CN203872437U - Tool for pasting circuit board reinforcing sheets - Google Patents
Tool for pasting circuit board reinforcing sheets Download PDFInfo
- Publication number
- CN203872437U CN203872437U CN201420221878.3U CN201420221878U CN203872437U CN 203872437 U CN203872437 U CN 203872437U CN 201420221878 U CN201420221878 U CN 201420221878U CN 203872437 U CN203872437 U CN 203872437U
- Authority
- CN
- China
- Prior art keywords
- wiring board
- reinforcing chip
- alignment pin
- base plate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000003014 reinforcing effect Effects 0.000 title claims abstract description 91
- 230000002787 reinforcement Effects 0.000 claims description 45
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 13
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a tool for pasting circuit board reinforcing sheets. The tool is characterized by comprising a base plate and a positioning device. The base plate is equipped with a top surface used for supporting a circuit board. The circuit board is equipped with areas to be reinforced. The positioning device is arranged on the base plate and positions the circuit board on the top surface. The tool for pasting circuit board reinforcing sheets positions the circuit board at an assigned position on the top surface of the base plate with the positioning device. Second positioning pins penetrate the circuit board and the reinforcing sheets such that the reinforcing sheets and the areas to be reinforced are accurately aligned. Therefore, the reinforcing sheets are accurately pasted on the areas to be reinforced. The pasting precision of the tool is greatly improved compared with that of manual alignment such that the quality of the circuit is improved. In addition, eye aligning time is shortened and work efficiency is improved.
Description
Technical field
The utility model relates to printed substrate and manufactures field, particularly a kind of wiring board reinforcing chip attaching tool.
Background technology
Flexibility printed circuit board, because it is frivolous, volume is little, flexible, can three-dimensional wiring etc. advantage be widely used in printed wire industry.But when welding electronic component, flex circuit application is because mechanical strength is little, flexible on flexibility printed circuit board, thus the weld defect such as cause that components and parts leg bursts apart.In order to reduce the generation of weld defect, improve the reliability of flexibility printed circuit board, need to paste reinforcing chip at welding component position, to strengthen the mechanical strength at this position.
The stickup of reinforcing chip at present adopts manual operations mostly, and reinforcing chip of a gripping, uses artificial naked eyes contraposition, is pasted assigned address in the circuit board.Not only inefficiency of this kind of method of attaching, Anawgy accuracy is also very poor.The reinforcing chip volume of pasting when needs when very little, be not only difficult to gripping, and cannot accurately paste assigned address by naked eyes at all.Even if reinforcing chip is affixed to the assigned address on wiring board exactly by manual operations, because reinforcing chip is to bond together by adhesive and wiring board, before adhesive does not solidify completely, touch because of carelessness reinforcing chip and also can cause it to be shifted, reduce and paste precision.
Utility model content
The purpose of this utility model is in order to overcome deficiency of the prior art, and a kind of wiring board reinforcing chip attaching tool that improves reinforcing chip stickup precision is provided.
For realizing above object, the utility model is achieved through the following technical solutions:
Wiring board reinforcing chip attaching tool, is characterized in that, comprising:
Base plate, described base plate has the upper surface for supporting wiring board; Described wiring board is provided with treats reinforcement region;
Positioner, described positioner is arranged on described base plate, and described wiring board is positioned on described upper surface.
Preferably, described the first positioner comprises at least one first alignment pin; Described the first alignment pin is arranged on described base plate, and protrudes described upper surface; Described wiring board is provided with the first location hole adapting with described the first alignment pin; Described the first location hole is positioned at treats region in addition, reinforcement region; Described the first alignment pin runs through described the first location hole, described wiring board is positioned on described upper surface, and described in making, treats reinforcement region and the corresponding setting of the second positioner.
Preferably, described base plate is provided with the first slot adapting with described the first alignment pin; Described the first alignment pin inserts in described the first slot, and arranges separably with described base plate.
Preferably, described positioner with described in treat the corresponding setting in reinforcement region; Described positioner, for reinforcing chip being positioned to the top of described wiring board, making to treat reinforcement region described in described reinforcing chip covering, and treats that with described reinforcement region is bonding.
