plate 1 and cover board 2.
Specifically, the first magnetic absorption member and the second magnetic absorption member 12 are respectively in the circumferentially-spaced distribution of cover board 2 and support plate 1.
That is circumferentially-spaced distribution of first magnetic absorption member in cover board 2, circumferentially-spaced distribution of second magnetic absorption member 12 in support plate 1.
Optionally, the first magnetic absorption member is evenly spaced in the circumferential direction of cover board 2, and the second magnetic absorption member 12 is uniform in the circumferential direction of support plate 1
It is spaced apart.First magnetic absorption member and the second magnetic absorption member 12 can be at the profile complete cycle intervals of support plate 1 Yu 2 overlapping region of cover board point
Cloth.It, can be to avoid waiting for a little as a result, by the way that the first magnetic absorption member and the second magnetic absorption member 12 to be located to the peripheral region of support plate 1 and cover board 2
The mainboard of glue meets with stresses, it is ensured that waits for the safety of dispensing mainboard, and can be to avoid waiting for mainboard for dispensing glue from support plate 1 and cover board 2
Between slip.
Specifically, support plate 1 is equipped with the first fitting groove, and the first magnetic absorption member is in the first fitting groove.Cover board 2 is equipped with the
Two fitting grooves, the second magnetic absorption member 12 is in the second fitting groove.Thus, it is possible to improve the first magnetic absorption member and the second magnetic absorption member 12
The stability set improves the reliability of magnetic cooperation.
Further, multiple first magnetic absorption members are equipped between two adjacent row storage tanks 11 at interval.With reference to Fig. 2, carry
Plate 1 is rectangular slab with cover board 2, and the frame position of " saying " font of rectangular slab is equipped with the first magnetic absorption member.Thus, it is possible to further
Ground avoids waiting for that mainboard for dispensing glue meets with stresses, it is ensured that waits for the safety of dispensing mainboard, and can be to avoid waiting for mainboard for dispensing glue from load
It is slipped between plate 1 and cover board 2.
Optionally, the spacing d between two neighboring first magnetic absorption member meets:6mm≤d≤10mm.For example, two neighboring
Spacing d between one magnetic absorption member can further meet:D=6mm, d=8mm, d=10mm etc..Thus, it is possible to ensure support plate 1
There is sufficiently large magnetic attraction between cover board 2.
It is magnetic in some alternative embodiments of the present invention, one of in the first magnetic absorption member and the second magnetic absorption member 12
Iron, another is magnetic material pieces (such as ferrous material part, the mixing material of the magnetic powder containing opposite magnetic pole that can be connected with magnet magnetic
Materials and parts).Facilitate processing as a result, and the effect that magnetic is connected is good.
In other alternative embodiments of the present invention, the first magnetic absorption member and the second magnetic absorption member 12 are magnet.It can manage
The magnetic pole of solution, the first magnetic absorption member and the second magnetic absorption member 12 is opposite.Facilitate processing as a result, and the effect that magnetic is connected is good.
In still other alternative embodiment of the present invention, magnet is equipped with one of in cover board 2 and support plate 1, it is another
A magnetic material pieces (such as ferrous material part, the mixing material materials and parts of the magnetic powder containing opposite magnetic pole) for that can be connected with magnet magnetic.
Facilitate processing as a result, and the effect that magnetic is connected is good.
Some further embodiments according to the present invention, support plate 1 and cover board 2 are limited by position limiting structure 3 to be coordinated.Namely
It says, support plate 1 other than magnetic is connected, is also limited by position limiting structure 3 and coordinated with cover board 2.Thus, it is possible to ensure 1 He of support plate
The connected position face of 2 magnetic of cover board is accurate, to improve magnetic connected reliability, stability and validity.
Specifically, position limiting structure 3 includes limited post 31 on one of being located in support plate 1 and cover board 2 and is formed in
Limit hole 32 on another in support plate 1 and cover board 2.For example, when support plate 1 be equipped with limited post 31 when, cover board 2 be equipped with
The limit hole 32 that limited post 31 coordinates.When cover board 2 is equipped with limited post 31, support plate 1 is equipped with the limit coordinated with limited post 31
Position hole 32.Position limiting structure 3 is simple as a result, easy to process, and convenient for limit cooperation.Certainly, the specific composition of position limiting structure 3 is not
It is limited to this, position limiting structure 3 can also include positive stop lug boss on one of being located in support plate 1 and cover board 2 and be formed in load
Limiting groove etc. on another in plate 1 and cover board 2.
In some embodiments of the invention, the position of support plate 1 and the limit cooperation of cover board 2 is the intersection of support plate 1 and cover board 2
Corner position.That is, the thickness direction (i.e. the thickness direction of cover board 2) along support plate 1 projects, support plate 1 overlaps area with cover board 2
The corner position in domain, which is the position of limit cooperation, (such as in specific example shown in Fig. 1, can be arranged in the corner position and limit
Position column 31 and limit hole 32).Thus, it is possible to improve the validity of limit, the reliability of support plate 1 and 2 magnetic of cover board and steady is improved
It is qualitative.
