CN103957666A - Jig and carrier plate used for attaching circuit board strength reinforcing pieces - Google Patents
Jig and carrier plate used for attaching circuit board strength reinforcing pieces Download PDFInfo
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- CN103957666A CN103957666A CN201410182834.9A CN201410182834A CN103957666A CN 103957666 A CN103957666 A CN 103957666A CN 201410182834 A CN201410182834 A CN 201410182834A CN 103957666 A CN103957666 A CN 103957666A
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Abstract
The invention discloses a jig and carrier plate used for attaching circuit board strength reinforcing pieces. The jig used for attaching the circuit board strength reinforcing pieces is characterized by comprising a bottom plate and a cover plate. The bottom plate is provided with an upper surface used for supporting a circuit board. The cover plate is matched with the bottom plate and used for clamping the circuit board placed on the upper surface. The cover plate is provided with at least one first through hole. The first through holes make the circuit board be exposed partially. According to the jig used for attaching the circuit board strength reinforcing pieces, the bottom plate is adopted for supporting the circuit board, the circuit board is covered by the cover plate, and a region, to be reinforced, of the circuit board is exposed through the first through hole in the cover plate, and then the strength reinforcing pieces are embedded into the first through holes to be attached to the circuit board. Due to the fact that the cover plate has a certain thickness, an operator can accurately embed the strength reinforcing pieces into the first through holes and pasting the strength reinforcing pieces to be region to be reinforced, pasting precision is greatly improved, meanwhile, time for alignment through the naked eyes is shortened, and working efficiency is improved.
Description
Technical field
The present invention relates to printed substrate and manufacture field, particularly a kind of wiring board reinforcing paster attaches the support plate that attaches use with tool, wiring board reinforcing paster.
Background technology
Flexibility printed circuit board, because it is frivolous, volume is little, flexible, can three-dimensional wiring etc. advantage be widely used in printed wire industry.But when welding electronic component, flex circuit application is because mechanical strength is little, flexible on flexibility printed circuit board, thus the weld defect such as cause that components and parts leg bursts apart.For fear of the generation of weld defect, improve the reliability of flexibility printed circuit board, need to paste reinforcing chip at welding component position, to strengthen the mechanical strength at this position.
The stickup of reinforcing chip at present adopts manual operations mostly, and reinforcing chip of a gripping, uses artificial naked eyes contraposition, is pasted assigned address in the circuit board.Not only inefficiency, length consuming time of this kind of method of attaching, Anawgy accuracy is also very poor.In the time of reinforcing chip small volume that needs are pasted, be not only difficult to manual gripping, and cannot accurately paste assigned address by naked eyes at all.Even if reinforcing chip is affixed to the assigned address on wiring board exactly by manual operations, because reinforcing chip is to bond together by adhesive and wiring board, before adhesive does not solidify completely, touch because of carelessness reinforcing chip and also can cause it to be shifted, reduce and paste precision.
Summary of the invention
The object of the invention is in order to overcome deficiency of the prior art, a kind of wiring board reinforcing paster attaching tool that improves reinforcing chip sticking efficiency is provided.
For realizing above object, the present invention is achieved through the following technical solutions:
Wiring board reinforcing paster attaching tool, is characterized in that, comprising:
Base plate, described base plate has the upper surface for supporting wiring board;
Cover plate, described cover plate and described base plate coordinate, for clamping the wiring board being placed on described upper surface; Described cover plate is provided with at least one first through hole; Described the first through hole exposes the subregion of described wiring board.
Preferably, also comprise positioner, described positioner is positioned at described cover plate the upper surface top of described base plate; Described positioner is arranged on described base plate, described cover plate, or a part is arranged on described base plate, another part is arranged on described cover plate.
Preferably, described positioner comprises at least one alignment pin and at least one first location hole; Position and the shape of each described alignment pin and described first location hole adapt; Described alignment pin be arranged in described base plate and described cover plate one upper, described the first location hole is arranged on another in described base plate and described cover plate; Described alignment pin runs through described the first location hole, described cover plate is positioned to the upper surface top of described base plate.
Preferably, described positioner comprises four alignment pins; Described the first location hole number is four; Described four alignment pins are separately positioned on four drift angle places of described upper surface, and protrude described upper surface; Described the first location hole is arranged on described cover plate.
Preferably, at least wherein two described alignment pins are mutually asymmetric.
Preferably, described base plate is provided with the slot adapting with described alignment pin; The quantity of described slot is more than the quantity of described alignment pin; Described alignment pin can plug and be inserted in described slot.
Preferably, also comprise positioner; Described positioner comprises at least one alignment pin; Described cover plate is provided with the first location hole adapting with described alignment pin; On described base plate, be provided with the slot relative with described the first position of positioning hole; Described alignment pin can plug and be inserted in described slot through described the first location hole.
Preferably, described cover plate is rotationally connected by articulated elements and described base plate.
