CN104576426A - Mounting method of flip chip and wafer level chip and mounting jig set - Google Patents
Mounting method of flip chip and wafer level chip and mounting jig set Download PDFInfo
- Publication number
- CN104576426A CN104576426A CN201510019008.7A CN201510019008A CN104576426A CN 104576426 A CN104576426 A CN 104576426A CN 201510019008 A CN201510019008 A CN 201510019008A CN 104576426 A CN104576426 A CN 104576426A
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- China
- Prior art keywords
- weld
- aiding cream
- chip
- cream
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 16
- 238000007639 printing Methods 0.000 claims abstract description 60
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 46
- 239000010959 steel Substances 0.000 claims abstract description 46
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000006071 cream Substances 0.000 claims description 136
- 229910000679 solder Inorganic materials 0.000 claims description 27
- 238000004513 sizing Methods 0.000 claims description 16
- 238000004806 packaging method and process Methods 0.000 claims description 14
- 238000007493 shaping process Methods 0.000 claims description 9
- 238000005476 soldering Methods 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 229920003023 plastic Polymers 0.000 claims description 4
- 230000004907 flux Effects 0.000 abstract 5
- 239000000843 powder Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 6
- 238000004140 cleaning Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L2021/60285—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the use of mechanical auxiliary parts without the use of an alloying or soldering process, e.g. pressure contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a mounting jig set for a flip chip and a wafer level chip. The mounting jig set for the flip chip and the wafer level chip comprises a paste flux printing steel plate used for printing a certain amount of paste flux in advance and a tin paste printing steel plate used for printing tin paste and extruding and finalizing the shape of the paste flux. The invention further provides a mounting method of the flip chip and the wafer level chip. By the adoption of the mounting method and the mounting jig set of the flip chip and the wafer level chip, a certain amount of paste flux can be printed firstly, then the paste flux is used for finalizing the shape and fixing the amount when the tin paste is printed, a conventional surface chip mounter is adopted conveniently to carry out surface mounting of the flip chip and the wafer level chip, and special mounting equipment is not needed.
Description
Technical field
The present invention relates to attaching method and the attachment tool group of flip-chip and wafer stage chip.
Background technology
In response on market for the demand that electronic product is compact, microsize flip-chip (Flip Chip) and wafer-level packaging chip (WLCSP) should accumulate and give birth to, and flip-chip and wafer-level packaging chip attachment cannot be produced with traditional tin cream processing procedure, need special equipment to mount, production cost is high.
The general method to flip-chip or wafer-level packaging chip attachment and step are mainly at present:
1) IC support plate is fixed: first inserted by IC support plate and be positioned in the mounting groove of pallet, re-using high temperature gummed tape and be fixed on pallet by IC support plate;
2) paste solder printing: the printing of tin cream steel mesh is carried out to IC support plate, flip-chip or wafer-level packaging chip place do not stamp tin cream;
3) liquid scaling powder is picked again by special mounting device paster after flip-chip or the first contraposition of wafer-level packaging chip;
4) conventional surface chip mounter is used to carry out other element pasters;
5) Reflow Soldering is crossed;
6) bottom glue (Under Fill) is filled;
7) IC carrier dismounting: use plastics electrostatic-resisting tweezers to be removed by high temperature gummed tape, take off IC support plate from pallet.
Above-mentioned general operational method has following defect:
(1) special mounting device investment amount is quite high, but often every sheet IC support plate needs the flip-chip that mounts and wafer-level packaging number of chips few, cause equipment mobility quite low, equipment investment is reclaimed not easily;
(2) liquid scaling powder picks its attached work amount uncontrollable, especially picking after scaling powder cannot contraposition, therefore must before picking liquid scaling powder leading contraposition again row pick row attachment again after liquid scaling powder, liquid scaling powder easily pollutes patch device and causes and safeguard that cleaning cost increases in the process;
(3) because the liquid scaling powder amount of picking cannot strictly control, therefore Reflow Soldering must be cleaned after completing, to reduce the residual of scaling powder; But after flip-chip and wafer-level packaging chip positioning, very little with the spacing of support plate, cleaning not easily, space will be produced by causing the coated processing procedure of bottom filler that causes of welding assisted agent residuals, element running adstante febre may produce gas explosion phenomenon, there is the problem of assembly reliability to produce, and affect by this, make the dynamical mode of production also be difficult to realize.