Some further embodiments according to the present invention, a side surface of the mainboard far from cover board 2 is (for example, the following table in Fig. 1
Face) there is the second dispensing region, support plate 1 to be equipped with the second dispensing hollow slots corresponding with the second dispensing region.Work as support plate as a result,
1 upward when, the second dispensing hollow slots that can lead on support plate 1 treat the second dispensing region on mainboard and carry out dispensing processing, from
And on the one hand it may be implemented to treat the two-sided dispensing of dispensing mainboard so that the manufacturing cost of glue-dropping tool 100 is greatly lowered.Separately
On the one hand, due to a set of glue-dropping tool 100 only with the embodiment of the present invention, you can realize the two-sided dispensing for waiting for dispensing mainboard,
So as to effectively save the parking space of glue-dropping tool 100.In another aspect, during dispensing, turned over by switching mechanism
Turn glue-dropping tool 100, you can realize two-sided dispensing, the reduction disengaging orbit time of glue-dropping tool 100 is primary, effectively promotes production and imitates
Rate.In addition, can unify while cross Reflow Soldering after completing two-sided dispensing, so as to effectively save electric energy, promotes Reflow Soldering and cross stove
Efficiency.
Further, the edge of at least one of support plate 1 and cover board 2, which inwardly concaves to be formed, picks and places slot 13.Pick and place slot
13 can be formed as arc groove.Specifically, the edge of support plate 1 can be made to inwardly concave to be formed and pick and place slot 13, or make cover board 2
Edge inwardly concave to be formed and pick and place slot 13, or make the edge of support plate 1 and recessed formation picks and places respectively inwards the edge of cover board 2
Slot 13.It is understood that when be equipped on support plate 1 and cover board 2 pick and place slot 13 when, picking and placeing on slot 13 and cover board 2 on support plate 1
The slot 13 that picks and places offset one from another setting.Slot 13 is picked and placeed by setting as a result, to be convenient for separating support plate 1 and cover board 2.
The dispenser of embodiment according to a second aspect of the present invention includes the point according to the above-mentioned first aspect embodiment of the present invention
Glue jig 100.Dispenser according to the ... of the embodiment of the present invention other constitute and operate for those of ordinary skill in the art and
Speech is all known, is not detailed herein.
The dispenser of embodiment according to a second aspect of the present invention, by setting according to the above-mentioned first aspect embodiment of the present invention
Glue-dropping tool 100, can the dispensing after mainboard jigsaw to be divided into veneer, make the production procedure of mainboard by patch → download software
→ dispensing → scoreboard → test → assembling becomes patch → download software → scoreboard → test → dispensing → assembling, so as to
Before carrying out dispensing to mainboard, underproof product is filtered out in time, fundamentally avoids mainboard semi-finished product before test
Caused by after dispensing the problems such as maintenance difficult, the maintenanceability of product is improved, and reduces and scraps probability.
The mainboard production method of embodiment according to a third aspect of the present invention, includes the following steps:
S10:Patch process;
S20:Dividing techniques;
S30:Point glue process.
Wherein, mainboard production method according to the ... of the embodiment of the present invention can be used for the production of mainboard finished product.Specifically, ginseng
According to Fig. 3, mainboard production method according to the ... of the embodiment of the present invention carries out dividing techniques, and in scoreboard work after completing patch process
Dispensing process is carried out after sequence.That is, a glue process is placed on after dividing techniques.Thus, it is possible to be effectively prevented from mainboard
Semi-finished product improve the maintenanceability of product before test caused by dispensing the problems such as maintenance difficult, and reduce and scrap
Probability.
Specifically, in the point glue process of the embodiment of the present invention, dispensing according to the above embodiment of the present invention can be used
Jig 100 carries out dispensing, and dispensing is carried out to the mainboard after scoreboard so as to easily realize.
According to some embodiments of the present invention, further include step S21 before glue process, after dividing techniques:Test
Process.Product can be assembled after test step.Thus, it is possible to filter out underproof product in time, fundamentally
Mainboard semi-finished product are avoided before test caused by after dispensing the problems such as maintenance difficult, improve the maintenanceability of product,
And it reduces and scraps probability.
According to some embodiments of the present invention, further include that step S11 downloads software process before dividing techniques.
Mainboard production method according to the ... of the embodiment of the present invention can be effectively after a glue process is placed on dividing techniques
It avoids mainboard semi-finished product before test caused by dispensing the problems such as maintenance difficult, improves the maintenanceability of product, and drop
It is low to scrap probability.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " specific example " or " some examples " etc. means specific features described in conjunction with this embodiment or example, knot
Structure, material or feature are included at least one embodiment or example of the invention.In the present specification, to above-mentioned term
Schematic representation may not refer to the same embodiment or example.Moreover, specific features, structure, material or the spy of description
Point can be combined in any suitable manner in any one or more of the embodiments or examples.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that:Not
In the case of being detached from the principle of the present invention and objective a variety of change, modification, replacement and modification can be carried out to these embodiments, this
The range of invention is limited by claim and its equivalent.