Preferably, also comprise support plate; Described support plate is used for carrying reinforcing chip; Described support plate and described cover plate be independent setting respectively; When described support plate covers on described cover plate, the reinforcing chip carrying is embedded in described the first through hole, and reinforcing chip is contacted with the exposed region of wiring board on described support plate.
Preferably, described support plate is provided with the second location hole adapting with described alignment pin; Described positioner comprises at least one alignment pin and at least one first location hole; Position and the shape of each described alignment pin and described first location hole adapt; Described alignment pin be arranged in described base plate and described cover plate one upper, described the first location hole is arranged on another in described base plate and described cover plate; Described alignment pin runs through described the first location hole, described cover plate is positioned to the upper surface top of described base plate; Described the second location hole and described the first position of positioning hole relatively arrange; Described alignment pin can arrange through described the second location hole ground.
Preferably, described support plate comprises location-plate and at least one adhesive sheet; Described location-plate is provided with at least one second through hole; Described the second through hole and reinforcing chip shape size adapt; Described adhesive sheet is bonded on described location-plate; Each reinforcing chip embeds in described second through hole, and bonding with described adhesive sheet.
Preferably, described location-plate is provided with the second location hole adapting with alignment pin; Described alignment pin runs through described the second location hole and cover plate, and the relative position of described location-plate and cover plate and base plate is fixed.
Another object of the present invention is for providing a kind of reinforcing paster of increasing work efficiency.
For realizing above object, the present invention realizes by the following technical solutions:
Wiring board reinforcing paster attaches the support plate of use, it is characterized in that, comprises location-plate and at least one adhesive sheet; Described location-plate is provided with at least one second through hole; Described the second through hole and reinforcing chip shape size adapt; Described adhesive sheet is removably bonded on described location-plate; Each reinforcing chip embeds in described second through hole, and bonding with described adhesive sheet.
Wiring board reinforcing paster attaching tool provided by the invention, adopt backplanes support wiring board, cover plate covers wiring board, only the reinforcement region for the treatment of of wiring board is exposed by the first through hole on cover plate, then makes reinforcing paster embed in the first through hole and attaches in the circuit board.Because cover plate has certain thickness, operating personnel can embed reinforcing chip in the first through hole exactly, and stick on wiring board treat reinforcement region, paste precision and greatly improve, also reduced naked eyes to bit time simultaneously, improved operating efficiency.On the other hand, because the reinforcing chip of pasting is in the circuit board embedded in the first through hole, reinforcing chip can be because touching of the external world produces displacement, can treat that adhesive completely solidifies and cover plate removed from PCB surface again, further improve stickup precision, improved the quality of wiring board.
Positioner in the present invention can be accurately positioned in cover plate the assigned address on base plate, makes the first through hole on the wiring board of plate upper surface, treat reinforcement region accurate contraposition with being placed on.Compared with manual alignment, precision improves greatly, has further improved the quality of wiring board.
Base plate is provided with multiple slots that adapt with alignment pin, alignment pin is inserted in the slot adapting according to the wiring board size for the treatment of reinforcement, runs through the location hole on wiring board by alignment pin, wiring board is fixed and is accurately positioned in the assigned address on base plate.A wiring board reinforcing paster attaches the wiring board that can be applicable to different size with tool, and the flexibility that has improved tool, has expanded range of application.
In the present invention, cover plate and base plate can arrange independently of each other, in the time attaching reinforcing chip, cover plate are covered on the upper surface at base plate; Can also be arranged on base plate turning cover plate by articulated elements, prevent that operating personnel from arbitrarily putting cover plate or base plate, cause both to separate, be difficult to pairing, ensure integrality and the registration of tool, improve the practicality of tool.When wiring board in the time that reinforcement region shape changes, detachable hinge members separates cover plate with base plate, the cover plate matching with wiring board is installed, wiring board reinforcing paster attach with tool can supporting multiple cover plates, the reinforcement processing that makes it be applied to various lines plate, the flexibility that has improved tool, has expanded range of application.On the other hand, cover plate and base plate hinged, also can make cover plate be positioned at plate upper surface top assigned address, improves reinforcing chip and paste precision.
In the present invention, by the multiple reinforcing chips of carrier for bearing.By alignment pin, support plate is positioned at after the assigned address of cover plate top, makes the many places on multiple reinforcing chips and wiring board treat the contraposition simultaneously of reinforcement region, and complete bonding.Reduce contraposition and pasted number of times, having reduced the probability that produces error, greatly having improved operating efficiency, having saved human cost.
In the present invention, on the location-plate of support plate, offer the second through hole, reinforcing chip is embedded in the second through hole, and be adhesively fixed by adhesive sheet, avoid reinforcing chip on support plate, occur displacement and out of position, greatly improve the stability of reinforcing chip on support plate, guaranteed that reinforcing chip is transferred to wiring board from support plate exactly.
