CN111867258A - A seamless splicing process of a cuboid LED display PCB board - Google Patents
A seamless splicing process of a cuboid LED display PCB board Download PDFInfo
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- 238000004080 punching Methods 0.000 claims abstract description 12
- 238000003466 welding Methods 0.000 claims abstract description 11
- 239000003292 glue Substances 0.000 claims abstract description 10
- 238000004519 manufacturing process Methods 0.000 claims abstract description 8
- 238000005520 cutting process Methods 0.000 claims abstract description 6
- 238000005476 soldering Methods 0.000 claims abstract description 5
- 238000005553 drilling Methods 0.000 claims description 13
- 238000010586 diagram Methods 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 8
- 230000007797 corrosion Effects 0.000 claims description 7
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
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- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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Abstract
Description
技术领域technical field
本发明涉及PCB板拼接技术领域，尤其涉及一种长方体LED显示屏PCB板无缝拼接工艺。The invention relates to the technical field of PCB board splicing, in particular to a seamless splicing process of a rectangular parallelepiped LED display PCB board.
背景技术Background technique
LED显示屏的发展使得LED用电路板的运用越来越广泛，我们常见的LED显示屏多是单面的，随着市场的需求的改变出现一些多面LED显示屏，以更好的展示商品广告；而对于一些特殊的LED显示屏，用的电路板也要特殊要求，在市场上，有一种长方体LED显示屏，它需要四面PCB无缝拼接。The development of LED displays has made the use of LED circuit boards more and more widely. Most of our common LED displays are single-sided. With the change of market demand, some multi-sided LED displays appear to better display product advertisements. ; And for some special LED displays, the circuit boards used also have special requirements. In the market, there is a cuboid LED display, which requires seamless splicing of PCBs on four sides.
发明内容SUMMARY OF THE INVENTION
为了克服现有技术的缺陷，本发明所要解决的技术问题在于提出一种长方体LED显示屏PCB板无缝拼接工艺，以解决上述问题。In order to overcome the defects of the prior art, the technical problem to be solved by the present invention is to propose a seamless splicing process for the PCB boards of the rectangular parallelepiped LED display screen to solve the above problems.
为达此目的，本发明采用以下技术方案：For this purpose, the present invention adopts the following technical solutions:
本发明提供的一种长方体LED显示屏PCB板无缝拼接工艺，包括以下步骤：A seamless splicing process for a cuboid LED display PCB board provided by the present invention includes the following steps:
S1、PCB板电路制作：根据设计好的电路图纸制作好电路板；S1, PCB board circuit production: make a good circuit board according to the designed circuit drawings;
S2、PCB板边缘切割：使用CCD精雕机配合特定的铣刀(4)对PCB的边缘进行切割，使PCB板装有电气元件的一侧边缘切割成一定夹角；S2. PCB board edge cutting: use CCD engraving machine and a specific milling cutter (4) to cut the edge of the PCB, so that the edge of the side of the PCB board with electrical components is cut into a certain angle;
S3：PCB板打孔：根据电路图纸在PCB板需要插入电气元件的地方用电路板打孔机进行打孔；S3: PCB board punching: According to the circuit drawings, use a circuit board punching machine to punch holes where electrical components need to be inserted on the PCB board;
S4：LED灯模组安装孔打孔：使用X-RAY二次打靶的方式在PCB板上打出要安装LED灯模组的安装孔；S4: LED light module mounting hole drilling: use the X-RAY secondary shooting method to punch the mounting holes on the PCB board to install the LED light module;
S5、电气元件安装及焊接：根据电路设计图纸将电气元件插入打好的引脚孔中并焊接固定；S5. Installation and welding of electrical components: according to the circuit design drawings, insert the electrical components into the punched pin holes and weld them to fix them;
S6、PCB板拼装：利用辅助工具将PCB板竖立起来，并调节辅助工具将PCB板初步拼合在一起；S6, PCB board assembly: use auxiliary tools to erect the PCB board, and adjust the auxiliary tools to initially assemble the PCB board together;
S7、PCB板刷胶粘合：将竖立拼装好的PCB板在棱与棱贴合的地方刷涂胶水使其彼此粘合在一起；S7. PCB board brushing and gluing: Brush the assembled PCB board with glue in the place where the edges and edges fit together to make them adhere to each other;
S8、辅助工具拆除：待胶水粘合后将辅助工具拆除；S8. Auxiliary tool removal: After the glue is bonded, the auxiliary tool is removed;
S9、孔洞填补：在焊锡焊接的一侧刷涂环氧树脂将安装引脚的孔洞封补；S9. Hole filling: Apply epoxy resin on the side of soldering to seal the holes of the mounting pins;
S10、导线连接：将PCB板与PCB板之间需要相连的导线连接在一起。S10. Wire connection: connect the wires that need to be connected between the PCB board and the PCB board.
