CN202979485U - Flexible circuit board surface mount technology and magnetic fixture and steel mesh used in the technology - Google Patents
Flexible circuit board surface mount technology and magnetic fixture and steel mesh used in the technology Download PDFInfo
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- CN202979485U CN202979485U CN 201220526198 CN201220526198U CN202979485U CN 202979485 U CN202979485 U CN 202979485U CN 201220526198 CN201220526198 CN 201220526198 CN 201220526198 U CN201220526198 U CN 201220526198U CN 202979485 U CN202979485 U CN 202979485U
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Abstract
The utility model relates to a manufacturing technology of a printed circuit board, in particular to a magnetic fixture and a steel mesh which are used in a flexible circuit board (FPC) surface mount technology (SMT). The magnetic fixture comprises a buckle cover plate and a magnetic tray, wherein the magnetic tray is a magnetic substrate, the buckle cover plate is a metal thin plate which can be absorbed by the substrate, and a slot hole for printing a tin paste and mounting chips on the flexible circuit board is arranged on the buckle cover plate, which is characterized in that: the buckle cover plate is the steel sheet which can be absorbed by a magnet, a ladder layer in the same shape with the buckle cover plate is etched on the buckle cover plate, and the depth of the ladder layer is same to the thickness of the steel sheet. Before the printing process, the magnetic tray is fixed on the upper surface of a positioning base, and then the flexible circuit board and the buckle cover plate are placed on the magnetic tray in turn, and after accurately positioning the magnetic tray, the flexible circuit board and the magnetic fixture are taken out from the positioning base and then subject to tin paste printing, chip mounting and solder-reflow technology.
Description
Technical field
The present invention relates to the manufacturing technology of printed substrate, relate in particular to a kind of surface mounting process for flexible circuit board and the magnetic tool that uses and steel mesh in this technique.
Background technology
Flexible Printed Circuit (FPC) has the characteristics such as distribution density is high, lightweight, thin thickness, is mainly used in a lot of products such as mobile phone, notebook computer, PDA, digital camera.The surface mounting technology of Flexible Printed Circuit (SMT) process mainly comprises paste solder printing, mounts and the three basic links such as Reflow Soldering.Paste solder printing refers to tin cream is passed through the mould printing of predetermined pattern to the weld pad of circuit board; Paster is that the surface-assembled components and parts accurately are installed on the fixed position of Flexible Printed Circuit; Reflow Soldering refers to dissolve tin cream and makes and realize between electronic devices and components pin and circuit board welding pad that machinery is connected with electrical equipment.
In these links, to the paste solder printing figure, paster all has point-device requirement, in case paste solder printing figure, patch location are not accurate enough, to cause the bad connection between electronic devices and components pin and flexible circuit board weld pad, cause that product rejection maybe needs the processing of doing over again.Surface mount process is completed on Flexible Printed Circuit, so will accurately locate Flexible Printed Circuit, the surface-pasted quality of guarantee like this, yet FPC itself is soft, its mechanical strength high not, so its position is more difficult more fixing than common PCB, in order to prevent that in the surface mount process, distortion appears in Flexible Printed Circuit, guarantee the accuracy of paste solder printing and patch location, usually pending surface-pasted Flexible Printed Circuit fixed placement is carried out the surface mount processing procedure again on a loading plate.What present industrial application was more has two kinds with the Flexible Printed Circuit fixed placement in the method for loading plate, the first, the loading plate surrounding is posted resistant to elevated temperatures Double-face gummed paper with fixing four limits of Flexible Printed Circuit, but this kind method is the middle part of Flexible Printed Circuit fixedly, make floating the sticking up of Flexible Printed Circuit of intermediate sector, so that after surface adhered with electronic component, the phenomenons such as sky welds, bridge joint is bad appear in the Flexible Printed Circuit middle part; The second, the loading plate surface arranges a layer of silica gel, make flexible circuit board centre and four limits all be fixed on loading plate, but this kind method is at the beginning of loading plate uses, the viscosity of its layer of silica gel can be higher, Flexible Printed Circuit is difficult to again FPC and loading plate are peeled off after by soldering furnace like this, get and easily lose when attached, and the upper residual jelly of FPC easily is stained with dust and contaminated.Layer of silica gel is in being repeatedly used process, and the viscosity of layer of silica gel can step-down,, when the viscosity of silica gel was too low, fixedly FPC owed firmly, easily causes FPC to misplace.