Brief description of the drawings
Fig. 1 is that in the embodiment of the present invention 1, wiring board reinforcing paster attaches the structural front view with tool;
Fig. 2 is that in the embodiment of the present invention 1, wiring board reinforcing paster attaches the structural front view with tool;
Fig. 3 is the structural front view of wiring board in the embodiment of the present invention 1;
Fig. 4 is the schematic diagram of step a in the embodiment of the present invention 1;
Fig. 5 is the schematic diagram of step b in the embodiment of the present invention 1;
Fig. 6 is the schematic diagram of step c in the embodiment of the present invention 1;
Fig. 7 is the schematic diagram of steps d in the embodiment of the present invention 1;
Fig. 8 is that in the embodiment of the present invention 2, wiring board reinforcing paster attaches the structural front view with tool;
Fig. 9 is the structural front view of support plate in the embodiment of the present invention 2;
Figure 10 is the structural front view of location-plate in the embodiment of the present invention 2;
Figure 11 is the structural front view that is bonded with the support plate of reinforcing chip in the embodiment of the present invention 2;
Figure 12 is the schematic diagram of step c in the embodiment of the present invention 2;
Figure 13 is the side schematic view of step c in the embodiment of the present invention 2.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in detail:
Embodiment 1
As shown in Figure 1-2, wiring board reinforcing paster attaching tool, comprises base plate 1 and cover plate 2.Base plate 1 has the upper surface 11 for supporting wiring board.Cover plate 2 is rotationally connected by articulated elements (not shown) with base plate 1.Cover plate 2 is provided with multiple the first through holes 21.The shape size of each the first through hole 21 treats that according to each on wiring board reinforcement region formulates, and makes each the first through hole 21 and its corresponding reinforcement region for the treatment of keep identical shape size.In the present embodiment, need respectively to treat that reinforcement region shape size is identical on the wiring board of reinforcement, so the shape size of each the first through hole 21 on cover plate 2 is identical.
The attaching of wiring board reinforcing paster also comprises positioner with tool.Positioner comprises four cylindricality alignment pins 4.Be respectively the first alignment pin 41, the second alignment pin 42, the 3rd alignment pin 43 and the 4th alignment pin 44.The first alignment pin 41, the second alignment pin 42, the 3rd alignment pin 43 and the 4th alignment pin 44 are separately positioned on four drift angle places of base plate 1, and protrude upper surface 11.Wherein the second alignment pin 42, the 3rd alignment pin 43 and the 4th alignment pin 44 are symmetrical, and the first alignment pin 41 and the second alignment pin 42, the 3rd alignment pin 43, the 4th alignment pin 44 are all asymmetric.Cover plate 2 is provided with four the first location holes 22 that adapt with alignment pin 4.Position shown in rotating plate 2 to Fig. 2, alignment pin 4 runs through the first location hole 22, makes cover plate 2 cover base plate 1 upper surface 11, the first through holes 21 subregion of upper surface 11 is exposed.This subregion with will be placed on wiring board on base plate treat reinforcement area coincidence.
Using method of the present invention is as follows:
A. as shown in Figure 3, provide a wiring board 3, wiring board 3 is provided with location hole 31 and multiple reinforcement region 32 for the treatment of.Location hole 31 adapts with alignment pin 4.The first through hole 21 with treat that reinforcement region 32 shape sizes are identical.As shown in Figure 4, run through the location hole 31 on wiring board 3 by alignment pin 4, wiring board 3 is positioned to the assigned address on upper surface 11.
B. as shown in Figure 5, rotating plate 2, makes alignment pin 4 run through the first location hole 22.Coordinate with base plate 1 by cover plate 2, the wiring board 3 being placed on upper surface 11 is clamped, and treat reinforcement region 32 and the first through hole 21 accurate contrapositions, will treat that by the first through hole 21 reinforcement region 32 exposes.
C. as shown in Figure 6, provide the reinforcing chip 5 that shape size is identical with treating reinforcement region 32.Treating that 32 surfaces, reinforcement region or reinforcing chip 5 surfaces smear adhesive, then reinforcing chip 5 is embedded one by one in the first corresponding through hole 21, and accurately stick on the treating on reinforcement region 32 of wiring board.
D. as shown in Figure 7,, after adhesive solidifies completely, rotating plate 2, makes the first location hole 22 depart from alignment pin 4.Take off from base plate 1 wiring board 3 that is pasted with reinforcing chip 5, complete the reinforcement operation to a wiring board.After the reinforcement of all wiring boards all completes, rotating plate 3, fits the upper surface 11 of itself and base plate 1.
In above-mentioned steps, because cover plate 2 has certain thickness, operating personnel can pass through the position of finger touches the first through hole 32, reinforcing chip is embedded in the first through hole exactly, aim at contraposition compared with naked eyes, paste precision and greatly improve, also reduced naked eyes to bit time, improved operating efficiency simultaneously.On the other hand, because the reinforcing chip of pasting is in the circuit board embedded in the first through hole, reinforcing chip can be because touching of the external world produces displacement, can treat that adhesive completely solidifies and cover plate 3 removed from PCB surface again, further improve stickup precision, improved the quality of wiring board.