Preferably, described positioner comprises at least one second alignment pin; Described the second alignment pin is arranged on described base plate, protrudes described upper surface; Eachly treat that reinforcement region is equipped with the second location hole that at least one and described the second alignment pin adapt; ; Reinforcing chip is provided with the 3rd location hole that at least one and described the second alignment pin adapt; Described the second alignment pin runs through described the second location hole and described the 3rd location hole, makes each reinforcing chip all treat the corresponding setting in reinforcement region with one.
Preferably, described base plate is provided with the second slot adapting with described the second alignment pin; Described the second alignment pin inserts in described the second slot, and arranges separably with described base plate.
Preferably, also comprise support plate; Described support plate is used for carrying reinforcing chip; Described support plate is positioned at wiring board top, and each reinforcing chip of described carrier for bearing all covers one and treats reinforcement region.
Preferably, described support plate is provided with the 4th location hole that at least one and described the first alignment pin adapt; Described the first alignment pin runs through described the 4th location hole, makes each reinforcing chip of described carrier for bearing all treat that with one reinforcement region is corresponding, and reinforcing chip and described upper surface are oppositely arranged.
Preferably, described support plate comprises location-plate and at least one adhesive sheet; Described location-plate is provided with at least one through hole; Described through hole is identical with reinforcing chip shape size; Described adhesive sheet is bonded on described location-plate; Each reinforcing chip embeds in a described through hole, and bonding with described adhesive sheet.
Preferably, also comprise dividing plate; Described dividing plate is arranged between described base plate and described wiring board, and arranges separably with described base plate; Described the first alignment pin and described the second alignment pin run through described dividing plate, and protrude the upper surface of described dividing plate.
Preferably, the upper surface area of described dividing plate is greater than the upper surface area of described base plate.
The wiring board reinforcing chip attaching tool that the utility model provides, is positioned at wiring board by positioner the assigned address of plate upper surface.The second alignment pin runs through wiring board and reinforcing chip, makes reinforcing chip and treats reinforcement region accurate contraposition, treats on reinforcement region thereby reinforcing chip is sticked on exactly.Compared with manual alignment, paste precision and greatly improve, improve the quality of wiring board.Also reduced naked eyes to bit time, improved operating efficiency simultaneously.
In the utility model, wiring board is positioned at the assigned address on base by the first alignment pin.The support plate of the multiple reinforcing chips of carrying is provided.By the first alignment pin, support plate is positioned at after the assigned address of wiring board top, makes the many places on multiple reinforcing chips and wiring board treat the contraposition simultaneously of reinforcement region, and complete bonding.Reduce contraposition and pasted number of times, having reduced the probability that produces error, greatly having improved operating efficiency, having saved human cost.
Due to some wiring board thinner thickness, in the process separating with base plate at the wiring board that reinforcement is good, if operating personnel directly force in wiring board, very easily because causing wiring board distortion, misoperation, application of force inequality even damage, cause scrapping.So operating personnel need significant care, operating efficiency decreases.In the utility model, between wiring board and base plate, dividing plate is set, makes the first alignment pin and the second alignment pin on base plate run through dividing plate, and protrude baffle surface.Dividing plate can move relative to base plate.The upper surface area of dividing plate is greater than the upper surface area of base plate, and dividing plate extends along the upper surface direction of base plate, and protrudes the sidewall of base plate.Upwards lift at the position of the hand-held dividing plate protrusion of staff base plate, evenly forces in wiring board by dividing plate, and dividing plate is taken off from base plate together with wiring board, and wiring board is separated with the second alignment pin with the first alignment pin.Effectively avoid wiring board deform or damage, can reduce operation easier, increase work efficiency simultaneously.