Therefore be necessary to provide a kind of fully fixedly Flexible Printed Circuit, and prevent that Flexible Printed Circuit produces deformation in the surface mount processing procedure surface mount from taking up tool.
China national Department of Intellectual Property discloses the fixture (publication number: CN200944704 of a kind of flexible circuit board (FPC) dress coupling, open day: 2007.09.05), it is characterized in that: described fixture comprises: cover plate and support plate, cover plate is the ferromagnetic material sheet metal of elastically deformable, need exposed slotted eye when on the cover board being provided with alignment pin and filling connection for flexible circuit board, need exposed slotted eye when being provided with the location hole corresponding with alignment pin and filling connection for flexible circuit board on support plate, also be provided with one group of permanent magnets on support plate, alignment pin coordinates with location hole, permanent magnets and cover plate are integral by magnetic attracting.
This fixture with respect to front two kinds adopt gluing method fixedly Flexible Printed Circuit have simple in structure, quick during use, facilitate, good reliability, highly versatile such as can be repeatedly used at the characteristics, production efficiency is provided, has saved production cost, improved simultaneously the acceptance rate of product.yet in this utility model, described cover plate must be the sheet metal of ferromagnetic material, and this thin plate also has certain mechanical strength, common iron plate is because its toughness is inadequate, the words of thickness too thin (less than 0.1mm), easily fracture, this makes in getting additive process very difficult, human cost improves greatly, its useful life is also very short simultaneously, if thickness too thick (greater than 0.1mm), if just fix Flexible Printed Circuit with cover plate and support plate in the paste solder printing stage, can affect its printing quality, cause the tin cream skewness, affect follow-up technique.So the technique that has adopted in the industry at present is: one deck viscose paper is set on support plate, FPC is bonded on support plate, then carry out paste solder printing technique, cover plate is placed on above FPC after paste solder printing is complete again, carry out paster and reflow soldering process.So this technology is actually a kind of improvement for said method two, by cover plate, FPC is pushed down to solve the problem on deformation of FPC in paster and reflow process.During the use viscose paper has method two in this process, one deck layer of silica gel being set on support plate has same drawback, so want fundamentally to solve the series of problems of above-mentioned appearance, must adopt a kind of new magnetic material sheet metal as cover plate.
Owing to having adopted cover plate that FPC is covered, in paste solder printing, one deck steel mesh need to be set on the cover board, and cover plate has certain thickness, if silk screen is directly overlayed on steel plate, can make the upper tin cream of FPC too much, affect follow-up paster and reflow soldering process, thereby affect the quality of whole attachment process.So steel mesh must be removed certain thickness, the quality of the whole technique of guarantee.
Summary of the invention
Main purpose of the present invention is to provide the middle magnetic tool that uses of a kind of novel Flexible Printed Circuit (FPC) surface mount process (SMT), and a kind of new Flexible Printed Circuit (FPC) surface mount process (SMT) that has produced because used this magnetic tool.
The magnetic tool that uses in Flexible Printed Circuit (FPC) surface mount process (SMT), described magnetic tool comprises clinching cover plate and magnetic pallet, described magnetic pallet is for being with magnetic substrate, the sheet metal of clinching cover plate for being attracted by substrate, be provided with the slotted eye for Flexible Printed Circuit print solder paste and paster on the clinching cover plate, it is characterized in that, described clinching cover plate is can be by the steel disc of attraction.
Described steel disc is stainless steel substrates, its thickness 0.05-0.1mm, and hardness is 480-700 Vickers hardness.Steel disc is for adopting austenitic stainless steel or martensitic stain less steel to make through cold working, and the steel of selecting are special steel, and the chemical composition of these special steel is as follows:
C:Si：Mn：P：S：Ni：Cr:Fe=(0.08-0.15)：(0.75-1.00)：(1.00-2.00)：(0.04-0.045)：(0.025-0.030)：(6.00-10.00)：(16.0-19.0)：(68.0-76.0)。
Described magnetic pallet is to adopt the materials such as aluminium alloy, synthetic stone, glass mat to inlay the substrate that resistant to elevated temperatures permanent magnet is made.