As shown in Figure 3, for needing the wiring board 3 of reinforcement.Wiring board 3 is symmetric body.In the time that wiring board 3 is placed on to plate upper surface, if four alignment pins 4 on base plate 1 are symmetrical arranged mutually, no matter be which of wiring board 3 placement that faces up, all can make location hole 31 on wiring board 3 through alignment pin 4.Wiring board is placed in the process on base plate, if occur the placement that faces up without reinforcement, wiring board need to be overturn and just can carry out reinforcement, reduced production efficiency.Serious, if do not find in time wiring board placement mistake, will cause reinforcing chip to stick on the face without reinforcement, make to cause wiring board to be scrapped.
In the present invention, the second alignment pin 42, the 3rd alignment pin 43 and the 4th alignment pin 44 are symmetrical, the first alignment pin 41 and the second alignment pin 42, the 3rd alignment pin 43, all asymmetric settings of the 4th alignment pin 44.And four location holes 31 corresponding with alignment pin 4 are set on wiring board 3.Only have in the time that wiring board 3 needs one of reinforcement to face up to be placed on base plate 1 (as shown in Figure 4), alignment pin 4 just can run through location hole 31 corresponding on wiring board 3 smoothly.Improve the accuracy that wiring board is placed, improved production efficiency and conforming product rate.
In like manner, four first location holes 22 corresponding with alignment pin 4 are set on cover plate 2.Only have in the time of cover plate 2 correct placement, alignment pin 4 just can run through the first location hole 22 corresponding on cover plate 2 smoothly, is accurately alignd in the first through hole 21 of cover plate 2 and the reinforcement region for the treatment of of wiring board 3.Improve the accuracy that cover plate 2 is placed, improved production efficiency.
Embodiment 2
As shown in Figure 8, the attaching of wiring board reinforcing paster comprises base plate 1 and cover plate 2 with tool.Base plate 1 has the upper surface 11 for supporting wiring board.Cover plate 2 is rotationally connected by articulated elements with base plate 1.Cover plate 2 is provided with multiple the first through holes 21.The shape size of each the first through hole 21 treats that according to each on wiring board reinforcement region formulates, and makes each the first through hole 21 and its corresponding reinforcement region for the treatment of keep identical shape size.In the present embodiment, need respectively to treat that reinforcement region shape size is identical on the wiring board of reinforcement, so the shape size of each the first through hole 21 on cover plate 2 is identical.
The attaching of wiring board reinforcing paster also comprises positioner with tool.Positioner comprises four cylindricality alignment pins 4, is respectively the first alignment pin 41, the second alignment pin 42, the 3rd alignment pin 43 and the 4th alignment pin 44.Base plate 1 is provided with multiple slots 12 that adapt with alignment pin 4.According to the size of wiring board, four alignment pins 4 are inserted respectively in slot 121, slot 122 and the slot 123 corresponding with position of positioning hole on wiring board, and protrude upper surface 11.Alignment pin 4 arranges separably with base plate 1.Wherein the second alignment pin 42, the 3rd alignment pin 43 and the 4th alignment pin 44 are symmetrical, and the first alignment pin 41 and the second alignment pin 42, the 3rd alignment pin 43, the 4th alignment pin 44 are all asymmetric.Cover plate 2 is provided with four the first location holes 22 that adapt with alignment pin 4, and alignment pin 4 runs through the first location hole 22, makes cover plate 2 cover base plate 1 upper surface 11, the first through holes 21 subregion of upper surface 11 is exposed.This subregion with will be placed on wiring board on base plate treat reinforcement area coincidence.
As shown in Fig. 9-11, the attaching of wiring board reinforcing paster also comprises support plate 6 with tool.Support plate 6 comprises a location-plate 61 and three adhesive sheets 62.The second through hole 611 that location-plate 61 is provided with the first through hole 21 quantity equate, shape size is identical.Adhesive sheet 62 is bonded on location-plate 61.The reinforcing chip 5 identical with the first through hole 21 shape sizes embedded in the second through hole 611, and bonding with adhesive sheet 62.Support plate 6 covers cover plate 2, makes reinforcing chip 5 embed the first through hole 21, and be arranged on wiring board on upper surface treat that reinforcement region is bonding.
Location-plate 61 is provided with four the second location holes 612 that adapt with alignment pin 4.Alignment pin 4 runs through the second location hole 612, support plate 6 is positioned to the assigned address of cover plate 2 tops, and the each reinforcing chip 5 on support plate 6 is evenly alignd with first through hole 21 on cover plate 2, and reinforcing chip 5 is arranged on the below of adhesive sheet 62.