进一步，所述S1、PCB板电路制作：先将设计好的电路图通过石墨打印机将电路图纸按照比例打印热转印纸上，再通过热转印方式将电路转印在PCB板有铜层的一面，电路打转完后放入腐蚀溶液中进行腐蚀，腐蚀结束后将覆盖在电路上的碳粉用擦去。Further, the circuit production of the S1 and PCB board: firstly, the designed circuit diagram is printed on the thermal transfer paper according to the proportion by the graphite printer, and then the circuit is transferred on the side of the PCB board with the copper layer by the thermal transfer method. , After the circuit is turned, put it into the corrosive solution for corrosion, and wipe off the carbon powder covering the circuit after the corrosion is completed.
进一步，诉述辅助工具包括底座和支撑杆；所述底座为L形；在所述底座上设置有相对底座移动将PCB板夹合的滑块和穿过滑块与底座在螺纹连接的螺杆；在所述支撑杆两端设置有可以在支撑杆上滑动并将PCB板夹合的板扣。Further, the said auxiliary tool includes a base and a support rod; the base is L-shaped; the base is provided with a slider that moves relative to the base to clamp the PCB board and a screw that passes through the slider and is threadedly connected to the base; Both ends of the support rod are provided with plate buckles that can slide on the support rod and clamp the PCB board together.
进一步，所述S2、PCB板边缘切割：根据PCB板大小制作出模具，将PCB板通过抽真空的方式固定在模具上，再将模具固定在车床台上，再将铣刀装在车床的主轴上，通过高速转动铣刀对PCB边缘进行切割；所述铣刀中心位置到边缘的斜边与模具表面成一定角度。Further, the S2, the edge of the PCB board is cut: a mold is made according to the size of the PCB board, the PCB board is fixed on the mold by means of vacuuming, and then the mold is fixed on the lathe table, and then the milling cutter is mounted on the spindle of the lathe The edge of the PCB is cut by rotating the milling cutter at a high speed; the hypotenuse from the center of the milling cutter to the edge forms a certain angle with the surface of the mold.
进一步，S4：LED灯模组安装孔打孔：开机进入操作界面选择已经做好的资料，输入新增聊号的基本数据，选择钻孔方式；保存好资料后进行钻孔矫正，矫正完钻头后进行打孔；打孔结束后关闭电源并对操作台面进行清理。Further, S4: LED light module installation hole drilling: boot into the operation interface, select the data that has been prepared, enter the basic data of the new chat number, and select the drilling method; after saving the data, perform drilling correction, and correct the drill bit. After punching, turn off the power and clean the operating table.
进一步，所述S5、电气元件安装及焊接：根据电路图纸将电气原件插入PCB板上，再将电气元件的引脚与电路焊接，焊接后通电进行测试检查。Further, the S5, installation and welding of electrical components: insert the electrical components into the PCB board according to the circuit drawings, then weld the pins of the electrical components to the circuit, and then energize for testing and inspection after welding.
进一步，所述S6、PCB板拼装：先将PCB板夹在底座上，是PCB板垂直站立起来，构成四边形结构，移动底座是PCB板将要贴合的边贴合在一起，再用支撑杆以井字形结构在PCB板上端固定起来。Further, the S6 and PCB board assembly: first clamp the PCB board on the base, the PCB board stands vertically to form a quadrilateral structure, and the moving base is where the edges of the PCB board to be attached are attached together, and then a support rod is used to The well-shaped structure is fixed on the upper end of the PCB board.