Brief description of the drawings
Fig. 1 is the front view of wiring board in the utility model embodiment 1;
Fig. 2 is the structural front view of base plate in the utility model embodiment 1;
Fig. 3 is the schematic diagram of step a in the utility model embodiment 1;
Fig. 4 is the schematic diagram of step b in the utility model embodiment 1;
Fig. 5 is the structural front view of the utility model embodiment 1 MR medium reinforcing sheet;
Fig. 6 is the schematic diagram of step c in the utility model embodiment 1;
Fig. 7 is the structural front view of base plate in the utility model embodiment 2;
Fig. 8 is the structural front view of support plate in the utility model embodiment 2;
Fig. 9 is the structural front view of location-plate in the utility model embodiment 2;
Figure 10 is the structural front view that is bonded with the support plate of reinforcing chip in the utility model embodiment 2;
Figure 11 is the use schematic diagram of support plate in the utility model embodiment 2;
Figure 12 is the structural front view of base plate in the utility model embodiment 3.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in detail:
Embodiment 1
As shown in Figure 1, provide a wiring board 1.Wiring board 1 is provided with multiple reinforcement regions 11 for the treatment of.
As in Figure 2-4, be wiring board reinforcing chip attaching tool.The attaching of wiring board reinforcing chip comprises base plate 2 and dividing plate 3 with tool.Base plate 2 comprises the upper surface 21 for supporting wiring board 1.Dividing plate 3 is placed on upper surface 21, and can take off from base plate 2.The area of the upper surface 31 of dividing plate 3 is greater than the area of the upper surface 21 of base plate 2.Be that dividing plate 3 extends along the upper surface direction of base plate 2, and protrude the sidewall 22 of base plate 2.
The attaching of wiring board reinforcing chip also comprises positioner with tool.Positioner comprises two the first alignment pins 4 and multiple the second alignment pin 6.The first alignment pin 4 is arranged on base plate 2, protrudes upper surface 21.The first alignment pin 4 runs through dividing plate 3 and protrudes the upper surface 31 of dividing plate 3.Wiring board 1 is provided with two the first location holes 12 that adapt with the first alignment pin 4.The first location hole 12 is positioned at treats region in addition, reinforcement region 11.Two the first location holes 12 are symmetrical arranged along the diagonal of wiring board 1.The first alignment pin 4 runs through the first location hole 12, wiring board 1 is positioned to the assigned address of the upper surface 11 of base plate 1, make each treat reinforcement region 11 all with the corresponding setting of at least one the second alignment pin 6.
As illustrated in Figures 5 and 6, the second alignment pin 6 is arranged on base plate 2, protrudes upper surface 21.The second alignment pin 6 runs through dividing plate 3 and protrudes the upper surface 31 of dividing plate 3.Eachly treat that reinforcement region 11 is equipped with four the second location holes 13 that adapt with the second alignment pin 6.The second alignment pin 6 runs through the second location hole 13, and protrudes the upper surface of wiring board 1.Provide multiple and treat the reinforcing chip 5 that reinforcement region 11 shapes adapt.On each reinforcing chip 5, be equipped with four the 3rd location holes 51 that adapt with the second alignment pin 6.The second alignment pin 6 runs through the 3rd location hole 51, makes reinforcing chip 5 cover wiring board 1, and each reinforcing chip 5 all treats reinforcement region 11 accurate contrapositions with one, and mutually bonding.
Use above-mentioned wiring board reinforcing device to carry out reinforcement to wiring board 1, comprise the steps:
A. as shown in Figure 3, dividing plate 3 is placed on the upper surface 21 of base plate 2, and makes the first alignment pin 4 on base plate 1 and the second alignment pin 6 run through dividing plate 3 and protrude the upper surface 31 of dividing plate 3.
B. as shown in Figure 4, make the first alignment pin 4 on base plate 1 run through the first location hole 12 on wiring board 1, wiring board 1 is positioned to the assigned address on upper surface 11, be each treat reinforcement region 11 all with the corresponding setting of four the second alignment pins 6, the second alignment pin 6 runs through the second location hole 13 for the treatment of on reinforcement region 11.Dividing plate 3 is sandwiched between base plate 2 and wiring board 1.