Using method is as follows:
A. as shown in Figure 8, provide a wiring board 3, wiring board 3 is provided with multiple reinforcement regions 32 for the treatment of.The first through hole 21 is identical with the shape size for the treatment of reinforcement region 32.According to the size of wiring board 3, four alignment pins 4 are inserted respectively in slot 121, slot 122, slot 123 and the slot 124 corresponding with location hole 31 positions on wiring board 3 along the direction of arrow, and protrude upper surface 11.On wiring board 3, be also provided with four location holes 31 that adapt with alignment pin 4.Run through the location hole 31 on wiring board 3 by alignment pin 4, wiring board 3 is positioned to the assigned address on upper surface 11.
B. as shown in Figure 5, rotating plate 2, makes alignment pin 4 run through the first location hole 22.Coordinate with base plate 1 by cover plate 2, the wiring board 3 being placed on upper surface 11 is clamped, and treat reinforcement region 32 and the first through hole 21 accurate contrapositions, will treat that by the first through hole 21 reinforcement region 32 exposes.
C. as shown in Figure 12-13, treating that reinforcing chip 5 surfaces on 32 surfaces, reinforcement region or support plate smear adhesive, the viscosity of this adhesive is greater than the viscosity between reinforcing chip 5 and adhesive sheet 62.Alignment pin 4 runs through the second location hole 612, make multiple the first through holes 21 accurate contrapositions simultaneously on multiple reinforcing chips 5 and the cover plate 2 on support plate 6, and reinforcing chip 5 is arranged on the below of adhesive sheet 62.Press reinforcing chip 5, each reinforcing chip 5 is all embedded in first through hole 21, and accurately stick on the treating on reinforcement region 32 of wiring board.
D. after adhesive solidifies completely, rotating plate 2 drives the support plate 6 of cover plate 2 tops together to rotate simultaneously, makes the first location hole 22 and the second location hole 612 all depart from alignment pin 4.Take off from base plate 1 wiring board 3 that reinforcement is good, complete the reinforcement operation to a wiring board.After the reinforcement of all wiring boards all completes, rotating plate 3, fits the upper surface 11 of itself and base plate 1.
In above-mentioned steps, because cover plate 2 has certain thickness, operating personnel can pass through the position of finger touches the first through hole 32, reinforcing chip is embedded in the first through hole exactly, aim at contraposition compared with naked eyes, paste precision and greatly improve, also reduced naked eyes to bit time, improved operating efficiency simultaneously.On the other hand, because the reinforcing chip of pasting is in the circuit board embedded in the first through hole, reinforcing chip can be because touching of the external world produces displacement, can treat that adhesive completely solidifies and cover plate 3 removed from PCB surface again, further improve stickup precision, improved the quality of wiring board.
Support plate 6 carries multiple reinforcing chips 5.By alignment pin 4, support plate 6 is positioned at after the assigned address of cover plate 2 tops, makes multiple reinforcing chips 5 and the many places on wiring board 3 treat 32 contrapositions simultaneously of reinforcement region, and complete bonding.Reduce contraposition and pasted number of times, having reduced the probability that produces error, greatly having improved operating efficiency, having saved human cost.
Reinforcing chip 5 is embedded in the second through hole 611 of support plate 6, and be adhesively fixed by adhesive sheet 62, avoid reinforcing chip 5 that displacement occurs on support plate 6 and out of position, greatly improved the stability of reinforcing chip on support plate, guaranteeing that reinforcing chip is transferred to wiring board from support plate exactly.
Treating that reinforcing chip 5 surfaces on 32 surfaces, reinforcement region or support plate smear adhesive, the viscosity of this adhesive is greater than the viscosity between reinforcing chip 5 and adhesive sheet 62, can successfully depart from support plate 6 after can making reinforcing chip 5 and wiring board bonding.
As shown in Figure 3, for needing the wiring board 3 of reinforcement.Wiring board 3 is symmetric body.In the time that wiring board 3 is placed on to plate upper surface, if four alignment pins 4 on base plate 1 are symmetrical arranged mutually, the location hole 31 arranging on wiring board 3 is also symmetrical.No matter be which of wiring board 3 placement that faces up, all can make location hole 31 on wiring board 3 through alignment pin 4.Wiring board is placed in the process on base plate, if occur the placement that faces up without reinforcement, wiring board need to be overturn and just can carry out reinforcement, reduced production efficiency.Serious, if do not find in time wiring board placement mistake, will cause reinforcing chip to stick on the face without reinforcement, make to cause wiring board to be scrapped.
In the present invention, the second alignment pin 42, the 3rd alignment pin 43 and the 4th alignment pin 44 are symmetrical, the first alignment pin 41 and the second alignment pin 42, the 3rd alignment pin 43, all asymmetric settings of the 4th alignment pin 44.And four location holes 31 corresponding with alignment pin 4 are set on wiring board 3.Only have in the time that wiring board 3 needs one of reinforcement to face up to be placed on base plate 1 (as shown in Figure 4), alignment pin 4 just can run through location hole 31 corresponding on wiring board 3 smoothly.Improve the accuracy that wiring board is placed, improved production efficiency and conforming product rate.