进一步，所述S7、PCB板刷胶粘合：将环氧树脂加入凝固剂后灌装在针管中，使针头对准贴合的缝隙将环氧树脂填充在贴合的缝隙中。Further, the S7, the PCB board brushing and bonding: adding epoxy resin to the coagulant and then filling it in the needle tube, aligning the needle head with the bonding gap, and filling the epoxy resin in the bonding gap.
进一步，所述S9、孔洞填补：将辅助工具拆除后将液体环氧树脂加入凝固剂后以刷涂的方式将环氧在PCB板覆铜的一侧将多余的孔洞封堵同时形成一层保护膜保护电路。Further, the S9, hole filling: after the auxiliary tool is removed, the liquid epoxy resin is added to the coagulant, and then the epoxy is applied to the copper-clad side of the PCB board by brushing to block the excess holes and form a layer of protection. Membrane protection circuit.
本发明的有益效果为：The beneficial effects of the present invention are:
一种长方体LED显示屏PCB板无缝拼接工艺将PCB板边缘切割成一定角度后进行拼合增大了贴合处的贴合面使粘合面积更大，粘合更牢固；采用环氧树脂对PCB板进行粘合，使粘合更牢固同时可以充分将缝隙填补；通过辅助装置的固定使将PCB板粘合在一起更方便快捷，同时减小误差；当固定完后再次在PCB板的覆铜层上涂环氧树脂可以对电路进行保护，同时将孔洞和缝隙封堵形成以封闭的环境，还可以加强长方体的稳定性。A cuboid LED display PCB board seamless splicing process cuts the edge of the PCB board into a certain angle and then splices it together to increase the bonding surface of the bonding place, so that the bonding area is larger and the bonding is stronger; epoxy resin is used to The PCB board is bonded to make the bonding more firm and the gap can be fully filled; the fixing of the auxiliary device makes it easier and faster to bond the PCB boards together, and at the same time reduces the error; when the fixing is completed, the PCB board is covered again. Coating epoxy resin on the copper layer can protect the circuit, at the same time block the holes and gaps to form a closed environment, and can also strengthen the stability of the cuboid.
附图说明Description of drawings
图1是本发明一种长方体LED显示屏PCB板无缝拼接工艺流程示意图；Fig. 1 is a kind of cuboid LED display screen PCB board seamless splicing process flow schematic diagram of the present invention;
图2是本发明一种长方体LED显示屏PCB板无缝拼接工艺底座结构示意图；Fig. 2 is a schematic diagram of the base structure of a cuboid LED display PCB board seamless splicing process of the present invention;
图3是本发明一种长方体LED显示屏PCB板无缝拼接工艺支撑杆示意图；3 is a schematic diagram of a support rod for a seamless splicing process of a cuboid LED display PCB board according to the present invention;
图4是本发明一种长方体LED显示屏PCB板无缝拼接工艺铣刀结构示意图；4 is a schematic structural diagram of a milling cutter for a seamless splicing process of a cuboid LED display PCB board according to the present invention;
图中附图标记：Reference numbers in the figure:
1、辅助工具；2、底座；21、滑块；22、螺杆；3、支撑杆；31、板扣；4、铣刀。1. Auxiliary tools; 2. Base; 21. Slider; 22. Screw; 3. Support rod; 31. Plate buckle; 4. Milling cutter.
具体实施方式Detailed ways
下面结合附图并通过具体实施方式来进一步说明本发明的技术方案。The technical solutions of the present invention are further described below with reference to the accompanying drawings and through specific embodiments.