Summary of the invention
The object of the present invention is to provide attaching method and the attachment tool group of a kind of flip-chip and wafer stage chip, can first print a certain amount of weld-aiding cream, make weld-aiding cream shape quantitatively again when printing tin cream, be convenient to adopt conventional surface chip mounter to carry out surface mount to flip-chip and wafer-level packaging chip, do not need special mounting device.
For achieving the above object, the invention provides a kind of flip-chip and wafer stage chip attachment tool group, comprise: the weld-aiding cream for printing a certain amount of weld-aiding cream in advance prints steel plate, and the tin cream printing steel plate be extruded to shape for print solder paste and to weld-aiding cream;
Described weld-aiding cream is printed steel plate and is comprised weld-aiding cream Printing Zone, and be provided with weld-aiding cream printing hole in described weld-aiding cream Printing Zone, the steel plate thickness of described weld-aiding cream Printing Zone is 0.06mm;
Described tin cream is printed steel plate and is comprised: paste solder printing district, and prints corresponding weld-aiding cream shaping area, weld-aiding cream Printing Zone on steel plate with weld-aiding cream;
Paste solder printing hole is provided with in described paste solder printing district;
Be provided with the weld-aiding cream corresponding with weld-aiding cream printing hole in described weld-aiding cream shaping area to shape hole, the height (degree of depth) in described weld-aiding cream sizing hole is 0.05mm.
The present invention also provides the attaching method of flip-chip and wafer stage chip, it uses above-mentioned flip-chip and wafer stage chip attachment tool group, and comprises the steps:
1) IC support plate is fixed: first inserted by IC support plate and be positioned in the mounting groove of pallet, re-using high temperature gummed tape and be fixed on pallet by IC support plate;
2) use weld-aiding cream to print steel plate and print a certain amount of weld-aiding cream in advance;
3) tin cream is used to print steel plate print solder paste, while print solder paste, utilize weld-aiding cream sizing hole to be extruded to shape to the weld-aiding cream printed, the weld-aiding cream that weld-aiding cream is shaped in hole is uniformly distributed, and unnecessary weld-aiding cream is extruded weld-aiding cream sizing hole and removes, leaving the weld-aiding cream that sizing is quantitative;
4) conventional surface chip mounter is used to carry out other elements and flip-chip or wafer-level packaging chip attachment;
5) Reflow Soldering is crossed;
6) bottom glue is filled;
7) IC carrier dismounting: use plastics electrostatic-resisting tweezers to be removed by high temperature gummed tape, take off IC support plate from pallet.
Preferably, described step 2) and step 3) carry out on different print stations.
Advantage of the present invention and beneficial effect are: the attaching method and the attachment tool group that provide a kind of flip-chip and wafer stage chip, can first print a certain amount of weld-aiding cream, make weld-aiding cream shape quantitatively again when printing tin cream, be convenient to adopt conventional surface chip mounter to carry out surface mount to flip-chip and wafer-level packaging chip, do not need special mounting device.
After IC support plate top tray is fixing, printing weld-aiding cream and print solder paste need prepare two print stations, First print station uses weld-aiding cream print steel plate and print a certain amount of weld-aiding cream in advance, second print station use tin cream print steel plate print solder paste and weld-aiding cream is shaped quantitatively, then transferring load to conventional patch machine and carry out paster operation; Flip-chip or wafer-level packaging chip attachment only use a chip mounter carry out and do not need special patch device, reduce the input of special equipment by this, again through normal reflux weldering after paster completes, complete attachment operation.
Weld-aiding cream prints steel plate to print a certain amount of weld-aiding cream, the steel plate of weld-aiding cream Printing Zone need be thinned to desired thickness; Printing weld-aiding cream thickness the best of flip-chip and wafer-level packaging chip is 0.05mm, and for meeting weld-aiding cream demand, the steel plate thickness of weld-aiding cream Printing Zone is 0.06mm.
The computing formula that weld-aiding cream prints volume is: V=S × N × T;
Wherein, V is that weld-aiding cream prints volume, and S is that weld-aiding cream prints steel plate perforate (printing hole) area, and N is that weld-aiding cream prints steel plate number of aperture, and T is the steel plate thickness that weld-aiding cream prints steel plate Printing Zone.