In like manner, four first location holes 22 corresponding with alignment pin 4 are set on cover plate 2.Only have when cover plate 2 is correct while placing, alignment pin 4 just can run through the second corresponding location hole 612 on the first location hole 22 corresponding on cover plate 2 and support plate 6 smoothly.Improve the accuracy that cover plate 2 is placed, improved production efficiency.Four second location holes 612 corresponding with alignment pin 4 are set on support plate 6.Only have in the time of support plate 6 correct placement, alignment pin 4 just can run through the second location hole 612 corresponding on support plate 6 smoothly, ensures that on support plate 6, bonding reinforcing chip is arranged on the below of support plate 6, and contacts with treating reinforcement region.Improve the accuracy that support plate 6 is placed, improved production efficiency.
Embodiment 3
As shown in Fig. 9-11, it is reinforcing paster.Reinforcing chip comprises support plate 6 and multiple reinforcing chip 5.Reinforcing chip 5 is bonding by low viscous adhesive with support plate 6.
Support plate 6 comprises location-plate 61 and three adhesive sheets 62.It is identical with reinforcing chip 5 shapes that location-plate 61 is provided with multiple the second through hole 611, the second through holes 611.Adhesive sheet 62 is bonded on location-plate 61, and covers the second through hole 611.Reinforcing chip 5 embeds in the second through hole 611, and bonding by lower viscosity adhesives with adhesive sheet 62.The face that reinforcing chip 5 contacts with adhesive sheet 62 is first surface, and the face being oppositely arranged with first surface on reinforcing chip 5 is second surface, and second surface is provided with high-viscosity adhesive.
Reinforcing paster also comprises release liners (not shown).Release liners covers second surface, can avoid the high-viscosity adhesive on second surface to be polluted, and tears off also not have paper scrap after release liners and remain on second surface.
Second surface at reinforcing chip 5 arranges high-viscosity adhesive, and viscosity is greater than the viscosity of lower viscosity adhesives between reinforcing chip 5 and adhesive sheet 62, guarantee the second surface of reinforcing chip 5 and wiring board after reinforcement region is bonding, can successfully depart from support plate 6.
Upper and lower in the present invention, all taking Figure 13 as reference, is the relative concept that clearly illustrates that the present invention uses.
Embodiment in the present invention, only for the present invention will be described, does not form the restriction to claim scope, those skilled in that art can expect other be equal in fact substitute, all in protection range of the present invention.
Claims (13)
1. wiring board reinforcing paster attaching tool, is characterized in that, comprising:
Base plate, described base plate has the upper surface for supporting wiring board;
Cover plate, described cover plate and described base plate coordinate, for clamping the wiring board being placed on described upper surface; Described cover plate is provided with at least one first through hole; Described the first through hole exposes the subregion of described wiring board.
2. wiring board reinforcing paster attaching tool according to claim 1, is characterized in that, also comprises positioner, and described positioner is positioned at described cover plate the upper surface top of described base plate; Described positioner is arranged on described base plate, described cover plate, or a part is arranged on described base plate, another part is arranged on described cover plate.
3. wiring board reinforcing paster attaching tool according to claim 2, is characterized in that, described positioner comprises at least one alignment pin and at least one first location hole; Position and the shape of each described alignment pin and described first location hole adapt; Described alignment pin be arranged in described base plate and described cover plate one upper, described the first location hole is arranged on another in described base plate and described cover plate; Described alignment pin runs through described the first location hole, described cover plate is positioned to the upper surface top of described base plate.
4. wiring board reinforcing paster attaching tool according to claim 3, is characterized in that, described positioner comprises four alignment pins; Described the first location hole number is four; Described four alignment pins are separately positioned on four drift angle places of described upper surface, and protrude described upper surface; Described the first location hole is arranged on described cover plate.
5. wiring board reinforcing paster attaching tool according to claim 4, is characterized in that, at least wherein two described alignment pins are mutually asymmetric.
6. wiring board reinforcing paster attaching tool according to claim 3, is characterized in that, described base plate is provided with the slot adapting with described alignment pin; The quantity of described slot is more than the quantity of described alignment pin; Described alignment pin can plug and be inserted in described slot.
7. wiring board reinforcing paster attaching tool according to claim 1, is characterized in that, also comprises positioner; Described positioner comprises at least one alignment pin; Described cover plate is provided with the first location hole adapting with described alignment pin; On described base plate, be provided with the slot relative with described the first position of positioning hole; Described alignment pin can plug and be inserted in described slot through described the first location hole.
8. wiring board reinforcing paster attaching tool according to claim 1, is characterized in that, described cover plate is rotationally connected by articulated elements and described base plate.