本实施例中提供的一种长方体LED显示屏PCB板无缝拼接工艺，包括以下步骤：A seamless splicing process of a rectangular parallelepiped LED display PCB board provided in this embodiment includes the following steps:
S1、PCB板电路制作：根据PCB板要实现的功能和设计好的电路图纸制作好电路板；S1. PCB board circuit production: according to the functions to be realized by the PCB board and the designed circuit drawings, make a good circuit board;
S2、PCB板边缘切割：使用CCD精雕机配合特定的铣刀4对PCB的边缘进行切割，使PCB板装有电气元件的一侧边缘切割成45°夹角；S2. PCB board edge cutting: Use CCD engraving machine and specific milling cutter 4 to cut the edge of the PCB, so that the edge of the side of the PCB board with electrical components is cut into a 45° angle;
S3：PCB板打孔：根据电路图纸在PCB板需要插入电气元件的地方用电路板打孔机进行打孔；S3: PCB board punching: According to the circuit drawings, use a circuit board punching machine to punch holes where electrical components need to be inserted on the PCB board;
S4：LED灯模组安装孔打孔：使用X-RAY二次打靶的方式在PCB板上打出要安装LED灯模组的安装孔；S4: LED light module mounting hole drilling: use the X-RAY secondary shooting method to punch the mounting holes on the PCB board to install the LED light module;
S5、电气元件安装及焊接：根据电路设计图纸将电气元件插入打好的引脚孔中并焊接固定；S5. Installation and welding of electrical components: according to the circuit design drawings, insert the electrical components into the punched pin holes and weld them to fix them;
S6、PCB板拼装：利用辅助工具1将PCB板竖立起来，并调节辅助工具1将PCB板初步拼合在一起；S6, PCB board assembly: use
S7、PCB板刷胶粘合：将竖立拼装好的PCB板在棱与棱贴合的地方刷涂胶水使其彼此粘合在一起；S7. PCB board brushing and gluing: Brush the assembled PCB board with glue in the place where the edges and edges fit together to make them adhere to each other;
S8、辅助工具1拆除：待胶水粘合后将辅助工具1拆除；S8.
S9、孔洞填补：在焊锡焊接的一侧刷涂环氧树脂将安装引脚的孔洞封补；S9. Hole filling: Apply epoxy resin on the side of soldering to seal the holes of the mounting pins;
S10、导线连接：将PCB板与PCB板之间需要相连的导线连接在一起。S10. Wire connection: connect the wires that need to be connected between the PCB board and the PCB board.
进一步，所述S1、PCB板电路制作：先将设计好的电路图通过石墨打印机将电路图纸按照比例打印热转印纸上，再通过热转印方式将电路转印在PCB板有铜层的一面，电路打转完后放入腐蚀溶液中进行腐蚀，腐蚀溶液优选浓度为30％到60％的三氯化铁溶液；腐蚀结束后将覆盖在电路上的碳粉用擦去；在擦石墨时用细沙纸擦拭，同时将铜板上的氧化层擦掉。Further, the circuit production of the S1 and PCB board: firstly, the designed circuit diagram is printed on the thermal transfer paper according to the proportion by the graphite printer, and then the circuit is transferred on the side of the PCB board with the copper layer by the thermal transfer method. , after the circuit is turned, put it in a corrosive solution for corrosion, the corrosion solution is preferably a ferric chloride solution with a concentration of 30% to 60%; after the corrosion is completed, wipe off the carbon powder covering the circuit; when rubbing graphite, use Wipe with fine sandpaper, and at the same time wipe off the oxide layer on the copper plate.
进一步，诉述辅助工具1包括底座2和支撑杆3；所述底座2为L形；在所述底座2上设置有相对底座2移动将PCB板夹合的滑块21和穿过滑块21与底座2在螺纹连接的螺杆22；在所述支撑杆3两端设置有可以在支撑杆3上滑动将PCB板夹合的板扣31；底座2通过滑块21和底座2的配合并通过螺杆22调节滑块21位置可以适应更多厚度的PCB板；所述板扣31在支撑杆3上滑动可以适应与不同大小的长方体LED显示屏PCB板无缝拼接。Further, it is stated that the
进一步，所述S2、PCB板边缘切割：根据PCB板大小制作出模具，将PCB板通过抽真空的方式固定在模具上，再将模具固定在车床台上，使模具和PCB板与铣刀4相垂直，再将铣刀4装在车床的主轴上，通过45000转/分钟的转速转动动铣刀4对PCB边缘进行切割；所述铣刀4中心位置到边缘的斜边与模具表面成45°角。Further, the S2, the edge of the PCB board is cut: a mold is made according to the size of the PCB board, the PCB board is fixed on the mold by means of vacuuming, and the mold is fixed on the lathe table, so that the mold and the PCB board and the milling cutter 4 Vertically, the milling cutter 4 is mounted on the main shaft of the lathe, and the movable milling cutter 4 is rotated at a rotational speed of 45,000 rpm to cut the edge of the PCB; ° angle.