Described tin cream prints steel plate when print solder paste, and the pressure of scraper, except print solder paste, also can extrude the weld-aiding cream in weld-aiding cream sizing hole, the weld-aiding cream that weld-aiding cream is shaped in hole is uniformly distributed, unnecessary weld-aiding cream is extruded weld-aiding cream sizing hole, and is removed, and leaves the weld-aiding cream that sizing is quantitative.Weld-aiding cream shaping area is remained weld-aiding cream after printing steel plate printing and cleans by tin cream, can reuse.
Accompanying drawing explanation
Fig. 1 is the schematic diagram that weld-aiding cream of the present invention prints steel plate;
Fig. 2 is the schematic diagram that tin cream of the present invention prints steel plate.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is further described.Following examples only for technical scheme of the present invention is clearly described, and can not limit the scope of the invention with this.
The technical scheme that the present invention specifically implements is:
As shown in Figure 1 and Figure 2, the invention provides a kind of flip-chip and wafer stage chip attachment tool group, comprise: the weld-aiding cream for printing a certain amount of weld-aiding cream in advance prints steel plate A0, and the tin cream printing steel plate B0 be extruded to shape for print solder paste and to weld-aiding cream;
Described weld-aiding cream is printed steel plate A0 and is comprised weld-aiding cream Printing Zone A1, and be provided with weld-aiding cream printing hole A2 in described weld-aiding cream Printing Zone A1, the steel plate thickness of described weld-aiding cream Printing Zone A1 is 0.06mm;
Described tin cream is printed steel plate B0 and is comprised: paste solder printing district B1, and prints the corresponding weld-aiding cream shaping area B2 of weld-aiding cream Printing Zone A1 on steel plate A0 with weld-aiding cream;
Paste solder printing hole B3 is provided with in described paste solder printing district B1;
Be provided with the weld-aiding cream corresponding with weld-aiding cream printing hole A2 in described weld-aiding cream shaping area B2 to shape hole B4, the height (degree of depth) of described weld-aiding cream sizing hole B4 is 0.05mm.
The present invention also provides the attaching method of flip-chip and wafer stage chip, it uses above-mentioned flip-chip and wafer stage chip attachment tool group, and comprises the steps:
1) IC support plate is fixed: first inserted by IC support plate and be positioned in the mounting groove of pallet, re-using high temperature gummed tape and be fixed on pallet by IC support plate;
2) use weld-aiding cream to print steel plate A0 and print a certain amount of weld-aiding cream in advance;
3) tin cream is used to print steel plate B0 print solder paste, while print solder paste, utilize weld-aiding cream sizing hole B4 to be extruded to shape to the weld-aiding cream printed, the weld-aiding cream that weld-aiding cream is shaped in the B4 of hole is uniformly distributed, unnecessary weld-aiding cream extruded weld-aiding cream sizing hole B4 and remove, leaving the weld-aiding cream that sizing is quantitative;
4) conventional surface chip mounter is used to carry out other elements and flip-chip or wafer-level packaging chip attachment;
5) Reflow Soldering is crossed;
6) bottom glue is filled;
7) IC carrier dismounting: use plastics electrostatic-resisting tweezers to be removed by high temperature gummed tape, take off IC support plate from pallet.
Described step 2) and step 3) carry out on different print stations.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the technology of the present invention principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (3)
1. flip-chip and wafer stage chip attachment tool group, is characterized in that, comprising: the weld-aiding cream for printing a certain amount of weld-aiding cream in advance prints steel plate, and the tin cream printing steel plate be extruded to shape for print solder paste and to weld-aiding cream;
Described weld-aiding cream is printed steel plate and is comprised weld-aiding cream Printing Zone, and be provided with weld-aiding cream printing hole in described weld-aiding cream Printing Zone, the steel plate thickness of described weld-aiding cream Printing Zone is 0.06mm;
Described tin cream is printed steel plate and is comprised: paste solder printing district, and prints corresponding weld-aiding cream shaping area, weld-aiding cream Printing Zone on steel plate with weld-aiding cream;
Paste solder printing hole is provided with in described paste solder printing district;
Be provided with the weld-aiding cream corresponding with weld-aiding cream printing hole in described weld-aiding cream shaping area to shape hole, the height in described weld-aiding cream sizing hole is 0.05mm.