9. wiring board reinforcing paster attaching tool according to claim 1, is characterized in that, also comprises support plate; Described support plate is used for carrying reinforcing chip; Described support plate and described cover plate be independent setting respectively; When described support plate covers on described cover plate, the reinforcing chip carrying is embedded in described the first through hole, and reinforcing chip is contacted with the exposed region of wiring board on described support plate.
10. wiring board reinforcing paster attaching tool according to claim 9, is characterized in that, described support plate is provided with the second location hole adapting with described alignment pin; Described positioner comprises at least one alignment pin and at least one first location hole; Position and the shape of each described alignment pin and described first location hole adapt; Described alignment pin be arranged in described base plate and described cover plate one upper, described the first location hole is arranged on another in described base plate and described cover plate; Described alignment pin runs through described the first location hole, described cover plate is positioned to the upper surface top of described base plate; Described the second location hole and described the first position of positioning hole relatively arrange; Described alignment pin can arrange through described the second location hole ground.
11. wiring board reinforcing paster attaching tools according to claim 9, is characterized in that, described support plate comprises location-plate and at least one adhesive sheet; Described location-plate is provided with at least one second through hole; Described the second through hole and reinforcing chip shape size adapt; Described adhesive sheet is bonded on described location-plate; Each reinforcing chip embeds in described second through hole, and bonding with described adhesive sheet.
12. wiring board reinforcing paster attaching tools according to claim 11, is characterized in that, described location-plate is provided with the second location hole adapting with alignment pin; Described alignment pin runs through described the second location hole and cover plate, and the relative position of described location-plate and cover plate and base plate is fixed.
13. wiring board reinforcing pasters attach the support plate of use, it is characterized in that, comprise location-plate and at least one adhesive sheet; Described location-plate is provided with at least one second through hole; Described the second through hole and reinforcing chip shape size adapt; Described adhesive sheet is removably bonded on described location-plate; Each reinforcing chip embeds in described second through hole, and bonding with described adhesive sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410182834.9A CN103957666B (en) | 2014-04-30 | 2014-04-30 | Wiring board reinforcing paster attaching tool, the support plate of wiring board reinforcing paster attaching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410182834.9A CN103957666B (en) | 2014-04-30 | 2014-04-30 | Wiring board reinforcing paster attaching tool, the support plate of wiring board reinforcing paster attaching |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103957666A true CN103957666A (en) | 2014-07-30 |
| CN103957666B CN103957666B (en) | 2017-05-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410182834.9A Active CN103957666B (en) | 2014-04-30 | 2014-04-30 | Wiring board reinforcing paster attaching tool, the support plate of wiring board reinforcing paster attaching |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016090586A1 (en) * | 2014-12-11 | 2016-06-16 | 李林涛 | Pcb plate process frame structure |
| CN105828534A (en) * | 2016-04-26 | 2016-08-03 | 安徽安美半导体有限公司 | Tool for rapidly assembling semiconductor diode frame |
| CN106507603A (en) * | 2016-12-30 | 2017-03-15 | 桂林电子科技大学 | A kind of paster operation servicing unit of the rapid positioning operation for meeting ergonomics |
| CN107296429A (en) * | 2017-06-15 | 2017-10-27 | 龙游 | A kind of 3D materials add double microcirculation mattresses of magnetic and preparation method thereof |
| CN108146750A (en) * | 2017-12-19 | 2018-06-12 | 环维电子(上海)有限公司 | A kind of coat peeling unit and method |
| CN108347837A (en) * | 2018-04-09 | 2018-07-31 | 昆山振顺电子科技有限公司 | A kind of mobile phone LED lamp driver lath patch machine |
| CN108355927A (en) * | 2018-03-29 | 2018-08-03 | 广东欧珀移动通信有限公司 | Glue-dropping tool, dispenser and mainboard production method |
| CN110944453A (en) * | 2019-12-17 | 2020-03-31 | 江门市则成电子工业有限公司 | 3D steel sheet reinforcing and assembling process for FPC product |