C. as shown in Figure 6, smear adhesive treating 11 surfaces, reinforcement region or reinforcing chip 5 surfaces, make the second alignment pin 6 run through the 3rd location hole 51 of reinforcing chip 5, each reinforcing chip 5 is treated reinforcement region 11 accurate contrapositions with each one by one, and sticks on the treating on reinforcement region 11 of wiring board 1.
D. after adhesive solidifies completely, upwards lift at the position that the hand-held dividing plate 3 of staff protrudes base plate 2, evenly forces in wiring board 1 by dividing plate 3, and dividing plate 3 is taken off from base plate 2 together with wiring board 1.Effectively avoid wiring board 1 deform or damage, improved yields, can reduce operation easier, increase work efficiency simultaneously.
Embodiment 2
As shown in Figure 7, the attaching of wiring board reinforcing chip comprises positioner with tool.Positioner comprises two the first alignment pins 4 that are arranged on base plate 2.As different from Example 1, positioner does not comprise the second alignment pin 6 being arranged on base plate 2.
As shown in Fig. 8-10, the attaching of wiring board reinforcing chip also comprises support plate 7 with tool.Multiple reinforcing chips 5 are bonded on support plate 7.As different from Example 1, the 3rd location hole 51 that reinforcing chip 5 nothings and the second alignment pin 6 carrying on support plate 7 adapts.Support plate 7 is provided with two the 4th location holes 71 that adapt with the first alignment pin 4.Support plate 7 comprises a location-plate 72 and three adhesive sheets 73.Location-plate 72 is provided with the through hole 74 identical with reinforcing chip 5 shape sizes.Adhesive sheet 73 is bonded on location-plate 72.By corresponding the embedding in a through hole 74 of each reinforcing chip 5, and bonding with adhesive sheet 73.Support plate 7 covers wiring board 1, and what make that reinforcing chip 5 covers wiring board treats reinforcement region 11, and with treat that reinforcement region 11 is bonding.
The using method of support plate 7 is as follows: as shown in figure 11, support plate 7 is covered on wiring board 1, make the first alignment pin 4 run through the 4th location hole 71, the multiple reinforcing chips 5 on support plate 7 are treated reinforcement region 11 accurate contraposition simultaneously with the multiple of wiring board 1, and reinforcing chip 5 is oppositely arranged with upper surface 11.Press carrier plate 7, make reinforcing chip 5 and treat that reinforcement region 11 is pasted together.
Support plate 7 carries multiple reinforcing chips 5.By the first alignment pin 4, support plate 7 is positioned at after the assigned address of base plate 2 tops, makes multiple reinforcing chips 5 and the many places on wiring board 1 treat 11 contrapositions simultaneously of reinforcement region, and complete bonding.Reduce contraposition and pasted number of times, having reduced the probability that produces error, greatly having improved operating efficiency, having saved human cost.
Treating that the viscosity between 11 surfaces, reinforcement region and reinforcing chip 5 is greater than the viscosity between reinforcing chip 5 and support plate 7, to guarantee that reinforcing chip 5 and wiring board 1 can successfully depart from support plate 7 after bonding.
Except foregoing, the other guide of the present embodiment is all identical with embodiment 1.
Embodiment 3
As shown in figure 12, the attaching of wiring board reinforcing chip comprises positioner with tool.Positioner comprises multiple the second alignment pins 6.As different from Example 1, positioner does not comprise the first alignment pin 4 being arranged on base plate 2.On the one hand, run through the second location hole 13 for the treatment of on reinforcement region 11 by the second alignment pin 6, wiring board 1 be positioned to the assigned address on upper surface 21, treat even each reinforcement region 11 all with the corresponding setting of four the second alignment pins 6.On the other hand, run through the 3rd location hole 51 on reinforcing chip 5 by the second alignment pin 6, make reinforcing chip 5 cover wiring board 1, and each reinforcing chip 5 all treats reinforcement region 11 accurate contrapositions with one, and mutually bonding.
Except foregoing, the other guide of the present embodiment is all identical with embodiment 1.
Upper and lower in the utility model, all taking Figure 11 as reference, is the relative concept that clearly illustrates that the utility model uses.