Described magnetic tool also comprises positioning base, be provided with at least three alignment pins on positioning base, described magnetic pallet is provided with base location hole and the pallet location hole corresponding with the base alignment pin, be provided with the cover plate location hole corresponding with the pallet location hole on described clinching cover plate, be provided with the FPC location hole on described Flexible Printed Circuit, described pallet location hole, cover plate location hole and FPC location hole coordinate; Also be provided with the mark location hole corresponding with the optical markings of Flexible Printed Circuit location use on described clinching cover plate.
Also be provided with on described magnetic pallet the location notch identical with the Flexible Printed Circuit profile, with wiring board on corresponding groove or the louvre in components and parts positions, described groove can be filled out when mounting Flexible Printed Circuit is two-sided and put components and parts.
Described steel mesh is the non magnetic steel disc of 0.08mm or the above thickness of 0.08mm, and on it, etching has the flight identical with clinching cover plate shape, and the degree of depth of this flight is identical with the thickness of steel disc, and this flight adopts etch process local reduction to be made.
Be provided with the printing hole for the Flexible Printed Circuit print solder paste on described steel mesh, described printing hole needs the part of print solder paste corresponding with Flexible Printed Circuit, and this printing hole is to be made through radium-shine laser cutting.
Use Flexible Printed Circuit (FPC) surface mount process (SMT) of above-mentioned magnetic tool and steel mesh, it is characterized in that, its processing step is as follows:
(1) before the printing, the magnetic pallet is fixed on above positioning base, then put successively Flexible Printed Circuit and clinching cover plate, allow base location hole and the alignment pin of magnetic pallet fasten, allow corresponding cover plate location hole, FPC location hole overlap with pallet nail location hole, allow the mark location hole overlap with optical markings point on Flexible Printed Circuit, after accurate positioning, Flexible Printed Circuit and magnetic tool are taken out from positioning base together, put into printing track, after entering certain printing track etc. Flexible Printed Circuit, the printing machine that is provided with steel mesh begins to carry out paste solder printing.
(2) be completed for printing rear Flexible Printed Circuit and enter chip mounter with magnetic tool, chip mounter carries out component mounter to Flexible Printed Circuit.
(3) mount and enter reflow soldering after completing the solder joint on high-temperature components and Flexible Printed Circuit is welded and fixed.
(4) take out cooling magnetic tool from track after reflow soldering is completed, take down the clinching cover plate, take out Flexible Printed Circuit, magnetic tool enters circulation next time.
The fixed-direction of described Flexible Printed Circuit is chip component vertical direction, SOT and SOP horizontal direction; Be provided with optical positioning system on described printing machine, this optical positioning system can be identified the optical locating point on Flexible Printed Circuit; The scraper of printing machine is steel spatula, and the angle of described scraper and Flexible Printed Circuit is the 60-75 degree; The print direction of printing machine is left and right or fore-and-aft direction, and print speed printing speed is 10mm/s-25mm/s, and squeegee pressure is 0.1kg/cm
2-0.3kg/cm
2The stripping rate of printing machine is 0.1mm/s-0.2mm/s.
Be provided with suction nozzle on described chip mounter, after this suction nozzle paster is completed, suction becomes 0, and after suction became 0, suction nozzle was removed from Flexible Printed Circuit.
Reflow process comprises warm-up phase, constant temperature stage, welding stage and cooling stage in described step (3), warm-up phase, and temperature is raised to 110 degree from room temperature, and rate of rise in temperature is 1 ℃/S-2 ℃/S; In the constant temperature stage, temperature rises to 150 degree, temperature retention time 60s-120s from 110 degree; The welding stage, 1-2 ℃/S of temperature rising speed; Maximum temperature is less than 230 ℃, keeps temperature 20s-40s under 200 ℃-220 ℃, keeps temperature 3s-5s under 220 ℃-230 ℃; Cooling stage, temperature reach after maximum temperature and naturally descend, 2 ℃ of decrease speeds/S-5 ℃/S.