| CN112135425A (en) * | 2020-09-22 | 2020-12-25 | 镇江厦泰电子科技有限公司 | Circuit board software burn-in tool |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005322838A (en) * | 2004-05-11 | 2005-11-17 | Sumitomo Metal Mining Package Materials Co Ltd | Method for manufacturing flexible wiring board having stiffening plate |
| CN201594950U (en) * | 2009-12-09 | 2010-09-29 | 厦门弘信电子科技有限公司 | Fixture for reinforcing and laminating steel sheets on flexible circuit board |
| CN201821583U (en) * | 2010-10-20 | 2011-05-04 | 厦门弘信电子科技有限公司 | Stiffener lamination jig of flexible circuit board |
| CN201888031U (en) * | 2010-12-15 | 2011-06-29 | 瑞华高科技电子工业园(厦门)有限公司 | Universal jig for alignment of flexible circuit board and placement carrier |
| CN102802358A (en) * | 2012-08-16 | 2012-11-28 | 东莞森玛仕格里菲电路有限公司 | Method for bonding circuit board reinforcing patches |
| CN202721899U (en) * | 2012-06-27 | 2013-02-06 | 淳华科技(昆山)有限公司 | Flexible printed circuit board reinforcing sheet bonding device |
| CN202889791U (en) * | 2012-10-22 | 2013-04-17 | 昆山意力电路世界有限公司 | Book type reinforcing binding fixture |
| CN103731991A (en) * | 2013-12-26 | 2014-04-16 | 深圳华麟电路技术有限公司 | Attaching method of steel sheet enhancing sheets of flexible circuit board, jigs of flexible circuit board, and strip attaching steel sheets of flexible circuit board |
| CN203934114U (en) * | 2014-04-30 | 2014-11-05 | 上海美维电子有限公司 | Wiring board reinforcing paster attaches the support plate that attaches use with tool, wiring board reinforcing paster |
-
2014
- 2014-04-30 CN CN201410182834.9A patent/CN103957666B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005322838A (en) * | 2004-05-11 | 2005-11-17 | Sumitomo Metal Mining Package Materials Co Ltd | Method for manufacturing flexible wiring board having stiffening plate |
| CN201594950U (en) * | 2009-12-09 | 2010-09-29 | 厦门弘信电子科技有限公司 | Fixture for reinforcing and laminating steel sheets on flexible circuit board |
| CN201821583U (en) * | 2010-10-20 | 2011-05-04 | 厦门弘信电子科技有限公司 | Stiffener lamination jig of flexible circuit board |
| CN201888031U (en) * | 2010-12-15 | 2011-06-29 | 瑞华高科技电子工业园(厦门)有限公司 | Universal jig for alignment of flexible circuit board and placement carrier |
| CN202721899U (en) * | 2012-06-27 | 2013-02-06 | 淳华科技(昆山)有限公司 | Flexible printed circuit board reinforcing sheet bonding device |
| CN102802358A (en) * | 2012-08-16 | 2012-11-28 | 东莞森玛仕格里菲电路有限公司 | Method for bonding circuit board reinforcing patches |
| CN202889791U (en) * | 2012-10-22 | 2013-04-17 | 昆山意力电路世界有限公司 | Book type reinforcing binding fixture |
| CN103731991A (en) * | 2013-12-26 | 2014-04-16 | 深圳华麟电路技术有限公司 | Attaching method of steel sheet enhancing sheets of flexible circuit board, jigs of flexible circuit board, and strip attaching steel sheets of flexible circuit board |
| CN203934114U (en) * | 2014-04-30 | 2014-11-05 | 上海美维电子有限公司 | Wiring board reinforcing paster attaches the support plate that attaches use with tool, wiring board reinforcing paster |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016090586A1 (en) * | 2014-12-11 | 2016-06-16 | 李林涛 | Pcb plate process frame structure |
| CN105828534A (en) * | 2016-04-26 | 2016-08-03 | 安徽安美半导体有限公司 | Tool for rapidly assembling semiconductor diode frame |
| CN106507603A (en) * | 2016-12-30 | 2017-03-15 | 桂林电子科技大学 | A kind of paster operation servicing unit of the rapid positioning operation for meeting ergonomics |
| CN107296429A (en) * | 2017-06-15 | 2017-10-27 | 龙游 | A kind of 3D materials add double microcirculation mattresses of magnetic and preparation method thereof |
| CN108146750A (en) * | 2017-12-19 | 2018-06-12 | 环维电子(上海)有限公司 | A kind of coat peeling unit and method |
| CN108146750B (en) * | 2017-12-19 | 2023-12-01 | 环维电子(上海)有限公司 | Film tearing device and method |
| CN108355927A (en) * | 2018-03-29 | 2018-08-03 | 广东欧珀移动通信有限公司 | Glue-dropping tool, dispenser and mainboard production method |
| CN108347837A (en) * | 2018-04-09 | 2018-07-31 | 昆山振顺电子科技有限公司 | A kind of mobile phone LED lamp driver lath patch machine |
| CN110944453A (en) * | 2019-12-17 | 2020-03-31 | 江门市则成电子工业有限公司 | 3D steel sheet reinforcing and assembling process for FPC product |
| CN112135425A (en) * | 2020-09-22 | 2020-12-25 | 镇江厦泰电子科技有限公司 | Circuit board software burn-in tool |
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Application publication date: 20140730 Assignee: NEW CAREER GUANGZHOU ELECTRONICS CO.,LTD. Assignor: SHANGHAI MEADVILLE ELECTRONIC CO.,LTD. Contract record no.: X2023310000035 Denomination of invention: Fixture for circuit board reinforcement patch attachment, carrier plate for circuit board reinforcement patch attachment Granted publication date: 20170531 License type: Common License Record date: 20230317 |
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