Embodiment in the utility model, only for the utility model is described, does not form the restriction to claim scope, those skilled in that art can expect other be equal in fact substitute, all in the utility model protection range.
Claims (13)
1. wiring board reinforcing chip attaching tool, is characterized in that, comprising:
Base plate, described base plate has the upper surface for supporting wiring board; Described wiring board is provided with treats reinforcement region;
Positioner, described positioner is arranged on described base plate, and described wiring board is positioned on described upper surface.
2. wiring board reinforcing chip attaching tool according to claim 1, is characterized in that, described positioner comprises at least one first alignment pin; Described the first alignment pin is arranged on described base plate, and protrudes described upper surface; Described wiring board is provided with the first location hole adapting with described the first alignment pin; Described the first location hole is positioned at treats region in addition, reinforcement region; Described the first alignment pin runs through described the first location hole, and described wiring board is positioned on described upper surface.
3. wiring board reinforcing chip attaching tool according to claim 2, is characterized in that, described base plate is provided with the first slot adapting with described the first alignment pin; Described the first alignment pin inserts in described the first slot, and arranges separably with described base plate.
4. wiring board reinforcing chip attaching tool according to claim 1, is characterized in that, described positioner with described in treat the corresponding setting in reinforcement region; Described positioner, for reinforcing chip being positioned to the top of described wiring board, making to treat reinforcement region described in described reinforcing chip covering, and treats that with described reinforcement region is bonding.
5. wiring board reinforcing chip attaching tool according to claim 4, is characterized in that, described positioner comprises at least one second alignment pin; Described the second alignment pin is arranged on described base plate, protrudes described upper surface; Eachly treat that reinforcement region is equipped with the second location hole that at least one and described the second alignment pin adapt; Reinforcing chip is provided with the 3rd location hole that at least one and described the second alignment pin adapt; Described the second alignment pin runs through described the second location hole and described the 3rd location hole, makes each reinforcing chip all treat the corresponding setting in reinforcement region with one.
6. wiring board reinforcing chip attaching tool according to claim 5, is characterized in that, described base plate is provided with the second slot adapting with described the second alignment pin; Described the second alignment pin inserts in described the second slot, and arranges separably with described base plate.
7. wiring board reinforcing chip attaching tool according to claim 1, is characterized in that, also comprises support plate; Described support plate is used for carrying reinforcing chip; Described support plate is positioned at wiring board top, and each reinforcing chip of described carrier for bearing all covers one and treats reinforcement region.
8. wiring board reinforcing chip attaching tool according to claim 2, is characterized in that, also comprises support plate; Described support plate is used for carrying reinforcing chip; Described support plate is positioned at wiring board top, and each reinforcing chip of described carrier for bearing all covers one and treats reinforcement region.
9. wiring board reinforcing chip attaching tool according to claim 8, is characterized in that, described support plate is provided with the 4th location hole that at least one and described the first alignment pin adapt; Described the first alignment pin runs through described the 4th location hole, makes each reinforcing chip of described carrier for bearing all treat that with one reinforcement region is corresponding, and reinforcing chip and described upper surface are oppositely arranged.
10. according to the wiring board reinforcing chip attaching tool described in claim 7 or 8, it is characterized in that, described support plate comprises location-plate and at least one adhesive sheet; Described location-plate is provided with at least one through hole; Described through hole is identical with reinforcing chip shape size; Described adhesive sheet is bonded on described location-plate; Each reinforcing chip embeds in a described through hole, and bonding with described adhesive sheet.
11. wiring board reinforcing chip attaching tools according to claim 2, is characterized in that, also comprise dividing plate; Described dividing plate is arranged between described base plate and described wiring board, and arranges separably with described base plate; Described the first alignment pin runs through described dividing plate, and protrudes the upper surface of described dividing plate.
12. wiring board reinforcing chip attaching tools according to claim 5, is characterized in that, also comprise dividing plate; Described dividing plate is arranged between described base plate and described wiring board, and arranges separably with described base plate; Described the second alignment pin runs through described dividing plate, and protrudes the upper surface of described dividing plate.