Useful technique effect of the present invention is:
(1) the present invention adopts magnetic pallet and clinching cover plate as magnetic tool, Flexible Printed Circuit to be fixed firmly, so need not to adopt silica gel or double faced adhesive tape in whole surface mount process process, so can not make residual silica gel on Flexible Printed Circuit, can not be stained with ash on pallet yet, make greatly improve the useful life of pallet, and removed the cost that cleans from.
(2) the stainless steel clinching cover plate toughness that adopts is strong, makes it be not easy to fracture when attached getting, and has saved a large amount of human costs, and the useful life of having improved the clinching cover plate.
(3) the stainless steel clinching cover sheet thickness that adopts is very thin, after steel mesh adopts etch process local reduction simultaneously, can not cause the too much situation of tin cream, has guaranteed the quality of whole technique.
(4) adopt magnetic tool that the Flexible Printed Circuit wiring board is clipped in the middle, has good effect of heat insulation, make Flexible Printed Circuit can not be out of shape in reflow process, thereby guaranteed the situation that rosin joint and empty weldering can not occur that is connected between components and parts and Flexible Printed Circuit solder joint.
(5) due to the setting tool that does not adopt layer of silica gel or double faced adhesive tape as Flexible Printed Circuit in whole technical process, so can share tool in printing, paster and Reflow Soldering stage, not only simplified technological process, instrument cost and human cost have been saved, after work simplification simultaneously, the probability that affects product quality because of human factor reduces greatly, and the quality of product improves greatly.
(6) after paster technique is completed, only need clinching cover plate and magnetic pallet are separated, just can take off very easily Flexible Printed Circuit, can wiring board be lost because of between Flexible Printed Circuit and pallet, adhesion being arranged when getting wiring board.
Description of drawings
Fig. 1 is the dress connection schematic diagram of Flexible Printed Circuit of the present invention and magnetic tool;
Fig. 2 is the three-dimensional view of positioning base of the present invention;
Fig. 3 is the front view of magnetic pallet of the present invention;
Fig. 4 is the front view of clinching cover plate of the present invention;
Fig. 5 is the front view of Flexible Printed Circuit;
Fig. 6 is the front view of steel mesh of the present invention.
Wherein: 1: the magnetic pallet; 11: the base location hole; 12: the pallet location hole; 13: location notch; 14: groove; 15: louvre; 16: permanent magnet; 2: Flexible Printed Circuit; 21: the optical markings point; The 22:FPC location hole; 3: the clinching cover plate; 31: the cover plate location hole; 32: the mark location hole; 33: slotted eye; 4: positioning base; 41: alignment pin; 5: steel mesh; 51: flight; 52: printing hole.
Embodiment
The magnetic tool that the present invention relates to use in surface mounting process for flexible circuit board and steel mesh and the surface mounting process for flexible circuit board that uses this magnetic tool and steel mesh, this magnetic tool comprises magnetic pallet and clinching cover plate, the clinching cover plate is stainless steel substrates thin and that toughness is very high, and Flexible Printed Circuit is clipped in paste solder printing, paster and the reflow process of completing a whole set of technique between magnetic pallet and clinching cover plate.