进一步，S4：LED灯模组安装孔打孔：开机进入操作界面选择已经做好的资料，输入新增聊号的基本数据，选择钻孔方式；保存好资料后进行钻孔矫正，矫正完钻头后进行打孔；打孔结束后关闭电源并对操作台面进行清理。Further, S4: LED light module installation hole drilling: boot into the operation interface, select the data that has been prepared, enter the basic data of the new chat number, and select the drilling method; after saving the data, perform drilling correction, and correct the drill bit. After punching, turn off the power and clean the operating table.
进一步，所述S5、电气元件安装及焊接：根据电路图纸将电气原件插入PCB板上，再将电气元件的引脚与电路焊接，焊接后通电进行测试检查；提前对焊接好电气元件的电路板进行检查可以对安装错的元件进行替换，虚焊的元器件再次人工焊接，不能使用的电路板可以将元器件拆下二次利用，PCB板做报废处理，避免造成更大的损失；检测可以使用的电路板进行拼装。Further, the S5, the installation and welding of electrical components: insert the electrical components into the PCB board according to the circuit drawings, then weld the pins of the electrical components to the circuit, and power on for testing and inspection after welding; Inspection can replace the components that are installed wrongly, and the components that are soldered are manually welded again. The circuit boards that cannot be used can be removed for secondary use, and the PCB boards can be scrapped to avoid causing greater losses; detection can be done. used circuit board for assembly.
进一步，所述S6、PCB板拼装：先将PCB板夹在底座2上，是PCB板垂直站立起来，构成四边形结构，移动底座2使PCB板将要贴合的边贴合在一起，再用支撑杆3以井字形结构在PCB板上端固定起来；每一个电路板可以使用两个底座2或两个以上的底座2保证PCB板的稳定；通过底座2和支撑杆3使PCB板形成稳定的结构后再对其进行粘合。Further, the S6 and PCB board assembly: first clamp the PCB board on the
进一步，所述S7、PCB板刷胶粘合：将环氧树脂加入凝固剂后灌装在针管中，使针头对准贴合的缝隙将环氧树脂填充在贴合的缝隙中；通过针管将环氧树脂打入缝隙中使环氧树脂喷涂更均匀，同时避免环氧树脂的浪费。Further, the S7 and PCB board brushing and bonding: adding epoxy resin to the coagulant and then filling it in the needle tube, aligning the needle with the gap of the fit, and filling the epoxy resin in the fit gap; Oxygen resin is injected into the gap to make the epoxy resin spray more evenly, while avoiding the waste of epoxy resin.
进一步，所述S9、孔洞填补：将辅助工具1拆除后将液体环氧树脂加入凝固剂后以刷涂的方式将环氧在PCB板覆铜的一侧将多余的孔洞封堵同时形成一层保护膜保护电路。Further, the S9, hole filling: after the
工作原理：working principle:
一种长方体LED显示屏PCB板无缝拼接工艺将PCB板边缘切割成45°使PCB板在粘合的过程中有更大的接触面积；使用环氧树脂进行粘合因为环氧树脂凝固后结构稳定硬度强并与PCB板材料相似，使粘合更稳定，同时实现将粘合缝隙完全密封；在覆铜层上刷涂环氧树脂可以将孔洞填补，同时形成一层密封层保护电路不被外物破坏，同时环氧树脂具备防水作用。A cuboid LED display PCB board seamless splicing process cuts the edge of the PCB board to 45° so that the PCB board has a larger contact area during the bonding process; epoxy resin is used for bonding because the structure after the epoxy resin solidifies The stability and hardness are strong and similar to the PCB board material, which makes the bonding more stable, and at the same time realizes the complete sealing of the bonding gap; brushing epoxy resin on the copper clad layer can fill the hole, and at the same time form a sealing layer to protect the circuit from being damaged. Foreign objects are damaged, and epoxy resin has waterproof effect.
本发明是通过优选实施例进行描述的，本领域技术人员知悉，在不脱离本发明的精神和范围的情况下，可以对这些特征和实施例进行各种改变或等效替换。本发明不受此处所公开的具体实施例的限制，其他落入本申请的权利要求内的实施例都属于本发明保护的范围。The present invention has been described in terms of preferred embodiments, and those skilled in the art will appreciate that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. The present invention is not limited by the specific embodiments disclosed herein, and other embodiments falling within the claims of the present application all belong to the protection scope of the present invention.
Claims (9)
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