13. according to the wiring board reinforcing chip attaching tool described in claim 11 or 12, it is characterized in that, the upper surface area of described dividing plate is greater than the upper surface area of described base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420221878.3U CN203872437U (en) | 2014-04-30 | 2014-04-30 | Tool for pasting circuit board reinforcing sheets |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420221878.3U CN203872437U (en) | 2014-04-30 | 2014-04-30 | Tool for pasting circuit board reinforcing sheets |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203872437U true CN203872437U (en) | 2014-10-08 |
Family
ID=51653354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420221878.3U Expired - Lifetime CN203872437U (en) | 2014-04-30 | 2014-04-30 | Tool for pasting circuit board reinforcing sheets |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203872437U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104411097A (en) * | 2014-11-28 | 2015-03-11 | 苏州米达思精密电子有限公司 | Reinforcing piece carrying plate |
| CN106507587A (en) * | 2016-09-27 | 2017-03-15 | 台山市精诚达电路有限公司 | A kind of tool of hot pressing stiffening plate and the method using the tool hot pressing stiffening plate |
| CN113825311A (en) * | 2021-08-27 | 2021-12-21 | 深圳市鑫达辉软性电路科技有限公司 | Reinforced adhesive tape adsorption laminating jig and laminating method |
-
2014
- 2014-04-30 CN CN201420221878.3U patent/CN203872437U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104411097A (en) * | 2014-11-28 | 2015-03-11 | 苏州米达思精密电子有限公司 | Reinforcing piece carrying plate |
| CN106507587A (en) * | 2016-09-27 | 2017-03-15 | 台山市精诚达电路有限公司 | A kind of tool of hot pressing stiffening plate and the method using the tool hot pressing stiffening plate |
| CN113825311A (en) * | 2021-08-27 | 2021-12-21 | 深圳市鑫达辉软性电路科技有限公司 | Reinforced adhesive tape adsorption laminating jig and laminating method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103957666A (en) | Jig and carrier plate used for attaching circuit board strength reinforcing pieces | |
| CN203872437U (en) | Tool for pasting circuit board reinforcing sheets | |
| KR101281600B1 (en) | A taping attachment of pcb | |
| CN203934114U (en) | Wiring board reinforcing paster attaches the support plate that attaches use with tool, wiring board reinforcing paster | |
| CN104183527A (en) | Workpiece bonding system | |
| CN106231820A (en) | Rigid Flex processing method | |
| CN111469528A (en) | Method and equipment for laminating foldable ultrathin glass cover plate and preparation process thereof | |
| JPH0320051A (en) | Semiconductor device mounting structure and mounting method and mounting device | |
| CN104780713B (en) | Overturn pick-and-place machine | |
| CN103909042B (en) | Full-automatic PCB rubberizing paper, some glue and drying integral machine | |
| CN104159407B (en) | High-accuracy small-size reinforcement part attaching method | |
| CN110524890B (en) | Positioning platform for non-contact smart card production equipment | |
| CN204131841U (en) | Wiring board reinforcing paster attaching tool | |
| CN102740598A (en) | Three-layer anti-fake label PCB plate and preparation process thereof | |
| CN204498471U (en) | Wiring board reinforcing chip attaching tool | |
| CN109600936A (en) | A kind of processing technology of the Rigid Flex with steel disc reinforcement | |
| CN212519541U (en) | Can improve COB printed wiring board of going technology limit precision | |
| CN104812181B (en) | The photoresistance film of rigid-flex combined board with flexible structure outer layer keeps away infiltration technique | |
| CN202917793U (en) | Automobile connector pressing device | |
| CN106604547A (en) | No-pollution electronic circuit board manufacturing technique | |
| CN206237692U (en) | The SMT production tools of flexible yielding PCB | |
| JP5365204B2 (en) | Wiring board manufacturing method | |
| CN207736856U (en) | Four layers of double faced adhesive tape and attaching positioning device | |
| JP2011249629A5 (en) | ||
| CN111361264A (en) | Card lamination stop device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141008 |