Embodiment one:
as shown in Fig. 1-5, the magnetic tool that the present invention relates to comprises magnetic pallet 1, clinching cover plate 3 and positioning base 4, and described positioning base 4 is provided with two alignment pin 41(also can arrange three or three above alignment pins), described magnetic pallet 1 adopts the aluminium alloy melanism and then inlays the substrate that the permanent magnet 16 of anti-300 ℃ of high temperature is made and (also can adopt synthetic stone, resistant to elevated temperatures glass fibre is inlayed resistant to elevated temperatures permanent magnet again and is made), described magnetic pallet 1 is provided with base location hole 11 and the pallet location hole 12 corresponding with base alignment pin 41, also be provided with the location notch 13 identical with Flexible Printed Circuit 2 profiles on this magnetic pallet 1, the groove 14 corresponding with components and parts position on wiring board and louvre 15, described groove 14 can be filled out when mounting Flexible Printed Circuit 2 is two-sided and put components and parts, described clinching cover plate 3 is can be by the stainless steel substrates of attraction, the thickness of stainless steel substrates is 0.05mm, hardness is 480 Vickers hardnesses, and steel disc is for adopting austenitic stainless steel or martensitic stain less steel to make through cold working, and the chemical composition of the steel of selecting is as follows:
C:Si:Mn:P:S:Ni:Cr:Fe=0.08:0.7:1.00:0.04:0.025:6.00:16.0: 76.0, all the other are other impurity.Be provided with the cover plate location hole 31 corresponding with pallet location hole 12 on clinching cover plate 3, also be provided with the mark location hole 32 corresponding with the optical markings point 21 of Flexible Printed Circuit 2 location use on clinching cover plate 3 and for the slotted eye 33 of Flexible Printed Circuit 2 print solder paste and paster, be provided with on Flexible Printed Circuit 2 for printing the optical markings point 21 of locating and the FPC location hole 22 corresponding with the pallet location hole 12 of magnetic pallet 1.
before printing, magnetic pallet 1 is fixed on above positioning base 4, then put successively Flexible Printed Circuit 2 and clinching cover plate 3, allow the base location hole 11 of magnetic pallet 1 fasten with alignment pin 41, allow corresponding cover plate location hole 31, FPC location hole 22 overlaps with 12 holes, pallet nail location, allow mark location hole 32 overlap with optical markings point 21 on Flexible Printed Circuit, after accurate positioning, Flexible Printed Circuit 2 and magnetic tool are taken out from positioning base 4 together, put into printing track, the fixed-direction of described Flexible Printed Circuit 2 is the chip component vertical direction, SOT and SOP horizontal direction.After entering certain printing track etc. Flexible Printed Circuit 2, the printing machine that is provided with steel mesh 5 begins to carry out paste solder printing.
As shown in Figure 6, described steel mesh 5 is the thick non magnetic steel disc of 0.08mm, and on it, etching has the flight 51 identical with clinching cover plate 3 shapes, and the degree of depth of this flight 51 is 0.05mm, and this flight 51 adopts etch process local reduction to be made; Be provided with the printing hole 52 for Flexible Printed Circuit 2 print solder paste on described steel mesh 5, described printing hole 52 needs the part of print solder paste corresponding with Flexible Printed Circuit 2, and this printing hole 52 is made through radium-shine laser cutting.
Be provided with optical positioning system on described printing machine, this optical positioning system can be identified the optical locating point 21 on Flexible Printed Circuit 2; The scraper of printing machine is steel spatula, and the angle of described scraper and Flexible Printed Circuit is 60 degree; The print direction of printing machine is left and right directions (also can be fore-and-aft direction), and print speed printing speed is 10mm/s, and squeegee pressure is 0.1kg/cm
2The stripping rate of printing machine is 0.1mm/s.
Be completed for printing rear Flexible Printed Circuit and enter chip mounter with magnetic tool, chip mounter carries out component mounter to Flexible Printed Circuit; Mount and enter reflow soldering after completing the solder joint on high-temperature components and Flexible Printed Circuit is welded and fixed; Take out cooling magnetic tool from track after reflow soldering is completed, take down the clinching cover plate, take out Flexible Printed Circuit, magnetic tool enters circulation next time.
Be provided with suction nozzle on described chip mounter, after this suction nozzle paster is completed, suction becomes 0, and after suction became 0, suction nozzle was removed from Flexible Printed Circuit.
Reflow process comprises warm-up phase, constant temperature stage, welding stage and cooling stage, warm-up phase, and temperature is raised to 110 degree from room temperature, and rate of rise in temperature is 1 ℃/S; In the constant temperature stage, temperature rises to 150 degree, temperature retention time 60s from 110 degree; The welding stage, 1 ℃/S of temperature rising speed; Maximum temperature is 220 ℃, keeps temperature 20s under 200 ℃, keeps temperature 3s under 220 ℃; Cooling stage, temperature descend after reaching maximum temperature naturally, 2 ℃/S of decrease speed.