2. the attaching method of flip-chip and wafer stage chip, is characterized in that:
Employ flip-chip and wafer stage chip attachment tool group;
Described flip-chip and wafer stage chip attachment tool group comprise: the weld-aiding cream for printing a certain amount of weld-aiding cream in advance prints steel plate, and the tin cream printing steel plate be extruded to shape for print solder paste and to weld-aiding cream;
Described weld-aiding cream is printed steel plate and is comprised weld-aiding cream Printing Zone, and be provided with weld-aiding cream printing hole in described weld-aiding cream Printing Zone, the steel plate thickness of described weld-aiding cream Printing Zone is 0.06mm;
Described tin cream is printed steel plate and is comprised: paste solder printing district, and prints corresponding weld-aiding cream shaping area, weld-aiding cream Printing Zone on steel plate with weld-aiding cream; Paste solder printing hole is provided with in described paste solder printing district; Be provided with the weld-aiding cream corresponding with weld-aiding cream printing hole in described weld-aiding cream shaping area to shape hole, the height in described weld-aiding cream sizing hole is 0.05mm;
The attaching method of described flip-chip and wafer stage chip comprises the steps:
1) IC support plate is fixed: first inserted by IC support plate and be positioned in the mounting groove of pallet, re-using high temperature gummed tape and be fixed on pallet by IC support plate;
2) use weld-aiding cream to print steel plate and print a certain amount of weld-aiding cream in advance;
3) tin cream is used to print steel plate print solder paste, while print solder paste, utilize weld-aiding cream sizing hole to be extruded to shape to the weld-aiding cream printed, the weld-aiding cream that weld-aiding cream is shaped in hole is uniformly distributed, and unnecessary weld-aiding cream is extruded weld-aiding cream sizing hole and removes, leaving the weld-aiding cream that sizing is quantitative;
4) conventional surface chip mounter is used to carry out other elements and flip-chip or wafer-level packaging chip attachment;
5) Reflow Soldering is crossed;
6) bottom glue is filled;
7) IC carrier dismounting: use plastics electrostatic-resisting tweezers to be removed by high temperature gummed tape, take off IC support plate from pallet.
3. the attaching method of flip-chip according to claim 2 and wafer stage chip, is characterized in that, described step 2) and step 3) carry out on different print stations.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510019008.7A CN104576426A (en) | 2015-01-15 | 2015-01-15 | Mounting method of flip chip and wafer level chip and mounting jig set |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510019008.7A CN104576426A (en) | 2015-01-15 | 2015-01-15 | Mounting method of flip chip and wafer level chip and mounting jig set |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104576426A true CN104576426A (en) | 2015-04-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510019008.7A Pending CN104576426A (en) | 2015-01-15 | 2015-01-15 | Mounting method of flip chip and wafer level chip and mounting jig set |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104576426A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107347232A (en) * | 2017-08-10 | 2017-11-14 | 乐依文半导体(东莞)有限公司 | Surface mount method, SMT printed steel mesh and the wafer mounting apparatus of fixed wafer |
| CN107731693A (en) * | 2017-10-16 | 2018-02-23 | 苏州日月新半导体有限公司 | The operational method and its tool of scaling powder |
| CN107871675A (en) * | 2017-10-13 | 2018-04-03 | 天津大学 | A kind of nano mattisolda connection naked copper DBC power model preparation method |
| CN109104828A (en) * | 2018-09-30 | 2018-12-28 | 西安北方光电科技防务有限公司 | A kind of LGA device printing patch auxiliary device |
| CN110137095A (en) * | 2019-04-02 | 2019-08-16 | 中国电子科技集团公司第五十五研究所 | A kind of method of ultra-thin wafers matrix chip gold goal face-down bonding |
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| CN1866487A (en) * | 2005-05-17 | 2006-11-22 | 华为技术有限公司 | Ball mounting method and apparatus for ball grid array packaging substrate |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107347232A (en) * | 2017-08-10 | 2017-11-14 | 乐依文半导体(东莞)有限公司 | Surface mount method, SMT printed steel mesh and the wafer mounting apparatus of fixed wafer |
| CN107871675A (en) * | 2017-10-13 | 2018-04-03 | 天津大学 | A kind of nano mattisolda connection naked copper DBC power model preparation method |
| CN107731693A (en) * | 2017-10-16 | 2018-02-23 | 苏州日月新半导体有限公司 | The operational method and its tool of scaling powder |
| CN109104828A (en) * | 2018-09-30 | 2018-12-28 | 西安北方光电科技防务有限公司 | A kind of LGA device printing patch auxiliary device |
| CN110137095A (en) * | 2019-04-02 | 2019-08-16 | 中国电子科技集团公司第五十五研究所 | A kind of method of ultra-thin wafers matrix chip gold goal face-down bonding |
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