Embodiment two:
as shown in Fig. 1-5, the magnetic tool that the present invention relates to comprises magnetic pallet 1, clinching cover plate 3 and positioning base 4, and described positioning base 4 is provided with two alignment pin 41(also can arrange three or three above alignment pins), described magnetic pallet 1 adopts the aluminium alloy melanism and then inlays the substrate that the permanent magnet of anti-300 ℃ of high temperature is made and (also can adopt synthetic stone, resistant to elevated temperatures glass fibre is inlayed resistant to elevated temperatures permanent magnet again and is made), described magnetic pallet 1 is provided with base location hole 11 and the pallet location hole 12 corresponding with base alignment pin 41, also be provided with the location notch 13 identical with Flexible Printed Circuit 2 profiles on this magnetic pallet 1, the groove 14 corresponding with components and parts position on wiring board and louvre 15, described groove 14 can be filled out when mounting Flexible Printed Circuit 2 is two-sided and put components and parts, described clinching cover plate 3 is can be by the stainless steel substrates of attraction, and the thickness of stainless steel substrates is 0.1mm, and hardness is 700 Vickers hardnesses, and steel disc is for adopting austenitic stainless steel or martensitic stain less steel to make through cold working, and the chemical composition of the steel of selecting is as follows:
C:Si:Mn:P:S:Ni:Cr:Fe=0.15:1.00:2.00:0.045:0.030:10.00:19 .0:67.0, all the other are other impurity.Be provided with the cover plate location hole 31 corresponding with pallet location hole 12 on clinching cover plate 3, also be provided with the mark location hole 32 corresponding with the optical markings point 21 of Flexible Printed Circuit 2 location use on clinching cover plate 3 and for the slotted eye 33 of Flexible Printed Circuit 2 print solder paste and paster, be provided with on Flexible Printed Circuit 2 for printing the optical markings point 21 of locating and the FPC location hole 22 corresponding with the pallet location hole 12 of magnetic pallet 1.
before printing, magnetic pallet 1 is fixed on above positioning base 4, then put successively Flexible Printed Circuit 2 and clinching cover plate 3, allow the base location hole 11 of magnetic pallet 1 fasten with alignment pin 41, allow corresponding cover plate location hole 31, FPC location hole 22 overlaps with 12 holes, pallet nail location, allow mark location hole 32 overlap with optical markings point 21 on Flexible Printed Circuit, after accurate positioning, Flexible Printed Circuit 2 and magnetic tool are taken out from positioning base 4 together, put into printing track, the fixed-direction of described Flexible Printed Circuit 2 is the chip component vertical direction, SOT and SOP horizontal direction.After entering certain printing track etc. Flexible Printed Circuit 2, the printing machine that is provided with steel mesh 5 begins to carry out paste solder printing.
As shown in Figure 6, described steel mesh 5 is the thick non magnetic steel disc of 0.1mm, and on it, etching has the flight 51 identical with clinching cover plate 3 shapes, and the degree of depth of this flight 51 is 0.1mm, and this flight 51 adopts etch process local reduction to be made; Be provided with the printing hole 52 for Flexible Printed Circuit 2 print solder paste on described steel mesh 5, described printing hole 52 needs the part of print solder paste corresponding with Flexible Printed Circuit 2, and this printing hole 52 is made through radium-shine laser cutting.
Be provided with optical positioning system on described printing machine, this optical positioning system can be identified the optical locating point 21 on Flexible Printed Circuit 2; The scraper of printing machine is steel spatula, and the angle of described scraper and Flexible Printed Circuit is 75 degree; The print direction of printing machine is left and right directions (also can be fore-and-aft direction), and print speed printing speed is 25mm/s, and squeegee pressure is 0.3kg/cm
2The stripping rate of printing machine is 0.2mm/s.
Be completed for printing rear Flexible Printed Circuit and enter chip mounter with magnetic tool, chip mounter carries out component mounter to Flexible Printed Circuit; Mount and enter reflow soldering after completing the solder joint on high-temperature components and Flexible Printed Circuit is welded and fixed; Take out cooling magnetic tool from track after reflow soldering is completed, take down the clinching cover plate, take out Flexible Printed Circuit, magnetic tool enters circulation next time.
Be provided with suction nozzle on described chip mounter, after this suction nozzle paster is completed, suction becomes 0, and after suction became 0, suction nozzle was removed from Flexible Printed Circuit.
Reflow process comprises warm-up phase, constant temperature stage, welding stage and cooling stage, warm-up phase, and temperature is raised to 110 degree from room temperature, and rate of rise in temperature is 2 ℃/S; In the constant temperature stage, temperature rises to 150 degree, temperature retention time 120s from 110 degree; The welding stage, 2 ℃/S of temperature rising speed; Maximum temperature is 230 ℃, keeps temperature 40s under 220 ℃, keeps temperature 5s under 230 ℃; Cooling stage, temperature descend after reaching maximum temperature naturally, 5 ℃/S of decrease speed.
In a word, the present invention mainly provides a kind of very thin thickness and had can be with the securing clinching cover plate of flexible wire plate, make this magnetic tool need not silica gel and fix, have just this kind function clinching cover plate the attachment process of whole Flexible Printed Circuit is simplified greatly, production cost reduces greatly.
because having advantages of with iron, steel do not have, but common steel is not but by attraction, exactly because this point, in production application, people are difficult to solve the clinching cover plate can be by the problem of attraction, the inventor developed in doing process of the present invention a lot of can be by the steel disc of attraction, although the present invention only provides the material of a kind of stainless steel as the clinching cover plate, can not be interpreted as and only be confined to stainless steel as the material of clinching cover plate of the present invention, any can be by the steel disc of attraction, all belong to protection scope of the present invention in thickness of the present invention and hardness range.
Claims (6)
1. the magnetic tool that uses in surface mounting process for flexible circuit board, described magnetic tool comprises clinching cover plate and magnetic pallet, described magnetic pallet is for being with magnetic substrate, the sheet metal of clinching cover plate for being attracted by substrate, be provided with the slotted eye for Flexible Printed Circuit print solder paste and paster on the clinching cover plate, it is characterized in that, described clinching cover plate is can be by the steel disc of attraction.
2. magnetic tool according to claim 1, it is characterized in that, described steel disc is stainless steel substrates, and its thickness is 0.05-0.1mm, hardness is 480-700 Vickers hardness, the special steel of steel disc for adopting austenitic stainless steel or martensitic stain less steel to make through cold working.
3. magnetic tool according to claim 1, is characterized in that, described magnetic pallet is to adopt the materials such as aluminium alloy, synthetic stone, glass mat to inlay the substrate that resistant to elevated temperatures permanent magnet is made.
4. magnetic tool according to claim 1, it is characterized in that, described magnetic tool also comprises positioning base, be provided with at least two alignment pins on positioning base, described magnetic pallet is provided with base location hole and the pallet location hole corresponding with the base alignment pin, be provided with the cover plate location hole corresponding with the pallet location hole on described clinching cover plate, be provided with the FPC location hole on described Flexible Printed Circuit, described pallet location hole, cover plate location hole and FPC location hole coordinate; Also be provided with the mark location hole corresponding with the optical markings point of Flexible Printed Circuit location use on described clinching cover plate.
5. magnetic tool according to claim 1, it is characterized in that, also be provided with on described magnetic pallet louvre, the location notch identical with the Flexible Printed Circuit profile or with wiring board on the components and parts positions is corresponding can fill out the groove of putting components and parts when mounting Flexible Printed Circuit is two-sided.
6. the steel mesh that uses in surface mounting process for flexible circuit board, it is characterized in that, described steel mesh is the non magnetic steel disc of thickness 0.08mm or the above thickness of 0.08mm, on it, etching has the flight identical with clinching cover plate shape, the degree of depth of this flight is identical with the thickness of steel disc, and this flight adopts etch process local reduction to be made; Be provided with the printing hole for the Flexible Printed Circuit print solder paste on described steel mesh, described printing hole needs the part of print solder paste corresponding with Flexible Printed Circuit, and this printing hole is to be made through radium-shine laser cutting.
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